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The explosion of touch-enabled screens used in smartphones, tablets and other consumer devices, along with improvements in touch technology, are increasing demand for touch-screen automotive displays used for navigation, entertainment and online services, climate control, energy efficiency tracking and other activities. According to IHS Inc. (NYSE: IHS), a source of critical information and insight, the compound annual growth rate (CAGR) for global automotive touch panel shipments — which includes shipments of factory-installed automotive touch panel systems, as well as aftermarket applications, dealer installations, and service replacements — will average 18 percent through 2018, with revenues forecast to reach $1.5 billion.

“Analog resistive touch has dominated automotive touch panels, because the auto industry tends to prefer mature and proven technologies,” said Shoko Oi, senior analyst of touch panel and user interface research for IHS. “Resistive touch is less influenced by noise and is capable of receiving input from gloved hands; however, the explosion in touch-enabled smartphones and other devices is rapidly changing the consumer mindset, which is helping spur demand for better automotive touch screens. Touch screens that require lighter touch pressure are rapidly becoming standard technology in many types of vehicles, which is affecting the technological transition from resistive panels to projective-capacitive panels.”

touch panel shipments

Based on information from the latest Automotive Touch Panel Technology and Market Forecast Report from IHS, while projective-capacitive touch (PCT) technology has been a topic of discussion since 2012, adoption is finally expected to begin in 2015 models, which is leading to the rise in touch-panel shipments.

Due to improvements in the consumer interface, most touch panels for 2017 car models will use PCT technology, which is expected to surpass the use of resistive technology in 2017. “Some manufacturers will still opt to use resistive touch screens in their bills of materials, not only to reduce costs, but also to avoid some continuing issues in the PCT display supply chain,” Oi said.

The role of automotive displays is changing.  What was once simply a way to view information from navigation system or car audio systems, has evolved into a human-to- machine interface for devices of inside and outside the vehicle. “This evolution, along with the increased volume and importance of displayed data, is leading to a growing need for touch-panel designs that incorporate irregular or curved shapes, larger sizes and higher resolutions,” Oi said.

The Automotive Touch Panel Technology and Market Forecast Report from IHS explores the technologies and trends of touch panel adoption in future automobile designs.

Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity.

BY BIPIN SEN, Bosch Rexroth, Hoffman Estates, IL

One of the brightest developments in electronics is Organic Light Emitting Diode (OLED) TVs, which are attracting consumers with their eye-popping colors and super- thin designs. Unlike the components found in traditional flat-screen display technology, OLEDs use thin, flexible sheets of material that emit their own light and are produced using a technique similar to inkjet or sheet-feed printing.

Introduced to the consumer market only a few years ago, OLEDs are still relatively costly to manufacture in large sizes due to limitations in both shadow-mask deposition methods, and in newer laser annealing and inkjet printing techniques. To scale up large area display production economically, printed electronics manufacturers are seeing the benefits of another production method — namely, digital roll-to-roll web processing.

Like an inkjet printer deposits ink on sheets of paper, a digital roll-to-roll press patterns thin-film transistors and other devices directly onto large organic, flexible substrates. But unlike slower sheet-fed digital printing, the substrate in a roll-to-roll press is supplied from an infeed reel through the printing section onto an outfeed reel in one continuous inline web. An array of piezo- electric printheads deposit the ink — comprised of a conductive organic solution — on the substrate at precise locations. In roll-to-roll web processing, electroluminescent materials or other microcrys- talline layers are deposited on substrate at slower speeds, on the order of 10 to 100 feet (3 to 30 meters) per minute.

The speed of the roll-to-roll process reduces the cost of fabrication dramatically—but several challenges must be overcome to make it pay off.

Fast speeds create big challenges

Similar to how Sunday newspaper comics require precise color registration to keep images from blurring, printed electronics require far tighter registration. Tolerances for applications such as Thin-Film Transistors (TFTs) or OLEDs require registration smaller than 10 microns. High-speed, high-resolution cameras measure registration accuracy and provide input to the control system. To ensure that degree of accuracy, precise web tension control is required.

Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity.

Web transport control ensures proper uniform tension on the substrate web as it travels through the process. Because the substrate changes properties in response to force loading, changes in tension affect the stability of deposited materials. Substrate expansion causes cracks, broken traces, short circuiting and layer delamination. Changes in web velocity in the print zone affect registration, thickness and resolution of fine lines.

As the web travels downstream, constant tension must be maintained in each tension zone, which
is defined as an isolated area in a machine where constant tension must be maintained appropriate to the process being performed in that area. A roll- to-roll press has several tension zones. Problems occur when a change is made in one tension zone and no change is needed in other areas. When tension control is coupled between all zones, a change in one creates a cascade of changes in others, impacting the stability of the entire web.

FIGURE 1 shows how instability affects a web traveling at five meters per second with two successive tension controllers for two tension zones. A command for a step change tension reduction is sent to the green zone controllers.

FIGURE 1. Tension instability.

FIGURE 1. Tension instability.

