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NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

The identified Samsung products include the Galaxy Note Edge, Galaxy Note 4, Galaxy S5, Galaxy Note 3 and Galaxy S4 mobile phones; and the Galaxy Tab S, Galaxy Note Pro and Galaxy Tab 2 computer tablets. Most of these devices incorporate Qualcomm mobile processors — including the Snapdragon S4, 400, 600, 800, 801 and 805. Others are powered by Samsung Exynos mobile chips, which incorporate ARM’s Mali and Imagination Technologies’ PowerVR GPU cores.

NVIDIA co-founder and CEO Jen-Hsun Huang said: “NVIDIA has invented technologies that are vital to mobile computing. We have the richest portfolio of computer graphics IP in the world, with 7,000 patents granted and pending, produced by the industry’s best graphics engineers and backed by more than $9 billion in R&D.

“Our patented GPU inventions provide significant value to mobile devices. Samsung and Qualcomm have chosen to use these in their products without a license from us. We are asking the courts to determine infringement of NVIDIA’s GPU patents by all graphics architectures used in Samsung’s mobile products and to establish their licensing value.”

A pioneer in computer graphics, NVIDIA invented the GPU. The graphics processing unit enables computers to generate and display images. It brings to life the beautiful graphics that shape how people enjoy their mobile devices and is fundamental to the rise of mobile computing. NVIDIA GPUs are some of the most complex processors ever created, requiring over a thousand engineering-years to create and containing more than 7 billion transistors.

MarketResearchReports.Biz released a new market research report this week entitled “Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players.”

According to the new report, metal oxide display backplanes have already gone commercial. Sharp has invested in establishing a Gen8 IGZO plant at its Kameyama plant in Japan while LG has also selected IGZO backplanes for its large-sized white OLED technology. At the same time, Chinese companies such as BOE are fast playing catch up with both prototype and production capacity announcements.

IDTechEx estimates that 7 km sqr of metal oxide backplanes will be used in the OLED industry in 2024, enabling a 16 billion USD market at the display module level. The LCD display market will add an extra demand of at least 1 km sqr per year in 2024 for metal oxide backplanes.

The display industry continues to rapidly change and seek new markets. Long term trends are still prevalent and shape global activity. Examples include reducing power consumption, improving image resolution, and decreasing device thickness. At the same, the need to differentiate and capture new markets such as wearable electronics is first bringing in robust and then flexible and bendable displays. These trends will drastically affect the technology requirements at many levels including the backplane level. This will stretch several existing solutions beyond likely performance limits, thereby creating openings and opportunities for new entrants and the technology space for backplanes is complex. It consists of (a) mature technologies such as amorphous and polycrystalline silicon, (b) emerging technologies such as organic and metal oxides and (c) early state technologies such as graphene, carbon nanotubes, nanowires, etc. No single technology offers a one-size-fits-all solution and many technologies will co-exist in the market. Betting on the right technology will remain a decision-making nightmare.

It is within this emerging, complex yet changing space that metal oxide are emerging. They promise low leakage currents, high mobility, amorphousity, stability and wide bandgap. These attributes promise to enable, respectively, power consumption reduction, compatibility with current-driven OLEDs and/or 3D displays, image uniformity over large areas, long lifetime and transparency.

In the short term, this will help enable higher resolution and lower power consumption levels in displays including LCDs (particularly in medium- to large-sized displays); while in the medium- to long-term metal oxides will help enable uniform medium- to large-sized OLED displays.

The report specifically addresses the big picture – including OLED displays and lighting, to thin film photovoltaics to flexible sensors and much more. Importantly, it includes not only electronics which are printed, organic and/or flexible now, but it also covers those that will be. Realistic timescales, case studies, existing products and the emergence of new products are given, as are impediments and opportunities for the years to come.

Over 3,000 organizations are pursuing printed, organic, flexible electronics, including printing, electronics, materials and packaging companies. While some of these technologies are in use now – indeed there are three sectors which have created billion dollar markets – others are commercially embryonic.

Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

Commenting on the partnership, Jordan Wu, President and Chief Executive Officer of Himax, stated, “We are very excited to expand our existing partnership with Lumus. They have developed an innovative technology, which will enable Augmented Reality glasses to become the next ‘must-have’ consumer device.”

According to Zvi Lapidot, Chief Executive Officer of Lumus, “Himax’s superior LCOS technology, its availability for high volume production, and the Company’s forward looking technological applications were critical in our selection of Himax as a strategic partner. Their microdisplay, specifically designed for smart glasses, combines smoothly with Lumus’ transparent display, creating the ideal solution for true Augmented Reality and hands-free wearable computing.”

