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Qualcomm’s proposed acquisition of NXP Semiconductors marks the latest deal in a wave of industry consolidation that includes increasingly expensive transactions with greater focus on expanding scope rather than economies of scale, according to Fitch Ratings. Fitch believes consolidation in the chip industry will continue through the intermediate term within the context of cheap financing and tepid demand in more mature semiconductor markets.

While the NXP deal is expensive (and the largest ever) at $47 billion, including nearly $8 billion of net debt at NXP, Qualcomm will be able to tax-efficiently use offshore cash to fund a material amount of the all-cash transaction, given NXP’s Dutch incorporation. Fitch estimates Qualcomm will use approximately $28 billion of its $31 billion of total available cash at June 26, 2016 (more than $28 billion is located outside the U.S.) of offshore cash as of June 26, 2016 (versus $31 billion of total cash) and $11 billion of new debt, resulting in a Fitch estimated total leverage (total debt to operating EBITDA) of roughly 3.2x at closing. Despite the high price tag, Fitch believes the 4.6x revenue purchase multiples is in line with averages paid in large transactions completed over the last year, which Fitch estimates was roughly 5x revenues.

The Qualcomm deal with NXP is the latest example of chip companies acquiring capabilities within growth markets, particularly automotive and internet of things (IoT), as traditional semiconductor PC and smartphone markets mature. Qualcomm expects the acquisition will increase its addressable market by 40%, driven by increasing semiconductor content per car in automotive markets, exponential growth of connected devices in IoT markets and growing adoption of credit card security technologies.

Avago Technologies’ Feb. 2, 2016 acquisition of Broadcom for $37 billion focused on leveraging Broadcom’s leading wi-fi technology for the IoT market. Qualcomm’s August 2016 $2.4 billion acquisition of CSR plc strengthened Qualcomm’s nascent automotive and IoT offerings with significant semiconductor and software capabilities. Intel’s December 2015 acquisition of Altera Inc. for $16.7 billion acquisition of Altera diversified Intel away from personal computers by combining Altera’s field-programmable gate arrays with Intel’s low power processors for IoT applications. Even NXP’s December 2015 $12 billion acquisition of Freescale Semiconductor focused on expanding already strong capabilities and share in automotive and IoT markets.

Qualcomm has been in strategic review mode over the past few years amid growth concerns reflecting intensifying competition in the maturing smart phone market from the likes of Intel and a less robust long-term outlook for licensing revenue in China, where most smartphone unit growth is expected. The acquisition of NXP meaningfully diversifies Qualcomm’s end market exposure, reducing wireless handset exposure to below 50% of mobile products sales from 61% currently, and provides a top line growth catalyst, as well as earnings growth beyond significant share repurchases.

Fitch believes deal integration may be complicated by NXP’s ongoing integration of Freescale, which was structured largely as a merger of equals, and lack of technology overlap, given Qualcomm’s system-on-a-chip for mobile devices and telecom equipment focus and NXP’s focus on mixed-signal semiconductors and microprocessors and microcontrollers.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $88.3 billion for the third quarter of 2016, marking the industry’s highest-ever quarterly sales and an increase of 11.5 percent compared to the previous quarter. Sales for the month of September 2016 were $29.4 billion, an increase of 3.6 percent over the September 2015 total of $28.4 billion and 4.2 percent more than the previous month’s total of $28.2 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor market has rebounded markedly in recent months, with September showing the clearest evidence yet of resurgent sales,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The industry posted its highest-ever quarterly sales total, with most regional markets and semiconductor product categories contributing to the gains. Indications are positive for increased sales in the coming months, but it remains to be seen whether the global market will surpass annual sales from last year.”

Regionally, month-to-month sales increased in September across all markets: China (5.4 percent), the Americas (4.6 percent), Asia Pacific/All Other (4.2 percent), Japan (2.3 percent), and Europe (1.6 percent). Compared to the same month last year, sales in September increased in China (12.0 percent), Japan (4.2 percent), and Asia Pacific/All Other (1.7 percent), but decreased in the Americas (-2.4 percent) and Europe (-4.0 percent).

China stood out in September, leading all regional markets with growth of 5 percent month-to-month and 12 percent year-to-year,” Neuffer said. “Standouts among semiconductor product categories included NAND flash and microprocessors, both of which posted solid month-to-month growth in September.”

