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EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafer bonding chambers installed at customer facilities worldwide to date. This milestone cements EVG’s technology and market leadership in wafer bonding, which is an enabling process for volume manufacturing of semiconductor advanced packaging, MEMS, CMOS image sensors, and radio frequency (RF) devices. The EVG 500, EVG 850, GEMINI and ComBond series of wafer bonding solutions, in particular, are seeing strong demand due to their performance and cross-platform compatibility, which allows customers to more easily ramp up their R&D processes to high-volume manufacturing.

Every four seconds, a wafer is bonded with an EVG system. Shown here is a 300-mm bond chamber in an EVG®560 Automated Wafer Bonding System. The EVG560 accepts up to four bond chambers with various configuration options for all bonding processes, including anodic, thermo compression, fusion bonding and LowTemp™ plasma bonding.

Every four seconds, a wafer is bonded with an EVG system. Shown here is a 300-mm bond chamber in an EVG®560 Automated Wafer Bonding System. The EVG560 accepts up to four bond chambers with various configuration options for all bonding processes, including anodic, thermo compression, fusion bonding and LowTemp™ plasma bonding.

“For our high-volume customers, it is essential that they have ready access to industry-proven, cost-effective and high-yielding process solutions. EV Group has closely collaborated with customers and partners for nearly three decades to innovate wafer bonding technology, which has led to the establishment of our technology as the de-facto industry standard for high-volume manufacturing,” stated Hermann Waltl, executive sales and customer support director at EV Group. “Our product offerings span the entire manufacturing chain from R&D and small-scale production environments to full-scale, high-volume production. This enables us to support our customers throughout as they transform new ideas into real-world products.”

EVG’s wafer bonding solutions for adhesive and fusion/hybrid bonding, metal bonding (such as solder and eutectic), and high-vacuum encapsulation undergo continuous innovation in a variety of critical areas, including temperature and process uniformity, vacuum control, wafer alignment and ease of use to ensure a high-yielding and high-throughput bonding process. Manual and semi-automated wafer bonders are fully compatible with EVG production bonding systems, which shortens the development time for customers to bring new innovative devices to market.

For adhesive, solder and eutectic bonding, the EVG500 series of semi-automated wafer bonders and GEMINI series of fully-automated wafer bonders support non-hermetic, cost-efficient encapsulation of CMOS image sensors, surface acoustic wave (SAW) filters for wireless RF chips, and other devices for mobile phones and other high-volume consumer applications. Additionally, tool configurations can be tailored to more demanding bond processes such as hermetic encapsulation for MEMS devices.

For high-vacuum encapsulation bonding, the new EVG ComBond automated high-vacuum wafer bonder provides ultra-high vacuum encapsulation (10-8 mbar) needed for next-generation MEMS devices, such as gyroscopes, microbolometers, and advanced sensors used in autonomous cars, virtual reality headsets and other applications.

For fusion bonding, the EVG850LT and the GEMINI FB automated fusion bonders enable manufacturing of high-accuracy optical devices, image sensors, and engineered substrates such as silicon-on-insulator (SOI), silicon carbide (SiC) and gallium nitride (GaN) for RF, power and other high-speed/high-efficiency devices.

Added Waltl, “EVG is continuously improving our process solutions in order to address wider market applications and more stringent industry requirements. This has paid off for our customers, which in turn has enabled us to maintain our leadership position in the wafer bonding market. Every four seconds, a wafer is bonded with an EVG system. We are proud to bring our expertise gained from this far-reaching installed base to our customers around the world.”

Sigenics, Inc. has received a $1M award from the National Institutes of Health (NIH) to develop electronics technology that is key to a brain-based visual prosthesis system. The Sigenics award is part of an $11.8 million grant to Illinois Institute of Technology (IIT) funded by the White House BRAIN Initiative (Brain Research through Advancing Innovative Neurotechnologies). The project’s goal is to test an artificial vision system that may provide visual perception to people with blindness.

