Tag Archives: letter-leds-business

In response to the current crisis in confidence brought on by revelations of misreporting of emissions levels by a major multinational car manufacturer, Edwards Ltd and its subsidiaries (Edwards), the leading supplier of exhaust management abatement systems to the Semiconductor, Flat Panel Display, Solar and LED industry, reassures its customers that all of its exhaust management abatement system products are designed to meet industry emission standards.

“Environmental responsibility is one of our top priorities at Edwards,” states Paul Rawlings, Vice President Marketing, Semiconductor & DSL Business Unit. “We take great pride in adhering to high standards in our worldwide manufacturing facilities, as well as in all the products that we make. All of our exhaust management abatement systems have been independently verified in use according to internationally recognised methods and standards, including those set by the United States Environmental Protection Agency and other national and international regulatory bodies.”

Paul Rawlings adds, “The recent news and controversy about a German car company apparently deliberately designing its products to evade emissions tests is very surprising and serves as a reminder of the need to always verify testing methodologies when reviewing performance data. As a global leader in the design and manufacture of exhaust management abatement systems for the electronics industry we want to reassure our customers that all of our abatement products comply with internationally recognized standards and that protecting the environment from harmful gasses is a responsibility we all share – across all industries, and across all borders.”

Marking an industry first for emerging electronics devices, Semiconductor Research Corporation (SRC) today announced a significant expansion of its benchmarking research — a unique program that evaluates the relative capabilities of new and emerging computing devices.

SRC, the world’s leading university-research consortium for semiconductor technologies, is managing the initiative through its Nanoelectronics Research Initiative (SRC-NRI) and STARnet Research programs. The research will be led by the Georgia Institute of Technology’s Azad Naeemi, associate professor, Georgia Tech School of Electrical and Computer Engineering.

“Benchmarking guides university research funded through SRC — enabling concise communication of research outcomes, focusing researchers’ attention on key technical challenges and sparking invention,” said Tom Theis, executive director of SRC-NRI. “Professor Naeemi’s research is expected to take benchmarking of emerging devices to a new level of sophistication.”

Evaluating the performance of devices in representative “benchmark” circuits is a well-established engineering practice in the semiconductor industry. However, this new program is the first to develop a comparable methodology for evaluating the relative capabilities of emerging devices.

These emerging devices include, for example, transistor-like “steep slope” devices that can operate at very low voltage and, therefore, very low power, and non-volatile magnetic devices that combine the functions of logic and memory. The new devices operate by a variety of principles fundamentally different from those governing the operation of established silicon field-effect transistor technology.

In recent years, benchmarking of these devices has steadily increased in rigor. The Georgia Tech team — selected by a group of SRC member companies supporting the initiative including IBM, Intel Corporation, Micron Technology and Texas Instruments — will build on this foundation.

“This research will also enable selection of the most promising emerging devices for technology transfer to SRC member companies and for continued development in future SRC research programs,” said Gilroy Vandentop, executive director of STARnet Research.

Besides maintaining and improving the established benchmarking methodology, the Georgia Tech team is tasked with developing and evaluating benchmark circuits to better understand the potential of new devices for memory arrays, to explore and quantify the value of non-volatility and to measure the impact of various ways of implementing device-to-device connections. Perhaps most challenging, Prof. Naeemi will lead the development of a rigorous benchmarking methodology for non-Boolean (analog) computational circuits being explored for future applications such as artificial neural networks.

“Our team is chartered with maintaining and improving the established benchmarking methodology for emerging devices, evaluating the potential performance of the various SRC-NRI and STARnet devices in the established benchmark circuits,” said Naeemi. “We will incorporate additional device concepts as they emerge through ongoing research, and we will develop additional benchmark circuits to better understand the capabilities of these devices.”

The SRC benchmark program is a two-and-a-half year effort that funds research from July 1, 2015 through the close of 2017.

Solid State Technology is thrilled to announce that several key industry leaders have joined the Advisory Board for its annual conference and networking event, The ConFab. New members include: Robert Cappel, Senior Director Corporate Marketing, KLA-Tencor; William Chen, Fellow and Senior Technical Advisor, ASE; L.T. Guttadauro, Executive Director, Fab Owners Association; Li Li, Distinguished Engineer, Cisco Systems; Ariel Meyuhas, COO, The MAX Group; Gary Patton, CTO and Head of Worldwide R&D, GLOBALFOUNDRIES and Elton Peace, General Manager North America Regional Operations, Lam Research.