September 2016

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.43

5.68

4.6%

Europe

2.71

2.76

1.6%

Japan

2.74

2.80

2.3%

China

8.99

9.47

5.4%

Asia Pacific/All Other

8.37

8.73

4.2%

Total

28.24

29.43

4.2%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.82

5.68

-2.4%

Europe

2.87

2.76

-4.0%

Japan

2.69

2.80

4.2%

China

8.45

9.47

12.0%

Asia Pacific/All Other

8.58

8.73

1.7%

Total

28.41

29.43

3.6%

Three-Month-Moving Average Sales

Market

Apr/May/Jun

Jul/Aug/Sept

% Change

Americas

4.94

5.68

15.0%

Europe

2.68

2.76

3.0%

Japan

2.53

2.80

10.8%

China

8.29

9.47

14.2%

Asia Pacific/All Other

7.97

8.73

9.5%

Total

26.41

29.43

11.5%

IC Insights will release its October Update to the 2016 McClean Report later this week.  This Updateincludes a review of IC Insights’ latest 2016 IC market forecast, an update on the rebounding DRAM market, and an extensive analysis of the optoelectronics, sensor/actuator, and discrete (O-S-D) markets. An excerpt from the October Update, describing the upgraded 2016 IC market forecast, is shown below.

IC Insights has raised its IC market forecast for 2016 by three percentage points from a 2% decline to a 1% increase and its 2016 IC unit volume shipment growth rate forecast from 4% to 6%.  A large portion of this revision is due to a strengthening DRAM market.

Although the average third quarter sequential increase in the worldwide IC market since 2002 has been 8%, last year’s 3Q growth rate was barely positive with a meager 1% increase.  However, 3Q16 results were slightly above the past 15-year average and posted a strong 9% jump.  Moreover, with an anticipated increase of 1% next quarter, the total 4Q16 IC market is forecast to climb to $76.9 billion, a new quarterly record high, surpassing the previous high of $76.7 billion posted in 4Q14.

It should be noted that the average second half versus first half of the year growth rate in the IC market since 1990, including the forecast for 2016, is 8.9% (Figure 1).  However, IC Insights is forecasting that the 2H16 IC market will be up 12.3% as compared to 1H16, a strong turnaround from the extremely poor second half result of -1.2% posted last year and the highest second half growth rate since 2009.

With expectations for slightly better worldwide GDP growth in 2017 as compared to 2016 and continued firming of both DRAM and NAND memory prices, IC Insights believes that the worldwide IC market will grow by 4% next year (IC Insights’ detailed 2016-2020 IC market forecast by product type will be presented in the November Update).

history of ic growth

Less than a micrometre thin, bendable and giving all the colours that a regular LED display does, it still needs ten times less energy than a Kindle tablet. Researchers at Chalmers University of Technology have developed the basis for a new electronic “paper”. Their results were recently published in the high impact journal Advanced Materials.

Chalmers' e-paper contains gold, silver and PET plastic. The layer that produces the colours is less than a micrometre thin. Credit: Mats Tiborn

Chalmers’ e-paper contains gold, silver and PET plastic. The layer that produces the colours is less than a micrometre thin. Credit: Mats Tiborn

When Chalmers researcher Andreas Dahlin and his PhD student Kunli Xiong were working on placing conductive polymers on nanostructures, they discovered that the combination would be perfectly suited to creating electronic displays as thin as paper. A year later the results were ready for publication. A material that is less than a micrometre thin, flexible and giving all the colours that a standard LED display does.

“The ‘paper’ is similar to the Kindle tablet”, says Andreas Dahlin. “It isn’t lit up like a standard display, but rather reflects the external light which illuminates it. Therefore it works very well where there is bright light, such as out in the sun, in contrast to standard LED displays that work best in darkness. At the same time it needs only a tenth of the energy that a Kindle tablet uses, which itself uses much less energy than a tablet LED display”.

It all depends on the polymers’ ability to control how light is absorbed and reflected. The polymers that cover the whole surface lead the electric signals throughout the full display and create images in high resolution. The material is not yet ready for application, but the basis is there. The team has tested and built a few pixels. These use the same red, green and blue (RGB) colours that together can create all the colours in standard LED displays. The results so far have been positive, what remains now is to build pixels that cover an area as large as a display.