No change is required in the upstream blue zone. But because the web is continuous, the tension disturbance is carried back to the blue zone, which causes the blue controller to compensate. In turn, this change affects the downstream green zone, sending jitter back to the blue zone. This back and forth jitter takes about 85 seconds to settle down. The web tension finally stabilizes in about 90 seconds. During that time, the machine is yielding waste product.

The challenge of tension adjustment

In an ideal world, web instability would never occur because tension adjustment would never be needed. But tension adjustment is necessary due to several mechanical factors:

  • Oscillations caused by mechanical misalignments
  • Differing inertial response (lag) of mechanical elements during web acceleration
  • Out-of-round unwind and tension rolls
  • Slipping through nip rolls
  • Over aggressive web-guide correction

Several technical process and control issues also affect tension: tension set point changes, phase offset on driven rolls, tension bleed from one zone to another, and, of course, thermal effect (contraction/expansion) as the substrate passes through various processes.

The factors requiring tension adjustment cannot all be eliminated. Variance in any one factor in a zone necessitates changes in tension control and web speed. Consequently, with coupled tension zone control, jitter is inevitable in a continuous web where the controllers cause a feedback loop.

The benefits of decoupled controllers

There is a solution: Decouple each tension zone, allowing each controller to operate independently.
This has been accomplished in digital printing applications using Bosch Rexroth controllers incor- porating a unique tension decoupling function block. As the name implies, the function block allows tension control for each zone to operate independently. As a result, tension changes can be isolated in one zone without affecting tension change in other areas.

The result can be seen in FIGURE 2. In this example, the press uses two successive controllers. But now the step change signaled by the green section controller doesn’t create a cascade effect upstream. Along with decoupling to prevent feedback, the Rexroth controller initiates a response to step reduction in tension control in one-fourth the time compared to typical controllers.

FIGURE 2. Improved tension control.

FIGURE 2. Improved tension control.

With the Rexroth solution, tension can be controlled for up to eight axes. One or multiple points can be selected to be left uncontrolled. At the selected axis, line speed is held constant. At a standstill, web tension can be maintained. In fact, Rexroth multi-axis tension control increases stand-still web tension accuracy by a factor of two to four. Achieving the desired standstill web tension is also much faster. Without decoupling, a setpoint can be achieved in 13-14 seconds; with decoupling, it takes three to four seconds.

During acceleration, tension control decoupling ensures the web is stable as soon as full production speed is reached, compared to a delay of five seconds or longer with coupled control. And when tension setpoint changes occur during runtime, the transient response with decoupling takes about one second, compared to about four seconds with coupled control.

Not unlike digital printing, the adoption of roll-to-roll web printing will accelerate as the technology demonstrates its ability to provide high accuracy at high speeds.

SEMI today announced an update of the SEMI World Fab Forecast report which updates outlooks for 2015 and 2016. The SEMI report reveals that fab equipment spending in 2014 increased almost 20 percent and will rise 15 percent in 2015, increasing only 2-4 percent in 2016. Since November 2014, SEMI has made 270 updates on its World Fab Forecast report, which tracks fab spending for construction and equipment, as well as capacity changes, and technology nodes transitions and product type changes by fab.

2013

2014

2015

2016

Fab equipment*

$29.4

$35.2

$40.5

$41 to $42

Change % Fab equipment

-10.0%

19.8%

15.0%

2% to 4%

Fab construction US$

$8.8

$7.7

$5.2

$6.9

Change % construction

13.6%

-11.0%

-32.0%

+32.0%

* Chart US$, in billions; Source: SEMI, March 2015

The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment and spending on facilities for installation.

Fab spending, such as construction spending and equipment spending, are fractions of a company’s total capital expenditure (capex). Typically, if capex shows a trend to increase, fab spending will follow.  Capex for most of the large semiconductor companies is expected to increase by 8 percent in 2015, and grow another 3 percent in 2016. These increases are driven by new fab construction projects and also ramp of new technology nodes. Spending on construction projects, which typically represents new cleanroom projects, will experience a significant -32 percent decline in 2015, but is expected to rebound by 32 percent in 2016.

Comparing regions across the world, according to SEMI, the highest fab equipment spending in 2015 will occur in Taiwan, with US$ 11.9 billion, followed by Korea with US$ 9 billion.  The region with third largest spending, the Americas, is forecast to spend about US$ 7 billion.  Yet growth will decline in the Americas, by 12 percent in 2015, and decline by 12 percent in 2016 again.  Fourth in spending is China, with US$ 4.7 billion in 2015 and US$ 4.2 billion in 2016. In other regions, Japan’s spending will grow by about 6 percent in 2015, to US$ 4 billion; and 2 percent in 2016, to US$ 4.2 billion.  The Europe/Mideast region will see growth of about 20 percent (US$ 2.7 billion) in 2015 and over 30 percent (US$ 3.5 billion) in 2016. South East Asia is expected to grow by about 15 percent (US$ 1.3 billion) in 2015 and 70 percent (US$ 2.2 billion) in 2016.

2015 is expected to be the second consecutive year in equipment spending growth. SEMI’s positive outlook for the year is based on spending trends tracked as part of our fab investment research. The “bottom’s up” company-by-company and fab-by-fab approach points to strong investments by foundries and memory companies driving this year’s growth.