Mr. Lapidot added, “While our ultra-thin, see-through optics enable natural looking wearable displays, Himax’s unique LCOS technology provides the high level of brightness necessary for see-through Augmented Reality. Ultimately, our cooperation enables us to bring widely appealing solutions to help seamlessly and intuitively blend wearable technology into our daily lives.”

Himax and Lumus have been successfully collaborating for several years in the field of combat aviation, producing market leading helmet mounted displays. Leveraging their combat-proven solutions and manufacturing capabilities, the two companies are now collaborating to make wearable displays mainstream consumer products.

The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $82.7 billion during the second quarter of 2014, an increase of 5.4 percent over the previous quarter and a jump of 10.8 percent compared to the second quarter of 2013. Global sales for the month of June 2014 reached $27.57 billion, marking the industry’s highest monthly sales ever. June’s sales were 10.8 percent higher than the June 2013 total of $24.88 billion and 2.6 percent more than last month’s total of $26.86 billion. Year-to-date sales during the first half of 2014 were 11.1 percent higher than they were at the same point in 2013, which was a record year for semiconductor revenues. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Through the first half of 2014, the global semiconductor market has demonstrated consistent, across-the-board growth, with the Americas region continuing to show particular strength,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “The industry posted its highest-ever second quarter sales and outperformed the latest World Semiconductor Trade Statistics (WSTS) sales forecast. Looking forward, macroeconomic indicators – including solid U.S. GDP growth announced last week – bode well for continued growth in the second half of 2014 and beyond.”

Regionally, sales were up compared to last month in the Americas (4.9 percent), Asia Pacific (2.1 percent), Japan (2.1 percent), and Europe (1.9 percent). Compared to June 2013, sales increased in the Americas (12.1 percent), Europe (12.1 percent), Asia Pacific (10.5 percent), and Japan (8.5 percent). All four regional markets have posted better year-to-date sales through the first half of 2014 than they did through the same point last year.

June 2014
Billions
Month-to-Month Sales
Market Last Month Current Month % Change
Americas 5.09 5.34 4.9%
Europe 3.13 3.19 1.9%
Japan 2.89 2.95 2.1%
Asia Pacific 15.76 16.09 2.1%
Total 26.86 27.57 2.6%
Year-to-Year Sales
Market Last Year Current Month % Change
Americas 4.76 5.34 12.1%
Europe 2.84 3.19 12.1%
Japan 2.72 2.95 8.5%
Asia Pacific 14.56 16.09 10.5%
Total 24.88 27.57 10.8%
Three-Month-Moving Average Sales
Market Jan/Feb/Mar Apr/May/June % Change
Americas 5.08 5.34 5.1%
Europe 3.08 3.19 3.5%
Japan 2.81 2.95 4.9%
Asia Pacific 15.18 16.09 6.0%
Total 26.15 27.57 5.4%

New approaches to start-ups can unlock mega-trend opportunities.

BY MIKE NOONEN, Silicon Catalyst, San Jose, CA; SCOTT JONES and NORD SAMUELSON, AlixPartners, San Francisco, CA

The semiconductor industry returned growth and reached record revenues in 2013, breaking $300 billion for the first time after the industry had contracted in 2011 and 2012 (FIGURE 1).

FIGURE 1. Worldwide semiconductor revenue. Source: World Semiconductor Trade Statistics, February 2014.

FIGURE 1. Worldwide semiconductor revenue. Source: World Semiconductor Trade Statistics, February 2014.

However, even with that return to growth, underlying trends in the semiconductor industry are disturbing: The semiconductor cycle continues its gyrations, but overall growth is slowing. And despite 5% year-on-year revenue growth in 2013 (the highest since 2010), the expectation is that semiconductor growth will likely continue to be at a rate below its long-term trend of 8 to 10% for the next three to five years (FIGURE 2). An AlixPartners 2014 publication , Cashing In with Chips, showed that semiconductor industry growth had slowed to roughly half of its long-term growth average since the 2010 recovery—with no expectation that it will return to historical growth until at least 2017. Other studies have also shownthat semiconductor growth has slowed not only relative to its previous performance but also versus growth in other industries. And a study conducted by New York University’s Stern School of Business[1] found that the semiconductor industry’s revenue growth lagged the average revenue growth of all industries and ranked 60th out of 94 industries surveyed. Surprisingly, the industry’s net income growth of semiconductor companies lagged even further behind—ranking 84th out of 94 companies surveyed—and had actually been negative during the previous five years.

