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FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors, power and other key electronic components. SEMI-FlexTech plans to announce multiple awards to teams or organizations with research and development capability in the U.S. White paper proposals are due July 9, 2018, at 5:00 PM PDT. Review the full Request for Proposal (RFP) for more information about the submission process here.

In partnership with the U.S Army Research Laboratories (ARL), SEMI-FlexTech is seeking proposals for projects that advance heterogeneous packaging for FHE including integrated systems, system architecture and design, and integrated power management components such as batteries, supercapacitors, and energy harvesting.

SEMI-FlexTech’s Technical Council will evaluate and rank proposals, prioritize and manage projects, and administer funding. Grant recipients must match the fund award with cash and in-kind contributions to cover total project cost. Historically, grant recipients have provided, on average, more than 60 percent of project costs. A product demonstration is also required for award consideration.

“This solicitation emphasizes FHE for the Internet of Things (IoT) as we seek to advance the state of the art and incorporate thinned ICs, flexible and printed electronics, power and sensors into a flexible, conformal, low-power package,” explained Melissa Grupen-Shemansky, Executive Director and CTO of SEMI-FlexTech. “The SEMI-FlexTech program is designed to engage multi-disciplinary teams from across the supply chain to develop creative solutions that accelerate the introduction of new FHE technologies.”

SEMI-FlexTech will fund technical approaches that are revolutionary or carry high risk as well as lower-risk evolutionary approaches with shorter development and delivery timetables. SEMI-FlexTech funds research and development initiatives that fall within the U.S. government’s Technology Readiness Levels (TRLs) 3-6 and Manufacturing Readiness Levels (MRLs) 1-3.

3D-Micromac AG, a supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced it has received an order for the company’s new microMIRA excimer laser lift-off (LLO) system from dpiX, a leading manufacturer of high-resolution digital sensors. The microMIRA system will be shipped to dpiX’s fab in Colorado Springs, Colo., where it will provide laser lift-off processing from Gen 4.5 glass substrates used in manufacturing X-ray sensors for medical, industrial and military applications.

The new microMIRA excimer laser lift-off system from 3D-Micromac provides highly uniform, force-free lift-off of flexible layers on large surface areas and at high speeds.

The new microMIRA excimer laser lift-off system from 3D-Micromac provides highly uniform, force-free lift-off of flexible layers on large surface areas and at high speeds.

3D-Micromac’s new microMIRA laser lift-off system provides highly uniform, force-free lift-off of flexible layers on large surface areas and at high speeds (up to 500 wafers/hour and up to 200 sheets/hour on Gen 6 substrates depending on the application). The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.

The microMIRA system can be used for a variety of applications, such as device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as organic light emitting diode (OLED) and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification, including printed electronics such as near-field communication (NFC) sensors and tags.

“In evaluating various laser approaches for our manufacturing needs, 3D-Micromac’s microMIRA laser lift-off system provided the best possible combination of cost of ownership, throughput and uniformity results,” stated Frank Caris, President and CEO of dpiX. “We look forward to installing this system in our production fab for use in manufacturing our latest silicon-based X-ray sensor arrays.”

In addition to its high configurability, speed and uniformity, 3D-Micromac’s microMIRA laser lift-off system provides many other benefits, including:

  • Force-free and extremely selective laser processing
  • No damage due to thermo-mechanical effects
  • Low production costs, including the ability to recycle/reuse carrier substrates
  • Elimination of costly and polluting wet chemical processes
  • Easy integration of adjacent manufacturing steps for greater fab productivity

“Our new microMIRA laser lift-off system takes advantage of the extensive process and applications knowledge we have built up from the more than 400 3D-Micromac laser systems installed and in use worldwide to date, including dozens of excimer laser systems used for display and microelectronics manufacturing,” stated Uwe Wagner, 3D-Micromac’s chief technology officer. “We look forward to closer engagement with dpiX to explore new opportunities and applications that can benefit from our laser products, processes and expertise.”

