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Lumileds announced the appointment of Kevin Martin as Senior Vice President of Quality, effective March 1. Martin has over 30 years of experience in Quality, most recently serving as VP of Global Quality at Flextronics.

“We are thrilled to have Kevin join our organization to continue to strengthen how we deliver advanced lighting solutions at the highest quality level,” said Mark Adams, CEO of Lumileds.

During his time at Flextronics, Martin led the worldwide Quality team supporting global operations in North and South America, China, Europe and India. Prior to Flextronics, Kevin served as VP of Total Customer Satisfaction at Nissan Motor, where he was responsible for North and South America field quality and customer satisfaction for all Nissan and Infiniti vehicles. Prior to Nissan, Kevin was the General Manager of Customer Quality Engineering at Toyota. In addition to roles in Quality, Martin has held positions in production, manufacturing operations and engineering. Martin has a Bachelor’s Degree in Manufacturing Engineering from Western Carolina University.

“I am excited to join Lumileds and help further our commitment to quality across our growing customer base,” added Martin.

On February 2, 2018, Seoul Semiconductor Co., Ltd (“Seoul”) filed a patent infringement lawsuit in Italy in the Court of Milan against Mouser Electronics Inc. (“Mouser”), a global electronic components distributor, as well as its Italian subsidiary – for the sale of certain Everlight LED products.

According to the complaint, Seoul has asserted that Mouser is liable for selling such LED products that infringe Seoul’s patent rights. Based on the alleged infringement, Seoul has sought a permanent injunction, damages, withdrawal from the market, and destruction of such products.

Prior to this litigation, Seoul already filed two patent infringement lawsuits against Mouser in Germany in the District Court of Düsseldorf in 2017, accusing high-power and mid-power LED products manufactured by Everlight of infringement.

Despite such lawsuits, however, Mouser has continued to sell products accused of infringement in other countries. For that reason, Seoul launched its third patent infringement lawsuit against Mouser for the sale of Everlight LED products in Italy. Seoul is committed to pursuing enforcement against those that infringe its patent rights.

Seoul has invested 10% of its revenue, more than 100 million dollars per year, in research and development to develop innovative technology and strengthen its patent portfolio since its inception. Seoul has also made a significant commitment to protecting its intellectual property rights against suspected infringement since it successfully obtained a preliminary injunction order against Taiwan LED maker AOT in 2005. For example, in 2014, Seoul filed patent infringement lawsuits against two North American TV makers in 2014, resulting in a judgment based upon one maker’s admissions of infringement, and royalty-bearing licenses by both makers. In 2016, Seoul secured a willful infringement judgment for its LED lens patent against Japanese LED lens maker Enplas from the U.S. district court. In 2017, Seoul resolved a patent infringement litigation that it had against Kmart, and as part of the settlement, Kmart agreed to stop selling certain filament LED bulbs. Seoul also recently began an enforcement campaign for protecting its Acrich technology, and has filed a patent litigation against a U.S. lighting maker for infringement of 12 Acrich patents. Throughout this period, Seoul has continued to put other companies on notice that it suspects of patent infringement.

Seoul plans to continue and expand its patent enforcement against market participants involving suspected-infringement across the world – until they cease suspected-infringement and Seoul secures court remedies to address harm caused by the suspected-infringement.

An official of Seoul’s IP team explained, “In order to fundamentally block distribution of suspected-infringing products, we will have to expand our enforcement efforts to include direct manufacturers, secondary product manufacturers who have purchased or used suspected-infringing components, as well as their distributors.”

He added, “For young entrepreneurs and small businesses that try to realize their dreams with a creative idea, we believe that intellectual property should be respected.”

Advanced Micro-Fabrication Equipment Inc. (AMEC) today announced that the Patent Re-examination Board (PRB) of the State Intellectual Property Office (SIPO) in China, ruled on Jan. 23 that all patent claims relating to patent number ZL 01822507.1 held by Veeco Instruments Inc. (Veeco U.S.), and titled “Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition”, are invalid. The court cited “lack of novelty and non-obviousness” for its decision.

