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This week, SEMI announced the keynote speakers for the third edition of the European 3D TSV Summit, event that will take place on January 19-21, 2015 in Grenoble, France. As an increasing number of companies, such as IBM, Xilinx, Samsung and Bosch, are taking 3D through-silicon-via (TSV) technology to the commercialization phase, the necessity for understanding the business and technological context surrounding these devices has become more important than ever. In this context, SEMI has invited experts on the forefront of the technology to share their perspectives on the industry.

Joining the conference as a keynote speaker, Bryan Black, senior fellow at AMD, will inform participants that die stacking is finally happening in mainstream computing and explain the impacts of this technology on the industry. Timo Henttonen, senior manager packaging at Microsoft, will discuss his vision of the future of 3D TSV for smartphones and connected devices. Finally, Bill Chen, fellow and senior technical advisor at ASE Group, will deliver a talk about the integration of 3D TSV into the DNA of packaging.

In addition to these three keynote speakers, over 20 invited speakers and panel discussion participants will share their views during the 3D TSV conference, including industry experts from Qualcomm, IBM, HP, ams AG, imec, CEA-LETI, Fraunhofer-IKTS, Broadpak, SPTS, Suss Microtec, EV Group, BESI, KLA-Tencor, Rudolph Technologies, Asahi Glass, Corning, Oerlikon, STMicroelectronics, AMKOR and more.

New this year, the Summit will include a Pre-Summit Market Briefing dealing specifically with the 3D TSV market outlook and hosting several talks by financial analysts and industry consultants, including Yole Development, TechSearch International, AlixPartners and ATREG.

Over 30 companies will join the event as exhibitors. In addition to the exhibit and conference, attendees will have the opportunity to set up one-on one business meetings and visit the CEA-Leti 300mm TSV-capable clean room.

For more information, please visit www.semi.org/european3DTSVSummit or contact Yann Guillou, SEMI Europe Grenoble Office ([email protected]).

According to preliminary results from the upcoming DisplaySearch Quarterly Mobile PC Shipment and Forecast Report, in the third quarter of this year, the global notebook PC market grew 10 percent year over year, to reach 49.4 million units. Global shipments of tablet PCs, by comparison, fell 8 percent. Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.

“The slump in tablet PC demand contributed to the growth in notebook PCs,” said Hisakazu Torii, vice president of smart application research at DisplaySearch, now part of IHS Inc. “Back-to-school sales were quite good, and this growth was supported by low-priced, Windows-based notebook PCs and Chromebooks. Chromebook sales were especially strong in the United States, especially in the commercial and education markets, due to easier IT management and volume-discount offers.”

Chromebooks are forecast to reach 5 percent (8 million units) of total global notebook PC shipments by the end of this year; however, if 2015 demand reaches the 20 million units planned by PC brands and OEMs, it is possible that the Chromebook share would rise to 12 percent. “Early Black Friday newspaper advertisements show some Windows-based notebook PCs and Chromebooks priced under $200,” Torii said.

The top five notebook PC brands collectively grew 23 percent in the third quarter of 2014, reaching 69 percent of total notebook units shipped. With strong sales in North America and Western Europe, the Lenovo Group and HP continued to lead the market, with shares of 20 percent and 19 percent, respectively. Lenovo Group led unit share in Western Europe and China, while HP took the leading position in North America, Eastern Europe and rest of the world. Year-over-year shipments of Apple’s iPad declined 13 percent, although Apple still ranked fifth globally, mainly due to increasing market share in North America. 

Table: Top-Five Worldwide Notebook PC Shipment Share 

Q3’14 Share Q3’13 Share Y/Y Growth
Lenovo Group 20% 16% 38%
HP 19% 18% 13%
Dell 12% 11% 21%
Acer Group 10% 9% 28%
Apple 9% 9% 15%
Total Top Five Brands 69% 62% 23%

Data note: Starting in Q1 2014, DisplaySearch included CCE, NEC, and Mobile Internet and Digital Home Business Group (MIDH) in Lenovo shipments. 

Source: DisplaySearch Quarterly Mobile PC Shipment and Forecast Report

The NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report delivers insight into worldwide and regional mobile PC shipments with data for global and regional brands.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design – in consultation with Semiconductor Research Corporation (SRC) – today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

Dr. Tsu-Jae King Liu, TSMC Distinguished Professor in Microelectronics in the Department of Electrical Engineering and Computer Sciences (EECS) at UC Berkeley, received the honor in technology research, while Dr. Kenneth O, professor of engineering at UT Dallas, was recognized for design research.

