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Illinois researchers have demonstrated that sound waves can be used to produce ultraminiature optical diodes that are tiny enough to fit onto a computer chip. These devices, called optical isolators, may help solve major data capacity and system size challenges for photonic integrated circuits, the light-based equivalent of electronic circuits, which are used for computing and communications.

Isolators are nonreciprocal or “one-way” devices similar to electronic diodes. They protect laser sources from back reflections and are necessary for routing light signals around optical networks. Today, the dominant technology for producing such nonreciprocal devices requires materials that change their optical properties in response to magnetic fields, the researchers said.

“There are several problems with using magnetically responsive materials to achieve the one-way flow of light in a photonic chip,” said mechanical science and engineering professor and co-author of the study Gaurav Bahl. “First, industry simply does not have good capability to place compact magnets on a chip. But more importantly, the necessary materials are not yet available in photonics foundries. That is why industry desperately needs a better approach that uses only conventional materials and avoids magnetic fields altogether.”

In a study published in the journal Nature Photonics, the researchers explain how they use the minuscule coupling between light and sound to provide a unique solution that enables nonreciprocal devices with nearly any photonic material.

However, the physical size of the device and the availability of materials are not the only problems with the current state of the art, the researchers said.

“Laboratory attempts at producing compact magnetic optical isolators have always been plagued by large optical loss,” said graduate student and lead author Benjamin Sohn. “The photonics industry cannot afford this material-related loss and also needs a solution that provides enough bandwidth to be comparable to the traditional magnetic technique. Until now, there has been no magnetless approach that is competitive.”

The new device is only 200 by 100 microns in size – about 10,000 times smaller than a centimeter squared – and made of aluminum nitride, a transparent material that transmits light and is compatible with photonics foundries. “Sound waves are produced in a way similar to a piezoelectric speaker, using tiny electrodes written directly onto the aluminum nitride with an electron beam. It is these sound waves that compel light within the device to travel only in one direction. This is the first time that a magnetless isolator has surpassed gigahertz bandwidth,” Sohn said.

The researchers are looking for ways to increase bandwidth or data capacity of these isolators and are confident that they can overcome this hurdle. Once perfected, they envision transformative applications in photonic communication systems, gyroscopes, GPS systems, atomic timekeeping and data centers.

“Data centers handle enormous amounts of internet data traffic and consume large amounts of power for networking and for keeping the servers cool,” Bahl said. “Light-based communication is desirable because it produces much less heat, meaning that much less energy can be spent on server cooling while transmitting a lot more data per second.”

Aside from the technological potential, the researchers can’t help but be mesmerized by the fundamental science behind this advancement.

“In everyday life, we don’t see the interactions of light with sound,” Bahl said. “Light can pass through a transparent pane of glass without doing anything strange. Our field of research has found that light and sound do, in fact, interact in a very subtle way. If you apply the right engineering principles, you can shake a transparent material in just the right way to enhance these effects and solve this major scientific challenge. It seems almost magical.”

The internet of things is coming, that much we know. But still it won’t; not until we have components and chips that can handle the explosion of data that comes with IoT. In 2020, there will already be 50 billion industrial internet sensors in place all around us. A single autonomous device – a smart watch, a cleaning robot, or a driverless car – can produce gigabytes of data each day, whereas an airbus may have over 10 000 sensors in one wing alone.

Two hurdles need to be overcome. First, current transistors in computer chips must be miniaturized to the size of only few nanometres; the problem is they won’t work anymore then. Second, analysing and storing unprecedented amounts of data will require equally huge amounts of energy. Sayani Majumdar, Academy Fellow at Aalto University, along with her colleagues, is designing technology to tackle both issues.

Majumdar has with her colleagues designed and fabricated the basic building blocks of future components in what are called “neuromorphic” computers inspired by the human brain. It’s a field of research on which the largest ICT companies in the world and also the EU are investing heavily. Still, no one has yet come up with a nano-scale hardware architecture that could be scaled to industrial manufacture and use.