The SEMI World Fab Forecast Report lists over 40 facilities making DRAM products. Many facilities have major spending for equipment and construction planned for 2015.

Large-area TFT LCD display panel suppliers enjoyed moderate growth in shipments, revenue and display area in 2014 as the market demand for key applications grew. Year-over-year shipments of 9-inch and larger panels increased 4 percent (721 million units), while overall display shipment area grew 13 percent, according to the latest Quarterly Large-Area TFT Panel Shipment Report from IHS (NYSE: IHS). Overall large-area TFT LCD display revenues grew 2 percent, reaching $74.4 billion in 2014.

“The double-digit increase in large-area TFT LCD panel area last year was mainly driven by increasing consumer demand for larger televisions, 4K TVs and high-end monitors,” said Yoonsung Chung, director of large area display research for IHS Technology, formerly DisplaySearch. “The notebook PC market rebound, which began in the second quarter of 2014, also aided large-area display growth.”

Overall shipment area of 40-inch-and-larger panel sizes increased 34 percent in 2014, compared to the previous year. Year-over-year notebook PC display unit shipments increased 8 percent, and revenues grew 16 percent; however, 9-inch-and-larger tablet LCD panels suffered from weaker demand, which slowed year-over-year unit growth to 1 percent and caused revenues to decline 6 percent.

2015 TFT LCD Forecast

Panel makers are projecting similar TFT LCD shipment trends in 2015, with overall large-area display shipments expected to grow just 1 percent and reach 729.5 million units. Revenue growth and area growth for this category, however, are forecast to reach 6 percent and 8 percent, respectively.

TFT LCD image

 

Total LCD TV panel shipments are expected to increase 3 percent in 2015, to reach 260.5 million units; shipment area will grow 8 percent, from 113 million square meters last year, to 123 million square meters in 2015. The importance of 4K in the TV market will continue in 2015, reaching more than 40 million units, comprising 15 percent of total LCD TV unit shipments, and more than doubling the 7 percent market penetration in 2014.

Growth in notebook PC and mini-note panel shipments will be flat in 2015, reaching just 198 million units.

“Lackluster sales are forcing panel makers to begin upgrading to FHD and other high resolution formats, and to adopt flat light guide plates in the backlight for ultra-slim panels, in hopes of raising profit margins,” Chung said.

IHS forecasts that 9-inch-and-larger TFT LCD tablet PC panel shipments will decline 11 percent in 2015 versus the previous year. The primary cause of this decline is that Samsung has started to adapt OLED panels for tablet PCs, which will negatively influence the overall TFT LCD market this year.

LCD monitor panel shipments are expected to grow 8 percent in 2015, to reach 168 million units. “Due to larger sizes, technology improvements and low depreciation in old fabs, the profit margin for monitor panels was solid last year, which is leading panel makers to plan more monitor shipments this year,” Chung said.

Year-over-year public display unit shipments grew 44 percent in 2014, with the retreat of plasma display panels (PDPs) and stronger momentum for the digital signage category. IHS expects public display unit shipments to increase 7 percent in 2015.

Global mobile phone display module shipments in 2015 are expected to rise just 4 percent year-over-year to reach two billion units, leading to even stronger competition among mobile phone display manufacturers. According to a new report from IHS, Chinese display module makers have resolved to increase their share of global mobile-phone display shipments. In fact in the third quarter (Q3) of 2014, BOE unseated Samsung Display to become the leading global mobile phone display module supplier.

“BOE has benefitted not only from Samsung’s LCD outsourcing strategy, but also by aggressively developing direct relationships with Chinese mobile phone makers,” said Terry Yu, senior analyst for small and medium displays and display technologies for IHS Technology, formerly DisplaySearch. “BOE, Tianma and InfoVision are all focusing their G5 capacity on the mobile phone market, placing strong emphasis on a-Si based mobile phone displays.”

Display module makers in China also intend to improve their market share in the high-end mobile phone display market. For example in 2014, BOE, Tianma and China Star attracted industry attention, when they announced their G6 LTPS investment plans. Truly, a local traditional Chinese LC module maker, also announced it was investing in G4 AMOLED manufacturing capabilities. “Until these capacities are ready in China, however, stronger competition in the high-end mobile phone display market will be primarily centered on panel makers in other parts of Asia, especially among Japan Display, Sharp, and Samsung Display, all of which have aggressive plans for the Chinese smartphone market in 2015,” Yu said.

Reacting to lowered demand for handsets, OLED module makers have been aggressively promoting AMOLED products in China, but they still face competitive pricing pressure. For example, the average price for 5-inch HD (1280 x 720 294 PPI) AMOLED modules in China’s open market, excluding cover glass and lamination cost, has fallen from $43 in the first quarter (Q1) of 2014 to $25 in the Q1 2015; however, 5-inch HD display modules are widely used in handsets with high cost-performance (CP) value ratios, with retail prices that vary from $95 (599 CNY) to $160 (999 CNY). With increased competition, low-end high-CP value handset prices are expected to fall as low as $80 (499 CNY) in 2015, so $25 AMOLED module costs will still face bill of materials (BOM) cost-control challenges.

