Tag Archives: letter-mems-business

From lifesaving smart headsets for truck drivers to gliding electric skateboards, five companies using MEMS and sensors will compete for audience votes during the Technology Showcase at the SEMI | MSIG MEMS & Sensors Executive Congress on November 1-2 in Napa Valley, Calif. As a featured event at the MEMS & Sensors Industry Group (MSIG) annual professional forum for executives from MEMS/sensors manufacturing and their end-user customers, the Technology Showcase highlights the newest and most unique MEMS/sensors-enabled applications in the industry.

“This year’s Technology Showcase finalists at the MEMS & Sensors Executive Congress are as fascinating as they are diverse,” said Frank Shemansky, CTO of SEMI | MSIG. “Imagine, for example, a MEMS-based switching element the width of a human hair, enabling RF switching that is 1,000 times faster and lasts 1,000 times longer than traditional mechanical switches. That is the kind of MEMS technology that could dramatically improve wireless applications, and it is just one of our Tech Showcase finalists ─  the others are equally compelling. The Tech Showcase is always a big draw at the Executive Congress because it gives attendees the chance to personally interact with the finalists’ demos to decide their vote for the winner – one of whom will be ‘crowned’ at the close of the conference.”

Tech Showcase Finalists

The LEIF eSnowboard by LEIF Technologies is the world’s first light electric vehicle that moves just like a snowboard. The LEIF brings to the pavement the smooth, sliding moves only found on a mountain or a wave — up to 23 mph and 15 miles per battery pack.

The Maven Co-Pilot by Maven Machines is the first smart headset for truck drivers. Employing MEMS, sensor fusion, wearable technology, machine intelligence and mobile-cloud architecture, the Maven Co-Pilot monitors drivers’ fatigue and distraction levels 50 times per second to provide accurate instantaneous early warnings to both drivers and fleet managers.

Menlo Digital-Micro-Switch Technology by Menlo Micro demonstrates fundamental materials’ advancements that improve the size, speed, power handling and reliability of MEMS switches. Smaller than the width of a human hair, Menlo Micro’s switching elements are so small that hundreds of them fit in a space smaller than 10mm2. Menlo Micro switches operate 1,000x faster than traditional mechanical switches — in a few microseconds rather than milliseconds. Their scalable architecture allows the handling of 100s of volts and 10s of amps without arcing. Menlo Micro’s devices last 1,000x longer than traditional mechanical switches, supporting billions of cycles without performance degradation.

The Berries Smart Sensor series by eLichens are patented autonomous non-dispersive infrared (NDIR) gas sensors offered in a 2 x 2 x 1cm package. These sensors integrate a dual-channel feature for a calibration-free long-life cycle. The miniaturized optical gas sensor is a complete system in package (SIP) integrating a proprietary infrared MEMS emitter and detectors, a highly efficient patented optical sampling chamber, and signal processing. The Berries series address the demanding requirements of the gas-sensing industries, where accuracy, auto-calibration and low power consumption are essential for new generations of gas- and air-detection products.

Coupled Time Domain Simulation for MEMS Sensors and System Integration by PZFlex lets engineers model and simulate a wide range of physics in new MEMS areas such as piezoelectric micromachined ultrasonic transducers (PMUTs) for fingerprint sensing. Engineers can conduct large-scale time-domain finite element analysis (FEA) simulation using PZFlex to gain insights into discrete device performance, device array performance, and full system performance for a PMUT fingerprint sensor embedded within a smartphone touch-display stackup.

MEMS & Sensors Executive Congress 2017 will take place November 1-2 at the Silverado Resort and Spa in Napa Valley, Calif. For more information, please contact SEMI via email: [email protected] or visit: www.semi.org/en/mems-sensors-executive-congress-2017.

Providing deep insights and perspectives on the challenges and opportunities in automotive electronics, the second edition of “FUTURECAR: New Era of Automotive Electronics Workshop” will be held November 8-10 at Georgia Tech in Atlanta, Georgia. SEMI (http://www.semi.org) and Georgia Tech, collaborators for the event, see unprecedented technical challenges and opportunities in electrical, mechanical and thermal designs, and new digital, RF, radar, LiDAR, camera, millimeter wave, high-power and high-temp technologies. The workshop will highlight rapid advancements in automotive electronics technologies and applications, and explore technical and business barriers and opportunities that are best addressed collectively across the supply chain.

