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Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles. Memory and storage are key components in accelerating the intelligence and user experience of next-generation systems in vehicles, including in-cabin infotainment as well as advanced driver-assistance systems (ADAS) technology, which together play an important role in making self-driving autonomous cars a reality.

Micron and the BMW Group will intensify their existing efforts toward testing and development of automotive memory solutions at Micron’s state-of-the-art lab in Munich, Germany. Using the Test Automation Framework of the BMW Group as a car emulator platform, the two companies will work together to define and validate memory and storage solutions for next-generation platforms. The collaborative effort will leverage Micron’s memory and storage technology expertise, along with its broad portfolio of DRAM, NAND, and NOR technologies, including LPDRAM, e.MMC, UFS and SSD storage solutions.

As a proven memory partner for automotive manufacturers, Micron recognizes the importance of validating and testing new automotive memory technologies for robustness and reliability before releasing them into the market. Micron’s customer lab expertise in developing innovative automotive memory technologies will enable the BMW Group to raise the quality of the driving experience in automobiles of the future.

“The incorporation of new features and capabilities in advanced in-vehicle infotainment (IVI) and ADAS, such as voice recognition, hand gesturing and image recognition, are driving an explosive growth in both volatile and nonvolatile memory embedded in vehicles, accelerating intelligence at the edge,” said Giorgio Scuro, vice president of Micron’s automotive division. “Micron has a long-standing record working with automotive industry partners, and this joint initiative with the BMW Group is a testament to our expertise in bringing innovative automotive memory technologies to market.”

As a leading memory partner with more than 25 years of experience, Micron provides advanced automotive memory solutions that meet stringent quality, reliability and compliance requirements. Micron’s broad portfolio of volatile and nonvolatile memory products are optimized for automotive and supported by a formal product longevity program.

The Chinese Advance Semiconductor Association (CASA) recently hosted the 7th annual IASIC event in Shenzhen, China. Attendees at the event were able to get a look at some of the most leading edge innovations from companies from around the world as well as fellow Chinese companies. Among all the companies involved, NOWI was selected as the overall Innovation Winner for its energy harvesting power module.

The NOWI power module, a type of IC (integrated circuit) eliminates the need for frequent battery changes or impractical cables. Instead it enables any IoT or wearables company to use external ambient energy sources and thereby reduce the need for maintenance. We call this Plug & Forget. This is achieved with an energy harvesting PMIC with the worlds-highest efficiency and sensitivity. With the rise of the Internet of Things billions of wireless devices are required and this technology thereby solves a significant bottleneck in the industry.

Receiving the award, Simon van der Jagt, CEO of NOWI: “We are honored to receive the IASIC award and it has been a valuable experience to learn more about the Chinese semiconductor ecosystem. The Chinese Advanced Semiconductor Association (CASA) and the IASIC organization have recognized that the Internet of Things has a strong need for new power solutions to enable long maintenance-free product lifetimes. With new emerging energy harvesting and power management technology the Internet of Things is entering a new phase of maturity as connected devices become energy autonomous. This dramatically decreases the difficulty and cost of deploying and maintaining Internet of Things systems.”

“China has shown a clear ambition to be one of the leaders in the Internet of Things. As part of this visit, NOWI was also able to explore potential technology collaboration with leading global IoT companies”

During the two day event, a panel of international experts evaluated a range of leading semiconductor innovators. One such judge, former Intel and GE Senior Executive, IASIC Judge Mr Charles Zhang “The NOWI IC is a revolutionary product for the IoT industry, especially for devices like wearables or very power sensitive IoT sensors.  With the ability to capture and process tiny bits of energy from the environment, this innovation can benefit all types IoT sensor devices. The NOWI team did a great job to not only develop this technology but to already be working with customer for the real time deployment. That is why this is a winner.”

Micron Technology, Inc. today announced the company has joined CERN openlab, a unique public-private partnership, by signing a three-year agreement. Under the agreement, Micron will provide CERN with advanced next-generation memory solutions to further machine learning capabilities for high-energy physics experiments at the laboratory. Micron’s memory solutions that combine neural network capabilities will be tested in the data-acquisition systems of experiments at CERN.

High-energy physics scientists are looking to deploy leading-edge technologies that can support their experiments’ computing and data processing requirements. Memory plays a vital role in accelerating intelligence by processing vast amounts of data, helping researchers gain valuable insights from data generated by high-energy physics experiments.

