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The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter. Sales for the month of September 2017 were $36.0 billion, an increase of 22.2 percent over the September 2016 total of $29.4 billion and 2.8 percent more than the previous month’s total of $35.0 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

highest ever sales

“Global semiconductor sales increased sharply year-to-year in September, and year-to-date sales through September are more than 20 percent higher than at the same point last year,” said John Neuffer, SIA president and CEO. “The industry posted its highest-ever quarterly sales in Q3, and the global market is poised to reach its highest-ever annual revenue in 2017.”

Regionally, year-to-year and month-to-month sales increased in September across all markets: the Americas (40.7 percent year-to-year/5.9 percent month-to-month), China (19.9 percent/2.5 percent), Europe (19.0 percent/1.8 percent), Asia Pacific/All Other (16.8 percent/1.9 percent), and Japan (11.9 percent/0.5 percent).

“The Americas market continued to stand out, notching its largest year-to-year sales increase in more than seven years,” Neuffer said. “Standouts among semiconductor product categories included memory products like DRAM and NAND flash, both of which posted major year-to-year growth in September, as well as Logic products, which enjoyed double-digit growth year-to-year.”

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 – 2022.

Under this dynamic context, Yole Group of Companies including Yole and its sister company System Plus Consulting proposes today a comprehensive review of the technology evolution, market trends and competitive landscape, with two reports, MEMS Packaging and MEMS Packaging: Reverse Technology Review.

The MEMS packaging report offers a deep understanding of the packaging over the years, detailed roadmap for future solutions, related market metrics and detailed analysis of the supply chain. In parallel, the MEMS Packaging: Reverse Technology Review details a comparative technology review and discloses insights into the packaging structure and technology of 80+ consumer and 20+ automotive MEMS devices developed by leading players: Robert Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…

The MEMS packaging market is becoming more and more attractive, offering important business opportunities for advanced packaging companies. What are the market needs? What are the conditions to penetrate this market? Are the technologies “ready to use”? Through its analyses, Yole Group believes that companies which will be successful, are the ones that will adapt their technologies portfolio to match with the market evolution and ensure their market shares. Yole and System Plus Consulting’s analysts put a spotlight today on MEMS packaging.

MEMS devices are characterized by a wide range of different designs and manufacturing technologies, with no standardized processes. As a consequence, many technical challenges are in place and create a strong competition between packaging companies.

“Players have to take into account specifies of each component as well as many application constraints, from the need to low cost packaging for consumer applications to the ability to withstand high temperature and harsh environment for automotive and aeronautics packaging,” explained Dr. Eric Mounier, Senior Technology & Market Analylst at Yole.

MEMS application scope is broad, very fragmented and diversified. Therefore, under its annual report, Status of the MEMS Industry, Yole’s MEMS & Sensors team analyzed more than 200+ applications. Thus, MEMS packaging must always cope with different end-application requirements. It includes for example, protection in different media, hermeticity, interconnection type, and thermal management. This context creates many issues within the packaging industry, which faces different package configurations (open/ closed package).

Under System Plus Consulting’s report, MEMS Packaging: Reverse Technology Review, the company analyzed more than 100 MEMS components developed by the major manufacturers. This review is a relevant comparison between the main existing packaging solutions. It includes the encapsulation processes, the preferred interconnection methods as well as the latest innovations. System Plus Consulting also evaluated the components in term of integration and functionalities.

“No tremendous changes in packaging platforms are expected,” commented Audrey Lahrach, in charge of costing analyses at System Plus Consulting.“But we rather see a change in the complexity of existing platforms to respond to the growing needs of sensor fusions.” Therefore, combining inertial and pressure sensors is now a reality. For example TDK/InvenSense released this month a high-performance “7-Axis” motion tracking device targeting drone applications and based on an exclusive assembly step stacking the 3-axis gyroscope, the 3-axis accelerometer and a barometric pressure sensor (1).

Driven by the complexity associated with the move to 5G and therefore the increasing demand for RF filters in 4G/5G, the largest MEMS growth will be for RF MEMS, especially BAW filters (2).
“The real opportunity of MEMS packaging is carried by RF MEMS devices as the number of units could be multiplied by five by 2022,” confirmed Dr. Mounier from Yole. Optical MEMS including micro mirrors and micro bolometers are second with a 28.5% CAGR, driven by consumer, automotive, and security applications.

Acoustic and ultrasonic sensors including microphones are third. Demand for audio processing is particularly strong, with high unit growth for MEMS microphones targeted at increasingly sophisticated applications that use the microphone to continuously sense what is happening around it.

But why is the MEMS packaging industry becoming so attractive? Yole identified several reasons:
“OSATs already have very low package margins due to fierce competition” asserted Emilie Jolivet, Technology & Market Analyst at Yole. And she added: “And it will be difficult for such companies to lower the cost further.”