SEMI, the industry association representing the global manufacturing supply chain, today announced postponement of SEMICON Southeast Asia from 8-10 May 2018 to 22-24 May 2018. The postponement avoids a timing conflict with the recently announced Malaysian election planned for 9 May 2018. The venue for SEMICON Southeast Asia, the newly constructed Malaysia International Trade and Exhibition Centre (MITEC), remains unchanged

The postponement is in respect to Malaysian exhibitors and visitors to exercise their right to vote, said Ng Kai Fai, President of SEMI Southeast Asia. The decision was made in view of the election date and following discussions with SEMICON Southeast Asia stakeholders.

“We highly value and respect the country’s election process, which is very important for Malaysia and Malaysians,” Kai Fai said. “We also want to ensure that SEMICON Southeast Asia achieves its primary objective of forming connections and collaborations for exhibitors and visitors, both regionally and globally. We have received very strong support from our stakeholders and are confident and reassured that this will be the largest SEMICON Southeast Asia show to date.”

 

Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc. The PC market experienced a 14th consecutive quarter of decline, dating back to the second quarter of 2012.

Asia/Pacific and the U.S. experienced declining shipments, while other regions saw some minimal growth, but it was not enough to drive overall growth for the PC industry. In the first quarter of 2018, PC shipments in Asia/Pacific declined 3.9 percent compared with the same period last year, while shipments in the U.S. decreased 2.9 percent.

“The major contributor to the decline came from China, where unit shipments declined 5.7 percent year over year,” said Mikako Kitagawa, principal analyst at Gartner. “This was driven by China’s business market, where some state-owned and large enterprises postponed new purchases or upgrades, awaiting new policies and officials’ reassignments after the session of the National People’s Congress in early March.

“In the first quarter of 2018, there was some inventory carryover from the fourth quarter of 2017,” Ms. Kitagawa said. “At the same time, vendors were cautious in overstocking due to the upcoming release of new models in the second quarter of 2018 with Intel’s new eighth-generation core processors.”

The top three vendors — HP, Lenovo and Dell — accounted for 56.9 percent of global PC shipments in the first quarter of 2018, compared with 54.5 percent of shipments in the first quarter of 2017 (see Table 1). Dell experienced the strongest growth rate among the top six vendors worldwide, as its shipments increased 6.5 percent.

Table 1
Preliminary Worldwide PC Vendor Unit Shipment Estimates for 1Q18 (Thousands of Units)

Company

1Q18 Shipments

1Q18 Market Share (%)

1Q17 Shipments

1Q17 Market Share (%)

1Q18-1Q17 Growth (%)

HP Inc.

12,856

20.8

12,505

20.0

2.8

Lenovo

12,346

20.0

12,305

19.7

0.3

Dell

9,883

16.0

9,277

14.8

6.5

Apple

4,264

6.9

4,199

6.7

1.5

Asus

3,900

6.3

4,458

7.1

-12.5

Acer Group

3,828

6.2

4,189

6.7

-8.6

Others

14,609

23.7

15,637

25.0

6.6

Total

61,686

100.0

62,569

100.0

-1.4

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels. Numbers may not add up to totals shown due to rounding.
Source: Gartner (April 2018)

HP Inc.’s worldwide PC shipments increased 2.8 percent in the first quarter of 2018 versus the same period last year. In EMEA, HP Inc. recorded double-digit growth in both desktop and mobile PCs. This was contrasted with a small decline in other regions. HP Inc. was adversely impacted by declining demand in the U.S., which generally accounts for one-third of its total shipments.

Lenovo’s global PC shipments remained flat in the first quarter of 2018. Lenovo achieved 6 percent growth in EMEA and double-digit shipment growth in Latin America. However, in Asia/Pacific (its largest market), PC shipments declined 4 percent.