The patent ruled invalid is the Chinese counterpart of the patents (U.S. 6506252 and U.S. 6726769) asserted by Veeco U.S. in an infringement action taken last year against AMEC’s wafer carrier supplier, and filed in the U.S. District Court for the Eastern District of New York.

AMEC thoroughly analyzed the patent when first developing its MOCVD technology. The company found that the technology covered by the patent was preceded by substantial prior art dating back to the 1960s. As such, the patent should be invalid. AMEC had earlier filed petitions to invalidate the counterpart patents in the Intellectual Property (IP) offices of China, South Korea and the U.S.

“We are pleased that based on our compelling evidence, the Chinese Patent Re-examination Board has ruled Veeco’s patent invalid,” said Dr. Zhiyou Du, senior vice president, COO & general manager of AMEC’s MOCVD product division. “We are confident that the same decision will be reached by the Patent Trial and Appeal Boards of the U.S. Patent & Trademark Office and the Korean IP office.”

Dr. Du continued: “To be enforceable, a patent must meet the requirements of patent law. It is intolerable to us that Veeco U.S. would attempt to stifle competition by leveraging an obviously invalid patent to file a lawsuit against AMEC’s wafer carrier supplier.”

In a separate development that occurred on Jan. 12, 2018, Chinese customs temporarily detained two EPIK700 MOCVD tools upon their arrival in China. The tools, shipped by Veeco Asia, are suspected of infringing AMEC’s patent (CN 202492576). The detention was consistent with Chinese law. AMEC is contemplating further legal action, which may include filing a patent infringement lawsuit with the Chinese court.

The enforcement action by Chinese customs on Jan. 12 followed a ruling last Dec. by the Fujian High Court in Chinawhen it granted AMEC’s motion for an injunction against Veeco Shanghai. The injunction prohibits Veeco Shanghai from importing, manufacturing, selling or offering for sale to any third party any MOCVD systems and wafer carriers used in the MOCVD systems that would infringe AMEC’s patent in China.

Dr. Gerald Yin, chairman and CEO of AMEC stated: “AMEC will never tolerate infringement of its IP rights. We will vigorously defend against violations and will always proactively protect our IP investment. Of course, we prefer to concentrate on innovating high-value products and providing quality services to customers instead of wasting time and resources on lawsuits.”

Dr. Yin concluded: “The Chinese LED industry should not be distracted or harmed by litigation involving Veeco U.S., our wafer carrier supplier, and AMEC. Therefore, we are open to reaching a solution that is beneficial for all three parties.”

More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate already strong industry growth. March 14-16, 2018, at the Shanghai New International Expo Centre (SNIEC), SEMICON China 2018 will bring together top executives and technologists in six exhibition halls, the most ever in the event’s 30-year history, to find opportunities in key focus areas including Smart Automotive and Smart Manufacturing, Green Tech, Advanced Technology, and Power and Compound Semiconductors.

Concurrent with FPD China, SEMICON China 2018, the largest and most influential gathering of the semiconductor supply chain in China, is now open for visitor registration.

SEMICON China technical forums will address the most pressing industry topics:

  • CSTIC 2018: Staged in conjunction with SEMICON China, this has ranked among the largest and most comprehensive annual semiconductor technology conferences in China since 2000. March 11-12, 2018, CSTIC 2018 will feature nine symposiums covering all aspects of semiconductor technology, with a focus on manufacturing and advanced technology.
  • SIIP: Tech Innovation and Investment Forum: SIIP is a key international platform for semiconductor industry investment in China. Informed by China’s IC policy to fund key semiconductor sectors, leaders of China’s National IC Fund and municipal IC funds will join leaders from global investment institutions to discuss hot opportunities in China semiconductor investment – and applications such as Artificial Intelligence (AI).
  • Win-Win: Build China’s IC Ecosystem: Spurred by a strong market outlook, policy and the national fund, fab construction in China will surge over the next five years, with OSAT (Outsourced Semiconductor Assembly and Test) making strategic investments. Industry leaders will explore how China’s semiconductor manufacturing industry will strengthen its core competency, prioritize resources, revisit its business model, and thrive in the electronics ecosystem.
  • Power and Compound Semiconductor International Forum: Among the largest power and compound semiconductor industry forums in Asia, this two-day event features four sessions: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology
  • Smart Automotive Forum – AI Inside: Top automotive, electronic, AI and technology executives will gather to discuss the future of the rapidly disrupting automotive industry.
  • China Memory Strategic Forum: Driven by market needs and policy support, three new Chinese Memory foundries are accelerating memory development. Industry leaders will explore ways multinationals can benefit more from China’s memory market, China can better leverage its technical strength, and Chinese companies can enhance research and development collaboration with global partners.
  • Green High-Tech Facility Forum: With more than 10 fabs now under construction in China,China’s semiconductor industry is entering a stage of rapid growth. Green Tech leaders will discuss how China can improve factory design and construction; optimize energy efficiency of semiconductor manufacturing equipment; enhance machine platform stability, chemicals and gas management, and wastewater treatment; and improve risk management.
  • Smart Manufacturing Forum: The semiconductor industry must be proactive in all aspects of smart manufacturing. This session will address automation, product tractability, cost and cycle time reduction, enhancements in productivity and yield, and efficiency improvements in front- and back-end factories.
  • Semiconductor New Technology Conference: The best way to promote new technology is through direct customer interaction and collaboration. Join this conference to discuss your new IC, new IOT solution, new machine or new material with more 200 customers from around the world.
  • 2018 China Display Conference-Emerging Display Forum: Join this forum, concurrent with FPD China 2018, to exchange ideas on emerging display technologies and future development.
  • MSIG International IOT Conference 2018: MEMS, sensors, IC, NB-IoT, 5G and smart application experts will share their insights on the IoT market and how to maximize the value of IoT applications.

SEMICON China also features three theme pavilions:

  • IC Manufacturing: See products, technologies, and manufacturing solutions focused on serving China’s fabless IC community, from design to final manufacturing.
  • LED and Sapphire: Learn how China has become the world’s largest sapphire manufacturing center.
  • ICMTIA: See the local IC material industry demonstrate its capabilities to support semiconductor industry growth.

Advanced Micro-Fabrication Equipment Inc. (AMEC) today announced that the Fujian High Court in China has granted AMEC’s motion for an injunction against Veeco Instruments (Shanghai) Co. Ltd. (Veeco Shanghai). The injunction prohibits Veeco Shanghai from importing, manufacturing, selling or offering for sale to any third party any MOCVD systems and wafer carriers used in the MOCVD systems that would infringe AMEC’s patent CN 202492576 in China. The patent covers AMEC’s proprietary wafer carrier and spindle-locking and synchronization technology. The injunction covers Veeco’s TurboDisk EPIK 700 system, EPIK 700 C2 system, and EPIK 700 C4 system, as well as the related wafer carriers used in the MOCVD systems. AMEC believes that the ruling should also cover Veeco’s EPIK 868 system and related wafer carriers, since AMEC believes that the EPIK 868 system also uses AMEC’s patented technology involved in the action.

The ruling, which is unappealable, takes effect immediately. The stringent injunction terms expose the nature of Veeco Shanghai’s flagrant violation of AMEC’s intellectual property (IP) and confirms that Veeco Shanghai does not respect AMEC’s IP rights.

AMEC filed the patent infringement claim against Veeco Shanghai in the Fujian High Court on July 13th 2017. The motion requested a permanent injunction against Veeco Shanghai, as well as compensation for monetary damages of more than 100 million RMB Yuan (approx. US$15 million).

The injunction follows a previous victory for AMEC relating to the same action. When AMEC filed its claim in July, Veeco Shanghai responded by filing a patent invalidation request with the Patent Re-examination Board (PRB) of the State Intellectual Property Office (SIPO) in China. A second request to invalidate the same AMEC patent was filed concurrently by an individual. The PRB held separate hearings for the two requests. On Nov. 24th2017, the PRB dismissed both requests,thereby upholding the validity of the patent.