The second factor is related to the importance of testing steps. Because every MEMS is different, testing strategies defined by MEMS devices manufacturers are usually dedicated to one device type and account for a significant fraction of the final cost.

The third reason is focused on the packaging’s material cost that is playing a key role within the attractiveness of the MEMS packaging business.

At the end, the strong CAGR of certain devices such as RF MEMS devices, also directly impacts the MEMS packaging industry with numerous opportunities to ensure larger volumes and better margins.

More than a dozen product categories in optoelectronics, sensors and actuators, and discretes semiconductors (O-S-D) are on track to set record-high annual sales this year, according to a new update of IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discrete Semiconductors.  Driven by the expansion of the Internet of Things (IoT), increasing levels of intelligent embedded controls, and some inventory replenishment in commodity discretes, the diverse O-S-D marketplace is having a banner year with combined sales across all three semiconductor segments expected to grow 10.5% in 2017 to a record-high $75.0 billion, says the O-S-D Report update.

In 2017, above average sales growth rates are being achieved in all but one major O-S-D product category—lamp devices, which are now expected to be flat in 2017 because of continued price erosion in light-emitting diodes (LEDs) for solid-state lighting applications.  Figure 1 compares annual growth rates in five major O-S-D product categories, based on the updated 2017 sales projection.

Figure 1

Figure 1

For the first time since 2014, all three O-S-D market segments are on pace to see sales growth in 2017. Moreover, 2017 is expected to be the first year since 2011 when all three O-S-D market segments set record-high annual sales volumes, according to IC Insights’ update.

The 2017 double-digit percent increase will be the highest growth rate for combined O-S-D sales since the strong 2010 recovery from the 2009 semiconductor downturn that coincided with the 2008-2009 financial crisis and global economic recession.  Total O-S-D revenues are now forecast to reach a ninth consecutive annual record high level of $80.5 billion in 2018, which will be a 7.4% increase from 2017 sales, says the O-S-D Report update.

After a rare decline of 3.6% in 2016, optoelectronics is recovering this year with sales now projected to grow 8.1% in 2017 to an all-time high of $36.7 billion, thanks to strong double-digit sales increases in CMOS image sensors (+22%), light sensors (+19%), optical-network laser transmitters (+15%), and infrared devices (+14%).

Meanwhile, record-high revenues for sensors and actuators are being fueled by the expansion of IoT and new automated controls in a wide range of systems—including more self-driving features in cars. Sensors/actuator sales are now expected to climb 17.5% in 2017 to $13.9 billion, marking the strongest growth year for this market segment since 2010.  Sales of sensors and actuators made with microelectromechanical systems (MEMS) technology are forecast to rise by 18.5% in 2017 to a record-high $11.6 billion.  The O-S-D Report update shows all-time high sales being reached in 2017 with strong double-digit growth in actuators (+20%), pressure sensor, including MEMS microphone chips (+18%), and acceleration/yaw sensors (+17%).

Even the commodity-filled discretes market is thriving in 2017 with worldwide sales projected to rise 10.3% to $24.1 billion, which will finally surpass the current peak of $23.4 billion set in 2011.  Sales of power transistors, which account for more than half of the discretes market segment, are forecast to grow 9.0% in 2017 to a record-high $14.0 billion, according to the new O-S-D Report update.

The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit (Nasdaq: INFO).

In a new free ebook entitled “The Internet of Things: a movement, not a market,” IHS Markit details how the IoT is revolutionizing the competitive landscape by transforming everyday business practices and opening new windows of opportunity.

According to the ebook, global data transmissions are expected to increase from 20 to 25 percent annually to 50 percent per year, on average, in the next 15 years.

“The emerging IoT movement is impacting virtually all stages of industry and nearly all market areas — from raw materials to production to distribution and even the consumption of final goods,” said Jenalea Howell, research director for IoT connectivity and smart cities at IHS Markit. “This represents a constantly evolving movement of profound change in how humans interact with machines, information and even each other.”

IHS Markit has identified four foundational, interconnected pillars at the core of the IoT movement: connect, collect, compute and create. The entire IoT is built upon these four innovational pillars:

  • New connections of devices and information
  • Enhanced collection of data that grows from the connections of devices and information
  • Advanced computation that transforms collected data into new possibilities
  • Unique creation of new interactions, business models and solutions.

“While internet-connected devices hold tremendous potential, many companies are having difficulty identifying a consistent IoT strategy,” Howell said. “The four Cs of IoT — connect, collect, compute, create — offer a pathway to navigate and take advantage of the changes and opportunities brought about by the IoT revolution.”

IC Insights has raised its IC market growth rate forecast for 2017 to 22%, up six percentage points from the 16% increase shown in its Mid-Year Update.  The IC unit volume shipment growth rate forecast has also been increased from 11% depicted in the Mid-Year Update to 14% currently.  As shown below, a large portion of the market forecast revision is due to the surging DRAM and NAND flash markets.

