Tag Archives: letter-mems-tech

SAN JOSE, Calif. — mCube, provider of MEMS motion sensors, today announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size (0.9mm3). The MC3571 is only 1.1×1.1×0.74mm in size making it 75% smaller than current 2x2mm accelerometers on the market today, enabling developers to design high-resolution 3-axis inertial solutions for products that require ultra-small sensor form factors.

mCube_MC3571_AccelerometerThe MC3571 features a Wafer Level Chip Scale Package (WLCSP), making it smaller than a grain of sand. This achievement marks a major innovation milestone in the MEMS sensor industry and opens up new design possibilities for the next generation of sleek new mobile phones, surgical devices, and consumer products.

“The new MC3571 truly represents mCube’s vision of delivering a high-performance motion sensor in less than a cubic millimeter size,” said Ben Lee, president and CEO, mCube. “This advancement demonstrates how our monolithic technology can unleash amazing possibilities for designers to create exciting new products that could never be possible with today’s standard 2x2mm sensors.”

“mCube is the first company we’ve seen with a 1.1×1.1mm integrated MEMS+CMOS accelerometer and stretches once again the limits of miniaturization establishing new standards for the industry,” said Guillaume Girardin, Technology & Market Analyst MEMS & Sensors at Yole Développement (Yole). And his colleague, Thibault Buisson, Technology & Market Analyst, Advanced Packaging added: “Clearly, there is a growing trend among consumer companies to transition to wafer-level CSP packaging designs and with the MC3571 inertial motion sensor, mCube is at the forefront of this market evolution and at Yole, we are curious to see how competition will react.”

The high-resolution 14-bit, 3-axis MC3571 accelerometer is built upon the company’s award-winning 3D monolithic single-chip MEMS technology platform, which is widely adopted in mobile handsets with over 100 million units shipped. With the mCube approach, the MEMS sensors are fabricated directly on top of IC electronics in a standard CMOS fabrication facility. Advantages of this monolithic approach include smaller size, higher performance, lower cost, and the ability to integrate multiple sensors onto a single chip.

About the MC3571 Accelerometer

MC3571 is a low-noise, integrated digital output 3-axis accelerometer, which features the following:

  • 8, 10, or 14-bit resolution;
  • Output Data Rates (ODR) up to 1024Hz;
  • Selectable interrupt modes via an I2C bus;
  • Requires only a single external passive component, compared to competitive offerings requiring 2 or more.

Samples of the world’s smallest 1.1×1.1mm WLCSP accelerometer are available to select lead customers now with volume production scheduled for the second quarter of 2016.

 

Mentor Graphics Corporation today announced an update to the Mentor (R) Embedded Nucleus (R) real time operating system (RTOS) targeting low power, next-generation applications for connected embedded and internet of things (IoT) devices. The Nucleus RTOS supports the development of safe and secure applications utilizing the ARM (R) TrustZone (R) in Cortex (R)-A processors. The ARM TrustZone technology provides a system approach to create processor partitioning that isolates both hardware resources and software to help create a “secure” world that is protected from software attacks.

Non-secure applications are executed in the non-isolated domain – the “normal” world- without the ability to impact the applications executing in the secure world. Devices with safety and security operating requirements can isolate and execute secure applications on the Nucleus RTOS in a trusted environment with priority execution over the non-secure applications in the normal world.  Devices requiring a safe domain with dedicated peripherals for trusted applications to support secure software updates, digital rights management, and trusted payments will benefit from the hardware partitioning technology provided by the ARM TrustZone. This release of the Nucleus RTOS also includes support for low power, resource constrained IoT devices with 6LoWPAN and 802.15.4 wireless connectivity.

The explosive growth of smart IoT connected devices with the proliferation of cloud-based services places new requirements on developers to protect assets from software attacks. The ARM TrustZone enables embedded system developers to allocate system peripherals such as secure memory, crypto blocks, wireless devices, LCD screens, and more to a secure operating domain that is isolated from the remaining system. This hardware separation allows for the development of separate, secure applications on Nucleus RTOS in a trusted environment.