AMEC invested heavily in R&D and IP protection for this key technology. AMEC first developed the technology, filed a series of patents to protect the innovations, and installed equipment containing the technology at a number of LED production fabs in China. Veeco later followed by using the same locking approach in its MOCVD system to improve the tool’s performance. After AMEC filed the patent disputed by Veeco Shanghai, Veeco Instruments Inc. (Veeco US) submitted a similar patent application, and subsequently used this technology in its MOCVD system, thus infringing AMEC’s patent.

“The court’s ruling and the PRB’s decisions together confirm in no uncertain terms that AMEC’s technology contains unique innovations, and that our patent portfolio is comprehensive, robust and highly valuable,” said Dr. Zhiyou Du, Senior Vice President, COO & General Manager of AMEC’s MOCVD Product Division. “We are very pleased with the court’s decision. We take IP enforcement seriously, and we will not tolerate any violation of our IP rights. Indeed, we will aggressively pursue instances of infringement, and vigorously protect our IP portfolio.”

Dr. Du continued: “As a supplier of high-end micro-fabrication equipment to leading global manufacturers of ICs, LEDs and power devices, AMEC attaches great importance to IP protection. Since our founding in 2004, we have independently developed unique technologies to enable our customers worldwide. Therefore, for more than a decade, we have defended our IP in domestic and international jurisdictions when challenged, and prevailed in every case. We respect the IP of our customers and competitors, and we expect the same regard for our IP.”

In a separate development, AMEC filed a motion on Dec. 8th 2017 to invalidate a Veeco patent with the Patent Trial and Appeal Board (PTAB) of the US Patent & Trademark Office (USPTO). The patent, US 6,726,769 filed in 2001, covers a detachable wafer carrier technology. It was asserted in an infringement action initiated in the US by Veeco US against AMEC’s supplier of wafer carriers for MOCVD systems. AMEC believes that the Veeco patent is invalid because the technology was definitively and clearly disclosed in many prior patents and publications as far back as the early 1960s. Therefore, the Veeco patent does not meet standard patent law requirements. Besides filing to invalidate the patent in the US, AMEC has already filed motions to invalidate counterpart patent families in China and South Korea.

AMEC intends to also challenge a second Veeco US patent (US 6,506,252) involved in the same US infringement action. A motion to that effect will soon be filed with the PTAB.

Dr. Gerald Yin, Chairman and CEO of AMEC, said: “We are confident that AMEC will prevail in its action against Veeco Shanghai, and that Veeco Shanghai will be required to pay for the enormous cost of its infringement beginning in 2014 when Veeco US launched its EPIK 700 system. In addition, we believe that our supplier will eventually prevail in its US case.”

Dr. Yin further noted: “AMEC is an innovative company with extensive expertise in providing breakthrough technologies that enable customers with competitive advantages. Our products have earned market success for their differentiation and value. Naturally, we prefer to focus our efforts on providing such innovative products and stellar service to customers instead of wasting time and resources on litigation. That’s why we’re fully committed to reaching a positive resolution with Veeco, and working diligently to achieve that goal.”

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $37.1 billion for the month of October 2017, an increase of 21.9 percent from the October 2016 total of $30.4 billion and 3.2 percent more than last month’s total of $36.0 billion. October marked the global industry’s largest-ever monthly sales total. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, the latest WSTS industry forecast was revised upward and now projects annual global market growth of 20.6 percent in 2017 and 7.0 percent in 2018.

“The global semiconductor market continued to grow impressively in October, with sales surpassing the industry’s highest-ever monthly total and moving closer to topping $400 billion for 2017,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Market growth continues to be driven in part by high demand for memory products, but combined sales of all other semiconductor products were up substantially as well, showing the breadth of the market’s strength this year.”

Regionally, year-to-year sales increased in the Americas (40.9 percent), Europe (19.5 percent), China (19.1 percent), Asia Pacific/All Other (16.3 percent), and Japan (10.7 percent). Compared with last month, sales were up more modestly across all regions: the Americas (6.8 percent), China (2.6 percent), Europe (2.6 percent), Japan (1.8 percent), and Asia Pacific/All Other (1.5 percent).