In addition to increasing the IC market forecast for this year, IC Insights has also increased its forecast for the O-S-D (optoelectronics, sensor/actuator, and discretes) market.  In total, the semiconductor industry is now expected to register a 20% increase this year, up five percentage points from the 15% growth rate forecast in the Mid-Year Update.

For 2017, IC Insights expects a whopping 77% increase in the DRAM ASP, which is forecast to propel the DRAM market to 74% growth this year, the largest growth rate since the 78% DRAM market increase in 1994.  After including a 44% expected surge in the NAND flash market in 2017, including a 38% increase in NAND flash ASP this year, the total memory market is forecast to jump by 58% in 2017 with another 11% increase forecast for 2018.

At $72.0 billion, the DRAM market is forecast to be by far the largest single product category in the semiconductor industry in 2017, exceeding the expected NAND flash market ($49.8 billion) by $22.2 billion this year. As shown in Figure 1, the DRAM and NAND flash segments are forecast to have a strong positive impact of 13 percentage points on total IC market growth this year. Excluding these memory segments, the IC industry is forecast to grow by 9%, less than half of the current total IC market growth rate forecast of 22% when including these memory markets.

Figure 1

Figure 1

IC Insights is set to release its October Update to The McClean Report.  The 30-page Update includes a detailed analysis of IC Insights’ revised forecasts for the IC, O-S-D, and total semiconductor markets through 2021.

The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel, may go down as one of the most memorable editions for the sheer variety and depth of its talks, sessions, courses and events.

Among the most-anticipated talks are presentations by Intel and Globalfoundries, which will each detail their forthcoming competing FinFET transistor technology platforms in a session on Wednesday morning. FinFET transistors are a major driver of the continuing progress of the electronics industry, and these platforms are as important for their commercial potential as they are for their technical innovations.*

Each year at the IEDM, the world’s best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

“Those who attend IEDM 2017 will find much that is familiar, beginning with a technical program describing breakthroughs in areas ranging from mainstream CMOS technology to innovative nanoelectronics to medical devices. The Sunday Short Courses are also a perennial favorite because they are not only comprehensive but are also taught by accomplished world experts,” said Dr. Barbara De Salvo, Scientific Director at Leti. “But we have added some new features this year. One is a fourth Plenary session, on Wednesday morning, featuring Nobel winner Hiroshi Amano. Another is a revamped Tuesday evening panel. Not only will it focus on a topic of great interest to many people, it is designed to be more open and less formal.”

Other features of the IEDM 2017 include:

  • Focus Sessions on the following topics: 3D Integration and Packaging; Modeling Challenges for Neuromorphic Computing; Nanosensors for Disease Diagnostics; and Silicon Photonics: Current Status and Perspectives.
  • A vendor exhibition will be held, based on the success of last year’s event at the IEDM.
  • The IEEE Magnetics Society will again host a joint poster session on MRAM (magnetic RAM) in the exhibit area. New for this year, though, is that the Society will also hold its annual MRAM Global Innovation Forum on Thursday, Dec. 7 at the same hotel, enabling IEDM attendees to participate. (Refer to the IEEE Magnetics Society website.) The forum consists of invited talks by leading experts and a panel discussion.

Here are details of some of the events that will take place at this year’s IEDM:

90-Minute Tutorials – Saturday, Dec. 2
These tutorials on emerging technologies will be presented by leading technical experts in each area, with the goal of bridging the gap between textbook-level knowledge and cutting-edge current research.

  • The Evolution of Logic Transistors Toward Low Power and High Performance IoT Applications, Dr. Dae Won Ha, Samsung Electronics
  • Negative Capacitance Transistors, Prof. Sayeef Salahuddin, UC Berkeley
  • Fundamental, Thermal, and Energy Limits of PCM and ReRAM, Prof. Eric Pop, Stanford University
  • Hardware Opportunities in Cognitive Computing: Near- and Far-Term, Dr. Geoffrey Burr, Principal Research Staff Member, IBM Research-Almaden
  • 2.5D Interposers and High-Density Fanout Packaging as Enablers for Future Systems Integration, Dr. Venkatesh Sundaram, Associate Director, Georgia Tech 3D Systems Packaging Research Center
  • Silicon Photonics for Next-Generation Optical Interconnects, Dr. Joris Van Campenhout, Program Director Optical I/O, Imec

Short Courses – Sunday, Dec. 3
The day-long Short Courses provide the opportunity to learn about important developments in key areas, and they enable attendees to network with the industry’s leading technologists.