“For IoT and other connected applications, the expanded security and low-power connectivity features in Mentor’s Nucleus RTOS provide many of the capabilities needed for the creation of complex heterogeneous IoT systems,” stated Markus Levy, founder and president of EEMBC and The Multicore Association. “These features complement leading-edge hardware capabilities to meet the needs of today’s advanced IoT embedded systems.”

The applications in the secure world have access to all the system resources while a secure monitor acts to ensure the priority execution over the non-secure normal world applications. The secure monitor provides complete isolation to allow for the execution of bare-metal, Linux (R) or Nucleus RTOS-based applications in the normal world without impacting the safe Nucleus RTOS-based applications in the secure world.  The Nucleus RTOS with ARM TrustZone makes it possible to selectively secure peripherals and applications for system isolation to meet safety and security requirements.

“Nucleus RTOS support for ARM TrustZone provides system developers with the ability to meet the highest levels of safety and security for critical applications for heterogeneous OS-based systems,” states Scot Morrison, general manager of runtime solutions, Mentor Graphic Embedded Systems Division, “ARM TrustZone isolates the general purpose operating system, bare metal or Nucleus RTOS in the normal world from the secure application running in Nucleus RTOS in the secure world.”

IoT wearables, portable medical devices, home automation systems, and other smart connected devices are routinely designed with limited system resources to reduce power consumption and extend battery life. Designed for low data rate IP-driven communication, IPv6 over Lower Power Wireless Personal Area Network (6LoWPAN) is an adaptation layer that can be used to connect resource-limited IoT devices to the internet using IP network links like Ethernet, WiFi, or low power wireless connections. The Nucleus RTOS enables the development of IoT devices with 6LoWPAN to allow the low power exchange of data using TCP, UDP, CoAP transport protocols with compatible application layer security protocols such as DTLS. The use of IPv6 addressing allows every IoT device to have a routable IP address to facilitate internet and cloud access using the standard IP network infrastructure. For low power devices, embedded IoT developers can use 6LoWPAN over 802.15.4 wireless communication. With the Nucleus RTOS, IoT end nodes can be connected, monitored and updated using cloud-based services.

Caen, Oct. 22, 2015 – Two years after the launch of the PICS project (funded by the FP7 funding instrument dedicated to research for the benefit of SMEs), three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved during this program.

Started in September 2013, the PICS project was focused on developing innovative dielectric materials deposited by atomic layer deposition (ALD) and related tools (ALD batch tool and etching tool) to bring to mass production a new technology of high- density and high-voltage 3D trench capacitors targeting high-end markets like medical or aeronautics. Capacitors are key components presented in every electronic module. The integrated silicon capacitors technology offered by the SME IPDiA outperforms current technologies (using ceramic or tantalum substrates) in stability in temperature, voltage, aging and reliability and enables to build highly integrated and high-performance electronic modules.

The consortium’s three major technological results are:

  • A novel ALD batch tool was developed by Picosun and Fraunhofer IPMS-CNT. It enables to reduce cost-of-ownership and deliver better uniformity and step coverage for high-K dielectrics into 3D structures. With its demonstrated, optimized, and production-proven ALD processes, Picosun is solidifying its position as a technological leader in the IC, Semiconductor, MEMS markets, from R&D to production systems.
  • A new process for accurately etching high-K dielectrics, which are very specific materials, was demonstrated by SENTECH with the help of Fraunhofer IPMS-CNT. As a result, SENTECH has the potential to gain market share in the field of high-k materials, which have high interest for different applications, e.g. LED, MEMS, magnetic data storage.
  • Two new dielectric stacks were developed and integrated into the IPDiA 3D trench capacitors by IPDiA, CEA-Leti and Fraunhofer IPMS-CNT. The initial specifications were fulfilled and proven by electrical measurements. A new record on capacitance density (>500nF/mm² at 3.3V) and an extended operation voltage (10V with 150nF/mm²) were obtained, which expands IPDiA’s ability to meet current market requirements particularly in the field of medical or aeronautics. Qualification procedure was initiated during the project by launching preliminary reliability studies and it will continue in the coming months.

On top of these R&D results, the other main objective of PICS was the industrialization of this new integrated capacitors technology. Thanks to the partnerships set up, the manufacturability and financial viabilities were ensured by developing adequate industrial tools targeting mass production.

