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Global electronic components distributor Digi-Key Corporation, a provider of electronic component selection, availability and delivery, has partnered with AKM Semiconductor Inc., to facilitate the global distribution of AKM’s products.

In accordance with this renewed agreement, Digi-Key has added a number of AKM’s most reputable products to its selection, which include recently released Premium Audio Products, high bandwidth current sensors and industry’s lowest power PMICs tailored for the wearable market.

“We are pleased to announce our agreement with AKM Semiconductor to expand with a global distribution agreement,” said David Stein, Digi-Key’s Vice President of Semiconductor. “In addition to already popular electronic compass, we are excited to offer AKM’s high performance data converters, a variety of unique magnetic sensors and more new products to our customers worldwide.”

Asahi Kasei Microdevices Corporation (AKM) is a Japan-based company designs and manufactures CMOS mixed signal integrated circuits and magnetic sensors for applications including audio, multimedia, consumer electronics, industrial infrastructure, and telecommunications.

Digi-Key Corporation, based in Thief River Falls, Minn., is a global, full-service provider of both prototype/design and production quantities of electronic components, offering more than three million products from over 650 quality name-brand manufacturers

Poised for more growth


March 17, 2015

By Christian G. Dieseldorff, Industry Research & Statistics Group, SEMI

The most recent edition of the SEMI World Fab Forecast report — which tracks fab spending for construction and equipment, as well as capacity changes, and technology nodes transitions and product type changes by fab — reveals a positive forecast. The report shows that fab equipment spending in 2014 increased 20 percent, is expected to rise 15 percent in 2015, with another increase of 2-4 percent in 2016. Spending on construction projects, which typically represents new cleanroom projects, will see a significant decline in 2015 with -32 percent, but is expected to increase by 32 percent in 2016.  Since its last publication in November 2014, about 270 updates were made including data on 17 new facilities.

Fab Equipment/Fab Construction (2013-2016)

 

2013

2014

2015

2016
Fab equipment* 

$29.4

$35.2

$40.5

$41 to $42
Change % Fab equipment

-10.0%

19.8%

15.0%

2% to 4%
Fab construction US$

$8.8

$7.7

$5.2

$6.9
Change % construction

13.6%

-11.0%

-32.0%

+32.0%

* Chart US$, in billions; Source: SEMI, March 2015; SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment and spending on facilities for installation.

The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment and spending on facilities for installation.

Fab spending, such as construction spending and equipment spending, are fractions of a company’s total capital expenditure (capex). Typically, if capex shows a trend to increase, fab spending will follow.  Capex for most of the large semiconductor companies is expected to increase by eight percent in 2015, and grow another three percent in 2016. These increases are driven by new fab construction projects and also ramp of new technology nodes. Spending on construction projects, which typically represents new cleanroom projects, will experience a significant -32 percent decline in 2015, but is expected to rebound by 32 percent in 2016.

With worldwide capex growth of 8 percent, fab equipment spending is expected to increase by 15 percent in 2015.  At this point, SEMI’s data predict a slowdown of fab equipment spending in 2016 to low single digits.  No negative change is currently expected in our forecast scenario. Looking back to the last 25 years, after two years of growth a negative year typically followed. This may not be the case this time. Developments in the industry are pointing to a small but positive 2016.

Most fab equipment spending in 2015 is for foundry, memory, and Logic+MPU. Discretes including LED remain at about 4 percent share, MEMS/Other about 2-3 percent and Analog at less than1 percent.  Distribution will not change for 2016, except for foundry spending, which continues to increase year-over-year.

Comparing regions across the world, according to SEMI, the highest fab equipment spending in 2015 will occur in Taiwan, with US$ 11.9 billion, followed by Korea with US$ 9 billion.  The region with third largest spending, the Americas, is forecast to spend about US$ 7 billion.  Yet growth will decline in the Americas, by 12 percent in 2015, and decline by 12 percent in 2016 again.  Fourth in spending is China, with US$ 4.7 billion in 2015 and US$ 4.2 billion in 2016. In other regions, Japan’s spending will grow by about 6 percent in 2015, to US$ 4 billion; and 2 percent in 2016, to US$ 4.2 billion.  The Europe/Mideast region will see growth of about 20 percent (US$ 2.7 billion) in 2015 and over 30 percent (US$ 3.5 billion) in 2016. South East Asia is expected to grow by about 15 percent (US$ 1.3 billion) in 2015 and 70 percent (US$ 2.2 billion) in 2016.