The focus of the 2017 FUTURECAR workshop is on electronics in the car of the future. Autonomous driving, in-car smartphone-like infotainment, privacy and security, and all-electric cars will be among the topics presented, with particular emphasis on how these advancements impact devices and packaging with respect to materials, tools, processes, substrates, packages, components and integrated functions in R&D and in manufacturing. This event provides a unique opportunity for the semiconductor manufacturing and automotive supply chains to connect, collaborate and identify areas for new solutions.

The plenary session on November 8 will feature presentations from leading experts from Mercedes Benz, Porsche, Bosch, Qualcomm, SAE International and Yole Développement. The workshop sessions on November 9-10 include:

  • Power devices and packaging
  • High-temperature materials and reliability
  • Sensing electronics
  • Computing and communications
  • Student posters

FUTURECAR draws on the synergy between Georgia Tech in R&D and its industrial partners, as well as SEMI in global electronics manufacturing stewardship across the supply chain. Key to the depth of the workshop is support and expertise from the technical co-sponsors International Electronics Manufacturing Initiative (iNEMI), IEEE Electronics Packaging Society (IEEE EPS) and International Microelectronics Assembly and Packaging (IMAPS), as well as SAE International, the global association representing engineers and experts in the aerospace, automotive and commercial vehicle industries.

Workshop co-chairs are Prof. Rao Tummala, Georgia Tech; Bettina Weiss, SEMI; Grace O’Malley, iNEMI; Christian Hoffman (Qualcomm), IMAPS; and Patrick McCluskey, IEEE.

For more information on FUTURECAR 2017 and to register, please visit http://www.prc.gatech.edu/FUTURECAR

 

COMET Group, a global provider of high-quality systems, components and services such as x-ray, ebeam and radio frequency technologies, today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

Scheduled to open October 4th, Lab One will bring Comet Group’s three core technologies under one roof for the first time:

  • RF power – Comet Plasma Control Technologies (PCT) designs and manufactures the technology used to make semiconductors and is used by leading chip manufacturers that power the industry’s most popular mobile devices (e.g. Apple, Samsung) and electronics (e.g. flat panel displays)
  • X-ray – Yxlon’s industrial X-ray and computed tomography – systems and services enable customers to improve the quality of their products and processes by non-destructive testing, measuring and decision support in industries such as electronics, automotive, aerospace, medtech, science and new technologies. They are based on highly compact Comet x-ray components and sources
  • ebeam – ebeam technology inactivates harmful pathogens that can cause food borne illnesses and provides safe, environmentally friendly packaging materials that reduce waste and improve food security

The working Lab and testing environment will act as an extension to many leading Silicon Valley businesses – providing access to a variety of testing and inspection services, as well as opportunities to collaborate with Comet Group’s industry experts, who will be available for consultation, brainstorming and problem solving.

“Our new Lab One facility can save local businesses time by providing local inspection services, save them money by finding costly flaws, and solve their logistic inspection services headaches with quick answers to their non-destructive test needs,” said Paul Smith, Sr. Vice President at Comet Technologies USA. “It’s a place where ideas are jointly transformed into solutions and solutions into business success.” 

With pioneering solutions for a wide range of industries, Comet Group will support its clients by bringing greater safety and security, mobility, sustainability and efficiency to numerous areas of life.

TowerJazz, the global specialty foundry, and Crocus, a developer of TMR magnetic sensor technology and embedded MRAM, today announce volume manufacturing of Crocus TMR (Tunnel MagnetoResistance) sensors, using TowerJazz’s 0.13um CMOS process with a dedicated magnetic module in the Cu BEOL. With Crocus’ magnetic process, know-how and IP, and TowerJazz’s process technology and integration expertise, Crocus has successfully licensed the TMR technology to an automotive Tier 1 customer, bringing increased business to both companies.

According to a 2016 MarketsandMarkets report, the overall magnetic field sensors market was valued at USD $2.25 billion in 2015 and is expected to reach S4.16 billion by 2022, at a CAGR of 8.87% between 2016 and 2022. The growth of this market is driven by the rising demand for MEMS-based sensors across industry verticals, surge in the automotive industry, increasing demand for high-quality sensing devices, and continuous growth in consumer electronics applications.