Boosting Performance, Ensuring Reliability, Managing Variability in Sub-5nm CMOS, organized by Sandy Liao of Intel, will feature the following sections:

  • Transistor Performance Elements for 5nm Node and Beyond, Gen Tsutsui, IBM
  • Multi-Vt Engineering and Gate Performance Control for Advanced FinFET Architecture, Steve CH Hung, Applied Materials
  • Sub-5nm Interconnect Trends and Opportunities, Zsolt Tokei, Imec
  • Transistor Reliability: Physics, Current Status, and Future Considerations, Stephen M. Ramey, Intel
  • Back End Reliability Scaling Challenges, Variation Management, and Performance Boosters for sub-5nm CMOS,Cathyrn Christiansen, Globalfoundries
  • Design-Technology Co-Optimization for Beyond 5nm Node, Andy Wei, TechInsights

Merged Memory-Logic Technologies and Their Applications, organized by Kevin Zhang of TSMC, will feature the following sections:

  • Embedded Non Volatile Memory for Automotive Applications, Alfonso Maurelli, STMicroelectronics
  • 3D ReRAM: Crosspoint Memory Technologies, Nirmal Ramaswamy, Micron
  • Ferroelectric Memory in CMOS Processes, Thomas Mikolajick, Namlab
  • Embedded Memories Technology Scaling & STT-MRAM for IoT & Automotive, Danny P. Shum, Globalfoundries
  • Embedded Memories for Energy-Efficient Computing, Jonathan Chang, TSMC
  • Abundant-Data Computing: The N3XT 1,000X, Subhasish Mitra, Stanford University

Plenary Presentations – Monday, Dec. 4

  • Driving the Future of High-Performance Computing, Lisa Su, President & CEO, AMD
  • Energy-Efficient Computing and Sensing: From Silicon to the Cloud, Adrian Ionescu, Professor, EPFL
  • System Scaling Innovation for Intelligent Ubiquitous Computing, Jack Sun, VP of R&D, TSMC

Plenary Presentation – Wednesday, Dec. 6

  • Development of a Sustainable Smart Society by Transformative Electronics, Hiroshi Amano, Professor, Nagoya University. Dr. Amano received the 2014 Nobel Prize in Physics along with Isamu Akasaki and Shuji Nakamura for the invention of efficient blue LEDs, which sparked a revolution in innovative, energy-saving lighting. His talk will be preceded by the Focus Session on silicon photonics.

Evening Panel Session – Tuesday evening, Dec. 5

  • Where will the Next Intel be Headquartered?  Moderator: Prof. Philip Wong, Stanford

Entrepreneurs Lunch
Jointly sponsored by IEDM and IEEE EDS Women in Engineering, this year’s Entrepreneurs Lunch will feature Courtney Gras, Executive Director for Launch League, a local nonprofit focused on developing a strong startup ecosystem in Ohio. The moderator will be Prof. Leda Lunardi from North Carolina State University. Gras is an engineer by training and an entrepreneur by nature. After leaving her job as a NASA power systems engineer to work for on own startup company, she discovered a passion for building startup communities and helping technology-focused companies meet their goals. Named to the Forbes ’30 Under 30′ list in 2016, among many other recognitions and awards, Gras enjoys sharing her stories of founding a cleantech company with young entrepreneurs. She speaks on entrepreneurship, women in technology and clean energy at venues such as TEDx Budapest, the Pioneers Festival, and the IEEE WIE International Women’s Leadership Conference.

 

China IC industry outlook


October 17, 2017

SEMI, the global industry association and provider of independent electronics market research, today announced its new China IC Industry Outlook Report, a comprehensive report for the electronics manufacturing supply chain. With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

China is the largest consumer of semiconductors in the world, but it currently relies mainly on semiconductor imports to drive its growth. Policies and investment funds are now in place to further advance the progress of indigenous suppliers in China throughout the entire semiconductor supply chain. This shift in policy and related initiatives have created widespread interest in the challenges and opportunities in China.

With at least 15 new fab projects underway or announced in China since 2017, spending on semiconductor fab equipment is forecast to surge to more than $12 billion, annually, by 2018. As a result, China is projected to be the top spending region in fab equipment by 2019, and is likely to approach record all-time levels for annual spending for a single region.

Figure 1

Figure 1

This report covers the full spectrum of the China IC industry within the context of the global semiconductor industry. With more than 60 charts, data tables, and industry maps from SEMI sources, the report reveals the history and the latest industry developments in China across vast geographical areas ranging from coastline cities to the less developed though emerging mid-western regions.

The China IC industry ecosystem outlook covers central and local government policies, public and private funding, the industry value chain from design to manufacturing and equipment to materials suppliers. Key players in each industry sector are highlighted and discussed, along with insights into China domestic companies with respect to their international peers, and potential supply implications from local equipment and material suppliers. The report specifically details semiconductor fab investment in China, as well as the supply chain for domestic equipment and material suppliers.