New facilities beginning construction in 2015 and 2016 will start equipping in 2016 or later. SEMI’s data show that seven new facilities will start construction in 2015 (including one LED and one shell). In 2016, construction will possibly begin on five or six new fabs.

2015 is expected to be the second consecutive year in equipment spending growth. Our positive outlook for the year is based on spending trends we are tracking as part of our fab investment research. As noted in some of the examples cited above, the “bottom’s up” company-by-company and fab-by-fab approach points to strong investments by foundries and memory companies driving this year’s growth. Learn more about the SEMI fab databases at: www.semi.org/MarketInfo/FabDatabase.

Building on the highly successful inaugural program Innovation Village, SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders. The SEMICON Europa technology and business program agenda addresses the critical issues and challenges facing the microelectronics industries and provides information, education, and guidance for industry professional to move innovations and products to market. This year’s Innovation Village will bring together the most innovative European start-up and growth companies with leading investors from semiconductor and related industries.  New in 2015 is cooperation with the incubator “HighTech Startbahn” from Dresden with their Investors Congress “HighTech Venture Days.” As a result, the Innovation Village program has expanded to a four-day event with 60 selected companies, six high-tech sectors, speed presentations (pitches) and 60+ investors.

The goal of Innovation Village is to encourage exchanges between high-tech ventures and industry relevant investors. Participating start-up and growth companies have the opportunity to exhibit for three days at individual kiosks in the Innovation Village exhibition hall, presenting their innovations in a series of short pitches.  The Innovation Village features 40 private pitches to investors only, plus 20 public pitches — focusing on Information Communication Technology (ICT), Micro- and Nanotechnology and related applications, Materials Science, Environment and Energy Technology, Machinery and Plant Engineering, Industry 4.0 and Life Science and Automotive.

With a dedicated conference program on innovation and a live demonstration day for innovation products and applications, Innovation Village provides a uniquely valuable platform for both high-tech ventures as well as investors. The Innovation Village exhibition hall will also host several key industry companies and investors in exclusive booths with private meeting space.

“Saxony has gained a reputation for being one of Europe’s leading regions in innovative research,” says Heinz Kundert, president of SEMI Europe. “With the Innovation Village coming to Dresden for the first time, it is an excellent occasion to demonstrate the region’s capabilities for innovative technologies and products.”

“Dresden has proven to be one of Europe’s leading cities for IC manufacturing and microelectronics driven technology. The region is also host to a high number of innovations based start-ups,” says Bettina Vossberg, Chairwoman of the Board of Directors, HighTech Startbahn. “With the enhancement of both our strong concepts, it is an excellent occasion to demonstrate Europe’s capabilities in innovation and commercialization of new technologies.”

Innovation Village will represent the most viable new technology in Europe. Interested start-ups and growth companies are invited to fill out a Request for Participation (RFP) form online at the SEMICON Europa website (www.semiconeuropa.org). The ventures are encouraged to apply as early as possible. RFPs will be judged by SEMICON Europa Innovation Village Committee and HighTech Startbahn experts in venture capitalism and new technology investment: Tobias Jahn (3M New Ventures); Tony Chao (Applied Ventures LLC), Claus Schmidt (Robert Bosch Venture GmbH), Jim Traynor (TEL Venture), Christophe Desrumeaux (CEA Investissement), Jong Sang Choi (Samsung Ventures), Jean-Marc Girard (Air Liquid Electronics), Jean-Marc Bally (ASTER Capital), Erkki Aaltonen (VTT Ventures) and Pascal Vanluchene (Capital-E).

To encourage visibility for both investors and early stage innovative ventures, Innovation Village conferences and the exhibition will be free-of-charge for all SEMICON Europa visitors. Speakers will attract diverse visitors, including large companies, SMEs, and start-ups to the Innovation Village area. Dedicated innovation lounge areas set amidst the exhibition kiosks will allow visitors, investors and start-ups to interact with each other.