FIGURE 2. Semiconductor revenue growth. Sources: Semiconductor Industry Association and AlixPartners research.

FIGURE 2. Semiconductor revenue growth. Sources: Semiconductor Industry Association and AlixPartners research.

In another study released by AlixPartners that looked at a broader picture of the semiconductor value chain, including areas such as equipment suppliers and packaging and test companies, the research showed that outside of the top 5 companies, the remainder of the 186 companies surveyed had declining earnings before interest, taxes, depreciation, and amortization (FIGURE 3).

FIGURE 3. Spotlight on the top five (fiscal year 2012). Source: AlixPartners Research.

FIGURE 3. Spotlight on the top five (fiscal year 2012). Source: AlixPartners Research.

As revenue growth slows, costs increase at a rapid rate

As semiconductor technology advances, the cost of developing a system on chip (SoC) has risen dramatically for leading-edge process technologies. Semico Research has estimated that the total cost of an SoC development, design, intellectual property (IP) procurement, software, testing has tripled from 40/45 nanometers (nm) to 20 nm and could exceed $250 million for future 10-nm designs(FIGURE 4) [2]. This does not bode well for an economic progression of Moore’s law, and it means that very few applications will have the volume and pricing power to afford such outlandish investment. If we assume that a 28nm SoC can achieve a 20% market share and 50% gross margins, the end market would have to be worth over $1 billion to recoup R&D costs of $100 million. By 10 nm, end markets would have to result in more than $2.5 billion to recoup projected development costs. With few end markets capable of supporting that high a level of development costs, the number of companies willing to invest in SoCs on the leading edge will likely decline significantly each generation.

FIGURE 4. Development Costs are Skyrocketing. Source: Semico Research Corp.

FIGURE 4. Development Costs are Skyrocketing. Source: Semico Research Corp.

What happened to semiconductor start- ups?

The history of the semiconductor industry has been shaped by the semiconductor start-up. Going back to Fairchild, the start-up has been the driving force for growth and innovation. Start-ups helped shape the industry, and they are now some of the largest and most successful companies in the industry. But the environment that lasted from the 1960s until the early 2000s—and that made the success of those companies possible—has changed dramatically. The number of venture capital investments in new semiconductor start-ups in the United States has fallen dramatically, from 50 per year to the low single digits (FIGURE 5). And even though that drop is not as dramatic in other countries — such as China and Israel — it is indicative of an overall lack of investment in semiconductors.

FIGURE 5. Number of seed/series a deals. Source: Global Semiconductor Alliance.

FIGURE 5. Number of seed/series a deals. Source: Global Semiconductor Alliance.

The main reason for the decline is the attractiveness of other businesses for the same investment. In the fourth quarter of 2013, nearly 400 software start-ups received almost $3 billion of funding, whereas only 25 semiconductor start-ups received just $178 million (representing all stages) (FIGURE 6). It seems that (1) the lower cost of starting a software company, (2) the relatively short time frame to realize revenue, and (3) attractive initial-public-offering and acquisition markets possibly make the software start-up segment more interesting than semiconductors.

FIGURE 6. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

FIGURE 6. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

This situation is unfortunate and has conspired to create a vicious and downward cycle (FIGURE 7).

  • Lack of investment limits start-ups
  • Lack of start-ups limits innovation
  • Lack of innovation and fewer start-ups limits the number of potential acquisition targets for established companies.
  • Reduced potential acquisition targets in turn limit returns for companies and returns for those who would have invested in start-ups.
  • Limited returns make future investments less likely and continue the cycle of less innovation and lower investment [3]. 
FIGURE 7. A vicious cycle limits innovation.

FIGURE 7. A vicious cycle limits innovation.

Therefore, it is reasonable to conclude that the demise of semiconductor start-ups is a contributing cause to the lackluster results of the overall semiconductor industry. And that demise and those lackluster results are further exacerbated by the rise of activist shareholders who demand a more rapid return on their investment, which possibly reduces the potential for innovation in an industry that has lengthy development cycles.

What about other industries?

It is tempting to think that the semiconductor industry is alone in this predicament, but other industries face similar challenges and have figured out accretive paths forward. For example, biotechnology has some of the same issues:

  • An industry that grows by bringing innovation to market 
  • Similarly lengthy development cycles 
  • Potentially capital intensive at the research and production stages

In addition, the biotech industry faces a challenge the semiconductor world does not — namely, the need for government regulatory approval before moving to production and then volume sales. Gaining that regulatory approval is a go-to-market hurdle that can add years and uncertainty to a product cycle.