“The technology and design of neuromorphic computing is advancing more rapidly than its rival revolution, quantum computing. There is already wide speculation both in academia and company R&D about ways to inscribe heavy computing capabilities in the hardware of smart phones, tablets and laptops. The key is to achieve the extreme energy-efficiency of a biological brain and mimic the way neural networks process information through electric impulses,” explains Majumdar.

The probe-station device (the full instrument, left, and a closer view of the device connection, right) which measures the electrical responses of the basic components for computers mimicking the human brain. The tunnel junctions are on a thin film on the substrate plate. Credit: Tapio Reinekoski

The probe-station device (the full instrument, left, and a closer view of the device connection, right) which measures the electrical responses of the basic components for computers mimicking the human brain. The tunnel junctions are on a thin film on the substrate plate. Credit: Tapio Reinekoski

Basic components for computers that work like the brain

In their recent article in Advanced Functional Materials, Majumdar and her team show how they have fabricated a new breed of “ferroelectric tunnel junctions”, that is, few-nanometre-thick ferroelectric thin films sandwiched between two electrodes. They have abilities beyond existing technologies and bode well for energy-efficient and stable neuromorphic computing.

The junctions work in low voltages of less than five volts and with a variety of electrode materials – including silicon used in chips in most of our electronics. They also can retain data for more than 10 years without power and be manufactured in normal conditions.

Tunnel junctions have up to this point mostly been made of metal oxides and require 700 degree Celsius temperatures and high vacuums to manufacture. Ferroelectric materials also contain lead which makes them – and all our computers – a serious environmental hazard.

“Our junctions are made out of organic hydro-carbon materials and they would reduce the amount of toxic heavy metal waste in electronics. We can also make thousands of junctions a day in room temperature without them suffering from the water or oxygen in the air”, explains Majumdar.

What makes ferroelectric thin film components great for neuromorphic computers is their ability to switch between not only binary states – 0 and 1 – but a large number of intermediate states as well. This allows them to ‘memorise’ information not unlike the brain: to store it for a long time with minute amounts of energy and to retain the information they have once received – even after being switched off and on again.

We are no longer talking of transistors, but ‘memristors’. They are ideal for computation similar to that in biological brains. Take for example the Mars 2020 Rover about to go chart the composition of another planet. For the Rover to work and process data on its own using only a single solar panel as an energy source, the unsupervised algorithms in it will need to use an artificial brain in the hardware.

“What we are striving for now, is to integrate millions of our tunnel junction memristors into a network on a one square centimetre area. We can expect to pack so many in such a small space because we have now achieved a record-high difference in the current between on and off-states in the junctions and that provides functional stability. The memristors could then perform complex tasks like image and pattern recognition and make decisions autonomously,” says Majumdar.

A team of physicists, headed by the U.S. Naval Research Laboratory (NRL), have demonstrated the means to improve the optical loss characteristics and transmission efficiency of hexagonal boron nitride devices, enabling very small lasers and nanoscale optics.

Image shows directly measured polaritons propagating through a flake of Hexagonal boron nitride (hBN). This material has been identified as an ideal substrate for two-dimensional materials research while also recently being demonstrated as an exciting optical material for infrared nanophotonics. Credit: (US Naval Research Laboratory)

Image shows directly measured polaritons propagating through a flake of Hexagonal boron nitride (hBN). This material has been identified as an ideal substrate for two-dimensional materials research while also recently being demonstrated as an exciting optical material for infrared nanophotonics. Credit: (US Naval Research Laboratory)

“The applications for this research are considerably broad,” said Dr. Alexander J. Giles, research physicist, NRL Electronics Science and Technology Division. “By confining light to very small dimensions, nanophotonic devices have direct applications for use in ultra-high resolution microscopes, solar energy harvesting, optical computing and targeted medical therapies.”