TowerJazz, a specialty foundry, announced today it has begun mass production of an IR sensor used by Intel in one of its new 3D sensing solutions. Intel chose TowerJazz’s CMOS image sensor (CIS) platform, specifically its unique IS11 process, due to its unparalleled pixel performance at near infrared light with very high speed, high quantum efficiency (QE) and high optical resolution.

“Partnering with TowerJazz was a part of our success in producing our advanced image sensor for 3D imaging and was a natural choice as they were able to offer the required technical specifications and performance for this breakthrough technology,” said Sagi Ben Moshe, Director Depth Camera Engineering, Intel Corporation.

The unique pixel developed by TowerJazz for Intel is a 3.5um global shutter very fast pixel that allows high quantum efficiency at near infrared light, specifically at the scanning laser wavelength with high sensor resolution.

“This collaboration between Intel and TowerJazz was a natural fit. Intel’s leadership in this market, combined with our leading technology that provides outstanding pixel performance for near IR 3D imaging, along with the proximity of our Israel fab with Intel Israel, the group developing this technology, was an ideal alignment,” said Russell Ellwanger, Chief Executive Officer, TowerJazz. “We are very excited to partner with Intel to produce lifestyle changing technology that will revolutionize the way we interact with devices in both our professional and personal lives. We highly value our business relationship with Intel and look forward to further collaboration on their sensing technology.”

“It is truly amazing and thrilling to see our lengthy experience in the imaging field and our own CMOS image sensor technology developed in-house, combined with all of the R&D work we have undertaken for many years come to fruition in such a groundbreaking way,” said Dr. Avi Strum, Vice President and General Manager, CMOS Image Sensor Business Unit, TowerJazz. “Intel sensing solutions will bring consumers new experiences and will change the way people capture and share 3D images. We are very proud of our work with Intel and our ability to assist them in bringing cutting-edge technologies to market quickly and in high volume.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.5 billion for the month of January 2015, the industry’s highest-ever January total and an increase of 8.7 percent from January 2014 when sales were $26.3 billion. Global sales from January 2015 were 2 percent lower than the December 2014 total of $29.1 billion, reflecting normal seasonal trends. Regionally, sales in the Americas increased by 16.4 percent compared to last January to lead all regional markets. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“After a record-setting 2014, the global semiconductor industry is off to a promising start to 2015, posting its highest-ever January sales led by impressive growth in the Americas market,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Global sales have increased on a year-to-year basis for 21 consecutive months and remain strong across most regions and product categories.”

Regionally, year-to-year sales increased in the Americas (16.4 percent) and Asia Pacific (10.7 percent), but decreased in Europe (-0.2 percent) and Japan (-8 percent). Sales decreased compared to the previous month in Asia Pacific (-0.8 percent), Europe (-2 percent), the Americas (-3.3 percent), and Japan (-6.4 percent).

January 2015
Billions
Month-to-Month Sales
Market Last Month Current Month % Change
Americas 6.73 6.51 -3.3%
Europe 3.01 2.94 -2.0%
Japan 2.80 2.62 -6.4%
Asia Pacific 16.59 16.46 -0.8%
Total 29.13 28.53 -2.0%
Year-to-Year Sales
Market Last Year Current Month % Change
Americas 5.59 6.51 16.4%
Europe 2.95 2.94 -0.2%
Japan 2.84 2.62 -8.0%
Asia Pacific 14.87 16.46 10.7%
Total 26.25 28.53 8.7%
Three-Month-Moving Average Sales
Market Aug/Sep/Oct Nov/Dec/Jan % Change
Americas 6.41 6.51 1.5%
Europe 3.21 2.94 -8.2%
Japan 3.01 2.62 -13.1%
Asia Pacific 17.05 16.46 -3.5%
Total 29.68 28.53 -3.9%