The intracortical visual prosthesis (ICVP) system will translate images, captured by a glasses-mounted camera, into patterns of electrical stimulation and wirelessly deliver them to the visual cortex of the brain. A group of miniature 16-channel implantable stimulator modules, called wireless-floating-microelectrode-arrays (WFMA), that use Sigenics-designed wireless electronic chips will deliver the patterned electrical stimulation to the user’s brain through ultraminiature needle-like electrodes; about five of the electrode tips could be placed at the end of a human hair. Sigenics has also developed the non-implanted hardware that will process the camera image and prepare it for communication with the brain.

Mr. Glenn DeMichele and Dr. Douglas Kerns, Sigenics’ Director of Engineering and Chief Technology Officer respectively, have been working with IIT for over 20 years toward the clinical deployment of this technology.  Sigenics’ CEO, Dr. Philip Troyk, is a professor of biomedical engineering at IIT, and is principal investigator for the NIH project.

“This innovative project is the beginning of a bright future, where technology is applied in novel ways to treat disability and disease,” said DeMichele. “Our company is very excited and honored to be part of the exceptional team doing this pioneering work.”

The ICVP project is supported by the National Institute Of Neurological Disorders And Stroke of the National Institutes of Health under Award Number UG3NS09555. The content here is solely the responsibility of the authors and does not necessarily represent the official views of the National Institutes of Health.

STMicroelectronics (NYSE: STM) announced today the appointment of Jean-Marc Chery as Deputy CEO, effective July 1, 2017. Chery currently serves as Chief Operating Officer and, in his new role, he will continue to report to Carlo Bozotti, ST’s President and CEO.

In this new role, Chery will hold overall responsibility for Technology and Manufacturing as well as for Sales and Marketing.

A new organization will be also put in place. Its goal is to continue to build on the success of ST’s strategy, focused on Smart Driving and Internet of Things, with a strong market-driven and innovation approach.

ST’s Executive Team members will be:

·         Orio Bellezza, President, Global Technology and Manufacturing
·         Marco Cassis, President, Global Sales and Marketing
·         Claude Dardanne, President, Microcontrollers and Digital ICs Group
·         Carlo Ferro, Chief Financial Officer and President, Finance, Legal, Infrastructure and Services
·         Marco Monti, President, Automotive and Discrete Group
·         Georges Penalver, Chief Strategy Officer and President, Strategy, Communication, Human Resources and Quality
·         Benedetto Vigna, President, Analog, MEMS and Sensors Group.

These appointments and new organization are effective July 1st, 2017, upon shareholder approval of the reappointment of Carlo Bozotti as the sole member of the Managing Board and President and CEO of ST, at the Company’s next Annual General Meeting.

Chery began his career in the Quality organization of Matra, the French engineering group. In 1986, he joined Thomson Semiconducteurs, which subsequently became ST, and held various management positions in product planning and manufacturing, rising to lead ST’s wafer fabs in Tours, France, and later in Rousset, France. In 2005, Chery took charge of ST’s Front-End Manufacturing in Asia Pacific. In 2008, he was promoted Chief Technology Officer and assumed additional responsibilities for Manufacturing and Quality (2011) and the Digital Product Sector (2012). In 2014, he was promoted Chief Operating Officer.

Chery chairs the Board of STS, ST’s manufacturing joint venture in China, and holds board membership at the European microelectronics R&D program AENEAS.
Jean-Marc Chery was born in Orleans, France, in 1960, and graduated with a degree in Engineering from the ENSAM engineering school in Paris, France.

According to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker, phone companies shipped a total of 347.4 million smartphones worldwide in the first quarter of 2017 (1Q17). In light of what might seem like a slowing market, consumers continue to show demand for smartphones and OEM flagship hype seems strong as ever. Worldwide smartphone shipments grew 4.3% in 1Q17, which was slightly higher than IDC’s previous forecast of 3.6% growth.