Hexagonal boron nitride (hBN) forms an atomically thin lattice consisting of boron and nitrogen atoms. This material has recently been demonstrated as an exciting optical material for infrared nanophotonics and is considered an ‘ideal substrate’ for two-dimensional materials.

While previous work demonstrated that natural hBN supports deeply sub-diffractional hyperbolic phonon polaritons desired for applications, such as, sub-diffractional optical imaging (so-called ‘hyperlensing’), energy conversion, chemical sensing, and quantum nanophotonics, limited transmission efficiencies continue to persist.

“We have demonstrated that the inherent efficiency limitations of nanophotonics can be overcome through the careful engineering of isotopes in polar semiconductors and dielectric materials,” Giles said.

Naturally occurring boron is comprised of two isotopes, boron-10 and boron-11, lending a 10 percent difference in atomic masses. This difference results in substantial losses due to phonon scattering, limiting the potential applications of this material. The research team at NRL has engineered greater than 99 percent isotopically pure samples of hBN, meaning they consist almost entirely of either boron-10 or boron-11 isotopes.

This approach results in a dramatic reduction in optical losses, resulting in optical modes that travel up to three times farther and persist for up to three times longer than natural hBN. These long-lived vibrational modes not only enable immediate advances specific to hBN – near field optics and chemical sensing – but also provide a strategic approach for other materials systems to exploit and build upon.

“Controlling and manipulating light at nanoscale, sub-diffractional dimensions is notoriously difficult and inefficient,” said Giles. “Our work represents a new path forward for the next generation of materials and devices.”

Carbon nanotubes bound for electronics need to be as clean as possible to maximize their utility in next-generation nanoscale devices, and scientists at Rice and Swansea universities have found a way to remove contaminants from the nanotubes.

Rice chemist Andrew Barron, also a professor at Swansea in the United Kingdom, and his team have figured out how to get nanotubes clean and in the process discovered why the electrical properties of nanotubes have historically been so difficult to measure.

Scientists at Rice and Swansea universities have demonstrated that heating carbon nanotubes at high temperatures eliminates contaminants that make nanotubes difficult to test for conductivity. They found when measurements are taken within 4 microns of each other, regions of depleted conductivity caused by contaminants overlap, which scrambles the results. The plot shows the deviation when probes test conductivity from minus 1 to 1 volt at distances greater or less than 4 microns. Credit: Barron Research Group/Rice University

Scientists at Rice and Swansea universities have demonstrated that heating carbon nanotubes at high temperatures eliminates contaminants that make nanotubes difficult to test for conductivity. They found when measurements are taken within 4 microns of each other, regions of depleted conductivity caused by contaminants overlap, which scrambles the results. The plot shows the deviation when probes test conductivity from minus 1 to 1 volt at distances greater or less than 4 microns. Credit: Barron Research Group/Rice University

Like any normal wire, semiconducting nanotubes are progressively more resistant to current along their length. But over the years, conductivity measurements of nanotubes have been anything but consistent. The Rice-Swansea team wanted to know why.

“We are interested in the creation of nanotube-based conductors, and while people have been able to make wires, their conduction has not met expectations,” Barron said. “We wanted to determine the basic science behind the variability observed by other researchers.”

They discovered that hard-to-remove contaminants — leftover iron catalyst, carbon and water — could easily skew the results of conductivity tests. Burning those contaminants away, Barron said, creates new possibilities for carbon nanotubes in nanoscale electronics.

The new study appears in the American Chemical Society journal Nano Letters.

The researchers first made multiwalled carbon nanotubes between 40 and 200 nanometers in diameter and up to 30 microns long. They then either heated the nanotubes in a vacuum or bombarded them with argon ions to clean their surfaces.

They tested individual nanotubes the same way one would test any electrical conductor: by touching them with two probes to see how much current passes through the material from one tip to the other. In this case, tungsten probes were attached to a scanning tunneling microscope.