SEMICON Russia, a meeting place of the entire micro- and nanoelectronics industry in Russia, will take place from 16 to 18 June in Moscow. SEMICON Russia Exhibition is scheduled for 17-18 June with traditional location at Expocentre fairgrounds.  With programs that include the Microelectronics Market Conference, an Exhibition, TechARENA sessions and presentations, SEMICON Russia offers advanced opportunities for networking and cooperation with local and foreign professionals.  The event features the latest developments and emerging new markets, in addition to an opportunity to connect with customers, partners and investors. In 2015, SEMICON Russia features a new program TechARENA, consisting of sessions on Intelligent Systems and Semiconductor Optoelectronics. In addition, SEMICON Russia offers its exhibitors a TechLOUNGE where they can present their latest products and innovations. Over 130 exhibitors from 15 countries — including international and regional leading suppliers of equipment, materials and services — are expected to be on the show floor and more than 1500 attendees.

The Microelectronics Market Conference takes place on 16 June the day before the exhibition opening in Expocentre. It is devoted to the creation of large-scale manufacture of electronics in the Russian regions: markets, technology and government support.   The event is a unique opportunity to get a comprehensive perspective of the market situation, with panel discussions which include open debates. The Conference is attended by the representatives of federal and regional organizations and agencies, top and middle managers of major Russian and foreign companies, development institutions, Research Studies Institutes, industrial clusters, Russian and foreign experts.

Conference speakers include: Heinz Kundert, President of SEMI Europe; Alena Fomina, Managing director of JSC “CNII Elektronika;” Pavel Rudnik, Deputy Director, the Department of Innovative Development of the Ministry of Economic Development of the Russian Federation;  Dmitry Krinitskiy, Head of the Department for regional policy and cooperation with authorities, JSC “RUSNANO”; Denis Mironov, Vice-Chairman of Saint Petersburg Industrial Policy Innovations Committee; and  Evgeny Shakhmatov, Head of Samara State Aerospace University. For details about the agenda, please visit http://www.semiconrussia.org/en/Programs/Overview.

From 17 to 18 June, the Expocentre in Moscow will host the eighth SEMICON Russia exhibition, where leading companies from around the world will showcase their products, equipment, technology, facilities and services. Every year SEMICON Russia becomes a must-visit event for the global industry community: consumers, developers, engineers and researchers interested in the application and development of microelectronics technologies including: MEMS technology packaging, A3B5 electronics, photovoltaics, and flexible electronics. SEMICON Russia 2015 exhibitors include: SVCS s.r.o., Maicom Quarz GmbH, DIPAUL group, Eltech SPb, JSC, Schenker Deutschland AG, FÄTH, IMEC, M+W Group, STMicroelectronics, «NPP «ESTO» Isc, Zelenograd Innovation cluster Technounity.  Exhibiting companies are from Russia, Germany, Belarus, Czech Republic, France, UK, Netherlands, Singapore, Japan, the Netherlands, Sweden, and Italy.

“Despite global challenges, we believe that now is the time to strengthen the Russian industry. As the №1 global trade association committed to microelectronics industry development worldwide, SEMI will continue the effort to support the Russian microelectronic industry. Russian companies are looking for technical partnerships to improve competitiveness. SEMICON Russia is discussing new opportunities— including public-private partnership project development.  The semiconductor (and related) industries are also supported by the government and other local organizations, making SEMICON Russia an ideal place to connect to the industry,“ said Heinz Kundert, President of SEMI Europe.

On 17 June, for the first time TechARENA will present the “Smart Systems” session, which will provide an overview of global developments, future applications and markets. The session will focus on building successful cooperation with the Russian companies and funding possibilities.  In addition, the “Semiconductor Optoelectronics” session will take place on the 18 June at TechARENA in honor of the International Year of Light (YIL2015) and light-based technologies declared by the United Nations. This session will give an overview of the current trends and developments of the semiconductor optoelectronics technologies in Russia. Leading Russian and European experts and specialists will provide the R&D results and implementation projects, and review current and potential collaboration between Russian and other world players in this field. Within the framework of TechARENA program, SEMICON Russia exhibitors will make presentations. Visitors of SEMICON Russia get a free access to all TechARENA events.