After record holiday sales for consumer and gaming products in the fourth quarter of 2017, Dell continued to perform well in the first quarter of 2018. With double-digit shipment increases in EMEA, North America and Latin America, Dell grew in all regions except Asia/Pacific. Desktop and mobile PCs grew in equal measures, showing Dell’s strength in the business segment.

Rising ASPs

The average selling prices (ASPs) of PCs continue to rise. Acknowledging deceleration in the smartphone market, and uncertainty in PC replacement demand, component companies remain cautious about expanding their production capabilities. Therefore, persistent component shortages and a rising bill of materials continue to create an environment conductive to higher prices.

“In contrast to other DRAM-related price spikes, PC vendors are not reacting by reducing DRAM content. Rather they have passed the cost increase to consumers,” Ms. Kitagawa said. “With fewer people buying new machines, manufacturers need to get the highest profit margin from each sale. To do that, they are raising the selling points and focusing on customer experience or perception of value.”

Regional Overview

In the U.S., PC shipments totaled 11.8 million units in the first quarter of 2018, a 2.9 percent decrease from the first quarter of 2017. Dell moved into the No. 1 position in the U.S. based on shipments, as its market share increased to 29.1 percent. HP Inc. moved into the No. 2 position as its shipments declined 4.8 percent, and its market share totaled 28.4 percent in the first quarter of 2018 (see Table 2).

Table 2
Preliminary U.S. PC Vendor Unit Shipment Estimates for 1Q18 (Thousands of Units)

Company

1Q18 Shipments

1Q18 Market Share (%)

1Q17 Shipments

1Q17 Market Share (%)

1Q18-1Q17 Growth (%)

Dell

3,440

29.1

3,198

26.2

7.6

HP Inc.

3,363

28.4

3,532

29.0

-4.8

Lenovo

1,632

13.8

1,714

14.1

-4.8

Apple

1,491

12.6

1,484

12.2

0.5

Acer Group

321

2.7

429

3.5

-25.1

Others

1,586

13.4

1,836

15.1

-13.6

Total

11,833

100.0

12,193

100.0

-2.9

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels. Numbers may not add up to totals shown due to rounding.
Source: Gartner (April 2018)

PC shipments in EMEA totaled 18.6 million units in the first quarter of 2018, a 1.7 percent increase year over year. Enterprise shipments increased as many Windows 10 projects that were put on hold in 2017 began to be implemented. The fast approach of the compliance deadline for the General Data Protection Regulation (GDPR) in Europe, as well as earlier reports of cybersecurity breaches, made security a strong priority in the hardware refresh cycle among enterprises. Eurasia continued to be a bright spot for EMEA, as several countries, such as Russia, Ukraine and Kazakhstan, saw strong demand in the first quarter of 2018.

PC shipments in Asia/Pacific totaled 21.9 million units in the first quarter of 2018, a 3.9 percent decline from the first quarter of 2017. As previously mentioned, the PC market in China drove the decline in Asia/Pacific. There is no significant sign of strong upgrading to the special version of Windows 10 from the Chinese government institutions. Consumer demand was weak as most buyers already took advantage of the aggressive promotions offered in the fourth quarter of 2017.

These results are preliminary. Final statistics will be available soon to clients of Gartner’s PC Quarterly Statistics Worldwide by Region program. This program offers a comprehensive and timely picture of the worldwide PC market, allowing product planning, distribution, marketing and sales organizations to keep abreast of key issues and their future implications around the globe.

 

By Emir Demircan, Senior Manager Advocacy and Public Policy, SEMI Europe

With its leading research and development hubs, materials and equipment companies and chipmakers, the EU is in a strategic position in the global electronics value chain to support the growth of emerging applications such as autonomous driving, internet of things, artificial intelligence and deep learning. Underpinning the European electronics industry’s competitive muscle requires a new EU-wide strategy aimed at strengthening the value chain and connecting various players. Specializing and investing in key application segments, such as automotive where the EU enjoys a central place at global level, is crucial to help European electronics industry hold its ground.  In parallel, Europe’s production capabilities need bolstered, requiring effective use of Important Projects of Common European Interest (IPCEI).

