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BY TOM QUAN, Deputy Director, TSMC

The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest. The fact that they have been wrong for decades has not diminished their enthusiasm for criticism, and we should expect to hear from them again with the move to 10nm design.

Like any advanced technology transition, 10nm will be challenging, but we need it to happen. Design and process innovation march hand in hand to fuel the remarkable progress of the worldwide electronics industry, clearly demonstrated by the evolution of mobile phones since their introduction (FIGURE 1).

FIGURE 1. The evolution of mobile phones since their introduction.

FIGURE 1. The evolution of mobile phones since their introduction.

Each generation gets harder. There are two different sets of challenges included with a new process node: the process technology issues and the ecosystem issues.

Process technology challenges include:

  • Lithography: continue to scale to 193nm immersion
  • Device: continue to deliver 25-30% speed gain at the same or reduced power
  • Interconnect: address escalating parasitics
  • Production: ramp volume in time to meet end-customer demand
  • Integration of multiple technologies for future systems

Ecosystem challenges include:

  • Quality: optimize design trade-off to best utilize technology
  • Complexity: tackle rising technology and design complexity
  • Schedule: shortened development runway to meet product market window

Adding to these challenges at 10nm is that things get a whole lot more expensive, threatening to upset the traditional benefits of Moore’s Law. We can overcome the technical hurdles but at what cost? At 10nm and below from a process point of view, we can provide PPA improvements but development costs will be high so we need to find the best solutions. Every penny will count at 7nm and 10nm.

FIGURE 2. A new design ecosystem collaboration model is needed due to increasing complexity and shrinking development runways.

FIGURE 2. A new design ecosystem collaboration model is needed due to increasing complexity and shrinking development runways.

Design used to be fairly straightforward for a given technology. The best local optimum was also the best overall optimum: shortest wire length is best; best gate-density equates to the best area scaling; designing on best technology results in the best cost. But these rules no longer apply. For example, sub-10nm issues test conventional wisdom since globalized effects can no longer be resolved by localized approaches. Everything has to be co-optimized; to keep PPA scaling at 10nm and beyond requires tighter integration between process, design, EDA and IP. Increasing complexity and shrinking development runways call for a new design ecosystem collaboration model (FIGURE 2).

Our research and pathfinding teams have been working on disruptive new transistor architectures and materials beyond HKMG and FinFET to enable further energy efficient CMOS scaling. In the future, gate-all-around or narrow wire transistor could be the ultimate device structure. High mobility Ge and III-V channel materials are promising for 0.5V and below operations.

Scaling in the sub-10nm era is more challenging and costly than ever, presenting real opportunities for out-of-box thinking and approaches within the design ecosystem. There is also great promise in wafer-level integration of multiple technologies, paving the way for future systems beyond SoC.

A strong, comprehensive and collaborative ecosystem is the best way to unleash our collective power to turn the designer’s vision into reality.

Seoul Semiconductor Co., Ltd., an LED manufacturer has announced that the company was ranked as number four in the global rankings for Packaged LED Revenue in 2013 according to the market research firm IHS Technology. This is a step up from the 2012 ranking of number five global LED manufacturer despite any internal captive revenue.

One of the most important factors of Seoul Semiconductor’s consistent growth in the global LED market is based upon its established patent portfolio that consists of more than 10,000 patents. The company invests approximately 10% of its sales revenue each year into LED product research and development. Seoul Semiconductor was also the sole semiconductor company that only manufactures LED components to be selected in the 2012 and 2013 Semiconductor Manufacturing Patent Power Ranking by the Institute of Electrical and Electronics Engineers (IEEE).

As Seoul Semiconductor has manufactured LED technology for more than 20 years, the company continues to secure its place in the global LED market with continuous improvements and advancements in its LED product portfolio. In 2006, Seoul Semiconductor launched the revolutionary direct AC LED technology ‘Acrich’ which can be driven directly from AC without an AC-DC converter. After that, Seoul Semiconductor launched the nPola LED technology to boost brightness 5-10 times that of a conventional LED. Recently in June, Seoul Semiconductor launched the next generation of smart lighting with ‘Acrich3’ IC technology.

From the early 2000s when the LED lighting market was not fully developed, Seoul Semiconductor strengthened its sales teams and global marketing strategy. The company secured its business competence by providing high-quality LED products through 50 overseas sales offices including five production sites in Europe, North America and China.