“The first quarter smartphone results further prove that the smartphone industry is not dead and that growth still exists,” said Ryan Reith, program vice president with IDC’s Worldwide Quarterly Mobile Device Trackers. “There is no question that 2016 was a pivotal year for the industry as growth dipped to low single digits for the first time. However, we believe the industry will show some rebound in 2017, and the strong first quarter results certainly support this argument. In addition to what shipped in 1Q17, big flagship announcements from Huawei with the P10 devices and Samsung with the Galaxy S8 devices show that innovation is still possible. And despite any formal announcements from Apple it is safe to say the industry is highly anticipating what comes from this year’s iPhone announcements.”

When breaking down precisely where the first quarter growth came from, IDC continues to see the largest catalysts being a handful of Chinese OEMs. The clear leaders are Huawei, OPPO, and vivo, which have all well outpaced market growth for over a year now. And as these companies gain share in new territories the potential to continue this trend is high.

“Although we have seen an abundance of premium redesigned flagships that just entered the market, moving forward, we still expect most of the growth to come from more affordable models in a variety of markets,” said Anthony Scarsella, research manager with IDC’s Worldwide Quarterly Mobile Phone Tracker. “Despite all the popularity and media hype around premium devices, we continue to witness a shift in many companies’ portfolios geared towards affordable devices with premium-type styling compared to flagship models. Companies have started to implement a single premium design language that ultimately blurs the lines between the high-end and the low-end, allowing the average consumer to jump on the brand without a hefty upfront investment.”

Smartphone Company Highlights

Samsung regained control as the leader in the worldwide smartphone market despite a flat first quarter (0% year-over-year growth). Substantial discounts on the Galaxy S7 and S7 edge helped move last year’s flagships as they make way for the new S8 and S8+. Outside of the high end, the product mix continues to shift toward more affordable models. The J-Series and A-Series drove significant volumes in both emerging and developed markets thanks to flagship-like design at more affordable price points. A refreshed A7, A5, and A3 earlier this quarter, along with a recently updated J-Series, and new flagship S8/S8+ should give Samsung a well-balanced portfolio across all regions in the second quarter. An early positive response to the recently launched S8 and S8+ looks promising as it may have finally put Samsung’s Note 7 fiasco to bed.

Apple remained essentially flat with shipments reaching 51.6 million units in the first quarter, up slightly from the 51.2 million shipped last year. The strong holiday fourth quarter carried into the month of January as the larger iPhone 7 Plus returned to stock across most channels in numerous regions. Apple introduced a refreshed iPhone SE with more storage capacity (32GB and 128GB) that puts the mid-tier device in line with the rest of the iPhone portfolio. The Cupertino-based giant also refreshed its flagship smartphone by bringing (Product)Red over to the iPhone which paints both the iPhone 7 and 7 Plus in a new red finish. Finally, rumors of a special edition 10th anniversary iPhone continue to grow as a pending new design, screen size, and performance upgrades all look to be in the works for the fall.

Huawei sustained its dominance in China growing nearly 22% as shipments climbed from 28.1 million units last year, to 34.2 million units in the first quarter of 2017. Huawei once again demonstrated its stable position in the premium market with the P and Mate Series, and a strong presence in the affordable sector with its Y Series and Honor brand. Although Huawei announced earlier in the month that the Mate 9 has sold over 5 million units since it launched in November, here in the U.S. the device, as well as the brand, has failed to grab consumer’s attention. This U.S. attention is something they will need if they aspire to displace the two market leaders. The launch of the new P10 flagship and the new P10 Plus at the very end of the quarter presents consumers a valid third option (outside of Apple and Samsung) for the coming quarter thanks to both premium design and similar performance.