The PICS project is a success for all three SMEs and a good example of the benefits brought by the EU funding instrument “Research for the benefit of SMEs”. The SMEs were able to outsource a part of their research to get from RTD performers innovative know-how and cutting-edge technological processes. The project was built to answer the SMEs’ specific needs and a common goal was set up around the new IPDiA capacitors technology and the specific tools (ALD batch tool and etching) required for its commercial exploitation.

 

By Tom Abate, Stanford Engineering

Stanford chemical engineering Professor Zhenan Bao and her team have created a skin-like material that can tell the difference between a soft touch and a firm handshake. The device on the "golden fingertip" is the skin-like sensor developed by Stanford engineers.

Stanford chemical engineering Professor Zhenan Bao and her team have created a skin-like material that can tell the difference between a soft touch and a firm handshake. The device on the “golden fingertip” is the skin-like sensor developed by Stanford engineers. (Photo: Bao Lab, Stanford)

Stanford engineers have created a plastic “skin” that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.

Zhenan Bao, a professor of chemical engineering at Stanford, has spent a decade trying to develop a material that mimics skin’s ability to flex and heal, while also serving as the sensor net that sends touch, temperature and pain signals to the brain. Ultimately she wants to create a flexible electronic fabric embedded with sensors that could cover a prosthetic limb and replicate some of skin’s sensory functions.

Bao’s work, reported today in Science, takes another step toward her goal by replicating one aspect of touch, the sensory mechanism that enables us to distinguish the pressure difference between a limp handshake and a firm grip.

“This is the first time a flexible, skin-like material has been able to detect pressure and also transmit a signal to a component of the nervous system,” said Bao, who led the 17-person research team responsible for the achievement.

Benjamin Tee, a recent doctoral graduate in electrical engineering; Alex Chortos, a doctoral candidate in materials science and engineering; and Andre Berndt, a postdoctoral scholar in bioengineering, were the lead authors on the Science paper.

Digitizing Touch

Stanford sensor closeup

A closeup of the sensor. (Photo: Bao Lab, Stanford)

The heart of the technique is a two-ply plastic construct: the top layer creates a sensing mechanism and the bottom layer acts as the circuit to transport electrical signals and translate them into biochemical stimuli compatible with nerve cells. The top layer in the new work featured a sensor that can detect pressure over the same range as human skin, from a light finger tap to a firm handshake.

Five years ago, Bao’s team members first described how to use plastics and rubbers as pressure sensors by measuring the natural springiness of their molecular structures. They then increased this natural pressure sensitivity by indenting a waffle pattern into the thin plastic, which further compresses the plastic’s molecular springs.

To exploit this pressure-sensing capability electronically, the team scattered billions of carbon nanotubes through the waffled plastic. Putting pressure on the plastic squeezes the nanotubes closer together and enables them to conduct electricity.

This allowed the plastic sensor to mimic human skin, which transmits pressure information to the brain as short pulses of electricity, similar to Morse code. Increasing pressure on the waffled nanotubes squeezes them even closer together, allowing more electricity to flow through the sensor, and those varied impulses are sent as short pulses to the sensing mechanism. Remove pressure, and the flow of pulses relaxes, indicating light touch. Remove all pressure and the pulses cease entirely.

The team then hooked this pressure-sensing mechanism to the second ply of their artificial skin, a flexible electronic circuit that could carry pulses of electricity to nerve cells.

Importing the Signal

Bao’s team has been developing flexible electronics that can bend without breaking. For this project, team members worked with researchers from PARC, a Xerox company, which has a technology that uses an inkjet printer to deposit flexible circuits onto plastic. Covering a large surface is important to making artificial skin practical, and the PARC collaboration offered that prospect.

Finally the team had to prove that the electronic signal could be recognized by a biological neuron. It did this by adapting a technique developed by Karl Deisseroth, a fellow professor of bioengineering at Stanford who pioneered a field that combines genetics and optics, called optogenetics. Researchers bioengineer cells to make them sensitive to specific frequencies of light, then use light pulses to switch cells, or the processes being carried on inside them, on and off.