Magnetic transducers which sense magnetic field strength are widely used in modern industry and electronics to measure current, position, motion, direction, and other physical parameters. Crocus’ TMR technology is a CMOS-based, robust technology capable of offering important advantages in sensitivity, performance, power consumption, size and full integration with CMOS to create monolithic single die ICs. Benefits to customers come in the form of low power, a robust design and high temperature performance. Crocus TMR solutions are ideally suited for many applications ranging from IoT to consumer, medical, automotive and industrial equipment.

“We selected TowerJazz because of their high flexibility and capabilities to adapt their TS13 platform to incorporate our TMR technology which includes magnetic materials that are typically not used in CMOS. TowerJazz’s vast manufacturing expertise is enabling us to successfully fulfill the needs of several market sectors combined with increased performance required in next-generation sensors. TowerJazz has been our development partner for many years and together we have achieved technology maturity leading to expanded business and successful licensing of Crocus IP,” said Michel Desbard, Crocus CEO.

“As the demand for IoT applications in our daily life is ever-increasing, there is an even greater need for intelligent sensing, low power and improved performance. Crocus’ successful licensing of their IP, along with TowerJazz’s manufacturing capability and know-how, enables us to deliver highly-advanced and competitive embedded-solutions to multiple customers in various markets. Through our partnership with Crocus, we are broadening our presence in the sensors’ market, complementing our MEMS and image sensing programs,” said Zmira Shternfeld-Lavie, VP of TOPS BU and R&D Process Engineering.”

Crocus’s TMR magnetic sensor is expected to displace existing sensor technologies in many applications. Crocus’ TMR magnetic sensor product family includes multiple architectures which are based on its Magnetic Logic Unit, a disruptive CMOS-based rugged magnetic technology.

SEMI, the global electronics manufacturing supply chain association, and SAE International, the association driving knowledge and expertise across automotive and aerospace industries, announce a partnership to provide their members with insights and access to important markets. The partnership will include information-sharing, presentation opportunities, and branding and exposition opportunities for members from both organizations.

SEMI and SAE are creating forums for raising awareness of the challenges and opportunities in design and manufacturing for the automotive and electronics sectors. From the electronics manufacturing industry perspective, the smart transportation segment is rich with opportunity to improve the performance and digitalization of vehicles.

According to IHS Markit, the high-end car is on track to contain more than $6,000 worth of electronics in five years, driving to a $160 billion automotive electronics market in 2022 − a 7 percent CAGR through 2022. The design, sourcing, and manufacturing cycles are significantly different than traditional electronics markets (such as consumer) but the opportunities are significant.  From the transportation industry perspective, all roadmaps to improve performance emphasize that advancements in electronics systems are key.

“Electronics systems in vehicles continue to undergo significant changes year over year, driven by the changing electronics capabilities – even in subsystems areas such as infotainment and control.  The impact of new vehicle operational modes, such as autonomous driving, is all about gathering and processing information on an enormous scale.  The systems that do this are developing rapidly and our members want immediate visibility into these new materials, processing and electronic subsystems.  Improvements in processing, controlling, sensing, have impact across our vehicle supply chain,” notes Jim Forlenza, group director, SAE Events. “Our members look to us to multiply their interactions with the supply chain and our partnership with SEMI allows us to offer them this in several areas across the world.”

“This relationship provides a new platform for SEMI members to showcase products, services and engage new customers,” states Art Paredes, VP of Global Expositions at SEMI. “As SEMI members increasingly collaborate with end-product manufacturers to develop novel capabilities, automotive is the leading area for silicon solutions to enable the future of driving. Working directly with SAE’s members and ecosystem will speed the time to innovate for both memberships.”

From large events − including SAE’s annual World Congress Experience and SEMI’s annual SEMICON expositions around the world − to a host of smaller, focused workshops and speaking engagements throughout the year, members will have many opportunities to establish supplier-vendor-customer relationships.

The latest update to the World Fab Forecast report, published on September 5, 2017 by SEMI, again reveals record spending for fab equipment. Out of the 296 Front End facilities and lines tracked by SEMI, the report shows 30 facilities and lines with over $500 million in fab equipment spending.  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion. The SEMI World Fab Forecast also forecasts that in 2018, fab equipment spending will increase even more, another 5 percent, for another record high of about $58 billion. The last record spending was in 2011 with about $40 billion. The spending in 2017 is now expected to top that by about $15 billion.

fab equipment spending

Figure 1: Fab equipment spending (new and refurbished) for Front End facilities

Examining 2017 spending by region, SEMI reports that the largest equipment spending region is Korea, which increases to about $19.5 billion in spending for 2017 from the $8.5 billion reported in 2016. This represents 130 percent growth year-over-year. In 2018, the World Fab Forecast report predicts that Korea will remain the largest spending region, while China will move up to second place with $12.5 billion (66 percent growth YoY) in equipment spending. Double-digit growth is also projected for Americas, Japan, and Europe/Mideast, while other regions growth is projected to remain below 10 percent.