In clean nanotubes, resistance got progressively stronger as the distance increased, as it should. But the results were skewed when the probes encountered surface contaminants, which increased the electric field strength at the tip. And when measurements were taken within 4 microns of each other, regions of depleted conductivity caused by contaminants overlapped, which further scrambled the results.

“We think this is why there’s such inconsistency in the literature,” Barron said. “If nanotubes are to be the next-generation lightweight conductor, then consistent results, batch-to-batch and sample-to-sample, are needed for devices such as motors and generators as well as power systems.”

Heating the nanotubes in a vacuum above 200 degrees Celsius (392 degrees Fahrenheit) reduced surface contamination, but not enough to eliminate inconsistent results, they found. Argon ion bombardment also cleaned the tubes but led to an increase in defects that degrade conductivity.

Ultimately the researchers discovered vacuum annealing nanotubes at 500 degrees Celsius (932 Fahrenheit) reduced contamination enough to measure resistance accurately.

Barron said engineers who use nanotube fibers or films in devices currently modify the material through doping or other means to get the conductive properties they require. But if the source nanotubes are sufficiently decontaminated, they should be able to get the desired conductivity by simply putting their contacts in the right spot.

“A key result of our work is that if contacts on a nanotube are less than 1 micron apart, the electronic properties of the nanotube change from conductor to semiconductor, due to the presence of overlapping depletion zones, which shrink but are still present even in clean nanotubes,” Barron said.

“This has a potential limiting factor on the size of nanotube-based electronic devices,” he said. “Carbon-nanotube devices would be limited in how small they could become, so Moore’s Law would only apply to a point.”

At CES 2018, PixelDisplay will be demonstrating Vivid Color HDR, and implementations for thinner, more portable, brighter, narrow-bezel, cost-effective display products, targeting new HDR standards, with:

  • Increased color gamut and brightness, with better energy efficiency and lower cost, thickness, and weight than previously available
  • Wider-gamut color, for brighter edge-lit HDR LCD’s without the limitations of Quantum Dots, or HDR-crippling narrow-band phosphors
  • Thin MiniLED 2D array direct-backlit for HDR LCD’s, enabling removal of diffuser and light-guide layers, for additional savings
  • Flexible capabilities: “In-die” standard LED applications, “Roll-to-roll” color-conversion layers for MiniLED, and “Wafer-level-patterning” for MicroLED displays
  • Highest compatibility with LCD manufacturing processes, enabling existing LED Backlight designs to meet the new HDR standards
  • Zero heavy metals. Fully RoHS compliant

Following the initial launch of Vivid Color technology May 2017, demonstrated in the Innovation-Zone of SID’s DisplayWeek Conference in LA, showing an industry leading 97.8% of Rec.2020 from a single chip LED, PixelDisplay is directly addressing the HDR market gaps unfilled by Narrow-Band Phosphors, and Quantum Dots.

Mike Trainor, VP of Marketing at PixelDisplay, commented, “We’ve already established our capability for industry-leading laser-like color purity for AR and the next generation 8K standards, but the opportunity we also conveyed in our presentations and SID paper at DisplayWeek was the ability to apply the Vivid Color technology to nearer-term products aiming for prolific HDR compatibility, in thin, portable and narrow-bezel product categories.” Trainor continued, “We’re proud to be showing how near-term this technology is, through side-by-side comparisons with QLED LCD display, and LCD using our entry-level Vivid Color VC65R, the first of the new product series.”

Mike Trainor summarized, “Vivid Color is unique in enabling existing LCD display designs aiming to achieve the UHD Alliance’s MobileHDR and VESA’s new DisplayHDR logo’s requirements, without thickness-adding, bezel-widening. And unlike Narrow-Band KSF Phosphor LED’s, Vivid Color is fully HDR-Compatible, directly supporting inter-frame and dynamic PWM backlight control at high speeds, and very high brightness without disrupting color, sacrificing responsiveness or dynamic range – key challenges of these new HDR standards.”