On the other hand, in order to differentiate their products, local Chinese brands plan to adopt FHD (1920 x 1080, normally over 400 PPI) displays on the higher-end of high-CP value handsets, with average prices of $160. In fact, local smartphone brand Meizu has already launched its first sub-brand handset, Noblue Note, which is equipped with a 5.5-inch FHD display, selling for $160 (999 CNY). According to Yu, “the pricing pressure of these FHD displays will lead to the even more intense competition among FHD resolution display module makers in 2015.”

“Local Chinese brands are now simplifying their handset models, in order to achieve better revenue performance,” Yu said. “Larger orders for each handset model will drive stronger competition among leading global panel makers.”

IHS_Mobile_Phone_Display_Shipment_Forecast_150304--DS_colors

Leading global TV brands, Samsung Electronics, LG Electronics and Sony, gained market share and increased their year-over-year shares of LCD TV shipments by an average of 11 percent in 2014, which is higher than the market average. According to IHS (NYSE: IHS), the top three TV brands purchased more than one third (37 percent) of the total global TV panel supply in 2014, and they will continue to increase their share this year. Overall, the top three brands are expected to grow their LCD TV shipments 16 percent, year over year, to reach 110 million units or 42 percent of all TV panel shipments they want to secure from their suppliers in 2015.

“Based on very optimistic shipment targets, the panel-allocation dominance of these three companies — and Samsung, in particular — will be even more pronounced, which will put more competitive pressure on smaller competitors,” said Deborah Yang, display supply chain research director for IHS Technology, formerly DisplaySearch. “The three leading TV manufacturers will, therefore, have greater influence over the global panel supply this year, causing panel makers to list them as first priority customers.”

In the LCD TV industry, the companies controlling panel allocations during a shortage will garner the most market share. Companies that purchase panels at competitive prices during an over-supply can also save on costs, which helps raise profits. TV makers also prefer a shortage to an over-supply, because a shortage can stimulate consumer purchases; in an over-supply situation, prices fall quickly, which encourages consumers to postpone purchases, while they wait for even better bargains.

“For Samsung, LGE, and Sony, it makes sense to obtain large allocations and make the market tighter, especially when they dominate purchasing and can influence panel allocations,” Yang said. “Meanwhile, panel makers are encouraged to support them, because they must look for long-term winners, rather than just supporting smaller, niche players.”

The top three TV brands’ influence over certain panel sizes will also increase this year, according to the Quarterly LCD TV Value Chain & Insight Report from IHS. Based on 2015 LCD TV manufacturers’ business plans, the top three players will make up more than half of all panel allocations for six of the most popular panel sizes; if there are shortages, other TV manufacturers may have difficulty obtaining allocations for these sizes. “For 48-inch, 49-inch and 58-inch sizes, in particular, the purchasing power of the three TV market leaders is very strong,” Yang said. “As the largest companies’ panel allocations become even bigger, smaller players could be forced to take a niche approach or be squeezed out entirely.”

Even as smartphone panel resolution continues to rise, and as display sizes continue to grow, panel manufacturers are facing pressure to reduce prices. According to the Quarterly Mobile Phone Display Shipment and Forecast Report from IHS, a global source of critical information and insight, total mobile phone display shipments are estimated to reach a new record high of 2 billion units in 2014. Average smartphone display prices declined nearly 14 percent year-over-year (YoY) from $22 per module in 2013 to $19 in 2014. IHS Technology forecasts another double-digit fall for smartphone display prices in 2015, resulting in a blended ASP of about $17.

“While smartphone display resolution and sizes reach new milestones, panel makers are still being challenged to reduce display module prices,” said Terry Yu, analyst for small and medium displays and display technologies for IHS Technology, formerly with DisplaySearch. “Shipment and manufacturing of panels using various display technologies like a-Si, Oxide, LTPS and AMOLED continues to rise, while pricing continues to decline. The sharpest smartphone average panel price declines occurred in 2014, and this trend of double-digit declines is expected to continue in 2015.”

Panel makers (like Tianma, BOE, InfoVision, and Japan Display Inc. (JDI) via their subsidiary TDI) are all promoting their products to Chinese smartphone makers with aggressive pricing strategies. Chinese smartphone makers are agile enough to use economies of scale and their strong market position to better negotiate display prices. On the supply side, LTPS LCD manufacturing capacity is increasing in all regions. Taiwanese panel suppliers are aggressively shifting production of smartphone panels to Gen 5 fabs, as well. These factors are adding pressure to reduce prices.

According to the Monthly Smartphone and Tablet PC FPD Pricing Report, 5-inch LTPS TFT LCD FHD (1920×1080) smartphone panels with IPS/FFS LCD technology, experienced a decline of 30 percent YoY, from $30 in December 2013 to $21 in December 2014. “Smartphone ASPs will continue to drop substantially in the first quarter of 2015, which is a traditionally slow season for smartphone display panel purchasing,” Yu said.

ihs smartphone displays

The 5-inch 720 HD (1280×720 pixels) module is the most popular smartphone display size in China, helping the format to gain over 40 percent market share in the market global 5.x-inch space during 2014. “Most brands are promoting low-priced, high-specification models with these displays, especially on e-commerce platforms,” Yu said. “China is the major battlefield for 5-inch smartphone displays. Demand for these displays is very strong, but they face strong competitive price pressure in the set market.”