For this experiment the team members engineered a line of neurons to simulate a portion of the human nervous system. They translated the electronic pressure signals from the artificial skin into light pulses, which activated the neurons, proving that the artificial skin could generate a sensory output compatible with nerve cells.

Optogenetics was only used as an experimental proof of concept, Bao said, and other methods of stimulating nerves are likely to be used in real prosthetic devices. Bao’s team has already worked with Bianxiao Cui, an associate professor of chemistry at Stanford, to show that direct stimulation of neurons with electrical pulses is possible.

Bao’s team envisions developing different sensors to replicate, for instance, the ability to distinguish corduroy versus silk, or a cold glass of water from a hot cup of coffee. This will take time. There are six types of biological sensing mechanisms in the human hand, and the experiment described in Science reports success in just one of them.

But the current two-ply approach means the team can add sensations as it develops new mechanisms. And the inkjet printing fabrication process suggests how a network of sensors could be deposited over a flexible layer and folded over a prosthetic hand.

“We have a lot of work to take this from experimental to practical applications,” Bao said. “But after spending many years in this work, I now see a clear path where we can take our artificial skin.”

The tiny transistor is the heart of the electronics revolution, and Penn State materials scientists have just discovered a way to give the workhorse transistor a big boost, using a new technique to incorporate vanadium oxide, one of a family of materials called functional oxides, into the device.

The researchers knew that vanadium dioxide, which is just a specific combination of the elements vanadium and oxygen, had an unusual property called the metal-to-insulator transition. In the metal state, electrons move freely, while in the insulator state, electrons cannot flow. This on/off transition, inherent to vanadium dioxide, is also the basis of computer logic and memory.

The researchers had the idea that if they could add vanadium oxide close to the transistor it could boost the transistor’s performance. Likewise, by adding it to the memory cell, it could improve the stability and energy efficiency to read, write and maintain the information state. The major challenge they faced was that vanadium dioxide of sufficiently high quality had never been grown in a thin film form on the scale required to be of use to industry, the so-called wafer scale. Although vanadium dioxide, the targeted compound, looks simple, it is very difficult to synthesize. In order to create a sharp metal-to-insulator transition, the ratio of vanadium to oxygen needs to be precisely controlled. When the ratio is exactly right, the material will show a more than four-order-of-magnitude change in resistance, enough for a sufficiently strong on/off response.

In a paper in the online journal Nature Communications, the Penn State team reports for the first time the growth of thin films of vanadium dioxide on 3-inch sapphire wafers with a perfect 1:2 ratio of vanadium to oxygen across the entire wafer. The material can be used to make hybrid field effect transistors, called hyper-FETs, which could lead to more energy efficient transistors. In a paper published earlier this year, also in Nature Communications, the research group led by Prof. Suman Datta at Penn State showed that the addition of vanadium dioxide provided steep and reversible switching at room temperature, reducing the effects of self-heating and lowering the energy requirements of the transistor.

The implementation of vanadium dioxide can also benefit existing memory technologies, a quest that Penn State researchers are actively pursuing.

mCube, provider of MEMS motion sensors, today announced the sampling of its new MC3635 3-axis accelerometer featuring the industry’s lowest power consumption and a microscopic 1.6×1.6 mm Land Grid Array (LGA) package. The MC3635 will enable developers to design a complete 3-axis inertial solution, with only a single resistor, in less than 1/10 of a square centimeter of space on a printed circuit board. These advancements will enable a new generation of wearable devices and Internet of Moving Things (IoMT) that require significantly extended battery life and very small form factors.

As the newest member of mCube’s MC3600 family of ultra-low power, high-performance 3-axis accelerometers, the MC3635 is built upon the company’s award-winning 3D monolithic single-chip MEMS technology platform, which is widely adopted in mobile handsets with over 100 million units shipped. With the mCube approach, the MEMS sensors are fabricated directly on top of IC electronics in a standard CMOS fabrication facility. Advantages of this monolithic approach include smaller size, higher performance, lower cost, and the ability to integrate multiple sensors onto a single chip.

“The MC3635 delivers on the miniaturization and extended battery life needed to enable the next generation of fashionable wearable products,” said Ben Lee, president and CEO, mCube. “As IoT devices continue to be widely adopted around the world, mCube will continue to deliver new sensing innovations that help extend battery life to the point where the batteries last the lifetime of the products. mCube has taken the next step in delivering the best accelerometer solution to IoT developers in terms of size and power savings.”