“We are working at a fundamental level but even so, the step to manufacturing a product out of it shouldn’t be too far away. What we need now are engineers”.

One obstacle today is that there is gold and silver in the display, which makes the manufacturing expensive.

“The gold surface is 20 nanometres thick so there is not that much gold in it”, says Andreas Dahlin. “But at present there is a lot of gold wasted in manufacturing it. Either we reduce the waste or we find another way to decrease the manufacturing cost”.

Andreas Dahlin thinks the best application for the displays will be well-lit places such as outside or in public places to display information. This could reduce the energy consumption and at the same time replace signs and information screens that aren’t currently electronic today with more flexible ones.

Flat-panel display (FPD) equipment sales are expected to attain their highest sustained three-year level in the history of the industry. FPD equipment spending will rise 89 percent, hitting $12.9 billion in 2016. Increased spending levels will continue, reaching $13 billion in 2017, then declining slightly to $11.8 billion in 2018, according to IHS Markit (Nasdaq: INFO).

fpd equipment

“Investments in new FPD factories had been trending upwards for the past several years as Chinese panel makers continue to relentlessly build new FPD factories to make the country the largest FPD producing region in the world,” said Charles Annis, senior director at IHS Markit. “In fact, China will surpass long-dominant South Korea in capacity share by the second quarter of 2017.”

According to the IHS Markit Display Supply Demand & Equipment Tracker, in addition to the substantial number of sixth-generation (Gen 6) and Gen 8 factories (fabs) being built in China, the two largest panel makers in the country, BOE and China Star, are rushing to construct Gen 10.5 fabs that process enormous glass substrates, targeting efficient production of 65-inch and 75-inch panels. FPD makers in South Korea and Japan have now started ceding the LCD market to producers of lower-cost displays in China. They are also starting to shutter their large-area LCD factories, to focus on active-matrix organic light-emitting diode (AMOLED) panel production, where they still have a technology edge. Declining capacity in other regions is now balancing supply and demand, which is further encouraging Chinese makers to press their advantage and build even more factories. China will account for sixty-five percent of all FPD equipment spending, on average, between 2016 and 2018.

The FPD industry is in the midst of an unprecedented and rapid display technology shift from LCD to AMOLED for mobile applications. Samsung Display has led this change to-date with the success of its own AMOLED displays for Galaxy-based products and expansion of AMOLED panel sales to other smartphone makers looking to differentiate their products with high-end displays. Panel makers in South Korea and Japan are rushing to build new AMOLED fabs, so as not to miss out on the market shift. Chinese makers, backed by joint ventures with regional governments, are also building a large number of AMOLED factories, because they view AMOLED as a potential opportunity to upgrade from trailing-edge to leading-edge display manufacturing.

“Not only are there an extraordinary number of new FPD factories under construction, but many of the new factories are also some of the most expensive ever built,” Annis said. “Of course, the Gen 10.5 factories have much more capacity, but the capital costs are more than twice that of typical Gen 8 factories, due to the size of machines and unique facility requirements.”

Almost all of the new AMOLED factories plan to produce flexible, plastic-based displays. Most of these new factories are adopting highly complicated, high-mask-count LTPS-TFT processes that require more high-resolution exposure lines and other supporting equipment. The new flexible AMOLED lines now under construction are almost 50 percent more expensive than the rigid AMOLED factories constructed only a few years ago.

“FPD equipment makers are scrambling to ramp-up capacity to meet customer demand and take advantage of the best sales opportunity ever,” Annis said. “Even so, equipment companies know how cyclical the market is, so they need to manage the additional capacity and staff they are now putting in place, when the market eventually starts to slow down.”

The IHS Markit Display Supply Demand & Equipment Tracker covers metrics used to evaluate supply, demand and capital spending for all major FPD technologies and applications.

Due to increasing capacity from China, South Korean LCD panel makers are quickly realizing that LCD displays profitability may eventually erode, due to growing capacity and price competition from China, so they are betting their future on organic light-emitting diode (OLED) displays. Because of lower profit margins and slowing market growth, the IT display category has become the first product line that LCD display manufacturers are quitting, according to IHS Markit (Nasdaq: INFO), a world leader in critical information, analytics and solutions.