In China’s open market, prices for 5-inch 720HD panels declined significantly to just under $12 in December 2014. Business agreements aside, market pricing for low-specification 5.x-inch panels is expected to decline to about $11 by March 2015. Prices of some low-grade specifications panels (lower brightness requirement) could decline to below $10 by the same period.

Due to the booming demand for LTPS LCD in China, panel makers are expected to continue expanding their LTPS manufacturing capacities & shipment.

“By the end of 2016, new fab investments by AUO, BOE, China Star, Tianma, and Foxconn will result in at least five Gen 6 LTPS fabs running in China and Taiwan, which may induce more pressure to reduce smartphone ASPs in the future,” Yu said.

Another price-reduction pressure in the smartphone display market comes from aggressive smartphone end-market pricing by Chinese smartphone brands. According to the Monthly Smartphone and Tablet PC FPD Pricing Report, after the introduction of the iPhone 6 Plus with its 5.5-inch FHD display, more Android-based premium models are expected to come equipped with wide-quad high-definition (WQHD) (2560×1440) displays driving FHD models down into the mid-range segment with lower pricing.

On December 23, 2014, Meizu, a rising brand in China, introduced its new “No Blue Note” smartphone, which was equipped with a 5.5-inch FHD display from Taiwan, which sells for just CNY 999 ($161). This model and pricing has been cited by many in the industry as a warning for upcoming price competition in 2015. “Facing ASP pressures, display cost reduction will be the top priority for the panel makers, especially through more effective production yield rate management and improvements in component performance,” Yu said.

Pulsed measurements are defined in Part 1, and common pulsed measurement challenges are discussed in Part 2.

By DAVID WYBAN, Keithley Instruments, a Tektronix Company, Solon, Ohio

Performing a DC measurement starts with applying the test signal (typically a DC voltage), then waiting long enough for all the transients in the DUT and the test system to settle out. The measurements themselves are typically performed using a sigma-delta or integrating-type analog-to-digital converter (ADC). The conversion takes place over one or more power line cycles to eliminate noise in the measurements due to ambient power line noise in the test environment. Multiple measurements are often averaged to increase accuracy. It can take 100ms or longer to acquire a single reading using DC measurement techniques.

In contrast, pulsed measurements are fast. The test signal is applied only briefly before the signal is returned to some base level. To fit measurements into these short windows, sigma-delta ADCs are run at sub-power-line interval integration times; sometimes, the even faster successive approximation register (SAR) type ADCs are used. Because of these high speeds, readings from pulsed measurements are noisier than readings returned by DC measurements. However, in on-wafer semiconductor testing, pulse testing techniques are essential to prevent device damage or destruction. Wafers have no heat sinking to pull away heat generated by current flow; if DC currents were used, the heat would increase rapidly until the device was destroyed. Pulse testing allows applying test signals for very short periods, avoiding this heat buildup and damage.

Why use pulsed measurements?

The most common reason for using pulsed measurements is to reduce joule heating (i.e., device self-heating). When a test signal is applied to a DUT, the device consumes power and turns it into heat, increasing the device’s temperature. The longer that power is applied, the hotter the device becomes, which affects its electrical characteristics. If a DUT’s temperature can’t be kept constant, it can’t be characterized accurately. However, with pulsed testing, power is only applied to the DUT briefly, minimizing self-heating. Duty cycles of 1 percent or less are recommended to reduce the average power dissipated by the device over time. Pulsed measurements are designed to minimize the power applied to the device so much that its internal temperature rise is nearly zero, so heating will have little or no effect on the measurements.

Because they minimize joule heating, pulsed measurements are widely used in nanotechnology research, such as when characterizing delicate materials and structures like CNT FETs, semiconductor nanowires, graphene-based devices, molecular- based electronics and MEMs structures. The heat produced with traditional DC measurement techniques could easily alter or destroy them.

To survive high levels of continuous DC power, devices like MOSFETs and IGBTs require packaging with a solid metal backing and even heat-sinking. However, during the early stages of device development, packaging these experimental devices would be much too costly and time consuming, so early testing is performed at the wafer level. Because pulsed testing minimizes the power applied to a device, it allows for complete characterization of these devices on the probe station, reducing the cost of test.

The reduction in joule heating that pulsed testing allows also simplifies the process of characterizing devices at varying temperatures. Semiconductor devices are typically so small that it is impossible
to measure their temperature directly with a probe. With pulsed measurements, however, the self- heating of the device can be made so insignificant that its internal temperature can be assumed to be equal to the surrounding ambient temperature. To characterize the device at a specific temperature, simply change the surrounding ambient temperature with a thermal chamber or temperature-controlled heat sink. Once the device has reached thermal equilibrium at the new ambient temperature, repeat the pulsed measurements to characterize the device at the new temperature.