STMicroelectronics (NYSE:STM) and USound, a fast-growing audio company, have delivered the first silicon micro-speakers resulting from their technology collaboration announced last year. Engineering samples are now with lead customers, and trade demonstrations will take place during CES 2018, in Las Vegas.

These extremely small speakers, expected to be the thinnest in the world and less than half the weight of conventional speakers, enable wearable tech such as earphones, over-the-ear headphones, or Augmented-Reality/Virtual-Reality (AR/VR) headgear to become even more compact and comfortable. Their extremely low power consumption saves extra weight and size by allowing smaller batteries, and unlike conventional speakers they generate negligible heat.

As MEMS (Micro Electro-Mechanical Systems) devices, the speakers are leveraging technology that has already revolutionized the capabilities of smartphones and wearables. High-performing MEMS motion sensors, pressure sensors, and microphones built on silicon chips are the critical enablers for context sensing, navigation, tracking, and other features that mobile users now rely on every day. With MEMS advancements now coming to speakers, designers can further miniaturize the audio subsystem, reduce power consumption, and create innovative features like 3D sound. MEMS-industry analyst Yole Développement values the overall micro-speakers market at $8.7 billion[1] currently, and expects MEMS manufacturers to capture share with silicon-based devices.

“This successful project combines USound’s design flair and ST’s extensive investment in MEMS expertise and processes, including our advanced thin-film piezo technology PeTra (Piezo-electric Transducer),” said Anton Hofmeister, Vice President and GM of MEMS Microactuators Division, STMicroelectronics. “Together, we are winning the race to commercialize MEMS micro-speakers by delivering a more highly miniaturized, efficient, and better-performing solution leveraging the advantages of piezo-actuation.”

“ST has provided the production expertise and manufacturing muscle to realize our original concept as a pace-setting, advanced product ready for consumer-market opportunities,” said Ferruccio Bottoni, CEO of USound. “These tiny speakers are now poised to change the design of audio and hearable products, and open up new opportunities to develop creative audio functionalities.”

In addition to applications in mobiles, audio accessories, and wearables, the new piezo-actuated silicon speakers support innovation in a wide variety of hearable electronics, including home digital assistants, media players, and IoT (Internet-of-Things) devices.

USound will demonstrate prototype AR/VR glasses containing multiple MEMS speakers per side, to invited guests at ST’s private suite during CES 2018. The demo will leverage the speakers’ ultra-thin form factor, low weight, and high sound quality to show how miniaturized audio systems can deliver outstanding experiences, and advanced features such as beam forming for private audio, within the extremely tight size, weight, and power constraints imposed by glasses and other wearables.

Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions.

Samsung_1y-nm_8Gb_DDR4_Chp+Mod

“By developing innovative technologies in DRAM circuit design and process, we have broken through what has been a major barrier for DRAM scalability,” said Gyoyoung Jin, president of Memory Business at Samsung Electronics. “Through a rapid ramp-up of the 2nd-generation 10nm-class DRAM, we will expand our overall 10nm-class DRAM production more aggressively, in order to accommodate strong market demand and continue to strengthen our business competitiveness.”

Samsung’s 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30 percent productivity gain over the company’s 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4’s performance levels and energy efficiency have been improved about 10 and 15 percent respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600 megabits per second (Mbps) per pin, compared to 3,200 Mbps of the company’s 1x-nm 8Gb DDR4.

To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive “air spacer” scheme.

In the cells of Samsung’s 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity.

The new 10nm-class DRAM also makes use of a unique air spacer that has been placed around its bit lines to dramatically decrease parasitic capacitance**. Use of the air spacer enables not only a higher level of scaling, but also rapid cell operation.

With these advancements, Samsung is now accelerating its plans for much faster introductions of next-generation DRAM chips and systems, including DDR5, HBM3, LPDDR5 and GDDR6, for use in enterprise servers, mobile devices, supercomputers, HPC systems and high-speed graphics cards.

Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.

In addition, the world’s leading DRAM producer expects to not only rapidly increase the production volume of the 2nd-generation 10nm-class DRAM lineups, but also to manufacture more of its mainstream 1st-generation 10nm-class DRAM, which together will meet the growing demands for DRAM in premium electronic systems worldwide.

In today’s “internet of things,” devices connect primarily over short ranges at high speeds, an environment in which surface acoustic wave (SAW) devices have shown promise for years, resulting in the shrinking size of your smartphone. To obtain ever faster speeds, however, SAW devices need to operate at higher frequencies, which limits output power and can deteriorate overall performance. A new SAW device looks to provide a path forward for these devices to reach even higher frequencies.

A team of researchers in China has demonstrated a SAW device that can achieve frequencies six times higher than most current devices. With embedded interdigital transducers (IDTs) on a layer of combined aluminum nitride and diamond, the team’s device was also able to boost output significantly. Their results are published this week in Applied Physics Letters, from AIP Publishing.

“We have found the acoustic field distribution is quite different for the embedded and conventional electrode structures,” said Jinying Zhang, one of the paper’s authors. “Based on the numerical simulation analysis and experimental testing results, we found that the embedded structures bring two benefits: higher frequency and higher output power.”

Surface acoustic wave devices transmit a high-frequency signal by converting electric energy to acoustic energy. This is often done with piezoelectric materials, which are able to change shape in the presence of an electric voltage. IDT electrodes are typically placed on top of piezoelectric materials to perform this conversion.

Ramping up the operational frequency of IDTs — and the overall signal speed — has proven difficult. Most current SAW devices top out at a frequency of about 3 gigahertz, Zhang said, but in principle it is possible to make devices that are 10 times faster. Higher frequencies, however, demand more power to overcome the signal loss, and in turn, some features of the IDTs need to be increasingly small. While a 30 GHz device could transmit a signal more quickly, its operational range becomes limited.

“The major challenge is still the fabrication of the IDTs with such small feature sizes,” Zhang said. “Although we made a lot of efforts, there are still small gaps between the side walls of the electrodes and the piezoelectric materials.”

To ensure that the transducers had the proper feature size, Zhang’s team needed a material with a high acoustic velocity, such as diamond. They then coupled diamond, a material that changes its shape very little with electric voltage, with aluminum nitride, a piezoelectric material, and embedded the IDT inside their new SAW device.

The resulting device operated at a frequency of 17.7 GHz and improved power output by 10 percent compared to conventional devices using SAWs.

“The part which surprised us most is that the acoustic field distribution is quite different for the embedded and conventional electrode structures,” Zhang said. “We had no idea at all about it before.”

Zhang said she hopes this research will lead to SAW devices used in monolithic microwave integrated circuits (MMICs), low-cost, high-bandwidth integrated circuits that are seeing use in a variety of forms of high speed communications, such as cell phones.

The coldest chip in the world


December 20, 2017

Physicists at the University of Basel have succeeded in cooling a nanoelectronic chip to a temperature lower than 3 millikelvin. The scientists from the Department of Physics and the Swiss Nanoscience Institute set this record in collaboration with colleagues from Germany and Finland. They used magnetic cooling to cool the electrical connections as well as the chip itself. The results were published in the journal Applied Physics Letters.

Even scientists like to compete for records, which is why numerous working groups worldwide are using high-tech refrigerators to reach temperatures as close to absolute zero as possible. Absolute zero is 0 kelvin or -273.15°C. Physicists aim to cool their equipment to as close to absolute zero as possible, because these extremely low temperatures offer the ideal conditions for quantum experiments and allow entirely new physical phenomena to be examined.