Additionally, SIA today endorsed the WSTS Autumn 2017 global semiconductor sales forecast, which projects the industry’s worldwide sales will be $408.7 billion in 2017. This would mark the industry’s highest-ever annual sales, its first time topping $400 billion, and a 20.6 percent increase from the 2016 sales total. WSTS projects double-digit year-to-year increases across all regional markets for 2017: the Americas (31.9 percent), Asia Pacific (18.9 percent), Europe (16.3 percent), and Japan (12.6 percent). Beyond 2017, growth in the semiconductor market is expected to moderate across all regions. WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

To find out how to purchase the WSTS Subscription Package, which includes comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, please visit http://www.semiconductors.org/industry_statistics/wsts_subscription_package/. For detailed data on the global and U.S. semiconductor industry and market, consider purchasing the 2017 SIA Databook: https://www.semiconductors.org/forms/sia_databook/.

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Transphorm Inc., a designer and manufacturer of highest reliability (JEDEC and AEC-Q101 qualified) 650V gallium nitride (GaN) semiconductors, announced it received a $15 million investment from Yaskawa Electric Corporation. This news comes only a few weeks after Yaskawa revealed its integrated Σ-7 F servo motor relies on Transphorm’s high-voltage (HV) GaN to deliver unprecedented performance and power density. Transphorm intends to allocate the funds to various areas of its GaN product development.

“We’ve seen the benefits of working with gallium nitride from the R&D phases through to the application development phases of our products, such as photovoltaic converters and the integrated Σ-7 F servo motor,” said Yukio Tsutsui, General Manager of Corporate R&D Center from Yaskawa. “We look ahead to further developments from Transphorm and its cutting-edge technology.”

The integrated Σ-7 F products resulting from the companies’ co-development serves one of the core target markets that can benefit most from HV GaN: servo motors. The technology is also an optimal solution for automotive systems, data center and industrial power supplies, renewable energy and other broad industrial applications.

“Transphorm has consistently prioritized the quality and reliability of our GaN platform,” said Dr. Umesh Mishra, Chairman, CTO and co-founder of Transphorm. “That focus leads to strong customer relationships with visionaries such as Yaskawa and companies that not only innovate, but also influence market growth by demonstrating GaN’s real-world impact. Receiving Yaskawa’s recent support illustrates the rising confidence in GaN while underscoring its reliability.”

Pixelligent Technologies, the inventor of PixClear high-index nanocomposites for the OLED display, HD display, and solid state lighting markets, announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

“Alain and Gene are joining the Pixelligent team at a critical time in our development as we are emerging from years of product development and application engineering, to widespread adoption of our nanocomposites across all of our target markets. The combined vast experience which Alain Harrus brings on the OLED and semiconductor equipment front, and that Gene Banucci brings from having built one of the most successful advanced materials companies, is an incredibly valuable addition to the Pixelligent team and we are honored to have them,” commented Craig Bandes, CEO of Pixelligent Technologies.

Alain Harrus is currently the CEO of Kateeva, a manufacturer of a deposition equipment platform utilizing ink jet printing, with its initial focus on mass production of OLED displays. Kateeva’s innovations are helping to accelerate the adoption of OLED and other advanced display technologies. Prior to Kateeva, Alain was a Partner at Crosslink Capital, a San Francisco-based venture capital company where he led the firm’s semiconductor and energy technology investment activities. Before Crosslink he was the CTO at Novellus Systems—now part of Lam Research. “I’m excited to be joining the Pixelligent Board as the Company is entering its inflection point and emerging as a leading provider of high-efficiency materials to the OLED and HD display markets,” said Alain Harrus. Pixelligent and Kateeva have been partnering to optimize advanced display process solutions for the OLED for the past 12 months.

Gene Banucci is the former founding CEO of ATMI.  Gene served as CEO of ATMI from 1986-2004 and remained on the Board until the company was sold for $1.1B in 2014. Under his leadership the company completed an IPO and he grew the company to $245 million in revenues when he retired.  Since retiring as CEO, he has served on over 10 Boards across numerous industries.  “I have known and worked with executives at Pixelligent and have been following the Company’s progress for the last few years.  I am impressed with the balanced approach that Pixelligent has executed on both the market-leading materials they have developed as well as their proprietary mass production manufacturing platform.  I look forward to working with the team to help firmly establish Pixelligent as a leading advanced materials supplier to the OLED and Solid State Lighting markets,” said Gene Banucci.