“We are pleased to honor Dr. Liu and Dr. O for their pioneering work that has helped advance the semiconductor industry,” said Dr. John E. Kelly III, IBM senior vice president, director of IBM Research, and 2014 SIA chairman. “Research is the lifeblood of our industry as we endeavor to advance electronics to new levels of productivity. We salute Dr. Liu and Dr. O for their achievements.”

“SRC’s mission is to seed innovation and help provide the people and ideas to keep its members and the U.S. semiconductor industry competitive, and Dr. Liu and Dr. O are ideal examples of this collective effort,” said SRC President Larry Sumney. “We commend these accomplished researchers for their roles in our university research engine that has made the U.S. the cradle of discovery and technology development.”

Dr. Liu, a member of the Kavli Energy NanoSciences Institute and Chair of the EECS Department at UC Berkeley, earned B.S., M.S. and Ph.D. degrees in Electrical Engineering from Stanford University. Prior to joining UC Berkeley, she worked as a researcher at the Xerox Palo Alto Research Center. Dr. Liu’s current research activities include nanometer-scale logic and memory devices for energy-efficient electronics; she currently leads research on millivolt nanomechanical switches under the NSF Center for Energy Efficient Electronics Science. More on Dr. Liu’s career can be found here.

Dr. O received his B.S., M.S. and Ph.D. degrees in Electrical Engineering and Computer Science from MIT. Before joining UT Dallas, he was a professor at the University of Florida, Gainesville. Dr. O is researching devices, circuits and systems in CMOS for sub-millimeter wave and THz applications. Dr. O is the Director of the Texas Analog Center of Excellence (TxACE) funded by SRC, the state through its Texas Emerging Technology Fund, Texas Instruments Inc., the UT System and UT Dallas. More on Dr. O’s career can be found here.

Worldwide silicon wafer area shipments increased during the third quarter 2014 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments were 2,597 million square inches during the most recent quarter, a 0.4 percent increase from the 2,587 million square inches shipped during the previous quarter. New quarterly total area shipments are 11.0 percent higher than third quarter 2013 shipments, according to SEMI.

“After reaching record levels in the second quarter, silicon wafer shipment volume growth plateaued during the most recent quarter,” said Hiroshi Sumiya, chairman of SEMI SMG and general manager of the Corporate Planning Department of Shin-Etsu Handotai Co., Ltd. “Year-to-date silicon volumes are 10 percent higher than the same period last year.”

Quarterly Silicon Area Shipment Trends

 

Million Square Inches
 

Q3 2013

Q2 2014

Q3 2014

Q1-Q3 2013

Q1-Q3 2014
Total

2,341

2,587

2,597

6,859

7,548

Semiconductor Silicon Shipments* – Millions of Square Inches

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or “chips” are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers, epitaxial silicon wafers, and non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturers Group acts as an independent special interest group within the SEMI structure and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information on the SEMI Worldwide Silicon Wafer Shipment Statistics, visit www.semi.org/en/MarketInfo/SiliconShipmentStatistics.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today applauded a long-sought deal between the U.S. and China to expand the Information Technology Agreement (ITA), a key trade pact that promotes fair and open trade by providing for duty-free treatment of certain information and communications technology (ICT) products, including semiconductors.

Following negotiations on the sideline of the Asia-Pacific Economic Cooperation (APEC) Leaders’ meeting in Beijing, President Obama announced a bilateral agreement on the product scope of an expanded ITA that includes next generation semiconductors, static converters and inductors, and an array of technology products including medical devices, GPS devices, software media, ICT testing instruments, and others. This breakthrough bilateral agreement will enable all negotiators to return to Geneva to finalize a pluri-lateral ITA deal, with full talks targeted for December.

“The ITA has played a central role in helping the U.S. semiconductor industry drive innovation, create jobs, lower consumer prices and connect communities throughout the world,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “Today’s agreement between the U.S. and China to expand the ITA is a hard-fought victory for the U.S. semiconductor industry and a big win for the U.S. economy and consumers around the world. We look forward to all ITA countries finalizing a deal as soon as possible.”

An expanded ITA – with an estimated value of over $1.4 trillion of annual world trade – represents one of the most valuable agreements for the global high tech industry in nearly two decades. It provides the first opportunity to include newly developed products resulting from the dynamic technological developments in the information technology sector since 1996, when the ITA was originally concluded.

U.S. negotiators sought expanded coverage for new and innovative semiconductor products, including multi-component semiconductors (MCOs). MCOs comprise a growing share of the global semiconductor market, and will be key to continued growth and innovation in a vast range of downstream products, services, and sectors, providing the basis for much needed economic growth and jobs. Inclusion of MCOs in an expanded ITA would save the industry $150 to $300 million in global annual tariffs. U.S. semiconductor companies stand to benefit significantly from expanding the ITA, given that semiconductors are one of America’s top exports.