OPPO’s midrange, camera-focused R9s was a crucial model in China that helped it to see strong shipments in the market. OPPO’s growth has in fact been stronger outside of China with nearly a quarter of shipments from international markets. In the rest of Asia and to a smaller degree in the Middle East and Africa regions, its strong retail presence has helped it to grow further in its business. It has been aggressive in both above-the-line and below-the-line activities in India, and stepped up with its after-sales service efforts in several Southeast Asian countries such as Indonesia by increasing its number of service centers.

vivo also relied on a key model with the x9 in China that continued to generate a lot of hype around its selfie camera features, targeted at the under-30 crowd. It stepped up with its marketing efforts in India and was as a sponsor of the Indian Premier League 2017, helping to increase vivo’s brand presence in the market, while also increasing the number of exclusive stores in India. In Southeast Asia, it continues to have its own promoters aggressively pushing its phones in the market. In Indonesia, it has also promised consumers single-day phone repairs as a differentiator to the competition.

Top Five Smartphone Vendors, Worldwide Shipments, Market Share, and Year-Over-Year Growth, Q1 2017 Preliminary Data(Shipments in Millions)
Vendor

1Q17
Shipment
Volume

1Q17 Market
Share

1Q16
Shipment
Volume

1Q16 Market
Share

Year-Over-
Year Change
1. Samsung 79.2 22.8 % 79.2 23.8 % 0.0 %
2. Apple 51.6 14.9 % 51.2 15.4 % 0.8 %
3. Huawei 34.2 9.8 % 28.1 8.4 % 21.7 %
4. OPPO 25.6 7.4 % 19.7 5.9 % 29.8 %
5. vivo 18.1 5.2 % 14.6 4.4 % 23.6 %
Others 138.7 39.9 % 140.0 42.1 % -1.0 %
Total 347.4 100.0 % 332.9 100.0 % 4.3 %
Source: IDC Quarterly Mobile Phone Tracker, April 27, 2017

InvenSense, Inc. (NYSE: INVN), a provider of MEMS sensor platforms, today announced that all necessary regulatory clearances have been received for the acquisition by TDK Corporation of InvenSense, including from the Committee on Foreign Investment in the United States (CFIUS) and all other necessary regulatory authorities, and the required waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976 has expired.

InvenSense will hold a special meeting of its stockholders on May 17, 2017 at 10:00 a.m. local time at the Company’s corporate headquarters at which stockholders will be asked to approve, among other items, the previously announced transaction. The companies expect to close the transaction shortly thereafter, for a total purchase price of approximately $1.3 billion in cash or $13.00 per common share. The closing is subject to the satisfaction of customary closing conditions.

InvenSense recently mailed the proxy statement and related proxy materials to stockholders holding shares as of the March 23, 2017 record date. The proxy statement and related proxy materials provide information for stockholders of InvenSense regarding the transaction and related proposals to be voted upon at the special meeting, as well as instructions for voting online, by telephone, by mail and in person.

Worldwide semiconductor revenue is forecast to total $386 billion in 2017, an increase of 12.3 percent from 2016, according to Gartner, Inc. Favorable market conditions that gained momentum in the second half of 2016, particularly for commodity memory, have accelerated and raised the outlook for the market in 2017 and 2018. However, the memory market is fickle, and additional capacity in both DRAM and NAND flash is expected to result in a correction in 2019.

“While price increases for both DRAM and NAND flash memory are raising the outlook for the overall semiconductor market, it will also put pressure on margins for system vendors of smartphones, PCs and servers,” said Jon Erensen, research director at Gartner. “Component shortages, a rising bill of materials, and the prospect of having to counter by raising average selling prices (ASPs) will create a volatile market in 2017 and 2018.”

PC DRAM pricing has doubled since the middle of 2016. A 4GB module that cost $12.50 has jumped to just under $25 today. NAND flash ASPs increased sequentially in the second half of 2016 and the first quarter of 2017. Pricing for both DRAM and NAND is expected to peak in the second quarter of 2017, but relief is not expected until later in the year as content increases in key applications, such as smartphones, have vendors scrambling for supply.

“With memory vendors expanding their margins though 2017, the temptation will be to add new capacity,” said Mr. Erensen. “We also expect to see China make a concerted effort to join the memory industry, setting the market up for a downturn in 2019.”