Pulsed measurements are also useful for extending instruments’ operating boundaries. A growing number of power semiconductor devices are capable of operating at 100A or higher, but building an instrument capable of sourcing this much DC current would be prohibitive. However, when delivering pulse mode power, these high power outputs are only for very short intervals, which can be done by storing the required energy from a smaller power supply within capacitors and delivering it all in one short burst. This allows instruments like the Model 2651A High Power SourceMeter SMU instrument to combine sourcing up to 50A with precision current and voltage measurements.

Pulsed I-V vs. transient measurements

Pulsed measurements come in two forms, pulsed I-V and transient. Pulsed I-V (FIGURE 1) is a technique for gathering DC-like current vs. voltage curves using pulses rather than DC signals. In the pulsed I-V technique, the current and voltage is measured near the end of the flat top of the pulse, before the falling edge. In this technique, the shape of the pulse is extremely important because it determines the quality of the measurement. If the top of the pulse has not settled before this measurement is taken, the resulting reading will be noisy and or incorrect. Sigma-delta or integrating ADCs should be configured to perform their conversion over as much of this flat top as possible to maximize accuracy and reduce measurement noise.

FIGURE 1. Pulse I-V technique.

FIGURE 1. Pulse I-V technique.

Two techniques can improve the accuracy of pulsed I-V measurements. If the width of the pulse and measurement speed permit, multiple measurements made during the flat portion of the pulse can be averaged together to create a “spot mean” measurement. This technique is commonly employed with instruments that use high speed Summation Approximation Register (SAR) ADCs, which perform conversions quickly, often at rates of 1μs per sample or faster, thereby sacrificing resolution for speed. At these high speeds, many samples can be made during the flat portion of the pulse. Averaging as many samples as possible enhances the resolution of the measurements and reduces noise. Many instruments have averaging filters that can be used to produce a single reading. If even greater accuracy is required, the measurement can be repeated over several pulses and the readings averaged to get a single reading. To obtain valid results using this method, the individual pulsed measurements should be made in quick succession to avoid variations in the readings due to changes in temperature or humidity.

Transient pulsed measurements (FIGURE 2) are performed by sampling the signal at high speed to create a signal vs. time waveform. An oscilloscope is often used for these measurements but they can also be made with traditional DC instruments by running the ADCs at high speed. Some DC instruments even include high-speed SAR type ADCs for performing transient pulsed measurements. Transient measurements are useful for investigating device behaviors like self-heating and charge trapping.

FIGURE 2. Transient pulse measurements.

FIGURE 2. Transient pulse measurements.

Instrumentation options

The simplest pulse measurement instrumentation option is a pulse generator to source the pulse combined with an oscilloscope to measure the pulse (FIGURE 3). Voltage measurements can be made by connecting a probe from the scope directly to the DUT; current measurements can be made by connecting a current probe around one of the DUT test leads. If a current probe is unavailable, a precision shunt resistor can be placed in series with the device and the voltage across the shunt measured with a standard probe, then converted to current using a math function in the scope. This simple setup offers a variety of advantages. Pulse generators provide full control over pulse width, pulse period, rise time and fall time. They are capable of pulse widths as narrow as 10 nanoseconds and rise and fall times as short as 2-3 nanoseconds. Oscilloscopes are ideal for transient pulse measurements because of their ability to sample the signal at very high speeds.

FIGURE 3. Pulse measurement using a pulse generator and an oscilloscope. Voltage is measured across the device with a voltage probe and current through the device is measured with a current probe.

FIGURE 3. Pulse measurement using a pulse generator and an oscilloscope. Voltage is measured across the device with a voltage probe and current through the device is measured with a current probe.

Although a simple pulse generator/oscilloscope combination is good for fast transient pulse measurements, it’s not appropriate for all pulse measurement applications. A scope’s measurement resolution is relatively low (8–12 bits). Because scopes are designed to capture waveforms, they’re not well suited for making pulse I-V measurements. Although the built-in pulse measure functions can help with measuring the level of a pulse, this represents only a single point on the I-V curve. Generating a complete curve with this setup would be time consuming, requiring either manual data collection or a lot of programming. Pulse generators are typically limited to outputting 10-20V max with a current delivery capability of only a couple hundred milliamps, which would limit this setup to lower power devices and/or lower power tests. Test setup can also be complex. Getting the desired voltage at the device requires impedance matching with the pulse generator. If a shunt resistor is used to measure current, then the voltage drop across this resistor must be taken into account as well.

Curve tracers were all-in-one instruments designed specifically for I-V characterization of 2- and 3-terminal power semiconductor devices. They featured high current and high voltage supplies for stimulating the device and a configurable voltage/ current source for stimulating the device’s control terminal, a built-in test fixture for making connections, a scope like display for real-time feedback, and a knob for controlling the magnitude of the output. However, Source measure unit (SMU) instruments (FIGURE 4) have now largely taken up the functions they once performed.

FIGURE 4. Model 2620B System SourceMeter SMU instrument.