As the trend toward “smart” products continues, demand for advanced semiconductor products like MCOs has been growing consistently in the past few years and will continue to do so in the future. According to industry experts and SIA estimates, global sales of MCOs are estimated to grow by 10 percent annually over the next 5 years.

“Expanding the ITA to keep pace with the latest technologies will fuel foreign and domestic semiconductor design and manufacturing investments, reduce costs for consumers, promote exports, and strengthen overall semiconductor sector development and growth,” said Toohey. “SIA would like to extend sincere thanks to President Obama and the U.S. negotiating team for achieving this strong and successful outcome for American businesses and consumers.”

In July during SEMICON West 2014, James C. Morgan, chairman emeritus, Applied Materials, Inc., announced a challenge where he would match up to $500,000 in donations to the SEMI Foundation to secure $1 million of funding support for workforce development.  With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

Contributors to the SEMI Foundation through the “Challenge Grant” included: Art Zafiropoulo, Ultratech; Rick Wallace, KLA-Tencor; Martin Anstice, Lam Research; Archie Hwang, Hermes Epitek; LT Guttadauro, Fab Owners Association; T.J. Rodgers; and the Urbanek Family Foundation.   A “success” party took place on October 18 at Ferrari Silicon Valley, hosted by Art Zafiropoulo, CEO of Ultratech.

As part of the challenge grant success party, six graduates of SEMI’s High Tech U program gave short narratives on the impact that HTU had on their lives.  Of the six students who attended, two have jobs in high tech, three are majoring in an undergraduate STEM program and one has returned to school to get his masters in civil engineering. Lisa Anderson said that 76 percent of HTU students who attended HTU between 2006 and 2010 are now employed in a STEM field.

The SEMI HTU alumnus spoke about the program giving them their first-ever exposure to direct STEM and semiconductor equipment industry experience or confirmed and deepened their developing interest in STEM education after seeing the linkage to industry delivered by HTU’s volunteer instructors.  Each former HTU student was clear that the SEMI HTU was an important experience  that shaped their later decisions on pursuing STEM-based careers.

“I’m pleased and honored by the generosity of the donors in meeting my challenge grant,” said Jim Morgan. “They will make it possible for thousands of young people to learn about the importance of math, science and the opportunities in high-tech careers through the phenomenal High Tech U program. Now the High Tech U program can proceed to the next level and achieve even greater impact.”

The SEMI Foundation supports STEM education and promotes career awareness in the areas of semiconductor and high-tech manufacturing and technology. Through High Tech U, the SEMI Foundation has conducted more than 170 programs for both students and teachers with a combined impact on more than 350,000 individuals.  High Tech U programs consist of a three-day “hands-on” science-based curricula and interactive professional skills development program. SEMI held 20 programs in 2013 in Europe, Japan, Korea and the United States.  The Foundation plans to expand the impact of the High Tech U franchise through enhanced program development, portal-based student engagement and tracking, industry employment information assistance and other improvements.

Jim and Becky Morgan; Lisa and Art Zafiropoulo

Denny McGuirk, SEMI (left); Art Zafiropoulo,Ultratech (center) accepting his award for his Million Dollar Challenge Donation of $100,000; Dana Ditmore, SEMI Foundation (right).

“Jim and Becky Morgan epitomize leadership and generosity through their tireless work to foster education,” said Denny McGuirk, president and CEO of SEMI.  “We commend his numerous contributions to SEMI, our industry, and the youth who will occupy high-tech careers in the future. We encourage others to support the SEMI Foundation.”

Morgan has an extensive history in business and philanthropy. He is chairman emeritus of Applied Materials. He previously served as chairman of the board from 1987 to 2009, and as chief executive officer from 1977 to 2003. Morgan is the recipient of the 1996 National Medal of Technology, IEEE Robert N. Noyce Medal, and Silicon Valley Leadership Group’s “Spirit of Silicon Valley Lifetime Achievement Award.” Morgan was vice chairman of the President’s Export Council in 2003. He was appointed to the 2002 U.S.-Japan private Sector Government Commission. From 1996 to 1997, Morgan served on the Commission on U.S. Pacific Trade and Investment Policy. From 1988 to 1992, he served on the National Advisory Committee on Semiconductors.

For more information on the SEMI Foundation and High Tech U, visit www.semi.org/Foundation

SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

“Ron has distinguished himself as a results-oriented leader through his ability to meet significant challenges in his first six months, and we are fortunate to have a seasoned executive with more than 30 years of experience in the semiconductor industry,” said SEMATECH Chairman William Rozich. “Ron has a vision of how to drive the next stage of innovation and growth that will establish a solid foundation for SEMATECH’s future and we are eager to move forward under his leadership.”