On research, development and innovation (RD&I), the upcoming Framework Programme 9 (FP9) must provide unprecedented collaboration and funding opportunities to Europe’s electronics players. Concerning small and medium enterprises (SMEs) and startups, it is vital that EU policies are aligned with global trends and small and young companies benefit from a business-friendly regulatory framework. And as an overarching action, building a younger, bigger and more diverse talent pipeline is paramount for Europe to innovate in the digital economy.

Laith Altimime, President at SEMI Europe, opening speech at ISS Europe 2018

Laith Altimime, President at SEMI Europe, opening speech at ISS Europe 2018

These were the clarion messages that emerged from the Industry Strategy Symposium (ISS) Europe organized by SEMI in March, an event that brought together more than 100 industry, research and government representatives for in-depth discussions on strategies and innovations for Europe to compete globally. Here are the key takeaways:

1) Build a strong electronics value chain with a focus on emerging demands

In recent years the EU has focused on beefing up semiconductor production in Europe within the 2020-25 window, starting with the EU 10|100|20 Electronic Strategy of 2013. The strategy aims to secure about 20 percent of global semiconductor manufacturing by 2020 with the help of € 10 billion in public and private funding and € 100 billion investment from the industry. Today, Europe is not nearly on track to achieving this target. Supply-side policies have done little to help grow the EU semiconductor industry. Now is the time to change our thinking.

To nourish the electronics industry in Europe, we need to shift our focus to demand. Semiconductors are a key-enabling technology for autonomous driving, wearables, healthcare, virtual and augmented reality (VR/AR), artificial intelligence (AI) and all other internet of things (IoT) and big data applications. To become a world leader in the data economy and energize its semiconductor industry, Europe needs to start by better understanding the evolution of data technologies and their requirements from electronics players, then design and implement an EU-wide strategy focused on strengthening collaboration within the value chain.

2) Specialize and invest in Europe’s strengths that are enabled by electronics

Jens Knut Fabrowsky, Executive VP Automotive Electronics at Bosch

Jens Knut Fabrowsky, Executive VP Automotive Electronics at Bosch

Fueled by increasing demand for smaller, faster and more reliable products with greater power, the global electronics industry has developed a sophisticated global value chain. Europe brings to this ecosystem leading equipment and materials businesses, world-class R&D and education organizations, and key microelectronics hubs throughout Europe that are home to multinationals headquartered both in and outside of the EU. Nevertheless, global competition is growing ever fiercer in the sectors where the European microelectronics industry is most competitive: automotive, energy, healthcare and industrial automation. In the future, Europe is likely to be more challenged between the disruptive business models of North America and the manufacturing capacity of East Asia. The European electronics industry must re-evaluate its strengths and set a strategic direction.

Make no mistake: Europe is in a strong position to advance its microelectronics industry. The EU already boasts leading industries that rely on advances made by electronics design and manufacturing. Take the automotive industry – crucial to Europe’s prosperity. Accounting for 4 percent of the EU GDP and providing 12 million jobs in Europe, according to the European Commission, the EU automotive industry exerts an important multiplier effect in the economy. Automotive is essential to both upstream and downstream industries such as electronics – a level of importance not lost on the EU’s GEAR 2030 Group. Since the 1980s, automotive industry components have increasingly migrated from mechanical to electrochemical and electronics.

Today, electronic components represent close to a third of the cost of an automobile, a proportion that will grow to as high as 50 percent by 2030 with the rise of autonomous and connected vehicles. Automotive experts anticipate that over the next five to 10 years, new cars will feature at least some basic automated driving and data exchange capabilities as electronics deepen their penetration into the automotive value chain. Europe’s leadership position and competitive edge in automotive are under threat by competitors across the world as they invest heavily in information and communications technologies (ICT) and electronics for autonomous driving and connected vehicles. Investing in next-generation cars will help the European electronics industry retain its strong competitive position, as will investments in other key application areas such as healthcare, energy and industrial automation where Europe is a global power.