A chip with a Coulomb blockade thermometer on it is prepared for experiments at extremely low temperatures. Credit: University of Basel, Department of Physics

A chip with a Coulomb blockade thermometer on it is prepared for experiments at extremely low temperatures. Credit: University of Basel, Department of Physics

Cooling by turning off a magnetic field

The group led by Basel physicist Professor Dominik Zumbühl had previously suggested utilizing the principle of magnetic cooling in nanoelectronics in order to cool nanoelectronic devices to unprecedented temperatures close to absolute zero. Magnetic cooling is based on the fact that a system can cool down when an applied magnetic field is ramped down while any external heat flow is avoided. Before ramping down, the heat of magnetization needs to be removed with another method to obtain efficient magnetic cooling.

A successful combination

This is how Zumbühl’s team succeeded in cooling a nanoelectronic chip to a temperature below 2.8 millikelvin, thereby achieving a new low temperature record. Dr Mario Palma, lead author of the study, and his colleague Christian Scheller successfully used a combination of two cooling systems, both of which were based on magnetic cooling. They cooled all of the chip’s electrical connections to temperatures of 150 microkelvin – a temperature that is less than a thousandth of a degree away from absolute zero.

They then integrated a second cooling system directly into the chip itself, and also placed a Coulomb blockade thermometer on it. The construction and the material composition enabled them to magnetically cool this thermometer to a temperature almost as low as absolute zero as well.

“The combination of cooling systems allowed us to cool our chip down to below 3 millikelvin, and we are optimistic than we can use the same method to reach the magic 1 millikelvin limit,” says Zumbühl. It is also remarkable that the scientists are in a position to maintain these extremely low temperatures for a period of seven hours. This provides enough time to conduct various experiments that will help to understand the properties of physics close to absolute zero.

Researchers at Aalto University, Finland, have developed a biosensor that enables creating a range of new easy-to-use health tests similar to home pregnancy tests. The plasmonic biosensor can detect diseased exosomes even by the naked eye. Exosomes, important indicators of health conditions, are cell-derived vesicles that are present in blood and urine.

A rapid analysis by biosensors helps recognize inflammatory bowel diseases, cancer and other diseases rapidly and start relevant treatments in time. In addition to using discovery in biomedicine, industry may use advanced applications in energy.

Researchers created a new biosensor by depositing plasmonic metaparticles on a black, physical body that absorbs all incident electromagnetic radiation. A plasmon is a quantum of plasma oscillation. Plasmonic materials have been used for making objects invisible in scientific tests. They efficiently reflect and absorb light. Plasmonic materials are based on the effective polarizabilities of metallic nanostructures.

The carriers containing Ag nanoparticles are covered with various dielectrics of AlN, SiO2 and the composites thereof that are placed on a black background to enhance the reflectivity contrast of various colours at a normal angle of incidence. Credit: Aalto University

The carriers containing Ag nanoparticles are covered with various dielectrics of AlN, SiO2 and the composites thereof that are placed on a black background to enhance the reflectivity contrast of various colours at a normal angle of incidence. Credit: Aalto University

“It is extraordinary that we can detect diseased exosomes by the naked eye. The conventional plasmonic biosensors are able to detect analytes solely at a molecular level. So far, the naked-eye detection of biosamples has been either rarely considered or unsuccessful”, says Professor Mady Elbahri from Aalto University.

Plasmonic dipoles are famous for their strong scattering and absorption. Dr. Shahin Homaeigohar and Moheb Abdealziz from Aalto University explain that the research group has succeeded in demonstrating the as-yet unknown specular reflection and the Brewster effect of ultrafine plasmonic dipoles on a black body host.

“We exploited it as the basis of new design rules to differentiate diseased human serum exosomes from healthy ones in a simple manner with no need to any specialized equipment”, says Dr. Abdou Elsharawy from the University of Kiel.

The novel approach enables a simple and cost-effective design of a perfect colored absorber and creation of vivid interference plasmonic colors.

According to Elbahri, there is no need to use of sophisticated fabrication and patterning methods. It enables naked-eye environmental and bulk biodetection of samples with a very minor change of molecular polarizability of even 0.001%.