“These are exciting times for Pixelligent and we expect 2018 to be a record year in terms of revenues and commercial wins across all of our core OLED display, OLED lighting, HD Display, and LED lighting markets,” said Bandes.

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter. Sales for the month of September 2017 were $36.0 billion, an increase of 22.2 percent over the September 2016 total of $29.4 billion and 2.8 percent more than the previous month’s total of $35.0 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

highest ever sales

“Global semiconductor sales increased sharply year-to-year in September, and year-to-date sales through September are more than 20 percent higher than at the same point last year,” said John Neuffer, SIA president and CEO. “The industry posted its highest-ever quarterly sales in Q3, and the global market is poised to reach its highest-ever annual revenue in 2017.”

Regionally, year-to-year and month-to-month sales increased in September across all markets: the Americas (40.7 percent year-to-year/5.9 percent month-to-month), China (19.9 percent/2.5 percent), Europe (19.0 percent/1.8 percent), Asia Pacific/All Other (16.8 percent/1.9 percent), and Japan (11.9 percent/0.5 percent).

“The Americas market continued to stand out, notching its largest year-to-year sales increase in more than seven years,” Neuffer said. “Standouts among semiconductor product categories included memory products like DRAM and NAND flash, both of which posted major year-to-year growth in September, as well as Logic products, which enjoyed double-digit growth year-to-year.”

The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel, may go down as one of the most memorable editions for the sheer variety and depth of its talks, sessions, courses and events.

Among the most-anticipated talks are presentations by Intel and Globalfoundries, which will each detail their forthcoming competing FinFET transistor technology platforms in a session on Wednesday morning. FinFET transistors are a major driver of the continuing progress of the electronics industry, and these platforms are as important for their commercial potential as they are for their technical innovations.*

Each year at the IEDM, the world’s best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

“Those who attend IEDM 2017 will find much that is familiar, beginning with a technical program describing breakthroughs in areas ranging from mainstream CMOS technology to innovative nanoelectronics to medical devices. The Sunday Short Courses are also a perennial favorite because they are not only comprehensive but are also taught by accomplished world experts,” said Dr. Barbara De Salvo, Scientific Director at Leti. “But we have added some new features this year. One is a fourth Plenary session, on Wednesday morning, featuring Nobel winner Hiroshi Amano. Another is a revamped Tuesday evening panel. Not only will it focus on a topic of great interest to many people, it is designed to be more open and less formal.”

Other features of the IEDM 2017 include:

  • Focus Sessions on the following topics: 3D Integration and Packaging; Modeling Challenges for Neuromorphic Computing; Nanosensors for Disease Diagnostics; and Silicon Photonics: Current Status and Perspectives.
  • A vendor exhibition will be held, based on the success of last year’s event at the IEDM.
  • The IEEE Magnetics Society will again host a joint poster session on MRAM (magnetic RAM) in the exhibit area. New for this year, though, is that the Society will also hold its annual MRAM Global Innovation Forum on Thursday, Dec. 7 at the same hotel, enabling IEDM attendees to participate. (Refer to the IEEE Magnetics Society website.) The forum consists of invited talks by leading experts and a panel discussion.

Here are details of some of the events that will take place at this year’s IEDM:

90-Minute Tutorials – Saturday, Dec. 2
These tutorials on emerging technologies will be presented by leading technical experts in each area, with the goal of bridging the gap between textbook-level knowledge and cutting-edge current research.