Figure 2

Figure 2

IDTechEx predict that 2017 will be the first billion dollar year for wearable sensors. These critical components are central to the core value proposition in many wearable devices. The “Wearable Sensors 2018-2028: Technologies, Markets & Players” report includes IDTechEx’slatest research and forecasts on this topic, collating over 3 years of work to provide a thorough characterisation and outlook for each type of sensor used in wearable products today.

Despite sales volumes from wearable products continuing to grow, creeping commoditisation squeezes margins, with hardware sales being particularly vulnerable. This has led to some consolidation in the industry, with several prominent failures and exits, and challenging time even amongst market leaders in each sector. As hardware margins are squeezed, business models are changing to increasingly focus on the valuable data generated once a device is worn. Sensors are responsible for the collection and quality of that data, so understanding the capabilities and limitations of different sensor platforms is critical to understanding the progress of the industry as a whole.

In the report, IDTechEx address 21 different types of wearable sensor across 9 different categories as follows: Inertial Measurement Units (IMUs), optical sensors, electrodes, force/pressure/stretch sensors, temperature sensors, microphones, GPS, chemical & gas sensors & others. Hundreds of examples from throughout the report cover a breadth of technology readiness, ranging from long-established industries to early proof-of-concepts. The report contains information about the activities of over 115 different companies, with primary content (including interviews, exhibition or site visits by the authors) to more than 80 different companies, large and small.

IDTechEx describe wearable sensors in three waves. The first wave includes sensors that have been incorporated in wearable for many years, often being originally developed for wearable products decades ago, and existing as mature industries today. A second wave of wearable sensors came following huge technology investment in smartphones. Many of the sensors from smartphones could be easily adapted for use in wearable products; they could be made-wearable. Finally, as wearable technology hype and investment peaked, many organisations identified many sensor types that could be developed specifically with wearable products in mind. These made-for-wearablesensors often remain in the commercial evaluation or relatively early commercial sales today, but some examples are already becoming significant success stories.

WearableSensors_Large

Click to enlarge.

Billions of wearable electronic products are already sold each year today. Many have already experienced significant hardware commoditisation, with tough competition driving prices down. Even as wearable devices become more advanced, introducing more sensors and better components to enhance value propositions, lessons of history tell us that hardware will always be prone to commoditisation. As this happens the role of sensors only becomes more important; with hardware prices being constantly squeezed, increasing proportions of the value that companies can capture from products will be from the data that the products can generate.

The key hardware component for capturing this data is the sensors, so understanding the development and prospects of sensors today is critical to predicting the potential for this entire industry in the future. “Wearable Sensors 2018-2028: Technologies, Markets & Players” is written to address the needs of any company or individual looking to gain a clearer, independent perspective on the outlook for various types of wearable sensor. The report answers detailed questions about technology, markets and industry trends, and supported by years of primary research investment collated and distilled within.

Advancements in spintronics


September 25, 2017

Applications now include nanoscale Spintronics sensors that further enhance the areal density of hard disk drives, through MRAMs that are seriously being considered to replace embedded flash, static random access memories (SRAM) and at a later stage dynamic random access memories (DRAM).

BY HIDEO OHNO, MARK STILES, and BERNARD DIENY, IEEE

Spintronics is the concept of using the spin degree of freedom to control electrical current to expand the capabilities of electronic devices. Over the last 10 years’ considerable progress has been made. This progress has led to technologies ranging from some that are already commercially valuable, through promising ones currently in development, to very speculative possibilities.

Today, the most commercially important class of devices consists of magnetic sensors, which play a major role in a wide variety of applications, a particularly prominent example of which is magnetic recording. Nonvolatile memories called magnetic random access memories (MRAMs) based on magnetic tunnel junctions (MTJs), are commercial products and may develop into additional high impact applications either as standalone memories to replace other random access memories or embedded in complementary metal–oxide–semiconductor (CMOS) logic.

Some technologies have appealing capabilities that may improve sensors and magnetic memories or develop into other devices. These technologies include three- terminal devices based on different aspects of spin-transfer torques, spin-torque nano-oscillators, devices controlled by electric fields rather than currents, and devices based on magnetic skyrmions. Even further in the future are Spintronics-based applications in energy harvesting, bioinspired computing, and quantum technologies.

But before we get into detail about where Spintronics is today, we need to cover the history of Spintronics.

The history of spintronics

Spintronics dates to the 1960s and was discovered by a group at IBM headed by Leo Esaki, a Japanese physicist who would later go on to win a share of the Nobel Prize I 1973 for discovering the phenomenon of electronic tunneling. Esaki and his team conducted a study which showed an antiferromagnetic barrier of EuSe sandwiched between metal electrodes exhibits a large magnetoresistance.