Unit production estimates for premium smartphones, graphics cards, video game consoles and automotive applications have improved and contributed to the stronger outlook in 2017. In addition, electronic equipment with heavy exposure to DRAM and NAND flash saw semiconductor revenue estimates increase. This includes PCs, ultramobiles, servers and solid-state drives.

“The outlook for emerging opportunities for semiconductors in the Internet of Things (IoT) and wearable electronics remains choppy with these markets still in the early stages of development and too small to have a significant impact on overall semiconductor revenue growth in 2017,” said Mr. Erensen.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $30.4 billion for the month of February 2017, an increase of 16.5 percent compared to the February 2016 total of $26.1 billion. Global sales in February were 0.8 percent lower than the January 2017 total of $30.6 billion, exceeding normal seasonal market performance. February marked the global market’s largest year-to-year growth since October 2010. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor industry has posted strong sales early in 2017, with memory products like DRAM and NAND flash leading the way,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth. Global market trends are favorable for continuing sales growth in the months ahead.”

Year-to-year sales increased across all regions: China (25.0 percent), the Americas (19.1 percent), Japan (11.9 percent), Asia Pacific/All Other (11.2 percent), and Europe (5.9 percent). Month-to-month sales increased modestly in Asia Pacific/All Other (0.5 percent) but decreased slightly across all others: Europe (-0.6 percent), Japan (-0.9 percent), China (-1.0 percent), and the Americas (-2.3 percent).

Neuffer also noted the recent growth of foreign semiconductor markets is a reminder of the importance of expanding U.S. semiconductor companies’ access to global markets, which is one of SIA’s policy priorities for 2017. The U.S. industry accounts for nearly half of the world’s total semiconductor sales, and more than 80 percent of U.S. semiconductor company sales are to overseas markets, helping make semiconductors one of America’s top exports.

February 2017

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

6.13

5.99

-2.3%

Europe

2.84

2.82

-0.6%

Japan

2.79

2.77

-0.9%

China

10.15

10.05

-1.0%

Asia Pacific/All Other

8.72

8.76

0.5%

Total

30.64

30.39

-0.8%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.03

5.99

19.1%

Europe

2.66

2.82

5.9%

Japan

2.47

2.77

11.9%

China

8.04

10.05

25.0%

Asia Pacific/All Other

7.88

8.76

11.2%

Total

26.08

30.39

16.5%

Three-Month-Moving Average Sales

Market

Sept/Oct/Nov

Dec/Jan/Feb

% Change

Americas

6.25

5.99

-4.2%

Europe

2.88

2.82

-2.3%

Japan

2.90

2.77

-4.6%

China

10.04

10.05

0.1%

Asia Pacific/All Other

8.94

8.76

-2.0%

Total

31.02

30.39

-2.0%

 

Leti, a research institute of CEA Tech, is marking its 50th anniversary this year during industry events and workshops in Grenoble, Tokyo, and Taipei and at both SEMICON West and IEDM 2017 in San Francisco.

Founded in 1967 as an electronics research division of the French Atomic Energy Commission, Leti evolved into a global leader in micro- and nanotechnologies tailoring differentiating applicative solutions.

Leti solutions target a wide variety of sectors, including sustainable transport systems, telecommunications, health, consumer electronics, energy, smart cities, defense and security and space. Leti has formed partnerships with world leaders of industry, such as IBM, Intel, Qualcomm and Applied Materials.

Among Leti’s 60 startups are Soitec and the company that became STMicroelectronics.

Leti miniaturization technologies in everyday life

Leti’s iconic low-power FD-SOI technology can be found in game consoles, GPS receivers, connected watches and many other everyday connected devices.  The institute’s accelerometer that automatically switches between portrait and landscape can now be found in millions of smartphones, along with Leti’s radio-frequency technologies. Leti also develops technology for health care, such as scanners and exoskeletons to increase quality of life for people affected with quadriplegia. Leti serves the defense and security industries with infrared technologies.