However, in spite of its similarities to the semiconductor business and the added regulatory hurdles, the biotech industry enjoys a very healthy venture-funding and start-up environment. In fact, in the fourth quarter of 2013 in the United States, biotech was the second-largest business sector for venture funding in both dollars and total number of deals (FIGURE 8).

FIGURE 8. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

FIGURE 8. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

Why is this? What do biotech executives, entre- preneurs, and investors know that the semiconductor industry can take advantage of? There are several lessons to be learned.

  • Big biotech companies have made investing, cultivating, and acquiring start-ups key parts of their innovation and product development processes. 
  • Biotech and venture investors identify interesting problems to solve and then match the problems to skilled and passionate entrepreneurs to solve them.
  • Those entrepreneurs are motivated to create and develop solutions much faster and usually more frugally than if they were working inside a large company.
  • The entrepreneurs and investors are creating businesses to be acquired versus creating businesses that will rival major industry players.
  • The acquiring companies apply their manufacturing economies of scale and well-estab- lished sales and marketing strategies to rapidly— and profitably—bring the newly acquired solutions to market.

For several reasons, certain megatrends are driving the high-technology sector and the economy as a whole, and all of them are enabled by semiconductor innovation (FIGURE 9). Among the major trends:

  • Mobile computing will likely continue to merge functions and drive computing power.
  • Security concerns appear to be increasing at all levels: government, enterprise, and personal.
  • Cloud computing will possibly cause an upheaval in information technology.
  • Personalization through technology and logistics appears to be on the rise.
  • Energy efficiency is likely need for sustainability and lower cost of ownership.
  • Next generation wireless will likely be driven by insatiable coverage and bandwidth needs.
  • The Internet of things will likely lead to mobile processing at low power with ubiquitous radio frequency.
FIGURE 9. Global internet device installed base forecast. Sources: Gartner, IDC, Strategy Analytics, Machina Research, company filings, BII estimates.

FIGURE 9. Global internet device installed base forecast. Sources: Gartner, IDC, Strategy Analytics, Machina Research, company filings, BII estimates.

The Internet of Things megatrend alone will result in a tremendous amount of new semiconductor innovation that in turn will likely lead to volume markets. Cisco Systems CEO John Chambers has predicted a $19-trillion market by 2020 resulting from Internet of Things applications [4].

Does it really cost $100 million to start a semiconductor company?

The prevailing conventional wisdom is that it takes $100 million to start a new semiconductor company, and in some cases that covers only the cost of a silicon development. It is true that recently, several companies have spent eight- or nine-figure sums of money to develop their products, but those are very much exceptions. The reality is that most semiconductor development is not at the bleeding edge, nor is the development of billion-transistor SoCs.

The majority of design starts in 2013 were in .13 μm, and this year, 65, 55, 45, and 40nm are all growing (FIGURE 10). These technologies are becoming very affordable as they mature. And costs will likely continue to decrease as more capacity becomes available once new companies enter the foundry business and as former DRAM vendors in Taiwan and new fab in China come online.

FIGURE 10: .13um has the most design starts; 65nm and 45nm have yet to peak.

FIGURE 10: .13um has the most design starts; 65nm and 45nm have yet to peak.

Another thing to consider is whether a new company would sell solutions that use existing technology or platforms (i.e., a chipless start-up) or whether a company would choose to originate IP that enables functionality for incorporation into another integrated circuit.

A chipless start-up would add value to an existing architecture or platform. It could be an algorithm or an application-specific solution on, say, a field-programmable gate array, a microcontroller unit or an application-specific standard product. It could also be service based on an existing hardware platform.

A company developing innovative new functionality for inclusion into another SoC paves a path to getting to revenue quickly. Such IP solution providers would supply functionality for integration not only into a larger SoC but also into the emerging market for 2.5-D and 3-D applications.

In both situations (the chipless start-up and the IP provider), significant cost may be avoided by the use of existing technology or the absence of the need to build infrastructure or capabilities already provided by partners. In addition, those paths have much faster times to revenue as well as inherently lower burn rates, which are conducive to higher returns for investors.

Even for start-ups that intend to develop leading-edge multicore SoCs, a $100-million investment is not inevitable. Take, for example, Adapteva, an innovative start-up in Lexington, Massachusetts. Founded by Andreas Olofsson, Adapteva has developed a 64-core parallel processing solution in 28 nm. The processor is the highest gigaflops/watt solution available today, beating solutions from much larger and more-established companies. However, Adapteva has raised only about $5 million to date, a good portion of which funding was crowd sourced on the Kickstarter Web site. This just shows that even a leading-edge multicore SoC can be developed cost-effectively—and effectively—through the use of multiproject wafers and other frugal methods.