Jung-Hoon Lee, CEO of Seoul Semiconductor, notes that “Because Seoul Semiconductor has no captive market and does not produce or sell LED lighting finished goods all LED lighting manufacturers in the lighting market, which is estimated to grow to $150 Billion, are potential Seoul Semiconductor customers.”

New approaches to start-ups can unlock mega-trend opportunities.

BY MIKE NOONEN, Silicon Catalyst, San Jose, CA; SCOTT JONES and NORD SAMUELSON, AlixPartners, San Francisco, CA

The semiconductor industry returned growth and reached record revenues in 2013, breaking $300 billion for the first time after the industry had contracted in 2011 and 2012 (FIGURE 1).

FIGURE 1. Worldwide semiconductor revenue. Source: World Semiconductor Trade Statistics, February 2014.

FIGURE 1. Worldwide semiconductor revenue. Source: World Semiconductor Trade Statistics, February 2014.

However, even with that return to growth, underlying trends in the semiconductor industry are disturbing: The semiconductor cycle continues its gyrations, but overall growth is slowing. And despite 5% year-on-year revenue growth in 2013 (the highest since 2010), the expectation is that semiconductor growth will likely continue to be at a rate below its long-term trend of 8 to 10% for the next three to five years (FIGURE 2). An AlixPartners 2014 publication , Cashing In with Chips, showed that semiconductor industry growth had slowed to roughly half of its long-term growth average since the 2010 recovery—with no expectation that it will return to historical growth until at least 2017. Other studies have also shownthat semiconductor growth has slowed not only relative to its previous performance but also versus growth in other industries. And a study conducted by New York University’s Stern School of Business[1] found that the semiconductor industry’s revenue growth lagged the average revenue growth of all industries and ranked 60th out of 94 industries surveyed. Surprisingly, the industry’s net income growth of semiconductor companies lagged even further behind—ranking 84th out of 94 companies surveyed—and had actually been negative during the previous five years.

FIGURE 2. Semiconductor revenue growth. Sources: Semiconductor Industry Association and AlixPartners research.

FIGURE 2. Semiconductor revenue growth. Sources: Semiconductor Industry Association and AlixPartners research.

In another study released by AlixPartners that looked at a broader picture of the semiconductor value chain, including areas such as equipment suppliers and packaging and test companies, the research showed that outside of the top 5 companies, the remainder of the 186 companies surveyed had declining earnings before interest, taxes, depreciation, and amortization (FIGURE 3).

FIGURE 3. Spotlight on the top five (fiscal year 2012). Source: AlixPartners Research.

FIGURE 3. Spotlight on the top five (fiscal year 2012). Source: AlixPartners Research.

As revenue growth slows, costs increase at a rapid rate

As semiconductor technology advances, the cost of developing a system on chip (SoC) has risen dramatically for leading-edge process technologies. Semico Research has estimated that the total cost of an SoC development, design, intellectual property (IP) procurement, software, testing has tripled from 40/45 nanometers (nm) to 20 nm and could exceed $250 million for future 10-nm designs(FIGURE 4) [2]. This does not bode well for an economic progression of Moore’s law, and it means that very few applications will have the volume and pricing power to afford such outlandish investment. If we assume that a 28nm SoC can achieve a 20% market share and 50% gross margins, the end market would have to be worth over $1 billion to recoup R&D costs of $100 million. By 10 nm, end markets would have to result in more than $2.5 billion to recoup projected development costs. With few end markets capable of supporting that high a level of development costs, the number of companies willing to invest in SoCs on the leading edge will likely decline significantly each generation.

FIGURE 4. Development Costs are Skyrocketing. Source: Semico Research Corp.

FIGURE 4. Development Costs are Skyrocketing. Source: Semico Research Corp.

What happened to semiconductor start- ups?

The history of the semiconductor industry has been shaped by the semiconductor start-up. Going back to Fairchild, the start-up has been the driving force for growth and innovation. Start-ups helped shape the industry, and they are now some of the largest and most successful companies in the industry. But the environment that lasted from the 1960s until the early 2000s—and that made the success of those companies possible—has changed dramatically. The number of venture capital investments in new semiconductor start-ups in the United States has fallen dramatically, from 50 per year to the low single digits (FIGURE 5). And even though that drop is not as dramatic in other countries — such as China and Israel — it is indicative of an overall lack of investment in semiconductors.