“Leti is an innovation institute,” said Marie Semeria, Leti’s CEO. “It is unique in the world because it embraces a broad diversity of technologies: CMOS, sensors, communication systems, packaging and 3D integration, power electronics, imaging, integrated circuits and many more. We will emphasize both Leti’s cultural of pioneering research and its technological strengths throughout this 50th anniversary year and on our redesigned website.”

Leti 50th anniversary worldwide events throughout the year

JUNE 28-29: FRANCE

Leti Innovation Days 

Leti and partners will discuss how microelectronics can make a difference in health care, address environmental concerns in a competitive world and help industrials and society embrace the digital revolution during its Leti Innovation Days, June 28-29, in Grenoble. Keynote sessions on June 28 will be followed on June 29 by an immersive exhibition packed with technology demonstrators, proof of concepts, a start-up corner and offering dynamic presentations on three routes to innovation in digital transformation, new frontiers in health care and electronics-driven environmental change. The institute will host a gala anniversary dinner event at Chateau de Sassenage.

OCTOBER: JAPAN & TAIWAN

Leti Day

Leti also will host one-day Leti Day events in Tokyo and Taiwan during the second week of October.

JULY & DECEMBER: USA

Leti Workshops

Anniversary-year events will conclude with workshops July 11 at SEMICON West in San Francisco and the International Electron Devices Meeting (IEDM 2017) Dec. 3 in San Francisco.

Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

“We are very pleased to welcome two new, independent directors with the depth of leadership experience at innovative, global companies that both Mr. Ishrak and Mr. Smith bring,” said Intel Chairman Andy Bryant. “We look forward to their valuable contributions as Intel continues to transform itself for growth in emerging, adjacent market segments.”

Omar-IshrakIshrak, 61, is the chairman and chief executive officer of Medtronic, a global leader in medical technology. He has served in that role since 2011. Prior to joining Medtronic, he spent 16 years in various roles with General Electric Company, most recently as president and chief executive officer of GE Healthcare Systems, a division of GE Healthcare. He is a member of the board of trustees of the Asia Society, which promotes mutual understanding and strengthening partnerships among peoples, leaders and institutions of Asia and the United States in a global context, and a member of the board of directors for Minnesota Public Radio.

Smith, 50, is the chief financial officer and executive vice president of corporate development and strategy at Boeing, the world’s largest aerospace and defense company. He has served as Boeing’s finance leader since 2012 and its strategy leader since 2015. Previously, Smith held various leadership roles across Boeing’s finance function and operations. He rejoined Boeing in 2008 after serving for four years as vice president of global investor relations at Raytheon. Smith serves on the board of trustees for the Chicago Museum of Science and Industry, and the board of directors of the Economic Club of Chicago, the Chicago Botanic Garden and the Northwestern Medicine Community Physicians Group.

North America-based manufacturers of semiconductor equipment posted $1.97 billion in billings worldwide in February 2017 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in February 2017 was $1.97 billion. The billings figure is 6.1 percent higher than the final January 2017 level of $1.86 billion, and is 63.8 percent higher than the February 2016 billings level of $1.20 billion.

“Billings levels remain elevated as memory and foundry manufacturers continue to invest in advanced semiconductor technologies,” said Ajit Manocha, president and CEO of SEMI. “These investments are paving the way for the ramp of 3D NAND and 1X-nm devices.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Year-Over-Year
September 2016

$1,493.3

-0.1%
October 2016

$1,630.4

20.0%
November 2016

$1,613.3

25.2%
December 2016

$1,869.8

38.5%
January 2017 (final)

$1,859.4

52.3%
February 2017 (prelim)

$1,973.1

63.8%
Source: SEMI (www.semi.org), March 2017

 

SEMI ceased publishing the monthly North America Book-to-Bill report in January 2017.  The decision to discontinue the Book-to-Bill report was based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program is no longer considered a necessary component of their industry analysis.