Samsung Display was the first company to do so, selling a fifth generation (Gen 5) fabrication plant (fab) to a Chinese touch and module maker last year. In the future, more fab restructuring is expected, especially the facilities dedicated to making IT panels. 

“Brands like HP and Lenovo expected notebook panels to be in a surplus situation, and they were therefore keeping their panel inventories at very low levels,” said Jason Hsu, senior principal analyst, IHS Markit. “This shift from Samsung Display could cause some brands to experience panel shortages in the third quarter of 2016.”

BOE to possibly double its panel shipments this year

Samsung Display delivered 30 million notebook panels in 2015, according to the latest information from the IHS Markit Tablet and Notebook Display Market Tracker. With the company’s latest fab reorganization plan, notebook PC LCD panel shipments could fall to 12 million units in 2016 and to 4 million in 2017. There will be an 18 million-unit gap this year, which means brands might not be able to find other sources to keep up with production needs.

When reviewing the supply chain mix in the first quarter of 2016, it is clear that HP has been affected by these changes more than other companies, with shipments from Samsung Display down from 1.1 million units in first quarter to 350,000 units in the second quarter. However, HP has shifted its orders to other panel makers to secure enough panels for its production needs, for example, Innolux.

BOE is another panel maker benefitting from the exit of Samsung Display from this market. Panel shipments from BOE increased from 4.9 million units in the first quarter to 7.2 million in the second quarter. BOE is expected to grow its notebook business to more than 36 million units in 2017. BOE first began to supply panels for notebooks in 2009, and it has now become one of the largest IT panel suppliers. Furthermore, BOE has a Gen8 fab in Chongqing, China — near the world’s largest notebook production base. In fact, notebook panel shipments from the Chongqing fab are expected to grow quickly next year, thanks to the more efficient logistics.

Chinese and Taiwanese makers to increase unit shipments of premium panels 

LG Display and Samsung Display used to supply Apple with notebook panels; however, the fab re-organization — especially the reallocation of oxide capacity — has increased Apple’s concerns about a potential panel shortage and possible low yields. For this reason, Apple is expected to add another panel supplier for its new MacBook Pro, to diversify the risk from Samsung Display business changes. For its legacy MacBook Air line of notebook PCs, Apple is considering diversifying its supply chain to Chinese makers, which is the first time Apple will use LCD panels from China.

Samsung Display’s exit from the LCD display business has also affected the supply of wide-view-angle in-plane switching (IPS) and plane-to-line switching (PLS) displays. Samsung Display has been one of the major suppliers to offer wide-view-angle panels, and its shipment volume is second only to LG Display.

In order to source IPS and PLS panels, brands must find other sources to replace Samsung Display, after the company begins to reduce production. AUO is one of the qualified candidates, and apparently it is receiving more orders from notebook PC brands. AUO, Innolux and other Taiwanese manufacturers and BOE and other Chinese suppliers are all expanding IPS panels to respond to increasing panel requirements.

Today, at the OLEDs World Summit in San Diego, Kateeva, a OLED production equipment developer, reported that its YIELDjet FLEX system has earned a commanding lead in the key organic layer deposition step in the OLED Thin Film Encapsulation (TFE) market. Since the novel inkjet printing solution debuted in manufacturing in 2014, the company has secured the vast majority of available TFE orders. Customers include the world’s largest flat panel display manufacturers located in three key Asia regions.

TFE is a critical step in the flexible OLED manufacturing process. It gives thinness and flexibility to the OLED device, and helps reduce overall manufacturing costs. OLEDs utilizing TFE are revolutionizing the consumer electronics industry by enabling exciting new mobile products that are bendable, foldable and even roll-able. Kateeva’s YIELDjet FLEX system helped catalyze the transition to the new display technology by solving key technical challenges that previously made mass-producing OLEDs with TFE, including flexible OLEDs, economically unviable.

Kateeva CEO Alain Harrus attributed the company’s market momentum to the swift migration to flexible OLED mass production by display leaders. “That fast manufacturing transition speaks to the spirited innovation within the display industry, where leaders are testing the limits of physics, chemistry and engineering ingenuity, and making substantial R&D investments to commercialize revolutionary displays. We’re privileged to partner with these trail-blazing companies, and pleased that our YIELDjet technology is enabling their processes.”