The World Fab Forecast report estimates that Samsung is expected to more than double its fab equipment spending in 2017, to $16-$17 billion for Front End equipment, with another $15 billion in spending for 2018. Other memory companies are also forecast to make major spending increases, accounting for a total of $30 billion in memory-related spending for the year. Other market segments, such as Foundry ($17.8 billion), MPU ($3 billion), Logic ($1.8 billion), and Discrete with Power and LED ($1.8 billion), will also invest huge amounts on equipment. These same product segments also dominate spending into 2018.

In both 2017 and 2018, Samsung will drive the largest level in fab spending the industry has ever seen. While a single company can dominate spending trends, SEMI’s World Fab Forecast report also shows that a single region, China, can surge ahead and significantly impact spending. Worldwide, the World Fab Forecast tracks 62 active construction projects in 2017 and 42 projects for 2018, with many of these in China.

For insight into semiconductor manufacturing in 2017 and 2018 with more details about capex for construction projects, fab equipping, technology levels, and products, visit the SEMI Fab Database webpage (www.semi.org/en/MarketInfo/FabDatabase) and order the SEMI World Fab Forecast Report. The report, in Excel format, tracks spending and capacities for over 1,200 facilities including over 80 future facilities, across industry segments from Analog, Power, Logic, MPU, Memory, and Foundry to MEMS and LEDs facilities.

Lama Nachman will share Intel‘s story of using contextually aware computing to improve assistive technology for Stephen Hawking during her keynote at the 13th annual MEMS & Sensors Executive Congress(November 1-2, 2017 in Napa Valley, Calif.). Hosted by MEMS & Sensors Industry Group®(MSIG), the event also features NXP‘s Lars Reger exploring the critical role of MEMS and non-MEMS sensors in the complex automotive ecosystems of today and tomorrow. Other speakers will address diverse topics spanning ingestible sensors that leverage integrated circuits (ICs), MEMS spectral sensors that improve crop yields, low-power acoustic sensing platforms for always-on voice-activated products, and thin-film pressure-sensitive tiles used for gait and performance analysis.

“Understanding the essential role of MEMS and sensors in integrated systems, such as smart home, smart automotive, smart biomedical/wellness and smart industrial, is critical to extracting maximum value from these devices, which market research firm Yole Développement expects to grow from $38 billion in 2016 to $66 billion in 2021,” said Karen Lightman, vice president, MSIG, a SEMI Strategic Association Partner. “From our keynote speakers to our featured presenters and panelists, MEMS & Sensors Executive Congress speakers will delve into some of the most exciting ways that MEMS and sensors add intelligence and insight to integrated systems.”

Other Highlights

  • Emerging MEMS & Sensors: Technologies to Watch ─ Alissa Fitzgerald, A.M. Fitzgerald & Associates
  • MEMS & Sensors: Outtakes of 2017 and Outlook for 2018 ─ Jérémie Bouchaud, IHS Markit
  • BioMEMS: The Next Big Thing for MEMS Players? ─ Sébastien Clerc, Yole Développement
  • Fireside Chat with Industry VCs ─ Wen Hsieh of Kleiner Perkins Caufield & Byersand Rudy Burger of Woodside Capital Partners
  • Featured “Tech Talks” on “Creating Six Senses” ─ styled in the manner of TED Talks™, these short talks feature Marcellino Gemelli of Bosch Sensortec and Peter Hartwell of InvenSense/TDK

For conference registration, please visit: www.semi.org/en/mems-sensors-executive-congress-agenda-register. Register by September 26 for a discount.

 

FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.

The forum will breakdown the topic into four key areas: OEM applications; market analysis and forecasts; challenges to integration; and solutions for Tier 2 and Tier 3 suppliers. Speakers include representatives from SBD Automotive, Fiat-Chrysler Group LLC, Velodyne LiDAR, Lumitex, Alpha Micron, NextFlex, Auburn University, Universal Instruments, Interlink Electronics, Georgia Institute of Technology, DuPont Photovoltaics & Advanced Materials and more.