FIGURE 5. Number of seed/series a deals. Source: Global Semiconductor Alliance.

FIGURE 5. Number of seed/series a deals. Source: Global Semiconductor Alliance.

The main reason for the decline is the attractiveness of other businesses for the same investment. In the fourth quarter of 2013, nearly 400 software start-ups received almost $3 billion of funding, whereas only 25 semiconductor start-ups received just $178 million (representing all stages) (FIGURE 6). It seems that (1) the lower cost of starting a software company, (2) the relatively short time frame to realize revenue, and (3) attractive initial-public-offering and acquisition markets possibly make the software start-up segment more interesting than semiconductors.

FIGURE 6. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

FIGURE 6. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

This situation is unfortunate and has conspired to create a vicious and downward cycle (FIGURE 7).

  • Lack of investment limits start-ups
  • Lack of start-ups limits innovation
  • Lack of innovation and fewer start-ups limits the number of potential acquisition targets for established companies.
  • Reduced potential acquisition targets in turn limit returns for companies and returns for those who would have invested in start-ups.
  • Limited returns make future investments less likely and continue the cycle of less innovation and lower investment [3]. 
FIGURE 7. A vicious cycle limits innovation.

FIGURE 7. A vicious cycle limits innovation.

Therefore, it is reasonable to conclude that the demise of semiconductor start-ups is a contributing cause to the lackluster results of the overall semiconductor industry. And that demise and those lackluster results are further exacerbated by the rise of activist shareholders who demand a more rapid return on their investment, which possibly reduces the potential for innovation in an industry that has lengthy development cycles.

What about other industries?

It is tempting to think that the semiconductor industry is alone in this predicament, but other industries face similar challenges and have figured out accretive paths forward. For example, biotechnology has some of the same issues:

  • An industry that grows by bringing innovation to market 
  • Similarly lengthy development cycles 
  • Potentially capital intensive at the research and production stages

In addition, the biotech industry faces a challenge the semiconductor world does not — namely, the need for government regulatory approval before moving to production and then volume sales. Gaining that regulatory approval is a go-to-market hurdle that can add years and uncertainty to a product cycle.

However, in spite of its similarities to the semiconductor business and the added regulatory hurdles, the biotech industry enjoys a very healthy venture-funding and start-up environment. In fact, in the fourth quarter of 2013 in the United States, biotech was the second-largest business sector for venture funding in both dollars and total number of deals (FIGURE 8).

FIGURE 8. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

FIGURE 8. Funding of software and semiconductor start- ups. Source: PwC, US Investments by Industry/Q4 2013.

Why is this? What do biotech executives, entre- preneurs, and investors know that the semiconductor industry can take advantage of? There are several lessons to be learned.

  • Big biotech companies have made investing, cultivating, and acquiring start-ups key parts of their innovation and product development processes. 
  • Biotech and venture investors identify interesting problems to solve and then match the problems to skilled and passionate entrepreneurs to solve them.
  • Those entrepreneurs are motivated to create and develop solutions much faster and usually more frugally than if they were working inside a large company.
  • The entrepreneurs and investors are creating businesses to be acquired versus creating businesses that will rival major industry players.
  • The acquiring companies apply their manufacturing economies of scale and well-estab- lished sales and marketing strategies to rapidly— and profitably—bring the newly acquired solutions to market.

For several reasons, certain megatrends are driving the high-technology sector and the economy as a whole, and all of them are enabled by semiconductor innovation (FIGURE 9). Among the major trends:

  • Mobile computing will likely continue to merge functions and drive computing power.
  • Security concerns appear to be increasing at all levels: government, enterprise, and personal.
  • Cloud computing will possibly cause an upheaval in information technology.
  • Personalization through technology and logistics appears to be on the rise.
  • Energy efficiency is likely need for sustainability and lower cost of ownership.
  • Next generation wireless will likely be driven by insatiable coverage and bandwidth needs.
  • The Internet of things will likely lead to mobile processing at low power with ubiquitous radio frequency.
FIGURE 9. Global internet device installed base forecast. Sources: Gartner, IDC, Strategy Analytics, Machina Research, company filings, BII estimates.