About the MC3635 Accelerometer

The new MC3635 accelerometer consumes less than 0.9uA of current at 25Hz Output Data Rate (ODR), which is less than half the power consumption of competing accelerometers. In order to further reduce system power consumption, it offers an ultra-low power wake mode that consumes 0.3uA at 1Hz ODR and sniff mode that consumes only 0.4uA at 6Hz ODR. These modes are ideal for wearables during periods of rest or inactivity. In addition to these ultra-low power modes, the MC3635 has been optimized by increasing its Serial Peripheral Interface (SPI) bus speed and reducing the number of transactions per SPI transfer, both of which further extends the battery life of systems.

Samples of the world’s smallest 1.6×1.6mm LGA accelerometers are available to selected lead customers now. General sampling is scheduled for December 2015 with volume production scheduled for the first quarter of 2016.

Internet of Moving Things

By 2020, analysts predict more than 50 billion devices will be connected to the Internet (TechLucia 5/15/2014) and a large percentage of those devices will be in motion. From smartphones and tablets to smart clothing and wearables, mCube is enabling a new era called the “Internet of Moving Things”, where the movement and context of everyday objects and devices can be measured, monitored and analyzed, generating valuable data and insights that will transform consumer experiences.

Peidong Yang is an inorganic chemist transforming the field of semiconductor nanowires and nanowire photonics and enabling wide-ranging practical applications. Nanowires are very small wires at the nano scale–so small that they behave differently, with quantum effects. Yang has led major breakthroughs in nanowire photonics over the last decade, from the initial development of nanowire lasers to the characterization of optical routing in nanowire assemblies and nanowire solar cells.

In addition to basic research, Yang has worked toward transitioning nanowire technology into real-world applications. Technology based on his findings is now being demonstrated in commercial devices for the conversion of waste heat into electricity, in chemical sensors, and in optical switches. Yang’s current research also focuses on artificial photosynthesis. Photosynthesis is the process by which plants gather sunlight and carbon dioxide from the air, combine them with water, and store energy in chemical compounds; previous attempts to replicate it as a means for converting solar energy into fuel have not been efficient enough for commercial use.

Yang and his collaborators have created a synthetic “leaf” that is a hybrid system of semiconducting nanowires and bacteria. The nanowires gather sunlight, and the bacteria trigger the use of carbon dioxide and water to complete the photosynthetic process and produce a targeted carbon-based chemical such as butanol. The team’s recent breakthrough in synthesizing carbon dioxide into methane, the primary component of natural gas, exhibits the potential to convert solar energy with an efficiency that makes it viable for commercial use. Yang’s advances in the science of nanomaterials are opening new horizons for tackling the global challenge of clean, renewable energy sources.

Peidong Yang received a B.A. (1993) from the University of Science and Technology in China and a Ph.D. (1997) from Harvard University. He was a postdoctoral fellow (1997-1999) at the University of California at Santa Barbara before joining the faculty of the University of California at Berkeley, where he is currently the S. K. and Angela Chan Distinguished Professor of Energy and Professor of Chemistry. His scientific papers have appeared in such journals as Science, Nature, Proceedings of the National Academy of Sciences, and Journal of the American Chemical Society, among others.

ams AG, a provider of high performance sensors and analog ICs, today announced the launch of the AS7000, the first member of a new family of health/fitness solutions aimed at wearable devices. The AS7000 solution incorporates a highly integrated optical sensor module accompanied by software to provide industry-leading, highly accurate optical heart rate measurements (HRM) and heart rate variation (HRV) readings, backed by opto-mechanical design-in support from ams.

Housed in a compact 6.1mm x 4.1mm x 1.0mm package, the AS7000 is the industry’s first complete integrated health and fitness solution wearables intended to be worn constantly, at rest and when exercising. The introduction of the module raises the prospect of fitness bands as well as sports and smart watches allowing for accelerated design cycles and replacing the cumbersome, uncomfortable electro-cardiogram (ECG) chest strap in lifestyle, fitness, and health monitoring applications.