“This forum is an excellent opportunity to discover the possibilities of flexible electronic systems incorporating advanced semiconductors, MEMS, and sensors, which will provide lightweight, sensor networks that conform, curve, and possibly more.  New automotive applications in this area will enable wholly new approaches for the in-cabin driving experience,” said Dr. Melissa Grupen-Shemansky, CTO for Flexible Electronics & Advanced Packaging at SEMI | FlexTech.

Company tours to Ford and a networking dinner are scheduled for September 12, 2017. For more information on the forum and how to register visit the event websiteat www.semi/org/en/FHE-forum-summary.

STMicroelectronics (NYSE: STM) has strengthened its ecosystem through a Partner Program that connects customers with qualified technical specialists capable of strategically supporting their projects.

The new ST Partner Program helps customers’ design teams access extra skills, products, and services to aid engineering development and shorten time-to-market for new products. While searching ST parts, solutions, and resources online, customers can at the same time identify approved Program members with competencies related to the chosen products. These competencies can be in Cloud services, associated Components or Modules, embedded Software, Engineering services, Development tools, or Training services. This info is also centralized in a dedicated partner area on the ST website at www.st.com/partners.

“The ST Partner Program provides fast introductions to trusted partners able to supply expertise to critical design projects. We evaluate program applicants to ensure that all partners are committed to offering consistently high-quality services,” said Alessandro Maloberti, Partner Ecosystem Director, STMicroelectronics. “The Program is designed to encourage product developers to choose even more components, modules, embedded software, and tools from the broad portfolio available at st.com to start their new product designs.”

Potential partners can apply to join the ST Partner Program via web registration. A complete framework covering technical, marketing, legal, and business aspects protects partners and ensures high service quality for customers. New, formalized partner benefits include enhanced marketing support from ST, which may include promotion in the ST Community and ST YouTube channel, the right to use the ST Partner Program logo and communication materials, as well as exposure to ST’s global customer base of engineers and purchasers from leading high-tech brands, manufacturing-service providers, and independent engineers and designers.

Going forward, ST will introduce more ways for its partners to engage, including co-marketing activities, sharing design opportunities, training, and networking events.

Qualcomm Incorporated (NASDAQ:QCOM) and its subsidiary Qualcomm Technologies, Inc., and Himax Technologies, Inc. (NASDAQ:HIMX), today jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.

The collaboration brings together Qualcomm Spectra™ technologies and expertise in computer vision architecture and algorithm with Himax’s complementary technologies in wafer optics, sensing, driver, and module integration capabilities to deliver a fully integrated SLiM (Structured Light Module) 3D solution. The SLiM is a turn-key 3D camera module that delivers real-time depth sensing and 3D point cloud generation with high resolution and high accuracy performance for indoor and outdoor environments. The SLiM is engineered for very low power consumption in a compact, low profile form factor, making the solution ideal for embedded and mobile device integration. Qualcomm Technologies and Himax will commercialize the SLiM 3D camera as a total camera system solution for a wide array of markets and industries with mass production targeting in Q1/2018.

“This partnership with Himax highlights the technology investments we are making with Taiwanese companies to continue leading in visual processing innovation,” said Jim Cathey, senior vice president and president, Asia Pacific and India, Qualcomm Technologies, Inc. “The combination of cutting edge technology licensing and collaboration with an industry leading Taiwanese partner like Himax will help create groundbreaking new products in Taiwan, strengthening the global 3D depth sensing ecosystem and boosting Taiwan’s economy.”

“As an engineer, it is gratifying to see how our technology inventions enable products that will enrich user experience for consumers around the world,” said Chienchung Chang, vice president of engineering, Qualcomm Technologies, Inc. “It has been a great experience collaborating with Himax on the project to enable 3D computer vision technologies in smartphones, virtual reality and augmented reality products.”

“Our 3D sensing solution will be a game changing technology for smartphones, where we will enable the Android ecosystem to provide the next generation of mobile user experience,” said Jordan Wu, President and Chief Executive Officer of Himax Technologies. “Our two companies have worked together for more than four years to design the SLiM 3D sensing solution to meet growing demands for enhanced computer vision capabilities that will enable amazing new features and use cases in a broad range of markets and applications. We are pleased to partner with Qualcomm Technologies to put together an ecosystem and to enable the revolutionary computer vision solutions for our customers globally in a timely fashion.”