FIGURE 4. Model 2620B System SourceMeter SMU instrument.

SMU instruments combine the source capabilities of a precision power supply with the measurement capabilities of a high accuracy DMM. Although originally designed for making extremely accurate DC measurements, SMU instruments have been enhanced to include pulse measurement capabilities as well. These instruments can source much higher currents in pulse mode than in DC mode. For example, the Keithley Model 2602B SourceMeter SMU instrument can output up to 3A DC and up to 10A pulsed. For applications that require even high currents, the Model 2651A SourceMeter SMU instrument can output up 20A DC or 50A pulsed. If two Model 2651As are configured in parallel, pulse current outputs up to 100A are possible.

SMU instruments can source both voltage and current with high accuracy thanks to an active feedback loop that monitors the output and adjusts it as necessary to achieve the programmed output value. They can even sense voltage remotely, directly at the DUT, using a second set of test leads, ensuring the correct voltage at the device. These instruments measure with high precision as well, with dual 28-bit delta-sigma or integrating-type ADCs. Using these ADCs along with their flexible sourcing engines, SMUs can perform very accurate pulse I-V measurement sweeps to characterize devices. Some, including the Model 2651A, also include two SAR-type ADCs that can sample at 1 mega-sample per second with 18-bit resolution, making them excellent for transient pulse measurements as well.

In addition, some SMU instruments offer excellent low current capability, with ranges as low as 100pA with 100aA resolution. Their wide dynamic range makes SMU instruments an excellent choice for both ON- and OFF-state device characterization. Also, because they combine sourcing and measurement in a single instrument, SMU instruments reduce the number of instruments involved, which not only simplifies triggering and programming but reduces the overall cost of test.

Although SMU instruments are often used for pulse measurements, they don’t operate in the same way as a typical pulse generator. For example, an SMU instrument’s rise and fall times cannot be controlled by the user; they depend on the instrument’s gain and bandwidth of the feedback loop. Because these loops are designed to generate little or no overshoot when stepping the source, the minimum width of the pulses they produce are not as short as those possible from a pulse generator. However, an SMU instrument can produce pulse widths as short as 50–100μs, which minimizes device self-heating.

The terminology used to describe a pulse when using SMU instruments differs slightly from that used with pulse generators. Rather than referring to the output levels in the pulse as amplitude and base or the high level and the low level, with SMU instruments, the high level is referred to as the pulse level and the low level as the bias level. The term bias level originates from the SMU’s roots in DC testing where one terminal of a device might be biased with a fixed level. Pulse width is still used with SMU instruments, but its definition is slightly different. Given that rise and fall times cannot be set directly and vary with the range in use and the load connected to the output, pulse width can’t be accurately defined by Full Width at Half Maximum (FWHM). (refer to the sidebar for more information on FWHM). Instead, for most SMU instruments, pulse width is defined as the time from the start of the rising edge to the start of the falling edge, points chosen because they are under the user’s control.

In other words, the user can set the pulse width by setting the time between when the source is told to go to the pulse level and then told to go back to the bias level.

FIGURE 5. A pulse measure unit card combines the capabilities of a pulse generator and a high resolution oscilloscope.

FIGURE 5. A pulse measure unit card combines the capabilities of a pulse generator and a high resolution oscilloscope.

Pulse measure units (PMUs) combine the capabilities of a pulse generator and a high-resolution oscilloscope, which are sometimes implemented as card-based solutions designed to plug into a test mainframe. Keithley’s Model 4225-PMU, designed for use with the Model 4200 Semiconductor Charac- terization System (FIGURE 5), is one example. It has two independent channels capable of sourcing up to 40V at up to 800mA. Like a standard pulse generator, users can define all parameters of the pulse shape. Pulse widths as narrow as 60ns and rise and fall times as short as 20ns make it well suited for characterizing devices with fast transients. A Segment Arb mode allows outputting multi-level pulse waveforms in separately defined segments, with separate voltage levels and durations for each. Each PMU channel is capable of measuring both current and voltage using two 14-bit 200MS/s ADCs per channel for a total of four ADCs per card. Additionally, all four ADCs are capable of sampling together synchronously at full speed. By combining a pulse generator with scope- like measurement capability in one instrument, a PMU can not only make high-resolution transient pulse measurements but also perform pulse I-V measurement sweeps easily using a spot mean method for enhanced resolution.

EGBERT WOELK, PH.D., is director of marketing at Dow Electronic Materials, North Andover, MA. ROGER LOO, PH.D., is a principal scientist at imec, Leuven, Belgium.

The announcement by GTAT and Apple in late 2013 of a more than $1 billion combined investment to set up the largest sapphire crystal growth facility in the world had raised hopes that adoption of sapphire in smartphones would rapidly reach a massive scale, with Apple setting up the pace and forcing its competitor to follow suit. Various second tier cell phone OEM upped their efforts in sapphire-related developments and tried to beat Apple by announcing or introducing smartphone models with sapphire display covers ahead of the highly anticipated iPhone 6 announcement. This prompted various sapphire manufacturers in China to announce plans for significant capacity increases to serve this new market.