For more information on SEMICON Russia 2015, please visit: http://www.semiconrussia.org

Total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march through the current cyclical period and top one trillion units for the first time in 2017, according to IC Insights’ forecast presented in the 2015 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry. Semiconductor shipments in excess of one trillion units are forecast to be the new normal beginning in 2017.

Figure 1 shows that semiconductor unit shipments are forecast to increase to 1,024.5 billion devices in 2017 from 32.6 billion in 1978, which amounts to average annual growth of 9.2 percent over the 39 year period and demonstrates how increasingly dependent the world is on semiconductors. From 2009 to 2014, the average annual growth rate of semiconductor units was 7.6 percent—somewhat slower than the long-term growth rate—due to global economic uncertainties through that five-year period. Stronger 8.2 percent annual growth is forecast from 2014 to 2019 as momentum strengthens for electronic systems.

semi units

The strongest annual increase in semiconductor unit growth over the time span shown in Figure 1 was 34 percent in 1984; the biggest decline was 19 percent in 2001 following the dot-com bust. Semiconductor unit shipments first topped the 100-billion mark in 1987, exceeded 500-billion units for the first time in 2006 and then surpassed 600-billion units in 2007 before the global financial meltdown and recession caused semiconductor shipments to fall in 2008 and 2009, the only time the industry has experienced a back-to-back decline in unit shipments. Semiconductor unit growth then surged 25 percent in 2010, the second-highest growth rate since 1978. IC Insights forecasts semiconductor unit growth of 10.0 percent in 2015 and 11.0 percent in 2016. The semiconductor unit growth rate is forecast to fall to only 3.4 percent in 2017, enough to push annual shipments beyond one trillion devices for the first time.

Interestingly, the percentage split of IC and O-S-D devices within total semiconductor units has remained fairly steady despite advances in integrated circuit technology and the blending of functions to reduce chip count within systems. In 1978, O-S-D devices accounted for 79 percent of semiconductor units and ICs represented 21 percent. Almost 40 years later in 2017, O-S-D devices are forecast to account for 74 percent of total semiconductor units, compared to 26 percent for ICs (Figure 2).

semi units 2

Further details on IC, O-S-D, and total semiconductor unit and market trends are provided in the 2015 edition of IC Insights’ flagship report, The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry.

The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia. The event promises to be larger and more comprehensive than its predecessor SEMICON Singapore, which has been held annually since 1993, with an expanded programme and larger audience base focusing on Southeast Asia communities in the semiconductor and microelectronics sector. The expanded strategy for the new SEMICON Southeast Asia Show — between Singapore, Malaysia and potentially the rest of the regions — will open new business opportunities for customers and foster stronger cross-regional engagement, according to SEMI, the event organiser. SEMICON Southeast Asia will feature a tradeshow exhibition, networking events, market and technology seminars, and conferences.

The event will connect decision makers from leading and emerging semiconductor companies with important industry stakeholders from both the region and all over the world.  Penang was selected for the inaugural SEMICON Southeast Asia exhibition because of its reputation as the “Silicon Valley of the East” and Malaysia’s vibrant eco-system, coupled with the drive and support from the state government.  Focusing on key trends and technologies in semiconductor design and manufacturing, the event also addresses expanding applications markets like mobile devices and other connected “Internet of Things” (IoT) technologies, many of which require development of specialised materials, packaging, and test technologies, as well as new architectures and processes.

For 2015 and 2016, SEMI estimates spending of almost US$ 5 billion on front-end and back-end equipment in the Southeast Asia region, and another $14 billion in spending on materials including $11 billion on packaging-related materials. In addition, according to the SEMI (www.semi.org) World Fab Forecast, Southeast Asia is home to over 35 production fabs covering Foundry, Compound Semiconductors, MEMS, Power, LED, and other devices.

Ng Kai Fai, President of SEMI Southeast Asia, said, “Southeast Asia is a significant and exciting market for the semiconductor industry. In fact, the region contributes a substantial 27 percent of global assembly, test and production, on top of being the largest market for assembly and test equipment.”