Subsequent advances of semiconductor thin film deposition techniques such as molecular beam epitaxy led to the development of semiconductor quantum structures, which prompted studies of magnetic multilayers. Ensuing studies of magnetic multilayers resulted in the discovery of giant magne- toresistance (GMR) in 1988. This effect was used to make magnetic sensors, which boosted the areal density of information stored on hard disk drives and led to the 2007 Nobel Prize in Physics awarded to Albert Fert and Peter Grunberg.

Since then rapid progress has continued to enhance both the role and the potential of Spintronics. So, let’s take a look at where we are now.

Where we are now

Applications now include nanoscale Spintronics sensors that further enhance the areal density of hard disk drives, through MRAMs that are seriously being considered to replace embedded flash, static random access memories (SRAM) and at a later stage dynamic random access memories (DRAM). Applica- tions also include devices that utilize spin current and the resulting torque to make oscillators and to transmit information without current.

Now let’s look at those applications and more in-depth.

Modern Hard Disk Drives: Two breeds of Spintronics sensors have replaced traditional anisotropic magnetoresistance (AMR) sensors. Those sensors include giant magnetoresistance (GMR) sensors (used in hard disk drives between 1998 and 2004) and tunnel magnetoresistance (TMR) sensors (used since 2004).

Those sensors are part of the technology development that enabled the increase of storage density of hard disk drives by several orders of magnitude, laying the foundation of today’s information age in the form of data centers installed by the cloud computing industry.

Magnetoresistive Random Access Memory (MRAM): MRAM and particularly spin-transfer- torque MRAM (STT-MRAM) is a nonvolatile memory with very high endurance and scalability. The current STT-MRAM technology uses an array of MTJs with an easy axis of magnetization oriented out of the plane of the layers. These MTJs utilize interface perpendicular anisotropy at the CoFeB–MgO interface, along with the large TMR of the system, for reading the state of magnetization. The spin-transfer torque exerted by a spin polarized current is used to change the magneti- zation direction, offering an efficient way of rewriting the memory. FIGURE 1 show the main families of MRAM that have evolved since 1995.

Screen Shot 2017-09-25 at 12.26.37 PM

 

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Three Terminal Magnetic Memory Devices: Recent physics developments raise the prospect of three- terminal spintronic memory devices. These devices have an advantage over the standard two-terminal devices used in memory applications such as MRAM in that separating the read and write functions poten- tially overcomes several future roadblocks in the devel- opment of MRAM. There are two writing schemes: one is based on spin currents generated by an electrical current running through a heavy metal adjacent to the free layer of the MTJ. The current causes a spin current both in the bulk of the heavy metal and at the interface; this spin current then exerts a torque, called the spin-orbit torque, on the magnetization. In this scheme, the write current does not pass through the MTJ, separating the write and read functions. The other scheme uses current-induced domain wall motion to move a domain wall in the free layer of the MTJ from one side of the fixed layer to the other. In this scheme, the current passes through the free layer, but not the tunnel barrier, again separating the read and write functions.

Standby-Power-Free Integrated Circuits Using MTJ-Based VLSI Computing: Spintronic-based nonvolatile embedded working memory used in conjunction with CMOS-based logic applications is a crucial first step toward standby-power-free logic circuits that are much needed for Internet of Things (IoT) applications. MRAM based logic-in-memory reduces the overhead of having memory and logic apart and gives both minimized interconnection delay and nonvolatility.

Security: These devices have shown great promise for logic and memory applications due to their energy efficiency, very high write endurance, and nonvolatility. Besides, these systems gather
many entropy sources which can be advantageously used for hardware security. The spatial and temporal randomness in the magnetic system associated with complex micromagnetic configurations, the nonlinearity of magnetization dynamics, cell-to-cell process variations, or thermally induced fluctuations of magnetization can be employed to realize novel hardware security primitives such as physical unclonable functions, encryption engines, and true random number generators.

Spin-Torque and Spin-Hall Nano-Oscillators: Spin-torque nano-oscillators (STNO) and spin-Hall effect nano-oscillators (SHNO) are in a class of miniaturized and ultra-broadband microwave signal generators that are based on magnetic resonances in single or coupled magnetic thin films. These oscil- lators are based on magnetic resonances in single or combined magnetic thin films where magnetic torques are used to both excite the resonances and subsequently tune them. The torques can be either spin-transfer torques due to spin-polarized currents (STNOs) or spin Hall torques due to pure spin currents (SHNOs). These devices are auto-oscillators and so do not require any active feedback circuitry with a positive gain for their operation. The auto-oscillatory state is strongly nonlinear, causing phase– amplitude coupling, which governs a wide range of properties, including frequency tunability, modulation, injection locking, mutual synchronization, but also causes significant phase noise. STNOs and SHNOs can, in principle, operate at any frequency supported by a magnetic mode, resulting in a potential frequency range of over six orders of magnitude, from below 100 MHz for magnetic vortex gyration modes to beyond 1 THz for exchange dominated modes. Since STNOs and SHNOs can also act as tunable detectors over this frequency range, there is significant potential for novel devices and applications.