The ams solution contains the AS7000 module including the LEDs, photo-sensor, analog front end (AFE) and controller, as well as application software required to implement an accurate optical HRM/HRV fitness band product. In addition to HRM/HRV, the module also enables skin temperature and skin resistivity measurements by providing interfaces to external sensors.

Drawing on its expertise in optical sensing in mobile devices, ams provides OEMs with electrical, mechanical, and optical design guidelines to enable them to quickly realize a successful implementation. These guidelines address critical opto-mechanical challenges such as the design and material of the wrist strap and housing, and specific optical design considerations such as the air gap and glass thickness.

The operation of the AS7000 is based on photoplethysmography (PPG), an HRM method which measures the pulse rate by sampling light modulated by the blood vessels, which expand and contract as blood pulses through them. Unlike existing optical AFEs, which produce raw PPG readings, the AS7000 integrates a digital processor which implements algorithms developed by ams. These convert the PPG readings into digital HRM and HRV values.

When the AS7000 is paired with an external accelerometer, these algorithms also filter out motion artifacts attributable to the beating of the heart which interfere with PPG readings. Combined with the low noise and high sensitivity of the AS7000’s analog circuitry, this means that the module can maintain high accuracy whether the user is resting or exercising.

The AS7000’s low-power design is particularly well suited to applications in fitness bands, smart watches, sports watches, and devices in which board space is limited and in which users look for extended, multi-day intervals between battery recharges.

“Unique ams innovations which reduce noise, compensate for motion artifacts and conserve energy have resulted in a breakthrough for the health-monitoring and fitness-monitoring markets.The AS7000 is ideally suited to customers seeking a total solution that enables a quick time to market when adding health and fitness features to their wearables,” said Ronald Tingl, Biosensors Senior Marketing Manager for the Advanced Optical Solutions Division.

Today’s device manufacturers must piece together disparate, component-level software to create sensor-based wearable devices–often at the expense of accuracy and power consumption. Manufacturers of wearable devices are looking for cost-effective, turnkey solutions that function as a system to provide faster time to market, increased functionality, superior performance, and supply-chain flexibility. In response, Hillcrest Labs today unveiled its MotionEngine (TM) Wear software with always-on, sensor-enabled features optimized for the latest generation of wearable devices.

According to industry research firm IDC, the worldwide wearables market will reach a total of 76.1 million units in 2015, up 163.6% from 2014, and 173.4 million units by 2019, resulting in a five-year compound annual growth rate (CAGR) of 22.9%. Hillcrest’s MotionEngine Wear offers device makers the ability to quickly create differentiated wearable products across the health, fitness, and lifestyle segments of this growing market. MotionEngine Wear is designed for smartwatches, activity and fitness bands, health and sleep monitors, and smart clothing. The small software footprint and low power profile make it a match for devices targeted to the mass market, active or sports segment, commercial and industrial markets, or for fashion accessories.

“Sensors play a key role in wearable devices but how these sensors are used to deliver a compelling and convenient user experience is even more critical to the success of a wearable product today,” said Chad Lucien, Senior Vice President of Sales and Marketing at Hillcrest Labs. “We are proud to offer our MotionEngine Wear software to manage and enhance the performance of sensors found in wearable devices–enabling high performance, low power motion-based applications, and providing the foundation for new user experiences.”

MotionEngine Wear provides high quality context awareness; tracks users’ daily activities such as walking, running, and sleeping; and simplifies the user experience with intuitive gesture controls. Unique power reduction algorithms provide always-on sensing without compromising the accuracy, reliability, or functionality of a wearable device. MotionEngine Wear is compatible with today’s widely used system architectures, including ARM Cortex-M, Cadence Tensilica Fusion DSP, and Synopsys ARC EM. It is OS independent, so it can be deployed when using platforms with Android, Android Wear, Tizen, WebOS, and RTOS, or others. Furthermore, it supports sensors from the leading suppliers to ensure lower costs, flexible implementations, and faster time to market.

Lucien continued: “With MotionEngine Wear, manufacturers are not locked into any one component supplier or system architecture. MotionEngine Wear therefore provides manufacturers with a highly flexible solution that enables faster time to market, product line diversity and lower costs.”