Several conclusions can be drawn at this point.

  • Even though the semiconductor industry is growing again, the underlying trends for profitability and growth are not encouraging. 
  • Cost development is increasingly rapid on leading-edge SoCs. 
  • Historically, start-ups have been engines of innovation of growth and innovation for semiconductors. 
  • In recent years, venture funding for new semiconductor companies has almost completely dried up. 
  • That lack of investment of semiconductor start-ups has contributed to a downward and vicious cycle that will further erode the economics of semiconductor companies. 
  • The biotechnology industry has many parallels to the semiconductor. Interestingly, biotechnology has a relatively thriving venture funding and start-up environment, and we can apply that industry’s successful approach to semiconductors. 
  • Despite the state of start-ups, it is now one of the most exciting times to be in semiconductors because most of the megatrends driving the economy are either enabled by or dependent on semiconductor innovation. 
  • It does not need to take $100 million to start the typical semiconductor company, because a great deal of innovation will use very affordable technologies, and come from chipless start-ups or IP providers that have much lower burn rates and ties to revenue.
  • Even leading-edge multicore SoCs can be developed frugally (for single-digit millions of dollars) and profitably. 

References

1. http://people.stern.nyu.edu/adamodar/New_Home_ Page/datafile/histgr.html

2. SoC Silicon and Software Design Cost Analysis: Costs for Higher Complexity Continue to Rise SC102-13 May 2013.

3. AlixPartners and Silicon Catalyst analysis and experi- ence.

4. Cisco Systems public statements.

The capacitive touch controller IC market is predicted to reach about $2.8 billion in 2017, an increase of nearly 50 percent from $1.9 billion in 2013, according to a new report from IHS Technology.

The controller IC market used in capacitive touch panels is likely to grow at a compound annual growth rate (CAGR) of 10.6 percent from 2013 to 2017 as the application of touch functions are expanded to various products, the report says.

“The touch controller IC price is expected to drop as competition gets fierce in the market, but the capacitive touch controller IC market is likely to maintain its positive growth trend for now,” said Seung-kyu Richard Son, senior analyst at IHS Technology. “Touch solutions that can stimulate consumers’ emotions should emerge steadily in order for the market to continue to grow.”

The touch controller IC, a key component that determines the performance of touch panels, is a non-memory semiconductor that transforms analogue signals into digital signals. This occurs when a user touches the screen on a device.

Capacitive touch technology, the mainstream in today’s touch panel market, is leading the growth in the touch panel industry. Over the past eight years, it has steadily advanced in many areas, including structures, materials and processes.

The report noted that smartphones and tablet PCs have accounted for the majority of the capacitive touch-panel demand market. But towards the end of 2012, the application of touch panels have been expanded to other applications, including notebook PCs and monitors. Along with this, touch controller ICs have become more important.

Up until 2011, US companies — including Atmel, Synaptics, Cypress and Broadcom — had dominated the capacitive touch controller IC market. But as the demand for smartphones and tablet PCs soared, Asian companies, including Melfas from South Korea, and FocalTech, Goodix and Mstar from China and Taiwan, are actively entering the touch controller IC market with enhanced skills and price competitiveness, the report says.

More notably, touch controller IC companies from China and Taiwan are rapidly growing on account of their low-priced products as well as having better relations with local smartphone and tablet PC makers. Although there are clear technological gaps between leading Western companies and the Chinese-Taiwanese touch controller IC suppliers, the gap has narrowed as latecomers continue their investments in mergers and acquisitions and R&D.

“The growth in Chinese-Taiwanese companies has resulted in a fall in supply prices for touch controller ICs, which is having a positive impact on manufacturers,” Mr. Son said. However, an excessive drop in prices can lead to lower profits for some companies and, in the end, will curb new investments.”

These findings are available in the report, “Touch Controller IC Market & Development Trend Report,” from IHS Technology.

Touch_controller_IC_pic

Solid State Technology and SEMI, today announced the recipient of the 2014 “Best of West” Award — Nikon Corporation — for its NSR-S630D Immersion Scanner. The award recognizes important product and technology developments in the microelectronics supply chain. The Best of West finalists were selected based on their financial impact on the industry, engineering or scientific achievement, and/or societal impact.