Beyond the applications listed, the spin degree of freedom is also being used to convert heat to energy through the spin Seebeck effect, to manipulate quantum states in solids for information processing and communication, and to realize biologically inspired computing. These may lead to new develop- ments in information storage, computing, communication, energy harvesting, and highly sensitive sensors. Let’s take a look at these new developments.

Thermoelectric Generation Based on Spin Seebeck Effects: The study of combined heat and spin flow, called spin caloritronics, may be used to develop more efficient thermoelectric conversion. Much of the focus of research in spin caloritronics has been the longitudinal spin Seebeck effect, which refers to spin-current generation by temperature gradients across junctions between metallic layers and magnetic layers. The generated spin current in the metallic layer gets converted into a charge current by the inverse spin Hall effect, making a two-step conversion process from a thermal gradient perpen- dicular to the interface into a charge current in the plane of the interface. This process can be used for thermoelectric conversion. Device structures using the spin Seebeck effect differ significantly from those using conventional Seebeck effects due to the orthog- onality of the thermal gradient and resulting charge current, giving different strategies for applications of the two effects.

Electric-Field Control of Spin-Orbit Interaction for Low-Power Spintronics: Control of magnetic properties through electric fields rather than currents raises the possibility of low energy magnetization reversal, which is needed for low-power electronics and Spintronics. One specific way to accomplish this low energy switching is through electric-field control of electronic states leading to modification of the magnetic anisotropy. By applying a voltage to a device, it is possible to change the anisotropy such that the magnetization rotates into a new direction. While such demonstrations of switching alone are not sufficient to make a viable device, voltage controlled reversal is a promising pathway toward low-energy nonvolatile memory devices.

Control of Spin Defects in Wide-Bandgap Semiconductors for Quantum Technologies: The spins in deep level defects found in diamond (nitrogen- vacancy center) and in silicon carbide (divacancy) have a quantum nature that manifests itself even at room temperature. These can be used as extremely sensitive nanoscale temperature, magnetic-field, and electric-field sensors. In the future, microwave, photonic, electrical, and mechanical control of these spins may lead to quantum networks and quantum transducers.

Spintronic Nanodevices for Bioinspired Computing: Bioinspired computing devices promises low-power, high-performance computing but will likely depend on devices beyond CMOS. Low-power, high performance bioinspired hardware relies on ultrahigh- density networks built out of complex processing units interlinked by tunable connections (synapses). There are several ways in which spin-torque-driven MTJs, with their multiple, tunable functionalities and CMOS compatibility, are very well adapted for this purpose. Some groups have recently proposed a variety of bioin- spired architectures that include one or several types of spin-torque nanodevices.

Skyrmion-Electronics: An Overview and Outlook: The concept of skyrmions derives from high energy physics. In magnetic systems, skyrmions are magnetic textures that can be viewed as topological objects. Theory suggests that they have properties that might make them useful objects in which to store and manip- ulate information. Many of the ideas are similar to ideas that were developed decades ago for bubble memory or, more recently, racetrack memory. There are several possible advantages for skyrmion devices as compared to other related devices. They are potentially higher density and lower energy, although the arguments for these remain to be experimentally verified.

So, what does the future of spintronics have in store?

The future

Spintronics will continue to have increasing impact, but the future is somewhat uncertain. The importance of magnetic sensors is likely to remain important while the importance of the magnetic sensors in hard disk drives appears to depend on the economics of mass storage in the cloud.

MRAM seems likely to play an increasing role both as standalone memory and embedded in CMOS. The degree of adoption still depends on a few technical and many economic considerations. The acceleration, over the past few months, of announcements and demonstrations related to STT-MRAM produced by major microelectronics companies, seems to indicate that large volume production of STT-MRAM is getting quite close. If the adoption of this technology by microelectronics industry becomes a reality, the whole field will be strongly boosted.

In the future, Spintronics can play a critical role in areas such as IoT, ultralow-power electronics, high-performance computing (HPC). Besides, in the next 10 to 15 years, we are likely to see a much greater role played by alternative forms of computing. The role that Spintronics plays in those technologies is likely to be strongly influenced by the success of MRAM. If MRAM is successful, we will have developed the ability to manufacture it making it easier to import into other technologies.

Some of the recent technical developments that have significant virtues for applications will likely play a role in technology 10 to 15 years from now but many will not. Research on many of these ideas will continue and will spawn related areas. Material research is key along this road.

Innovative materials allowing efficient charge to spin and spin to charge current conversion, or good control of magnetic properties by voltage, or efficient injection/manipulation/detection of spins in semicon- ductors can play major roles. Along with this idea, the use of oxide materials in spintronic devices can become quite important. Oxides share crystal- linity with semiconductors in distinction to metallic magnetic devices. Will the greater control that comes with crystallinity give advantages to oxides in future devices? These are some of the many topics that are likely to be addressed in the coming years.