3) Make better use of Important Projects of Common European Interest (IPCEI)

Microelectronics is capital-intensive, with a state-of-the-art fab easily costing billions of euros. That’s why countries around the world are making heavy government-backed investments to build domestic fabs. For instance, China’s “Made in China 2025” initiative, which establishes an Integrated Circuit Fund to support the development of the electronics industry, calls for 150 billion USD in funding to replace imported semiconductors with homegrown devices. In 2014, the European Commission adopted new rules to IPCEI, giving Member States a tool for financing large, strategically important transnational projects. IPCEI should help Member States fill funding gaps to overcome market failures and reinvigorate projects that otherwise would not have taken off. To fully benefit from the IPCEI, the industry requires Member States involved in a specific IPCEI to work in parallel and at the same pace and faster approvals of state-supported manufacturing projects.

4) Use FP9 to strengthen Europe’s RD&I capabilities

Panel Discussion on growing Europe in the global value chain. (L-R) Bryan Rice, GLOBALFOUNDRIES; James Robson, Applied Materials Europe; Joe De Boeck, imec; Leo Clancy, IDA Ireland; James O’Riordan, S3; Colette Maloney, European Commission; Moderator: Andreas Wild

Panel Discussion on growing Europe in the global value chain. (L-R) Bryan Rice, GLOBALFOUNDRIES; James Robson, Applied Materials Europe; Joe De Boeck, imec; Leo Clancy, IDA Ireland; James O’Riordan, S3; Colette Maloney, European Commission; Moderator: Andreas Wild

A top EU priority in recent years has been to enhance Europe’s position as a world leader in the digital economy. Fulfilling this mission requires an innovative electronics industry in Europe. To this end, FP9 should encourage greater collaboration between large and small companies to leverage their complementary strengths – the dynamism, agility and innovation of smaller companies and the ability of larger companies to mature and scale new product ideas on the strength of their extensive private funding instruments and testing and demonstration facilities. Also, future EU-funded research actions should prioritize electronics projects involving players across the value chain, starting with materials and equipment providers and spanning chipmakers, system integrators and players from emerging “smart” verticals such as automotive, medical technology and energy. FP9 should also play the pivotal role of setting clear objectives, increasing investments, and easing rules for funding. These measures would help expand the European electronics ecosystem, accelerate R&D results and defray the rising costs of developing cutting-edge solutions key to the growth of emerging industry verticals.

5) Support high-tech SMEs, entrepreneurship and startups to become globally competitive

European SMEs, the backbone of EU’s manufacturing, are already strong players in the global economy, making outsize contributions to Europe’s innovation. Yet more of Europe’s small and young businesses with limited resources are challenged in Europe’s regulatory labyrinth. Only by improving the European regulatory environment in a way that supports young and small businesses can Europe fulfill its vision of a dynamic electronics ecosystem and digital economy. Access to finance must also be easier, particularly as underinvested startups struggle under a European venture capital apparatus that is smaller and more fragmented than those in North America and Asia. Early-stage funding instruments such as bank loans are essential for young businesses but they often face barriers to finance due to the sophistication of their proposed business models that are difficult to be understood and supported by banks.

One answer is to better familiarize Europe’s financial sector with industrial SMEs and startups so they can co-develop financial tools that support the growth of small and young businesses. Also, the narrow European definition of SME with staff headcount limited to 250 block innovative companies from access to financial tools exclusively provided to SMEs. By contrast, the United States defines SMEs as businesses with as many as 500 employees, placing their EU counterparts at distinct funding disadvantage. EU should ensure that its SME policy is aligned with global trends and industry needs.