Nikon has clearly demonstrated leadership with ArF immersion tools, particularly in the area of 450mm. At SEMICON West, a collection of the first fully patterned 450mm wafers – using a Nikon immersion lithography tool — were on display at the newly merged SUNY CNSE/SUNYIT exhibit. The Nikon immersion scanner will join existing 450mm infrastructure at the Albany NanoTech Complex in April of 2015 in accordance with the project timeline. This critical milestone will enable G450C founding members and CNSE to perform 10nm and below, full wafer photolithography, while optimizing tool configuration and performance.

Award-winning NSR-S630D 300mm ArF immersion scanner

Award-winning NSR-S630D 300mm ArF immersion scanner

The Best of West award-winning NSR-S630D (300mm) ArF Immersion Scanner employs the well-known Streamlign platform, incorporating further developments in stage, optics, and autofocus technology to deliver unprecedented mix-and-match overlay and focus control with sustained stability to enable the 10/7nm node.

The semiconductor industry is moving to development and high volume manufacturing of sub-10nm generation process devices. Budgets are even tighter at these advanced nodes, making enhanced stability vital. The NSR-S630D leverages established immersion technology, while incorporating key innovations to deliver mix-and-match overlay (MMO) capabilities below 2.5 nm and throughput greater than 250 wafers per hour, in addition to critical overlay and focus with “optimal stability.”

The NSR-S630D builds upon the Streamlign platform, incorporating further technology, optics, and autofocus technology to deliver unprecedented performance with “sustained stability” to enable the 10/7nm node. Additionally, the S630D provides world-class throughput ≥ 250 WPH, and is compatible with advanced software solutions that ensure peak manufacturing performance. Significant technical, infrastructure, and business-related issues continue for EUVL, with unclear cost benefits. A 300mm process step and cost comparison for EUVL double patterning (DP) was 2x higher than ArF immersion multiple patterning, and EUV DP results were even less favorable under 450 mm conditions. From the overall cost perspective, new technologies are not always the best approach, and based on 10 years of success, it is believed that 193i immersion will remain the low cost solution moving forward.

The NSR-S630D utilizes newly designed optics that deliver multiple levels of active control, while Multipoint High Speed phase measurement interferometry enables adjustment of the lens at intervals to reduce aberrations. These enhanced tuning capabilities enable extremely low wavefront rms. Beyond imaging, overlay and focus control are the critical performance factors for the 10/7nm node.

Single nanometer distortion values have been achieved, which is a major factor in improving overlay/mix-and-match capabilities. In addition, the new NSR-S630D reticle stage uses an encoder servo system to increase accuracy while the wafer stage delivers improved temperature control, coupled with structural and water management innovations to enhance stability. The S630D has demonstrated single machine overlay (SMO) Avg.+3σ below 1.4nm across the lot, with across lot S622D/S630D mix-and-match overlay (MMO) below 2.5nm. Further, the S630D autofocus system employs a narrower sensor pitch and improved edge mapping for better focus uniformity, and minimizes sensor fluctuations and process sensitivities. Together these factors optimize yield and increase edge dies per wafer.

Autofocus performance was verified with uniformity data (3σ) below 7nm (including edge shots) and 5.9 nm for full field shots alone. Intrinsic CD uniformity results below 0.69 nm were also demonstrated for 41nm lines on a 90nm pitch.

At the most advanced nodes, tool stability and process robustness become increasingly critical. Additional calibrations help with this, but they must not compromise productivity. Therefore, long-term inherent tool stability and process robustness must be maintained. The S630D has demonstrated five lot SMO data below 1.7nm (Avg. + 3σ) across a ten-day period, and SMO performance (Avg. + 3σ) below 1.4nm across the lot for both hydrophobic and hydrophilic processes. Additionally, a two week focus stability range of only 5.3 nm max/min was achieved.

Nikon provides a number of “Masters” – automated software solutions that ensure the scanner is performing at its best. These include LNS (lens) Master, OPE Master, CDU Master, and OVL (overlay) Master. LNS Master enables reticle-specific thermal compensation on the scanner. OPE Master uses customer designs and scanner adjustments to provide illumination condition matching for aligning performance across a fleet of scanners and ensuring that one OPC solution works on all of them. CDU Master provides optimization capabilities that enable the scanner to correct for other process window detractors. Because overlay matching plays a central role in multiple patterning applications, OVL Master enables automated grid and distortion matching, as well as automated reticle expansion correction to maximize yield. The NSR-S630D works in tandem with the Masters software to deliver optimized scanner exposure parameters that enhance performance on product wafers. In addition to maximized yield and manufacturing flexibility, enhanced productivity is imperative in making these advanced multiple patterning processes cost effective for chipmakers, and the S630D delivers world-class throughput ≥ 250 wafers per hour (WPH).