FIGURE 9. Global internet device installed base forecast. Sources: Gartner, IDC, Strategy Analytics, Machina Research, company filings, BII estimates.

The Internet of Things megatrend alone will result in a tremendous amount of new semiconductor innovation that in turn will likely lead to volume markets. Cisco Systems CEO John Chambers has predicted a $19-trillion market by 2020 resulting from Internet of Things applications [4].

Does it really cost $100 million to start a semiconductor company?

The prevailing conventional wisdom is that it takes $100 million to start a new semiconductor company, and in some cases that covers only the cost of a silicon development. It is true that recently, several companies have spent eight- or nine-figure sums of money to develop their products, but those are very much exceptions. The reality is that most semiconductor development is not at the bleeding edge, nor is the development of billion-transistor SoCs.

The majority of design starts in 2013 were in .13 μm, and this year, 65, 55, 45, and 40nm are all growing (FIGURE 10). These technologies are becoming very affordable as they mature. And costs will likely continue to decrease as more capacity becomes available once new companies enter the foundry business and as former DRAM vendors in Taiwan and new fab in China come online.

FIGURE 10: .13um has the most design starts; 65nm and 45nm have yet to peak.

FIGURE 10: .13um has the most design starts; 65nm and 45nm have yet to peak.

Another thing to consider is whether a new company would sell solutions that use existing technology or platforms (i.e., a chipless start-up) or whether a company would choose to originate IP that enables functionality for incorporation into another integrated circuit.

A chipless start-up would add value to an existing architecture or platform. It could be an algorithm or an application-specific solution on, say, a field-programmable gate array, a microcontroller unit or an application-specific standard product. It could also be service based on an existing hardware platform.

A company developing innovative new functionality for inclusion into another SoC paves a path to getting to revenue quickly. Such IP solution providers would supply functionality for integration not only into a larger SoC but also into the emerging market for 2.5-D and 3-D applications.

In both situations (the chipless start-up and the IP provider), significant cost may be avoided by the use of existing technology or the absence of the need to build infrastructure or capabilities already provided by partners. In addition, those paths have much faster times to revenue as well as inherently lower burn rates, which are conducive to higher returns for investors.

Even for start-ups that intend to develop leading-edge multicore SoCs, a $100-million investment is not inevitable. Take, for example, Adapteva, an innovative start-up in Lexington, Massachusetts. Founded by Andreas Olofsson, Adapteva has developed a 64-core parallel processing solution in 28 nm. The processor is the highest gigaflops/watt solution available today, beating solutions from much larger and more-established companies. However, Adapteva has raised only about $5 million to date, a good portion of which funding was crowd sourced on the Kickstarter Web site. This just shows that even a leading-edge multicore SoC can be developed cost-effectively—and effectively—through the use of multiproject wafers and other frugal methods.

Several conclusions can be drawn at this point.

  • Even though the semiconductor industry is growing again, the underlying trends for profitability and growth are not encouraging. 
  • Cost development is increasingly rapid on leading-edge SoCs. 
  • Historically, start-ups have been engines of innovation of growth and innovation for semiconductors. 
  • In recent years, venture funding for new semiconductor companies has almost completely dried up. 
  • That lack of investment of semiconductor start-ups has contributed to a downward and vicious cycle that will further erode the economics of semiconductor companies. 
  • The biotechnology industry has many parallels to the semiconductor. Interestingly, biotechnology has a relatively thriving venture funding and start-up environment, and we can apply that industry’s successful approach to semiconductors. 
  • Despite the state of start-ups, it is now one of the most exciting times to be in semiconductors because most of the megatrends driving the economy are either enabled by or dependent on semiconductor innovation. 
  • It does not need to take $100 million to start the typical semiconductor company, because a great deal of innovation will use very affordable technologies, and come from chipless start-ups or IP providers that have much lower burn rates and ties to revenue.
  • Even leading-edge multicore SoCs can be developed frugally (for single-digit millions of dollars) and profitably. 

References

1. http://people.stern.nyu.edu/adamodar/New_Home_ Page/datafile/histgr.html

2. SoC Silicon and Software Design Cost Analysis: Costs for Higher Complexity Continue to Rise SC102-13 May 2013.

3. AlixPartners and Silicon Catalyst analysis and experi- ence.

4. Cisco Systems public statements.

Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates. Forecasts through 2019 are given for market size, wafer starts and equipment usage by application and technology.