“We are delighted to welcome the new additions to our Advisory Board, each of whom have a unique and valuable insight into the what makes the semiconductor manufacturing industry successful,” said Pete Singer, Editor-in-Chief of Solid State Technology and conference chair for The ConFab. “These individuals will be instrumental is ensuring that The ConFab has an expanded role in the industry and is a “must attend” event for networking and discussing critical economic and manufacturing issues.”

The ConFab 2016 conference program will focus on “The Economics of Semiconductor Manufacturing and Design”. Topics will include:

  • How IoT is Driving the Semiconductor Industry
  • Filling the Fabs of the Future: A Guide to Hot New Applications
  • MEMS Sensor Fusion and More then Moore
  • The Limits of Scaling: Understanding the Challenges of sub-10nm Manufacturing
  • Fabless, Foundries and OSATs: Optimizing the Supply Chain
  • System Integration, Advanced Packaging + 3D Integration
  • China’s New Role in the Global Semiconductor Industry
  • Legacy Fabs and the Resurgence of 200mm
  • The Impact of Continued Consolidation Across the Supply Chain
  • Wearables and Bioelectronics: The Cusp of a Revolution?
  • Tackling Rising R&D Costs in the Semiconductor Industry

The new members will be joining the existing Advisory Board, comprised of David Bennett, VP Alliances, GLOBALFOUNDRIES; Janice M. Golda, Director, Lithography Capital Equipment Development, Intel Corporation; Devan Iyer,,Director Worldwide Semiconductor Packaging Operations, Texas Instruments; Lori Nye, COO/Executive Director Customer Operations, Brewer Science; Ken Rygler, President, Rygler Associates (founder of Toppan Photomasks); Sima Salamati, VP, Fab Operations, imec; Hans Stork, CTO, ON Semiconductor Corporation; Aubrey Tobey, President, ACT International; Geoffrey Yeap, VP of Technology, Qualcomm Inc.; and Abe Yee, Sr. Director, Advanced Technology and Package Development, NVIDIA Corporation.

 The ConFab (June 12-15, 2016) is an executive-level conference and networking event for business leaders from the semiconductor manufacturing and design industry. The event features a high-level conference program, networking events and business meetings with purchasing decision makers and influencers. More information on The ConFab may be found at www.theconfab.com.

RayVio Corporation, a developer of deep ultraviolet (UV) LEDs and integrated solutions, announced today that they are expanding their international sales force, and manufacturing capacity. The facility expansion at the original site is scheduled to be complete by year-end.

RayVio’s current Silicon Valley headquarters houses their wafer growth, chip fabrication, packaging and test R&D and proto-typing capability. The expansion of this facility will enable RayVio to reduce cycle time and produce in excess of two million LED units annually through the installation of additional manufacturing and test equipment. Combined with its contract manufacturing strategy, RayVio is poised to keep pace with the increasing demand of the fast growing deep UV LED market.

The demand is being driven by a host of industrial and consumer applications ranging from water disinfection to consumer medical devices serving multiple global markets.

“Our proven, novel technology platform is producing best in class performance, and at the same time we are executing against our cost reduction roadmap, allowing our downstream partners to make their products a reality,” says Dr. Doug Collins, Vice President of Engineering and Operations.

Until recent achievements in both performance and cost, UV LED solutions were limited to niche applications. With the availability of high optical power UV LEDs, and competitive system level pricing to alternative UV sources, the UV LED industry is seeing a major uptake in solutions being provided.

“RayVio’s superior performance and cost effective solutions have accelerated the mass adoption of UV LED enabled industrial and consumer devices,” says Dr. Robert C. Walker, RayVio co-founder and CEO.  “With the funding we received earlier this year, we have the capital required to grow the company aggressively. By expanding our international sales force and increasing our manufacturing and research capabilities, we will be well positioned to maintain a leadership role.”