Dr. Goldblatt joined SEMATECH as Vice President of Technical Strategy and Operations in September 2013. Previously, he served as Distinguished Engineer and Senior Manager of Advanced Silicon Science and Process Technology for IBM Research and Microelectronics Division in Yorktown Heights, NY. Under his leadership, he led successful efforts in transforming IBM’s semiconductor research cleanroom, supporting early prototyping of breakthrough technologies and developing leading-edge semiconductor technologies. In addition to his deep expertise in leading major business initiatives, Dr. Goldblatt has extensive experience in leading and developing executive management teams.

“In order to move the industry forward and deliver value to our members, we must act aggressively to capture and capitalize on new opportunities that will position SEMATECH as an industry leader,” said Goldblatt. “By focusing on flawless execution of our operating strategy, we will leverage the full capabilities of our technical programs and deliver long-term value to our members and the industry at large.”

SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies on December 3 at SEMICON Japan 2014 in Tokyo.

Terry Higashi will receive the 18th SEMI Sales and Marketing Excellence Award for being a catalyst in the development of the advanced semiconductor research infrastructure in Albany, New York; setting a new standard for partnerships with his trusted relationship-style with customers; as well as his early efforts to globalize the company he leads and promote a collaboration model of industry engagement.

“Higashi-san is recognized as a leader and visionary throughout the semiconductor manufacturing supply chain,” said Denny McGuirk, president and CEO of SEMI. “His significant marketing leadership has served to energize the industry, and as a result he has had an impact extending far beyond his own company.”

Factors considered by the award selection committee in the evaluation of nominees include: marketing contribution, market growth considerations, value to the customer, and strategic importance to the industry. Many prominent industry executives representing both customers and competitors that commented during the committee’s due diligence process noted that, during the course of Higashi’s 35-year career, he championed the concept of a connected Value Chain with customers, suppliers, employees, and industry colleagues.

His encouragement of open platform initiatives and industry collaboration helped bring customers and suppliers closer together, increase the return on R&D investments, and focus research spending on the most challenging technical and economic challenges of Moore’s law. His leadership was vital to driving cooperation among SEMI members and their customers at innovation centers and consortia around the world that have helped the industry share risk and drive technology roadmaps.

Higashi is recognized as an early proponent of global business model among Japanese equipment company leaders. Early in his management tenure, at a time when the industry was transitioning from regional markets served by local suppliers to a truly global manufacturing supply chain, Higashi supported the transformation of TEL from a domestic trading company to a major, international equipment manufacturer. His global vision for regionally based sales, support and marketing grew to be among the most effective and respected in all regions.

Higashi also has an established record of industry stewardship. He was elected to the SEMI International Board of Directors in 1999 and served as Chairman of the SEMI Board from 2004 to 2005. He was named Director Emeritus of the Board in 2010. He also served as Chairman of SEAJ (Semiconductor Equipment Association of Japan) from 2005-2011, and currently serves as its Vice Chairman.

Tetsuro (Terry) Higashi serves as the Chairman, President and CEO at Tokyo Electron Limited. He joined the company in 1977, having served as the President & CEO since 1996. He has worked in a variety of senior management positions. Higashi received an undergraduate degree from International Christian University in Tokyo, Japan and a master’s degree from Tokyo Metropolitan University, Hachioji City, Tokyo.

The SEMI Sales and Marketing Excellence Award was inspired by the late Bob Graham, the distinguished semiconductor industry leader who was part of the founding team of Intel and who helped establish industry-leading companies Applied Materials and Novellus Systems. The Award was established to honor individuals for the creation and/or implementation of marketing programs that enhance customer satisfaction and further the growth of the semiconductor equipment and materials industry.

Eligible candidates are nominated by their industry peers and are selected by an award committee. Previous recipients of this SEMI award include: Art Zafiropoulo (2000), Jim Healy and Barry Rapozo (2001), Jerry Hutcheson and Ed Segal (2002), Steve “Shigeru” Nakayama (2003), Edward Braun (2004), Archie Hwang (2005), Aubrey C. (Bill) Tobey (2006), Richard Dyck (2007), Richard Hong (2008), Peter Hanley (2009), Martin van den Brink (2010), Franz Janker (2011),  Dan Hutcheson (2012), JC Kim (2013), and Winfried Kaiser (2014).