Researchers at Caltech have developed a prototype miniature medical device that could ultimately be used in “smart pills” to diagnose and treat diseases. A key to the new technology–and what makes it unique among other microscale medical devices–is that its location can be precisely identified within the body, something that proved challenging before.

“The dream is that we will have microscale devices that are roaming our bodies and either diagnosing problems or fixing things,” says Azita Emami, the Andrew and Peggy Cherng Professor of Electrical Engineering and Medical Engineering and Heritage Medical Research Institute Investigator, who co-led the research along with Assistant Professor of Chemical Engineering and Heritage Medical Research Institute Investigator Mikhail Shapiro. “Before now, one of the challenges was that it was hard to tell where they are in the body.”

A paper describing the new device appears in the September issue of the journal Nature Biomedical Engineering. The lead author is Manuel Monge (MS ’10, PhD ’17), who was a doctoral student in Emami’s lab and a Rosen Bioengineering Center Scholar at Caltech, and now works at a company called Neuralink. Audrey Lee-Gosselin, a research technician in Shapiro’s lab, is also an author.

Called ATOMS, which is short for addressable transmitters operated as magnetic spins, the new silicon-chip devices borrow from the principles of magnetic resonance imaging (MRI), in which the location of atoms in a patient’s body is determined using magnetic fields. The microdevices would also be located in the body using magnetic fields–but rather than relying on the body’s atoms, the chips contain a set of integrated sensors, resonators, and wireless transmission technology that would allow them to mimic the magnetic resonance properties of atoms.

Illustration of an ATOMS microchip localized within the gastrointestinal tract. The chip, which works on principles similar to those used in MRI machines, is embodied with the properties of nuclear spin. Credit: Ella Marushchenko for Caltech

Illustration of an ATOMS microchip localized within the gastrointestinal tract. The chip, which works on principles similar to those used in MRI machines, is embodied with the properties of nuclear spin. Credit: Ella Marushchenko for Caltech

“A key principle of MRI is that a magnetic field gradient causes atoms at two different locations to resonate at two different frequencies, making it easy to tell where they are,” says Shapiro. “We wanted to embody this elegant principle in a compact integrated circuit. The ATOMS devices also resonate at different frequencies depending on where they are in a magnetic field.”

“We wanted to make this chip very small with low power consumption, and that comes with a lot of engineering challenges,” says Emami. “We had to carefully balance the size of the device with how much power it consumes and how well its location can be pinpointed.”

The researchers say the devices are still preliminary but could one day serve as miniature robotic wardens of our bodies, monitoring a patient’s gastrointestinal tract, blood, or brain. The devices could measure factors that indicate the health of a patient–such as pH, temperature, pressure, sugar concentrations–and relay that information to doctors. Or, the devices could even be instructed to release drugs.

“You could have dozens of microscale devices traveling around the body taking measurements or intervening in disease. These devices can all be identical, but the ATOMS devices would allow you to know where they all are and talk to all of them at once,” says Shapiro. He compares it to the 1966 sci-fi movie Fantastic Voyage, in which a submarine and its crew are shrunk to microscopic size and injected into the bloodstream of a patient to heal him from the inside–but, as Shapiro says, “instead of sending a single submarine, you could send a flotilla.”

The idea for ATOMS came about at a dinner party. Shapiro and Emami were discussing their respective fields–Shapiro engineers cells for medical imaging techniques, such as MRI, and Emami creates microchips for medical sensing and performing actions in the body–when they got the idea of combining their interests into a new device. They knew that locating microdevices in the body was a long-standing challenge in the field and realized that combining Shapiro’s knowledge in MRI technology with Emami’s expertise in creating microdevices could potentially solve the problem. Monge was enlisted to help realize the idea in the form of a silicon chip.

“This chip is totally unique: there are no other chips that operate on these principles,” says Monge. “Integrating all of the components together in a very small device while keeping the power low was a big task.” Monge did this research as part of his PhD thesis, which was recently honored with the Charles Wilts Prize by Caltech’s Department of Electrical Engineering.

The final prototype chip, which was tested and proven to work in mice, has a surface area of 1.4 square millimeters, 250 times smaller than a penny. It contains a magnetic field sensor, integrated antennas, a wireless powering device, and a circuit that adjusts its radio frequency signal based on the magnetic field strength to wirelessly relay the chip’s location.

“In conventional MRI, all of these features are intrinsically found in atoms,” says Monge. “We had to create an architecture that functionally mimics them for our chip.”

While the current prototype chip can relay its location in the body, the next step is to build one that can both relay its location and sense body states.

“We want to build a device that can go through the gastrointestinal tract and not only tell us where it is but communicate information about the various parts of the body and how they are doing.”