The YIELDjet FLEX tool is the first system to emerge from Kateeva’s YIELDjet platform. The YIELDjet platform is Kateeva’s foundational technology. Introduced in late 2013, it was the first inkjet printing manufacturing equipment platform engineered specifically for OLED mass-production. OLED technology was already transforming rigid smart phone displays with vibrant color and extraordinary image quality. With new high-yield mass-production equipment, OLED technology would enable the next leap—freedom from glass substrates—a breakthrough that would unleash tantalizing new flexible products.

Kateeva’s YIELDjet FLEX system has enabled a rapid transition from glass encapsulation to TFE in new OLED production lines. The company’s precision deposition solution for the TFE organic layer deposition process is fast, offers good planarization, few particle defects, high material utilization, good scalability, and easy maintenance. These advantages deliver dramatically higher TFE yields and lower mass-production costs, making the system a powerful alternative to vacuum evaporation technologies which had reached their technical limits.

Today, barely two years after its debut, Kateeva’s YIELDjet FLEX tool is the undisputed leader in the industry.

At the OLEDs World Summit, Kateeva technologist, Neetu Chopra, Ph.D. will reveal how YIELDjet technology will soon be applied to mass-produce the RGB OLED layer to enable affordable OLED TVs. Dr. Chopra will present her talk today at 4:35pm.

Applied Materials, Inc. today introduced the display industry’s first high-resolution inline e-beam review (EBR) system, increasing the speed at which manufacturers of OLED and UHD LCD screens can achieve optimum yields and bring new display concepts to market.

Applied is the semiconductor industry leader in EBR with more than 70 percent market share in 2015. The company has combined its leading-edge SEM capabilities used in semiconductor device review with a large-scale display vacuum platform, resulting in an inline EBR technology that is the fastest, most effective method to discover and address the root causes of killer defects in advanced mobile and TV displays.

Applied’s EBR system has received orders from 6 of the top 10 largest display manufacturers in the world and demand is increasing as manufacturers look to quickly and cost effectively optimize their yields and bring new types of displays to market faster.

“Our new EBR system is the latest in a strong pipeline of display products that enables customers to solve critical OLED and LCD manufacturing challenges,” said Ali Salehpour, senior vice president and general manager, Display and Adjacent Markets and Applied Global Services, Applied Materials. “Applied’s unique ability to combine semiconductor yield techniques and panel-level SEM technology expands our addressable market and avoids costly yield excursions for our customers. Emerging applications such as augmented and virtual reality and smart vehicles require better displays with new form factors. These applications are driving demand for solutions like our EBR tool that give customers significant time-to-market advantages.”

“As a worldwide leader in display, Tianma values the strong relationship with Applied Materials to help us develop new technologies required to produce the high-quality, high-performance mobile displays that consumers have come to expect,” said Dr. Jun Ma, vice president, Tianma Micro-electronics Co., Ltd. “Applied’s EBR system will enable us to reduce the start-up time at our Wuhan fab and accelerate our ability to bring more advanced display technologies to market. In addition to EBR, we look forward to working with Applied to introduce other semiconductor yield techniques to mobile display manufacturing.”

Advanced display technologies require an increasing number of process steps resulting in more and smaller contaminates, and new types of defects. Current inline automated optical defect inspection tools for displays are not as effective as SEM analysis in distinguishing killer from non-killer defects, or in determining systematic root causes of defects. Prior to the introduction of Applied’s EBR system, conducting SEM analysis on displays required breaking the glass substrate into pieces and examining each piece separately under a microscope. This is not only costly and time consuming but also makes it nearly impossible to determine the location of the defect on the full panel. Applied solves these limitations by providing inline SEM review at the industry’s highest resolution and throughput without requiring the panel to be broken.

Applied Materials, Inc. (Nasdaq:AMAT) is a leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Applied Materials’ display e-beam review (EBR) system

Applied Materials’ display e-beam review (EBR) system

Solid State Technology announced today that its premier semiconductor manufacturing conference and networking event, The ConFab, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017. A 30% increase in attendance in 2016 with a similar uplift expected in 2017, makes the venue an ideal meeting location as The ConFab continues to expand.

    

For more than 12 years, The ConFab, an invitation-only executive conference, has been the destination for key industry influencers and decision-makers to connect and collaborate on critical issues.