The Semiconductor Industry Association (SIA), today announced that worldwide sales of semiconductors reached $87 billion during the third quarter of 2014, an increase of 5.7 percent over the previous quarter and a jump of 8 percent compared to the third quarter of 2013. Third quarter sales outperformed the latest World Semiconductor Trade Statistics (WSTS) industry forecast. Global sales for the month of September 2014 reached $29 billion, 8 percent higher than the September 2013 total of $26.9 billion and 1.9 percent more than last month’s total of $28.5 billion. All monthly sales numbers are compiled by WSTS and represent a three-month moving average.

“Through the third quarter of 2014, global semiconductor sales remain strong and well ahead of last year’s pace,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “The industry has now posted seven consecutive months of sequential monthly growth, and year-to-year growth has been strong across nearly all semiconductor product categories, with DRAM and Analog leading the way.”

Regionally, sales were up compared to last month in the Americas (2.8 percent) and Asia Pacific (2.5 percent), but down slightly in Europe (-0.1 percent) and Japan (-1.3 percent). Compared to September 2013, sales increased in Asia Pacific (12 percent), Europe (7.9 percent) and the Americas (3.7 percent), but decreased in Japan (-3.7 percent). All four regional markets have posted better year-to-date sales through September than they did through the same point last year.

September 2014      
Billions      
Month-to-Month Sales      
Market Last Month Current Month % Change
Americas 5.60 5.76 2.8%
Europe 3.22 3.22 -0.1%
Japan 3.07 3.03 -1.3%
Asia Pacific 16.57 16.99 2.5%
Total 28.46 29.00 1.9%
       
Year-to-Year Sales      
Market Last Year Current Month % Change
Americas 5.55 5.76 3.7%
Europe 2.98 3.22 7.9%
Japan 3.15 3.03 -3.7%
Asia Pacific 15.17 16.99 12.0%
Total 26.85 29.00 8.0%
       
Three-Month-Moving Average Sales      
Market Apr/May/Jun Jul/Aug/Sep % Change
Americas 5.24 5.76 9.8%
Europe 3.19 3.22 0.9%
Japan 2.97 3.03 2.2%
Asia Pacific 16.04 16.99 5.9%
Total 27.44 29.00 5.7%

 

Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.  SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology, will take place at its new venue in Tokyo Big Sight in Tokyo on December 3-5. A deep program spans from the 33rd annual SEMI Technology Symposium (STS) which begins on December 3, includes sessions on power devices, DFM, lithography, MEMS, packaging, and more to the new World of IoT (Internet of Things).

While the semiconductor and IC manufacturing industries have undergone consolidation, a surge in new investment points to a rebound in related spending in Japan. The semiconductor equipment market in Japan is forecast to grow both in 2014 and 2015.  Drivers for the increased investment are: memory devices, power semiconductors and “More than Moore” semiconductor technologies.  According to the SEMI World Fab Forecast, in 2014, Japan will spend more than $10 billion in 2014 on semiconductor equipment and materials.  The projection for 2015 is to more than double semiconductor equipment spending to $4.2 billion.

SEMICON Japan 2014 will bring Japan’’s rebounding semiconductor equipment market into focus and the underlying technology and business drivers.  SEMICON Japan will enable attendees to explore key technologies and business models necessary to grow in the coming years. On December 3, SEMICON Japan opens at 9:30am with a full day of speakers including:

  • Accenture Japan Ltd — Chikatomo Hodo, president and country managing director
  • IBM Japan — Chieko Asakawa, IBM fellow
  • Scripps Translational Science Institute — Donald Jones, chief digital officer
  • Toyota — Tokuhisa Nomura, executive general manager
  • Intel Japan — Makiko Eda, GM and president of Intel Japan
  • ARM K.K. — Yuzuru Utsumi, president
  • Toshiba — Yasuo Naruke, executive officer, corporate EVP and CEO, semiconductor & storage
  • National Institute of Information and Communication Technology (NIICT) — Miwako Doi, auditor

SEMICON Japan will also highlight emerging opportunities in its workforce composition.  In Japan, 14.7 percent of the students in science and engineering departments are women (source: Japan Ministry of Education, Culture, Sports, Science and Technology). SEMI will host a forum on “Women in Business” in Tokyo for the first time to discuss the gender diversity strategy, featuring women executives.

SEMICON Japan 2014 is the place for information exchange and networking opportunities for people interested in semiconductor-related businesses in Asia through the opening keynotes, pavilion and exchange networking events. SEMICON Japan 2014 also provides exhibitors an excellent opportunity to meet major device companies through the Suppliers Search Program. Japanese-English simultaneous translation will be available for many of the events and sessions at SEMICON Japan.

For further information on SEMICON Japan, visit www.semiconjapan.org/en/.