Their analysis shows that MEMS devices are the main applications using permanent bonding technologies in mass production, followed by CMOS Image Sensor BSI (CIS BSI). They conclude that fusion bonding is the most frequently-used permanent bonding technologies in today’s semiconductor industry, mainly supported by CIS and SOI substrate applications.

Permanent wafer bonding revenue was close $127MM in 2013 and expected to reach $450MM by 2019, growing at a 23% CAGR.

In the next few years, growth is expected from metal bonding for MEMs applications and Cu-Cu / oxide “hybrid bonding.” All major players are working on the implementation and qualification of this technology for the new generation of BSI CIS.

Perm Bond fig

Yole projects that permanent bonding, which is well established for MEMs,  will continue to grow over the next five years while moving from glass frit technology to metal bonding for  better reliability, better hermaticity and smaller footprint due to smaller required bond frames.

Permanent bonding for CMOS sensors is dominated by adhesive and fusion bonding. Adhesive bonding is used for attaching the glass cap wafer to the device wafer. Fusion bonding, with anneal temperatures in the range of 20 – 400 ◦C, is the dominant technology for BSI sensor technology. In the future Yole sees Cu-Cu /oxide hybrid bonding, such as that developed by Ziptronix, as the technology of choice to replace fusion bonding due to its superior electrical and mechanical properties.

For LEDs grown on GaAs or sapphire substrates thermo-compression and eutectic bonding are most often applied.

Fusion bonding is the technology of choice for SOI activities.  While the recent SOI market has been flat, due to AMDs recent move from SOI to bulk SI technology, Yole expects the SOI market to double by 2015 due to Rf applications making use of SOI.

EVG currently holds 75% of the permanent bonding equipment market. Yole sees them being challenged in the future by the recently combined TEL / Applied Materials. TEL has gained market share in 2013. Suss MicroTec, exited the market in 2013 after supplying permanent bonders for more than a decade.

Companies cited in this report include: AMD, AML, Applied Materials, Avago, Bosch, Discera, EVG, Infineon, Invensense, Lemoptix, Luxtera, Mitsubishi Heavy Industries, Murata/VTI, Nemotek, OSRAM, PlanOptik, Samsung, Sensonor, SOITEC, STMicroelectronics, SUSS MicroTec, Sony, Teledyne/Dalsa, Tokyo Electron, Ziptronix, IMEC, Leti, Texas Instruments, Tezzaron, WiSpry and Ziptronix.

The report was written by Amandine Pizzagalli who is responsible for equipment and materials for Yole’s Advanced Packaging team.

Berger Pierre-DamienBy Pierre-Damien Berger, VP Business Development & Communication; CEA-Leti

Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big. Citing industry sources during of “The Internet of Things: from sensors to zero power,” the recent LetiDays conference in Grenoble, France, speakers offered projections venturing up to 50 billion connected objects by 2020.

Jacques Husser, COO of SIGFOX, said the IoT is the next major technological revolution, and that connecting billions or trillions of devices and enabling them to communicate with each other and will require more than high bandwidth. While increasing bandwidth is a key focus for multi-media and voice data network operators, for IoT companies reducing energy consumption and costs are key to handling the continuous volume of small messages from all those things.

SIGFOX, whose network is dedicated to the IoT, provides power-efficient, two-way wireless connectivity for IoT and machine-to-machine communications. Husser said the company’s technology is compatible with existing chipsets from vendors such as Texas Instruments, STMicroelectronics, Silicon Labs, Atmel, NXP and Semtech. Husser said that while SIGFOX’s technology complements 2G, 3G and 4G systems, it does not require a SIM card. Devices’ IP addresses are established during manufacturing.

The company, which has networks operating or in rollout with partners in several countries and major cities, is enabling applications for building and vehicle security, indoor climate monitoring, pet tracking, smart-city apps for parking and lighting management, asset management including billboard monitoring, water utility metering, and health-care apps like fall detection, distress signaling and medicine dispensing. Many more are expected.