“SEMICON Southeast Asia is a natural progression from its earlier SEMICON Singapore exhibition and actively unites industry participants throughout the region. In addition to offering a deep networking opportunity for industry stakeholders, the event is also a catalyst for industry players within the region to collaborate and innovate to become larger players in this US$ 19 billion industry. This year, we expect about 60 industry speakers and close to 200 companies to participate in SEMICON Southeast Asia,” he added.

According to En. Zulkefli Haji Sharif, CEO of Malaysia Convention & Exhibition Bureau, “We are delighted to be able to host SEMICON Southeast Asia here in 2015. This prestigious event will showcase the best of the semiconductor industry and attendees can expect to find out more about the latest developments in microelectronics field. We have the utmost confidence that Penang will live up to all expectations as an attractive business events destination, and that the event will be a benefit to local and global players alike.”

Early-bird pricing on paid programmes ends 20 March, so register now. For more information and exhibition opportunities, visit www.semiconsea.org.

As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Gartner, Inc. forecasts that 4.9 billion connected things will be in use in 2015, up 30 percent from 2014, and the figure will reach 25 billion by 2020. The analyst firm also projects that by 2017, 50 percent of IoT solutions will originate in startups that are less than three years old.

Meanwhile, the specter of an insecure and dangerous IoT is becoming increasingly worrisome; last month, the U.S. Federal Trade Commission publicly raised concerns of security risks associated with the rising number of interconnected systems and devices, and a top U.S. news organization reported that DARPA had wirelessly hacked into a major automotive OEM’s braking system. Additionally, a recent report from tech giant HP found that many IoT end-nodes are inherently insecure, with 70 percent of evaluated devices transmitting data via unencrypted network services.

Intent on applying its extensive expertise and proven technologies to address these trends, Freescale today announced several landmark programs intended to help establish standards and drive industry metrics for IoT security assurance. These initiatives include:

  • Teaming with the Embedded Microprocessor Benchmarking Consortium (EEMBC) to identify critical embedded security gaps and collaborate with other consortium members to establish guidelines that help IoT OEMs and system designers better secure IoT transactions and endpoints. Founding members of this coalition will convene in May at the second annual IoT Developers Conference in Santa Clara, California.
  • Establishing Freescale Security Labs – Centers of Excellence (CoEs) at Freescale’s headquarters and other locations worldwide, where the company, its partners and customers will focus on enhancement of IoT security technologies spanning from the cloud to the end-node. Alongside these CoEs is the commitment to allocate up to 10 percent of the company’s annual R&D budget on IoT security technologies.
  • Creating a program dedicated to educating startups on IoT security best practices and providing best-in-class security support through Freescale’s partner ecosystem.

“Security challenges represent nothing less than an existential threat to the IoT movement, before it really has a chance to take off,” said Gregg Lowe, President and CEO of Freescale Semiconductor. “Freescale is addressing these challenges head-on to help ensure a future where secure solutions power every node of the IoT — from end devices to the network to the cloud.”

North America-based manufacturers of semiconductor equipment posted $1.31 billion in orders worldwide in January 2015 (three-month average basis) and a book-to-bill ratio of 1.03, according to the January EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in January 2015 was $1.31 billion. The bookings figure is 4.9 percent lower than the final December 2014 level of $1.38 billion, and is 2.6 percent higher than the January 2014 order level of $1.28 billion.

The three-month average of worldwide billings in January 2015 was $1.28 billion. The billings figure is 8.6 percent lower than the final December 2014 level of $1.40 billion, and is 3.5 percent higher than the January 2014 billings level of $1.23 billion.

“2014 was a strong growth year for the semiconductor equipment industry, and both bookings and billings at the start of this year are comparable to the early 2014 figures,” said SEMI president and CEO Denny McGuirk. “Given the positive outlook for the semiconductor industry in 2015 and based on current capex announcements, we expect the equipment market to continue to grow this year.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
August 2014 

$1,293.4

$1,346.1

1.04
September 2014 

$1,256.5

$1,186.2

0.94
October 2014 

$1,184.2

$1,102.3

0.93
November 2014 

$1,189.4

$1,216.8

1.02
December 2014 (final)

$1,395.9

$1,381.5

0.99
January 2015 (prelim)

$1,276.3

$1,313.6

1.03

Source: SEMI, February 2015