Receiving the Best of West award: Holly Magoon, senior marketing manager, and Butch Berry, service order administration manager, Nikon Corporation.

Receiving the Best of West award: Holly Magoon, senior marketing manager, and Butch Berry, service order administration manager, Nikon Corporation.

By Jeff Dorsch

In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.

For example: The 711th Human Performance Wing of the U.S. Air Force is looking at sweat sensors that could be embedded in a printed electronic plaster and attached to the arms of pilots to monitor whether they need to drink more fluids or if taking amphetamines would be advised to maintain optimal alertness in flight.

IDTechEx has forecast that the worldwide market for flexible, printed, and organic electronics will increase from $16.04 billion last year to $76.79 billion in 2023. The overall market will continue to be dominated organic light-emitting diode displays this year and in 2015, the market research firm predicts. Conductive ink and photovoltaics represent large segments of the total market. “On the other hand, stretchable electronics, logic and memory, thin-film sensors are much smaller segments but with huge growth potential as they emerge from R&D,” IDTechEx states.

Printed and flexible sensors are a $6.3 billion market, according to IDTechEx, with much of that total representing biosensors – disposable blood-glucose test strips that diabetics use to check their blood-sugar levels.

Frost & Sullivan forecasts that the printed electronics market will enjoy a compound annual growth rate of 34 percent through 2021.

Semiconductor Equipment and Materials International has taken a large interest in flexible and printed electronics for several years, establishing the SEMI Plastic Electronics Special Interest Group. In cooperation with FlexTech Alliance, SEMI will present a SEMICON West workshop on Thursday, July 10, on “Flexible Hybrid Electronics for Wearable Applications – Challenges and Solutions,” commencing at 10 a.m. at the San Francisco Marriott Marquis Hotel.

SEMI also will stage the annual Plastic Electronics Conference and Exhibition on October 7-9 in Grenoble, France. The plastic electronics show will alternate between Grenoble and Dresden, Germany, in the years ahead.

Belgium-based imec has been working with thin-film materials in flexible electronics – not the generally inflexible silicon, but indium gallium zinc oxide (IGZO), according to Philip Pieters, imec’s business development director. It is a very thin, flexible, unbreakable material, and “almost invisible,” he says.

IGZO thin-film transistors were first developed more than a decade ago by the Tokyo Institute of Technology and the Japan Science and Technology Agency. The IGZO-TFT technology has been licensed to Samsung Electronics and Sharp Electronics.

“We could make microprocessors, AC/DC circuits, etc.,” with IGZO, Pieters says. “Our processes are compatible with large-format glass plates. It could be processed in a cost-effective way for large-scale manufacturing.” IGZO could prove to be cheaper than silicon-based electronics, he adds.

As a research and development organization, imec keeps its production of IGZO-based electronics on a small scale, but the process could be ported to large-scale plants “in the next year or so,” Pieters says.

Stretchable electronics that “could be put on skin” are one potential application in wearable devices, the imec executive adds.

Printed, flexible, and organic electronics are clearly a growing opportunity, one that is attracting an increasing number of manufacturers and suppliers.

IGZO

Berger Pierre-DamienBy Pierre-Damien Berger, VP Business Development & Communication; CEA-Leti

Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big. Citing industry sources during of “The Internet of Things: from sensors to zero power,” the recent LetiDays conference in Grenoble, France, speakers offered projections venturing up to 50 billion connected objects by 2020.

Jacques Husser, COO of SIGFOX, said the IoT is the next major technological revolution, and that connecting billions or trillions of devices and enabling them to communicate with each other and will require more than high bandwidth. While increasing bandwidth is a key focus for multi-media and voice data network operators, for IoT companies reducing energy consumption and costs are key to handling the continuous volume of small messages from all those things.

SIGFOX, whose network is dedicated to the IoT, provides power-efficient, two-way wireless connectivity for IoT and machine-to-machine communications. Husser said the company’s technology is compatible with existing chipsets from vendors such as Texas Instruments, STMicroelectronics, Silicon Labs, Atmel, NXP and Semtech. Husser said that while SIGFOX’s technology complements 2G, 3G and 4G systems, it does not require a SIM card. Devices’ IP addresses are established during manufacturing.