RayVio came out of stealth mode at the beginning of 2015 after closing their $9.3M series B round of financing.  They are currently sampling selected customers, and are working closely with industry leading partners in the UV LED curing, medical device and water, surface and air disinfection markets.

The Semiconductor Industry Association (SIA) announced former Defense Secretary Leon Panetta will deliver the keynote address at the upcoming SIA Award Dinner, taking place on Thursday, Dec. 3 in San Jose, Calif. Mr. Panetta, who has also served as CIA director, White House chief of staff, director of the Office of Management and Budget (OMB), and as a member of Congress, will offer insight on how the strength of U.S. technology, and a vibrant U.S. semiconductor industry in particular, are critical to our country’s standing in the world and to our economy and national security.

“Leon Panetta is one of America’s most respected leaders and experts on foreign policy,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The semiconductor industry is a global industry with global challenges. We must ensure smart government policies are in place here at home so our industry can remain strong, and we must work closely with counterparts overseas to ensure we can play on a level playing field in the global markets. Given Mr. Panetta’s extensive and diverse experiences on the domestic and international stages, we very much look forward to his keen perspectives on these matters as we welcome him as the keynote presenter at this year’s SIA Award Dinner.”

Mr. Panetta has dedicated much of his life to public service. He served as the 23rd defense secretary from July 2011 to February 2013. Before joining the Department of Defense, Mr. Panetta served as the director of the CIA from February 2009 to June 2011. Previously, he spent 10 years co-directing with his wife, Sylvia, the Leon & Sylvia Panetta Institute for Public Policy, based at California State University, Monterey Bay. The Institute is a nonpartisan, not-for-profit center that seeks to instill the virtues and values of public service in young men and women.

From July 1994 to January 1997, Mr. Panetta served as chief of staff to President Bill Clinton. Prior to that, he was director of OMB, a position that built on his years of work on the House Budget Committee. Mr. Panetta represented California’s 16th (now 17th) congressional district from 1977 to 1993, rising to House Budget Committee chairman during his final four years in Congress. He holds a Bachelor of Arts degree in political science and a law degree, both from Santa Clara University.

The SIA Award Dinner also will feature the presentation of the semiconductor industry’s highest honor, the Robert N. Noyce Award.

Today, Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

The Intel and Georgia Tech program, announced in conjunction with the first-ever White House Demo Day, builds on Intel’s ongoing commitment to improve diversity in the technology industry. Earlier this year, Intel announced a new goal in diversity and inclusion: to achieve full representation of underrepresented minorities and women by the year 2020 in its U.S. workforce, along with a $300 million Diversity in Technology initiative to help build a pipeline of underrepresented engineers and computer scientists, to foster hiring and inclusion of women and underrepresented minorities at Intel, and to fund programs to support a more positive representation of women and underrepresented minorities in technology and gaming.

“Filling the tech industry pipeline with diverse students is critical to increasing the number of diverse engineers and computer scientists in the field,” said Rosalind Hudnell, vice president of Human Resources and Chief Diversity Officer at Intel. “The goal of this program is to inspire and support more women and underrepresented minorities to earn technical degrees so we can hire them down the road – we want to foster those future tech innovators.”

The program will support and expand several existing Georgia Tech initiatives, including:

  • Summer Engineering Institute: The three-week Summer Engineering Institute hosts rising 11th- and 12th-graders from around the country. Students learn basic engineering and computer science techniques and gain hands-on experience through working in teams to solve real-world engineering problems.
  • RISE: Retaining Inspirational Scholars in Technology and Engineering (RISE) provides financial support to talented underrepresented minority and non-traditional students. Intel’s existing Diversity Scholars program will provide scholarships with priority going to those whose majors align with Intel’s interests: electrical engineering, computer science and computer engineering.
  • Peer-2-Peer Mentoring: The mentoring program provides specialized guidance and support to undergraduate students majoring in science, technology, engineering and math (STEM), while also helping them adjust to the climate and culture at Georgia Tech. Mentors and mentees develop leadership, communication and networking skills.
  • SURE: The Summer Undergraduate Research in Engineering (SURE) is a 10-week research program to attract qualified minority students from across the country into graduate school in the fields of engineering and science. In addition to conducting research, participants receive mentoring from faculty and graduate students and participate in professional development and technical seminars.
  • Focus: The Focus program invites college juniors and seniors from around the country to attend a three-day event designed to raise awareness of graduate education among underrepresented students. Participants learn about financial resources, visit research laboratories, network with other scholars and receive help with the graduate school application process.