6) Create a bigger and more diverse talent pipeline with a hybrid skills set 

Europe’s world-class education and research capabilities help supply the electronics industry with skilled workforce. Yet the blistering pace of technology innovation calls for rapidly evolving skills sets, a trend that has led to worker shortages at electronics companies and left the sector fighting to diversify its workforce and strengthen its talent pipeline. The deepening penetration of electronics in AI, IoT, AR/VR, high-performance computing (HPC), cybersecurity and smart verticals is giving rise to a new set of skills that blend production technologies, software and data analytics. As more technologies converge, the gap between university education and business needs continues to widen.

One solution is work-based learning – allowing students to build job skills in a setting related to their career pathway. Encouraging higher female participation in STEM education programs at the high school and university levels is also a must to overcome the traditionally low number of females entering high technology. To build on its reputation as “a place to work” in the eyes of the international job seekers, Europe also needs a more flexible immigration framework to attract skilled labour to high-tech jobs.

Save the Date: Industry leaders, research and government representatives will meet again next year at the ISS Europe organized by SEMI on 28-30 April 2019 in Milan, Italy. More details regarding the event will be published soon on www.semi.org/eu.

By Jamie Girard, Sr. Director, Public Policy, SEMI

Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year. Congressional spending has been allocated in fits and starts since the end of FY 2017 last September, with patchwork deals keeping things running amid pervasive uncertainty. While this clearly isn’t an ideal way to fund the federal government, the end result will make many in the business of research and development pleased with the addition of more resources for science and innovation.

There was grave concern over the future of federal spending with the release of the president’s FY 2018 budget, which would have cut the National Science Foundation (NSF) budget by 11 percent and National Institutes of Standards & Technology (NIST) spending by 30 percent. Relief came with early drafts from Congress that whittled those cuts down to between 2-9 percent. But the real boost was a February bipartisan Congressional agreement that lifted self-imposed spending caps and introduced a generous dose of non-defense discretionary spending, increasing NSF spending 3.9 percent over the previous year and the NIST budget an astounding 25.9 percent over FY 2017 levels.

SEMI applauds this much-needed support for basic research and development (R&D) at these agencies after their budgets were cut or flat-funded for multiple cycles. It is well understood that federal R&D funding is critical to U.S. competitiveness and future economic prosperity. With the stakes that high, full funding of R&D programs at the NSF and NIST should be a bipartisan national priority backed by a strong and united community of stakeholders and advocates in the business, professional, research, and education communities.

With the work for FY 2018 completed, Congress will now turn to FY 2019 spending – already behind schedule due to the belated completion of the previous year’s budget. With 2018 an election year, Congress will likely begin work on the FY 2019 budget in short order, but probably won’t complete its work prior to the November elections.  SEMI will continue to work with lawmakers to support the R&D budgets at the agencies and their important basic science research. If you’d like to know how you can be more involved with SEMI’s public policy work, please contact Jamie Girard, Sr. Director, Public Policy at [email protected].

Samsung Electronics Co., Ltd. today announced more value added 8-inch (200mm) technology solutions for its foundry customers. On top of its existing eFlash, Power, display driver IC (DDI) and CMOS image sensor (CIS) offerings, RF/IoT and fingerprint technology solutions are now available through Samsung’s 8-inch foundry services.

Currently, customers are working closely with Samsung to utilize the company’s cutting-edge 8-inch technology offerings in various applications. All 8-inch offerings, ranging from 180nm to 65nm, are processed at Line 6, a highly automated facility in Giheung, Korea.

“Customers’ interests are very high given the industry’s needs for alternative 8-inch solutions,” said Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. “By expanding our technology offerings into the RF/IoT and fingerprint segments, we will enable our customers to take advantage of Samsung’s state-of-the-art 8-inch solutions in a broader range of applications.”