The company, which has networks operating or in rollout with partners in several countries and major cities, is enabling applications for building and vehicle security, indoor climate monitoring, pet tracking, smart-city apps for parking and lighting management, asset management including billboard monitoring, water utility metering, and health-care apps like fall detection, distress signaling and medicine dispensing. Many more are expected.

Leti’s RF design and antenna expertise were used to help connect SIGFOX’s cellular networks. In addition, Leti is working with other startups and SMEs to develop and connect smart functions in a variety of products that will use the IoT to communicate. Primo1D was spun out of Leti in 2013 to produce E-Thread®, an innovative microelectronic packaging technology that embeds LEDs, RFIDs or sensors in fabric and materials for integration in textiles and plastics using standard production tools.

Leti startup BeSpoon recently launched SpoonPhone, a smartphone equipped with the capability to locate tagged items within a few centimeters’ accuracy. The capability is enabled by an impulse radio ultra-wideband (IR-UWB) integrated circuit developed by Leti and BeSpoon. Leti and Cityzen Sciences, the award-winning designer and developer of smart-sensing products, have begun a project to take the company’s technology to the next level by integrating micro-sensors in textiles during the weaving stage.

Leti and CORIMA, a leading supplier of carbon-composite wheels and frames for track and road-racing cyclists, are developing an integrated sensor system to measure the power output of riders as they pedal.

Citing research by Morgan Stanley Research, Leti’s telecommunications department head Dominique Noguet noted that worldwide shipments of smartphones and tablets exceeded shipments of desktop and notebook PCs for the first time in 2011. This signaled that the web has gone mobile, a fact underscored by a Cisco forecast that M2M mobile data traffic will increase 24x from 24 petabytes per month in 2012 to 563 petabytes in 2017.

Noguet said the IoT growth will present scaling challenges and require new communication protocols for sporadic, asynchronous, decentralized, low-power traffic. In addition to harvesting, or scavenging, energy to assure continuous connectivity, there will be demand for technologies that enable spectrum scavenging in unlicensed spectra, for example, and that use new bands, such as millimeter wave, white spaces and even light.

Leti has numerous ways to support development of the IoT, ranging from embedding antennas in specific materials through characterization and design, to implementing full-blown custom radio technologies. The inclusion of UHF RFID tags for the tire industry was cited as a first example where read/write range performances were a challenge. Leti’s ultra-wideband localization technology is another example where competence in signal processing, real-time design, antenna technology and mixed RF/digital ASIC design was combined to provide a complete solution where no off-the-shelf approach was available.

Noguet also noted potential threats to IoT security, and cited Leti’s involvement in the Santander, Spain, smart city project, which includes experimental advanced research on IoT technologies. Leti and CEA-List were in charge of securing access to the SmartSantander infrastructure and communications over a wireless sensor network. This included ensuring the security of the transactions and protecting users’ privacy.

By Shannon Davis, Web Editor

The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

“The roadmap has never taken into consideration what the consumers were asking for,” said Mr. Rao, on Wednesday’s closing session at The ConFab 2014.

The industry has enjoyed a stable, predictable industry for many years, as we made PCs and a lot of PCs. However, these are no longer the driving devices in the consumer market, and with different cost structures and more pressure to innovate than ever before, Mr. Rao stressed that the industry’s tendency to solely focus on scaling was no longer going to be enough to keep up with shifting consumer demands. Mr. Rao’s main charge: the industry needs to intercept consumer thought and demand and determine how it is going to impact the semiconductor industry and supply chain.

“We need to cater the roadmap to the technologies that are coming and the products that consumers want,” Mr. Rao said.

In order to adapt, Mr. Rao explained that it was imperative to integrate the entire supply chain into the roadmap if we really want to make significant strides in the manufacturability of these new products.

“We need to look at the roadmap as an ecosystem – not just materials, not just equipment, but the entire picture. We need to understand how to bring the supply chain into the picture,” Mr. Rao said.

To do this, Mr. Rao outlined the elements of effective problem solving and encouraged his audience to become masters of it. To be effective in the evolving technology landscape, Mr. Rao stressed the importance of understanding and analyzing every aspect of the supply chain, down to the smallest component, all of which contribute to defects and can no longer be ignored if quality is to be maintained.

“You need to understand to the smallest degree of your supply chain,” Mr. Rao charged ConFab’s attendees. “You need to analyze and trace the data. If you don’t do that, then the time to market and time to money are sacrificed.”

“We can’t follow Moore’s Law conveniently and forget about what’s two years down the road,” he concluded.

Gopal Rao presents at The ConFab 2014 on June 25, 2014.

Gopal Rao presents at The ConFab 2014 on June 25, 2014.