“The semiconductor industry is maturing, yet opportunities abound,” said Pete Singer, Editor-in-Chief of Solid State Technology and Conference Chair of The ConFab. “The Internet of Things (IoT) is exploding, which will result in a demand for “things” such as sensors and actuators, as well as cloud computing. 5G is also coming and will be the key technology for access to the cloud.”

The ConFab is the best place to seek a deeper understanding on these and other important issues, offering a unique blend of market insights, technology forecasts and strategic assessments of the challenges and opportunities facing semiconductor manufacturers. “In changing times, it’s critical for people to get together in a relaxed setting, learn what’s new, connect with old friends, make new acquaintances and find new business opportunities,” Singer added.

Dave Mount

David Mount

Solid State Technology is also pleased to announce the addition of David J. Mount to The ConFab team as marketing and business development manager. Mount has a rich history in the semiconductor manufacturing equipment business and will be instrumental in guiding continued growth, and expanding into new high growth areas.

Mainstream semiconductor technology will remain the central focus of The ConFab, and the conference will be expanded with additional speakers, panelists, and VIP attendees that will participate from other fast growing and emerging areas. These include biomedical, automotive, IoT, MEMS, LEDs, displays, thin film batteries, photonics and advanced packaging. From both the device maker and the equipment supplier perspective, The ConFab 2017 is a must-attend networking conference for business leaders.

The ConFab conference program is guided by a stellar Advisory Board, with high level representatives from GLOBALFOUNDRIES, Texas Instruments, TSMC, Cisco, Samsung, Intel, Lam Research, KLA-Tencor, ASE, NVIDIA, the Fab Owners Association and elsewhere.

Details on the invitation-only conference are at: www.theconfab.com. For sponsorship inquiries, contact Kerry Hoffman at [email protected]. For details on attending as a guest or qualifying as a VIP, contact Sally Bixby at [email protected].

By Zvi Or-Bach, President & CEO, MonolithIC 3D Inc.

As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Our March 2014 blog Moore’s Law has stopped at 28nm has recently been re-confirmed. At the time we wrote: “From this point on we will still be able to double the amount of transistors in a single device but not at lower cost. And, for most applications, the cost will actually go up.” This reconfirmation can be found in the following IBS cost analysis table slide, presented at the early Sept FD-SOI event in Shanghai.

Gate costs continue to rise each generation for FinFETs, IBS predicts.

Gate costs continue to rise each generation for FinFETs, IBS predicts.

As reported by EE Times – Chip Process War Heats Up, and quoting Handel Jones of IBS “28nm node is likely to be the biggest process of all through 2025”.

IBS prediction was seconded by “Samsung executive showed a foil saying it believes 28nm will have the lowest cost per transistor of any node.” The following chart was presented by Samsung at the recent SEMICON West (2016).

Zvi 2

And even Intel has given up on its “every two years” but still claims it can keep reducing transistor cost. Yet Intel’s underwhelming successes as a foundry suggests otherwise. We have discussed it in a blog titled Intel — The Litmus Test, and it was essentially repeated by SemiWiki’s Apple will NEVER use Intel Custom Foundry!

This discussion seems academic now, as the actual engineering costs of devices in advanced nodes have shown themselves to be too expensive for much of the industry. Consequently, and as predicted, the industry is bifurcating, with a few products pursuing scaling to 7nm while the majority of designs use 28nm or older nodes.

The following chart derived from TSMC quarterly earnings reports was published last week by Ed Sperling in the blog Stepping Back From Scaling:

Zvi 3

Yes, the 50-year march of Moore’s Law has ended, and the industry is now facing a new reality.

This is good news for innovation, as a diversity of choices helps support new ideas and new technologies such as 3D NAND, FDSOI, MEMS and others. These technologies will enable new markets and products such as the emerging market of IoT.

A good opportunity to learn more about these new scaling technologies is the IEEE S3S ’16, to be held in the Hyatt Regency San Francisco Airport, October 10th thru 13th, 2016. It starts with 3D and FDSOI tutorials, the emerging technologies for the IC future. CEA Leti is scheduled to give an update on their CoolCube program, Qualcomm will present some of their work on monolithic 3D, and three leading researchers from an imec, MIT, and Korea university collaboration will present their work on advanced monolithic 3D integration technologies. Many other authors will discuss their work on monolithic 3DIC and its ecosystem, in addition to tracks focused on SOI, sub-VT and dedicated sessions on IoT.