Samsung’s 8-inch process technology offerings now include the following solutions:

  • eFlash : 130nm, 65nm
  • Power: 130nm, 90nm (BCD+eFlash)
  • Display Driver IC : 180nm, 130nm, 90nm, 70nm
  • CMOS Image Sensor: 90nm
  • RF/IoT : 90nm (Ultra low leakage device)
  • Fingerprint Sensor: 180nm

The 8-inch foundry market has been one of the focal points since Samsung Foundry became a separate business last May. In this regard, Samsung has firmly established customer centric 8-inch service capabilities with great multi project wafer (MPW) programs as well as intellectual property (IP), and launched the Samsung Advanced Foundry Ecosystem (SAFE™) program this year.

SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California. Building on a year of record-breaking industry growth, SEMICON West 2018 will highlight the engines of future industry expansion including smart transportation, smart manufacturing, smart medtech, smart data, big data, artificial intelligence, blockchain and the Internet of Things (IoT). Click here to register.

Themed BEYOND SMART, SEMICON West 2018 sets it sights on the growing impact of cognitive learning technologies and other industry disruptors with programs and new Smart Pavilions including Smart Manufacturing and Smart Transportation to showcase interactive technologies for immersive, virtual experiences. Each Pavilion will feature a Meet the Experts Theater with an intimate setting for attendees to engage informally with industry thought leaders.

Smart Workforce Pavilion: Connecting Next-Generation Talent with the Microelectronics Industry

The SEMI Smart Workforce Pavilion at SEMICON West 2018 leverages the largest microelectronic manufacturing event in North America to draw the next generation of innovators. Reliant on a highly skilled workforce, the industry today is saddled with thousands of job openings and fierce competition for workers, bringing renewed focus to strengthening its talent pipeline. Educational and engaging, the Pavilion connects the microelectronics industry with college students and entry-level professionals interested in career opportunities.

In the Workforce Pavilion “Meet the Experts” Theater, industry engineers will share insights and inspiration about their personal working experiences and career advisors will offer best practices. Recruiters from top companies will be available for on-the-spot interviews, while career coaches offer mentoring, tips on cover letter and resume writing, job-search guidance, and more. Visitors will learn more about the industry’s vital role in technological innovation in today’s connected world.

This year, SEMI will also host High Tech U (HTU) in conjunction with the SEMICON West Smart Workforce Pavilion. The highly-interactive program supported by Advantest, Edwards, KLA-Tencor and TEL exposes high school students to STEM education pathways and stimulates excitement about careers in the industry.

Free registration with three-day access and shuttle service to SEMICON West are available to all college students. Students are encouraged to register for the mentor program, attend keynotes and tour the exposition hall to see everything the industry has to offer.  To learn more, visit Smart Workforce Pavilion and College Track to preview how students can enter to win a $500 hiring bonus!

Three Ways to Experience the Expo

Attendees can tailor their SEMICON West experience to meet their specific interests. The All-In pass covers every program and event, while the Thought-Leadership and Expo-Only packages offer scaled pricing and program options. Attendees can also purchase select events and programs à la carte, including exclusive IEEE-sponsored sessions, the SEMI Market Symposium, and the STEM Rocks After-hours Party, a fundraising event to support the SEMI Foundation.

Immersion Corporation (NASDAQ:IMMR), a developer and licensor of touch feedback technology, today announced that it has filed a second complaint in the U.S. District Court for the Eastern District of Texas against Samsung Electronics America, Inc. and Samsung Electronics Co., Ltd. alleging that certain Samsung touchscreen phones, including the Galaxy S8, infringe Immersion’s U.S. Patent No. 8,619,051, “Haptic Feedback System with Stored Effects” (the ’051 patent) The complaint seeks to stop further infringement by Samsung and to recover damages. The ‘051 patent is one of the patents that Immersion asserted against Apple, Inc. which litigation has since terminated in a settlement and license agreement.