Leti’s RF design and antenna expertise were used to help connect SIGFOX’s cellular networks. In addition, Leti is working with other startups and SMEs to develop and connect smart functions in a variety of products that will use the IoT to communicate. Primo1D was spun out of Leti in 2013 to produce E-Thread®, an innovative microelectronic packaging technology that embeds LEDs, RFIDs or sensors in fabric and materials for integration in textiles and plastics using standard production tools.

Leti startup BeSpoon recently launched SpoonPhone, a smartphone equipped with the capability to locate tagged items within a few centimeters’ accuracy. The capability is enabled by an impulse radio ultra-wideband (IR-UWB) integrated circuit developed by Leti and BeSpoon. Leti and Cityzen Sciences, the award-winning designer and developer of smart-sensing products, have begun a project to take the company’s technology to the next level by integrating micro-sensors in textiles during the weaving stage.

Leti and CORIMA, a leading supplier of carbon-composite wheels and frames for track and road-racing cyclists, are developing an integrated sensor system to measure the power output of riders as they pedal.

Citing research by Morgan Stanley Research, Leti’s telecommunications department head Dominique Noguet noted that worldwide shipments of smartphones and tablets exceeded shipments of desktop and notebook PCs for the first time in 2011. This signaled that the web has gone mobile, a fact underscored by a Cisco forecast that M2M mobile data traffic will increase 24x from 24 petabytes per month in 2012 to 563 petabytes in 2017.

Noguet said the IoT growth will present scaling challenges and require new communication protocols for sporadic, asynchronous, decentralized, low-power traffic. In addition to harvesting, or scavenging, energy to assure continuous connectivity, there will be demand for technologies that enable spectrum scavenging in unlicensed spectra, for example, and that use new bands, such as millimeter wave, white spaces and even light.

Leti has numerous ways to support development of the IoT, ranging from embedding antennas in specific materials through characterization and design, to implementing full-blown custom radio technologies. The inclusion of UHF RFID tags for the tire industry was cited as a first example where read/write range performances were a challenge. Leti’s ultra-wideband localization technology is another example where competence in signal processing, real-time design, antenna technology and mixed RF/digital ASIC design was combined to provide a complete solution where no off-the-shelf approach was available.

Noguet also noted potential threats to IoT security, and cited Leti’s involvement in the Santander, Spain, smart city project, which includes experimental advanced research on IoT technologies. Leti and CEA-List were in charge of securing access to the SmartSantander infrastructure and communications over a wireless sensor network. This included ensuring the security of the transactions and protecting users’ privacy.

By Shannon Davis, Web Editor

The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

“The roadmap has never taken into consideration what the consumers were asking for,” said Mr. Rao, on Wednesday’s closing session at The ConFab 2014.

The industry has enjoyed a stable, predictable industry for many years, as we made PCs and a lot of PCs. However, these are no longer the driving devices in the consumer market, and with different cost structures and more pressure to innovate than ever before, Mr. Rao stressed that the industry’s tendency to solely focus on scaling was no longer going to be enough to keep up with shifting consumer demands. Mr. Rao’s main charge: the industry needs to intercept consumer thought and demand and determine how it is going to impact the semiconductor industry and supply chain.

“We need to cater the roadmap to the technologies that are coming and the products that consumers want,” Mr. Rao said.

In order to adapt, Mr. Rao explained that it was imperative to integrate the entire supply chain into the roadmap if we really want to make significant strides in the manufacturability of these new products.

“We need to look at the roadmap as an ecosystem – not just materials, not just equipment, but the entire picture. We need to understand how to bring the supply chain into the picture,” Mr. Rao said.

To do this, Mr. Rao outlined the elements of effective problem solving and encouraged his audience to become masters of it. To be effective in the evolving technology landscape, Mr. Rao stressed the importance of understanding and analyzing every aspect of the supply chain, down to the smallest component, all of which contribute to defects and can no longer be ignored if quality is to be maintained.

“You need to understand to the smallest degree of your supply chain,” Mr. Rao charged ConFab’s attendees. “You need to analyze and trace the data. If you don’t do that, then the time to market and time to money are sacrificed.”

“We can’t follow Moore’s Law conveniently and forget about what’s two years down the road,” he concluded.

Gopal Rao presents at The ConFab 2014 on June 25, 2014.

Gopal Rao presents at The ConFab 2014 on June 25, 2014.