“Wearable devices are rapidly becoming more sophisticated, moving beyond simple health and fitness tracking devices to support a myriad of advanced features, from sleep monitoring to gesture recognition,” said Ramon Llamas, Research Manager with IDC’s Wearables Program. “For the next generation of wearable devices, manufacturers need simple, cost-effective solutions to meet consumers’ expectations for a consistent and accurate user experience. Solutions like Hillcrest’s MotionEngine Wear, that are compatible with a variety of low power MCUs and support sensors from leading suppliers, offer manufacturers maximum flexibility to innovate as new technologies are introduced in the wearables market.

There are many uses and applications for wearable devices, including Health and Fitness, Lifestyle, Augmented and Virtual Reality, and Motion Capture. These categories of devices each have distinct feature requirements but share in the need to maintain low costs, minimize power consumption, and extract maximum performance out of the available sensors. Hillcrest has developed a portfolio of products to address these needs. MotionEngine Wear offers the foundation for a variety of wearable device applications, including:

  • Accurate Activity Tracking: Algorithms specifically tuned for wearable devices can automatically track a variety of users’ daily physical activities, such as walking and running steps taken and stairs climbed, to provide an assessment of exercise program effectiveness.
  • Advanced Sleep Monitoring: The proprietary sleep-state algorithm uses a low power method to capture motion data related to users’ sleep quality and present results.
  • Context Awareness: Automatic detection of when the user is in a vehicle, such as a car, or if the user is riding a bicycle to allow the user interface to adapt to different modes of use.
  • Precise Compass Heading and Orientation: Hillcrest’s calibration and sensor fusion algorithms ensure precise, drift- and jitter-free device orientation and compass heading to provide the foundation for navigation applications.
  • Intuitive Gesture Controls: Users can perform motion gestures to interact naturally with devices, such as the “glance” gesture, which is used to detect when a user looks at the front-facing screen.

ULVAC, Inc. announced that the company has developed G-TRAN series multi ionization gauge ST2, a transducer-type ionization vacuum gauge with a long product life that maintains high measurement accuracy even under harsh conditions, and will start selling the product in October 2015.

A variety of gas molecules may exist in a vacuum space under certain conditions. Therefore, it is not uncommon that vacuum measurements are performed under conditions that are severe for a vacuum gauge. As a result, we often hear that users encounter problems regarding lifetime of vacuum gauges (a short product life due to contamination, problems in electrical discharge, an increase in sensor head replacement frequency, etc.) and measurement accuracy (variation in sensitivity, errors, etc.). Major reasons for these difficulties are the following:

  • Outgassing released during various vacuum processes
  • Outgassing released from test pieces (samples)
  • Residue of cutting oil or cleaning fluid used during processing vacuum
    chambers
  • Outgassing released from wiring materials, moving mechanisms, motors,
    etc. inside vacuum chambers

These elements contaminate sensor heads causing problems such as a reduction in the length of life of filaments, a decrease in sensitivity, and failures in emission current and electric discharge. To avoid such problems, it is necessary to replace sensor heads periodically. More frequent replacement of sensor heads leads to:

  • An increase in running costs for sensor heads, which are consumables
  • Losses caused by suspension of production lines (systems) during
    replacement of sensor heads
  • An increase in time and effort required to replace them

To resolve these difficulties, ULVAC has developed an ionization vacuum gauge with a structure designed to lighten the load on ion collectors by reducing the ion current value per area and to make electric potential in ionized space uniform. This gauge enables the performance of accurate measurements for a longer period of time (more than 30 times longer compared to our conventional models) even under harsh conditions for ionization vacuum gauges. We believe our new product will greatly contribute to reducing running costs and downtime of your various vacuum systems and improving yield ratio.

Features of the new ionization vacuum gauge G-TRANS series ST2 are:

  • ULVAC’s unique electrode structure: Stable sensitivity, high precision, long product life (more than 30 times longer compared to our conventional models) and low running costs.
  • Compact metal tube: Smaller install space and lower risk of sensor head damage.
  • Multi-ion gauge-type sensor unit: Connecting the Pirani vacuum gauge unit and the atmospheric pressure sensor enables a reduction in control signals.