In the third quarter of 2017, Immersion filed a complaint against Samsung Electronics America, Inc. and Samsung Electronics Co., Ltd. in the U.S. District Court for the Eastern District of Texas alleging that certain Samsung touchscreen phones, including the Galaxy S8, infringe certain Immersion patents covering haptic feedback systems and methods in electronic devices. The Court has scheduled a claim construction hearing for August 15, 2018 and a trial date of February 19, 2019.

In addition, Immersion also announced today that it has filed a complaint in the Fuzhou Intermediate Court in Fuzhou, China against Samsung (China) Investment Co., Ltd., Huizhou Samsung Electronics Co., Ltd and Fujian Province Min Xin Household Electrical Appliances Technology Service Co., Ltd. alleging that certain Samsung touchscreen phones, including the Galaxy S8, infringe three Immersion Chinese patents covering haptic feedback systems and methods in electronic devices.

The Chinese patents being asserted are:

Chinese Patent No. ZL02821854.X “Input device and mobile telephone comprising the input device;”

Chinese Patent No. ZL201210005785.2 “Method and apparatus for providing tactile sensations;” and

Chinese Patent No. ZL201310253562.2 “Methods and apparatus for providing tactile sensations.”

These patents are related to the patents that were asserted against Apple, Inc. which litigation has since terminated in a settlement and license agreement.

 

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $37.6 billion for the month of January 2018, an increase of 22.7 percent compared to the January 2017 total of $30.6 billion. Global sales in January were 1.0 percent lower than the December 2017 total of $38.0 billion, reflecting normal seasonal market trends. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“After notching its highest-ever annual sales in 2017, the global semiconductor industry is off to a strong and promising start to 2018, posting its highest-ever January sales and 18th consecutive month of year-to-year sales increases,” said John Neuffer, president and CEO, Semiconductor Industry Association. “All major regional markets saw double-digit growth compared to last year, with the Americas leading the away with year-to-year growth of more than 40 percent. With year-to-year sales also up across all major semiconductor product categories, the global market is well-positioned for a strong start to 2018.”

Year-to-year sales increased substantially across all regions: the Americas (40.6 percent), Europe (19.9 percent), Asia Pacific/All Other (18.6 percent), China, (18.3 percent), and Japan (15.1 percent). Month-to-month sales increased slightly in Europe (0.9 percent), held flat in China, but fell somewhat in Asia Pacific/All Other (-0.6 percent), Japan (-1.0 percent), and the Americas (-3.6 percent).

To find out how to purchase the WSTS Subscription Package, which includes comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, please visit http://www.semiconductors.org/industry_statistics/wsts_subscription_package/. For detailed data on the global and U.S. semiconductor industry and market, consider purchasing the 2017 SIA Databook: https://www.semiconductors.org/forms/sia_databook/.

Jan 2018

Billions

Month-to-Month Sales                              

Market

Last Month

Current Month

% Change

Americas

8.95

8.63

-3.6%

Europe

3.37

3.40

0.9%

Japan

3.24

3.21

-1.0%

China

12.01

12.01

0.0%

Asia Pacific/All Other

10.41

10.35

-0.6%

Total

37.99

37.59

-1.0%

Year-to-Year Sales                         

Market

Last Year

Current Month

% Change

Americas

6.14

8.63

40.6%

Europe

2.84

3.40

19.9%

Japan

2.79

3.21

15.1%

China

10.16

12.01

18.3%

Asia Pacific/All Other

8.73

10.35

18.6%

Total

30.64

37.59

22.7%

Three-Month-Moving Average Sales

Market

Aug/Sep/Oct

Nov/Dec/Jan

% Change

Americas

8.54

8.63

1.1%

Europe

3.36

3.40

1.1%

Japan

3.20

3.21

0.3%

China

11.65

12.01

3.1%

Asia Pacific/All Other

10.33

10.35

0.1%

Total

37.09

37.59

1.4%