The Intel and Georgia Tech program is anticipated to result in retaining more than 1,000 underrepresented minority students and improve access to thousands more students.

“It is a national imperative that the U.S. continue to enhance the engagement of students of all backgrounds in STEM fields to create a more robust economy,” said Gary May, dean and Southern Company Chair in the College of Engineering at Georgia Tech. “The higher education and private sectors must combine forces to achieve the impact that is necessary. As a national leader in producing outstanding underrepresented engineering graduates, Georgia Tech is pleased to partner with Intel in this transformative initiative.”

The Intel and Georgia Tech program was announced in conjunction with the first-ever White House Demo Day, which celebrates the important role entrepreneurship plays in America’s economy. Unlike a private-sector demo day, where entrepreneurs and startups pitch their ideas to funders, this new event invites innovators from around the country to “demo” their individual stories in Washington, D.C.

Earlier this year, Intel CEO Brian Krzanich announced that Intel is entering into a memorandum of understanding with the Oakland Unified School District and will invest $5 million over the next five years to improve access to computer science and engineering careers as early as high school. As part of Intel’s new collaboration with Georgia Tech, many of the Oakland students will have the opportunity to participate in Georgia Tech’s Summer Engineering Institute.

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $84.0 billion during the second quarter of 2015, an increase of 1.0 percent over the previous quarter and 2.0 percent compared to the second quarter of 2014. Global sales for the month of June 2015 reached $28.0 billion, an uptick of 2.0 percent over the June 2014 total of $27.4 billion and a decrease of 0.4 percent from last month’s total of $28.1 billion. Year-to-date sales during the first half of 2015 were 3.9 percent higher than they were at the same point in 2014. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Macroeconomic headwinds and softening demand have slowed global semiconductor market growth somewhat, but the industry still posted its highest-ever second-quarter sales and remains ahead of the pace of sales set in 2014, which was a record year for semiconductor revenues,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The Americas market continues to post solid year-to-year sales increases, and the global market has now grown on a year-to-year basis for 26 consecutive months.”

Regionally, sales increased compared to June 2014 in China (7.8 percent), the Americas (5.6 percent), and Asia Pacific/All Other (5.2 percent), but fell in Europe (-11.5 percent) and Japan (-13.6 percent). Sales were up slightly compared to last month in Japan (1.0 percent) and China (0.6 percent), but down somewhat in Asia Pacific/All Other (-0.6 percent), the Americas (-1.6 percent), and Europe (-1.7 percent). Sales figures in Europeand Japan have been impacted somewhat by currency devaluation.

“Global semiconductor sales are one indicator of the strength of the U.S. industry, which accounts for more than half of total global sales,” Neuffer said. “Policymakers in Washington should enact policies that do more to promote innovation and allow our industry to compete more effectively globally. We applaud the newly formed Congressional Semiconductor Caucus – led by Sen. James Risch (R-Idaho), Sen. Angus King (I-Maine), Rep. Pete Sessions (R-Texas), and Rep. Zoe Lofgren (D-Calif.) – for working to advance pro-growth policies that will strengthen the U.S. semiconductor industry and our economy.”

June 2015

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.62

5.53

-1.6%

Europe

2.87

2.83

-1.7%

Japan

2.54

2.57

1.0%

China

8.08

8.13

0.6%

Asia Pacific/All Other

9.00

8.94

-0.6%

Total

28.11

27.99

-0.4%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.24

5.53

5.6%

Europe

3.19

2.83

-11.5%

Japan

2.97

2.57

-13.6%

China

7.54

8.13

7.8%

Asia Pacific/All Other

8.50

8.94

5.2%

Total

27.44

27.99

2.0%

Three-Month-Moving Average Sales

Market

Jan/Feb/Mar

Apr/May/Jun

% Change

Americas

5.81

5.53

-4.7%

Europe

2.96

2.83

-4.4%

Japan

2.55

2.57

0.8%

China

7.83

8.13

3.8%

Asia Pacific/All Other

8.57

8.94

4.4%

Total

27.70

27.99

1.0%

Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth. Yole Développement (Yole)estimates that more than 40 systems have been installed in 2014, with a compound annual growth rate (CAGR) representing 10 percent between 2014 and 2020. In the meanwhile, MEMS photolithography equipment looks set for 7 percent CAGR and LEDs 3 percent.