  • The Evolution of Logic Transistors Toward Low Power and High Performance IoT Applications, Dr. Dae Won Ha, Samsung Electronics
  • Negative Capacitance Transistors, Prof. Sayeef Salahuddin, UC Berkeley
  • Fundamental, Thermal, and Energy Limits of PCM and ReRAM, Prof. Eric Pop, Stanford University
  • Hardware Opportunities in Cognitive Computing: Near- and Far-Term, Dr. Geoffrey Burr, Principal Research Staff Member, IBM Research-Almaden
  • 2.5D Interposers and High-Density Fanout Packaging as Enablers for Future Systems Integration, Dr. Venkatesh Sundaram, Associate Director, Georgia Tech 3D Systems Packaging Research Center
  • Silicon Photonics for Next-Generation Optical Interconnects, Dr. Joris Van Campenhout, Program Director Optical I/O, Imec

Short Courses – Sunday, Dec. 3
The day-long Short Courses provide the opportunity to learn about important developments in key areas, and they enable attendees to network with the industry’s leading technologists.

Boosting Performance, Ensuring Reliability, Managing Variability in Sub-5nm CMOS, organized by Sandy Liao of Intel, will feature the following sections:

  • Transistor Performance Elements for 5nm Node and Beyond, Gen Tsutsui, IBM
  • Multi-Vt Engineering and Gate Performance Control for Advanced FinFET Architecture, Steve CH Hung, Applied Materials
  • Sub-5nm Interconnect Trends and Opportunities, Zsolt Tokei, Imec
  • Transistor Reliability: Physics, Current Status, and Future Considerations, Stephen M. Ramey, Intel
  • Back End Reliability Scaling Challenges, Variation Management, and Performance Boosters for sub-5nm CMOS,Cathyrn Christiansen, Globalfoundries
  • Design-Technology Co-Optimization for Beyond 5nm Node, Andy Wei, TechInsights

Merged Memory-Logic Technologies and Their Applications, organized by Kevin Zhang of TSMC, will feature the following sections:

  • Embedded Non Volatile Memory for Automotive Applications, Alfonso Maurelli, STMicroelectronics
  • 3D ReRAM: Crosspoint Memory Technologies, Nirmal Ramaswamy, Micron
  • Ferroelectric Memory in CMOS Processes, Thomas Mikolajick, Namlab
  • Embedded Memories Technology Scaling & STT-MRAM for IoT & Automotive, Danny P. Shum, Globalfoundries
  • Embedded Memories for Energy-Efficient Computing, Jonathan Chang, TSMC
  • Abundant-Data Computing: The N3XT 1,000X, Subhasish Mitra, Stanford University

Plenary Presentations – Monday, Dec. 4

  • Driving the Future of High-Performance Computing, Lisa Su, President & CEO, AMD
  • Energy-Efficient Computing and Sensing: From Silicon to the Cloud, Adrian Ionescu, Professor, EPFL
  • System Scaling Innovation for Intelligent Ubiquitous Computing, Jack Sun, VP of R&D, TSMC

Plenary Presentation – Wednesday, Dec. 6

  • Development of a Sustainable Smart Society by Transformative Electronics, Hiroshi Amano, Professor, Nagoya University. Dr. Amano received the 2014 Nobel Prize in Physics along with Isamu Akasaki and Shuji Nakamura for the invention of efficient blue LEDs, which sparked a revolution in innovative, energy-saving lighting. His talk will be preceded by the Focus Session on silicon photonics.

Evening Panel Session – Tuesday evening, Dec. 5

  • Where will the Next Intel be Headquartered?  Moderator: Prof. Philip Wong, Stanford

Entrepreneurs Lunch
Jointly sponsored by IEDM and IEEE EDS Women in Engineering, this year’s Entrepreneurs Lunch will feature Courtney Gras, Executive Director for Launch League, a local nonprofit focused on developing a strong startup ecosystem in Ohio. The moderator will be Prof. Leda Lunardi from North Carolina State University. Gras is an engineer by training and an entrepreneur by nature. After leaving her job as a NASA power systems engineer to work for on own startup company, she discovered a passion for building startup communities and helping technology-focused companies meet their goals. Named to the Forbes ’30 Under 30′ list in 2016, among many other recognitions and awards, Gras enjoys sharing her stories of founding a cleantech company with young entrepreneurs. She speaks on entrepreneurship, women in technology and clean energy at venues such as TEDx Budapest, the Pioneers Festival, and the IEEE WIE International Women’s Leadership Conference.