“After a 2014 year full of hopes, the sapphire industry is entering 2015 with a lots of uncertainties,” analyzes Dr Eric Virey, Senior, Technology & Market Analyst, Yole Développement (Yole). “Following a long period of depressed pricings and stagnating revenue, 2014 started with a welcome price recovery that lifted up the spirit of many industry players. But most of all, it was the prospect of a new killer application that had given reasons for optimism,” he adds.

But the news that the iPhone 6 would not use a sapphire display cover, shortly followed by GTAT bankruptcy sent shockwaves in the industry and raised many questions:

  • Is Apple still interested in sapphire and will the display cover glass opportunity ever materialize in a large scale?
  • Is the technology ready?
  • What will happen to the more than 2000 high capacity furnaces installed by GTAT and Apple?
  • Are other cell phone OEM still considering sapphire?
  • Can traditional applications such as LED or watch windows sustain more than 100 manufacturers?
  • Could other applications emerge soon? If not how will consolidation affect the industry?
  • Will China eventually dominate the sapphire industry?

GTAT and Apple

Yole analysts have been tracking the sapphire market for more than a decade. Their analysis is presented in the yearly technology & market analysis: Sapphire Applications & Market: from LED to Consumer Electronic and Sapphire Applications, Touch screens, displays, semiconductor, defense and consumer.

“The last 6 month events are shaking the sapphire industry,” comments Eric Virey from Yole. He adds: “Today, several points remain under questions: is the display cover application dead on arrival? What is Apple’s strategy regarding sapphire? Can the market absorb the more than 2000 high capacity GTAT furnaces now for sale.”

Under this context, Yole, the “More Than Moore” market research, technology and strategy consulting company, proposes to exchange and debate during the 1st International Forum on Sapphire Market & Technologies, on September 3rd, 2015. This Forum is hosted by CIOE. It will take place in Shenzhen, alongside the 17th China International Optoelectronic Expo 2015.

Both partners have set up a high added-value program including sessions on: sapphire market, technologies and supply chain – established and emerging sapphire applications – crystal growth – manufacturing technologies… The forum will wrap up with a round table with leading industry players and experts to discuss the future of sapphire technologies and markets.

“This 1st International Forum on Sapphire Market & Technologies is a must for all sapphire industry managers as well as for sapphire users in order to network and learn about all the latest industry trends,” comments Eric Virey.

The Yole & CIOE sapphire forum will bring together a world class panel of experts. It will allow participants to get valuable insights into the status and future of the sapphire industry. Moreover, the Forum will provide unprecedented opportunities for meetings with industry leaders.

Once focused on unit growth, the entire global flat-panel display (FPD) industry is now shifting to focus on area-demand growth. According to IHS (NYSE: IHS), the leading global source of critical information and insight, display panel shipments for all FPD applications grew 9 percent, year over year, to reach 168.9 million square meters in 2014. Total FPD display area demand is expected to grow at a compound annual growth rate (CAGR) of 5 percent from 2012, reaching 223.6 million square meters in 2020.

“The trend toward bigger displays continued in the flat panel display industry in 2014,” said Yoshio Tamura, director of display research for IHS Technology, formerly with DisplaySearch. “There were four major driving forces leading to a strong upgrade of the average FPD display sizes: consumer demand for larger LCD TVs, soaring demand for 5-inch-and-larger smartphones, larger automotive display screens, and larger tablet PCs.”

The annual area growth demand rate for major FPD applications in 2015 is forecast to reach 5 percent, which is down from 9 percent in 2014. Slowing growth is mainly caused by the maturity of some FPD applications, and a slowdown in the trend toward larger size screens for LCD TVs and smart handheld devices.

“New TV sizes launched by LCD and OLED panel makers mean that consumers now have more chances to trade up to larger sizes,” Tamura said. “For smartphones, especially in the Chinese market and developing countries, bigger screens have been triggered by higher resolution requirements, longer battery life, and shifts in user behavior.”

Apple, HP, Lenovo, Acer, ASUS and other mobile PC brands have begun to launch products with larger screens. New operating systems and convertible form factors are leading to displays growing from 10 inches to 12.9 inches in 2015, which will also add to FPD area demand.

For each FPD product category, IHS noted several reasons for the increase in the total FPD area base, including the following:

  1. LCD TV – 4K, 8K, ultra-slim type, slim bezel, better picture quality by wider color gamut and dynamic contrast ratio, new sizes launched by the panel makers, new smart TV platform
  2. Smartphone – higher resolution, slim design, bezel-less design, abundant ecosystem, component integration
  3. Mobile PC – higher resolution, better screen performance with the introduction of OLED, entry into the commercial and educational market
  4. Automotive – better user interface and touch performance, growing numbers of hybrid energy and electronic cars equipped with a larger and better screens, full dashboard digitalization, demand for bigger central information displays (CIDs), and the introduction of advanced driver assistance systems (ADAS) for smart cars

The Quarterly Worldwide FPD Shipment and Forecast Report covers worldwide shipments and forecasts for all major FPD applications, including details from more than 140 FPD producers, covering more than 10 countries.