Yole released last month its technology & market analysis dedicated to the manufacturing process, photolithography. Under this analysis entitled “Photolithography Equipment & Materials for Advanced Packaging, MEMS and LED Applications”, the “More than Moore” market research and strategy consulting company proposes a comprehensive overview of the equipment and materials market dedicated to the photolithography step. Yole’s analysts performed a special focus on the advanced packaging area. They highlighted the following topics: current and emerging lithography technologies, technical specifications, challenges and technology trends, market forecast between 2014 and 2020, market shares and some case studies.

yole packaging july

“The advanced packaging market is very interesting and is growing dynamically as it includes many different players along the supply chain,” said Claire Troadec, Technology & Market Analyst at Yole. It encompasses outsourced assembly at test firms (OSATs), integrated manufacturers (IDMs), MEMS foundries and mid-stage foundries.
In comparison, even if the MEMS & Sensors industry is growing at a fast pace, components are also experiencing die size reduction due to strong cost pressure in the consumer market. Consequently wafer shipments are not following the same trend as unit shipments. Lastly, LED equipment growth is back to a normal rhythm, after big investments made in recent years.

Advanced packaging has very complex technical specifications. Warpage handling as well as heterogeneous materials represent big challenges to photolithography. Due to aggressive resolution targets in advanced packaging, performance must be improved. The current minimum resolution required is below 5µm for some advanced packaging platforms, like 3D integrated circuits, 2.5D interposers, and wafer level chip scale packaging (WLCSP). A lot of effort is being made to reduce overlay issues due to shifting dies and obtain vertical sidewalls for flip-chip and WLCSP. Although steppers are already well established in the packaging field, new disruptive lithography technologies are also emerging and could contribute to market growth from 2015-2016.

“Huge business opportunities in the advanced packaging market are therefore driving photolithography equipment demand,” highlighted Amandine Pizzagalli, Technology & Market Analyst at Yole. “Given the high growth rate of this market, there is no doubt that already established photolithography players and new entrants will be attracted,” she added.

yole packaging july fig 2

The Semiconductor Industry Association (SIA) today commended the launch of the Congressional Semiconductor Caucus. SIA recognized members of the caucus at a reception on Capitol Hill Tuesday evening and honored the caucus’s co-chairs, Sen. James Risch (R-Idaho), Sen. Angus King (I-Maine), Rep. Pete Sessions (R-Texas), and Rep. Zoe Lofgren (D-Calif.).

“Semiconductors form the foundation of America’s technological and economic strength, national security, and global competitiveness,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The Congressional Semiconductor Caucus will provide a venue for Members of Congress and industry professionals to share ideas and work collaboratively to advance policies that preserve and strengthen the semiconductor industry and our country. We applaud Sen. Risch, Sen. King, Rep. Sessions, and Rep. Lofgren for leading the caucus and for their longstanding support of policies that promote growth and innovation.”

Semiconductors are the brains of modern electronics, making possible the myriad devices we use to work, communicate, travel, entertain, harness energy, treat illness, and make scientific discoveries. SIA is the voice of the U.S. semiconductor industry, uniting companies that account for 80 percent of America’s semiconductor production.

The semiconductor industry directly employs nearly a quarter of a million people in the U.S. and supports more than 1 million additional U.S. jobs. In 2014, sales from U.S. semiconductor companies accounted for more than half of the $336 billion in total global semiconductor sales. Semiconductors are America’s third-leading manufactured export, behind aircraft and automobiles. The industry is highly research-intensive, investing one-fifth of revenues in R&D annually – more than any other industry.

“In the semiconductor industry and across the tech sector, innovation is made possible through the hard work and ingenuity of the industry’s scientists and engineers and is aided by smart public policy from the federal government,” Neuffer said. “SIA looks forward to working with members of the Semiconductor Caucus to advance policies that facilitate free trade and open markets, modernize America’s tax system, strengthen America’s technology workforce, advance university research, and protect intellectual property, among other priorities.”

SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries. The annual SEMI Standards awards were announced at the SEMI Standards reception held last night during SEMICON West 2015. 

2015 SEMI International Standards Excellence Award, inspired by Karel Urbanek

The SEMI International Standards Excellence Award, inspired by Karel Urbanek, is the most prestigious award in the SEMI Standards Program. The 2015 recipient is Dr. Jean-Marie Collard of Solvay Chemicals. The Award recognizes the leadership of the late Karel Urbanek, co-founder of Tencor Instruments and a past SEMI Board of Directors member who was a key figure in the successful globalization of the Standards Program.

Active in SEMI Standards development since 1997, Collard co-chaired the European Chapters of the Gases and Liquid Chemicals Committees since 2003. Under his leadership, the committees created numerous Standards for the semiconductor and solar manufacturing industries.  Collard has been instrumental in ensuring that the standards developed are relevant. He has actively recruited key players in the supply chain to contribute to development efforts, making certain that the published Standards reflect the true needs of the industry.  He also served as co-chair of the European Regional Standards Committee (ERSC) from 2009 to 2013, steering the ERSC through difficult economic times. As ERSC co-chair, Collard was also an International Standards Committee member, and provided valuable, practical input for new proposals, including the current effort to establish virtual meetings.

Collard earned his Master’s degree and Ph.D. in analytical chemistry from the University of Liege, Belgium. He joined Solvay in 1988 and has worked in Belgium, France, and the United States.

Merit Award

The Merit Award recognizes a Standards volunteer major contributions to the semiconductor industry through the SEMI Standards Program. Award winners typically take on a complex problem at the task force level, gain industry support, and drive the project to completion. Matt Milburn of UCT established the Surface Mount Sandwich Component Dimensions Task Force, within the North America Chapter of the Gases Committee, in April 2013 to develop standards for “sandwich” components (components located between substrate and another component). At the time of Task Force formation, these components did not have dimensional standards in place and varied by each manufacturer, resulting in interchangeability issues between manufacturers of functionally equivalent components.  Milburn addressed this problem by leading the successful development of ballot 5595, Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems, which was recently approved by the Gases Committee and will be published as SEMI C88-0715.

Leadership Award

The Leadership Award recognizes volunteers who have demonstrated outstanding leadership in guiding the SEMI Standards Program. This Award is presented to individuals who have strengthened the Program through member training, mentoring, and new member recruitment. Frank Parker of ICL Performance Products and Frank Flowers of PeroxyChem have co-chaired the North America Chapter of the Liquid Chemicals Committee for over ten years. During this time, Parker and Flowers have overseen the development of new specifications and analytical test methods for liquid chemicals while keeping the extensive catalog of previously developed liquid chemical standards up-to-date with current industry needs. Their experience and patience has been critical in transforming new volunteers into productive committee contributors, effectively guiding them through the standardization process and minimizing wasted efforts.

Honor Award

The Honor Award is presented to an individual who has demonstrated long-standing dedication to the advancement of SEMI Standards. Dr. Jaydeep Sinha of KLA-Tencor has contributed to the Silicon Wafer Committee for over 15 years and has led the development of numerous metrology standards. In addition to leading the Advanced Wafer Geometry Task Force, Sinha organized several SEMI Standards workshops around the world, recruiting technologists from leading device makers, equipment suppliers, and consortia to educate local audiences on recent developments and future needs in wafer geometry. Sinha also actively works to keep the Silicon Wafer Committee familiar with oncoming industry trends, frequently inviting industry experts to speak at committee meetings on hot topics.

Corporate Device Member Award 

The Corporate Device Member Award recognizes the participation of the user community and is presented to individuals from device manufacturers. Dr. Jan Rothe of GLOBALFOUNDRIES is this year’s recipient. Rothe has been active in SEMI Standards since the mid-2000s, and has led the International E84 (Specification for Enhanced Carrier Handoff Parallel I/O Interface) Revision Task Force since 2007. Rothe’s consistent participation in the Physical Interfaces and Carriers Committee and feedback on ballot proposals has ensured that the customer perspective is reflected in all committee output.