As part of the work with CERN, Micron will develop and introduce a specially designed Micron memory solution that will be tested by researchers at CERN for use in rapidly combing through the vast amount of data generated by experiments. The project will feature FPGA-based boards with Micron’s most advanced high-performance memory combined with an advanced neural network technology developed in collaboration between Micron and FWDNXT, a provider of deep learning and AI solutions.

“Micron is committed to pushing the limits of innovation by providing high-performance memory and storage solutions to solve the world’s greatest computing and data processing challenges in data analytics and machine learning,” said Steve Pawlowski, vice president of advanced computing solutions at Micron Technology. “We’re proud to work with CERN to deliver machine learning capabilities that will enable high-energy physics scientists to make advances in their science and research experiments.”

“CERN collaborates openly with both the public and private sector, and working with technology partners like Micron helps ensure that members of the research community have access to the advanced computing technologies needed to carry out our groundbreaking work,” said Maria Girone, CTO at CERN openlab. “It is critical to the success of the Large Hadron Collider that we are able to examine the petabytes of data generated in a fast and intelligent manner that enables us to unlock new scientific discoveries. These latest-generation memory solutions from Micron and machine learning solutions from FWDNXT offer significant potential in terms of enabling us to process more data at higher speeds.”

Micron will demonstrate its high-performance memory solutions running FWDNXT’s Machine Learning SDK at SC18, November 12-15, in Dallas, Texas.

Spin Memory, Inc. (Spin Memory), the MRAM developer, today announced a commercial agreement with Applied Materials, Inc. (Applied) to create a comprehensive embedded MRAM solution. The solution brings together Applied’s deposition and etch capabilities with Spin Memory’s MRAM process IP.

Key elements of the offering include Applied innovations in PVD and etch process technology, Spin Memory’s revolutionary Precessional Spin Current™ (PSC™) structure (also known as the Spin Polarizer), and industry-leading perpendicular magnetic tunnel junction (pMTJ) technology from both companies. The solution is designed to allow customers to quickly bring up an embedded MRAM manufacturing module and start producing world-class MRAM-enabled products for both non-volatile (flash-like) and SRAM-replacement applications. Spin Memory intends to make the solution commercially available from 2019.

“In the AI and IoT era, the industry needs high-speed, area-efficient non-volatile memory like never before,” said Tom Sparkman, CEO at Spin Memory. “Through our collaboration with Applied Materials, we will bring the next generation of STT-MRAM to market and address this growing need for alternative memory solutions.”

“Our industry is driving a new wave of computing that will result in billions of sensors and a dramatic increase in data generation,” said Steve Ghanayem, senior vice president of New Markets and Alliances at Applied Materials. “As a result, we are seeing a renaissance in hardware innovation, from materials to systems, and we are excited to be teaming up with Spin Memory to help accelerate the availability of a new memory.”

Toyoda Gosei Co., Ltd. will establish a Corporate Venture Capital Department in January 2019. This new department will serve as the company’s center for flexible and swift investment in startups and venture capital to accelerate open innovations for practical application and commercialization of new technologies and products.

Toyoda Gosei formulated its medium and long-term business plan, the 2025 Business Plan, in May 2018 as a guide to acting flexibly and rapidly in a dramatically changing business environment. In a key area of activities in the Plan, “Venture into Innovation and New Mobility,” the company is developing e-Rubber, a next-generation artificial muscle for robots and other applications, modular automotive products with human-machine interface functionality that will serve as a bridge between humans and automobiles in autonomous driving, and other new technologies and products.

In order to commercialize them, the Corporate Venture Capital Department will invest quickly in startups that are promising for synergy with Toyoda Gosei’s core technologies. The department will have an operating budget of 3 billion yen, and will invest it for a period of two years starting in January 2019.

Semiconductor Research Corporation (SRC), today announced that SK hynix, a global leader in producing semiconductors including DRAM and NAND Flash memory, has signed an agreement to join SRC’s research consortium. SK hynix will participate in multiple SRC research initiatives including; Global Research Collaboration (GRC) and the New Science Team (NST) project.

GRC, a worldwide research program with 17 industrial sponsors is comprised of nine design and process technology disciplines. SK hynix will participate in SRC’s Nanomanufacturing Materials and Processes and Logic & Memory Devices research programs that focus on new device structures, memory alternatives, materials, and processes.

The NST project, a consortium consisting of 12 industrial sponsors and three government agencies is a 5-year, $300 million SRC initiative launched this January. NST consists of two complementary research programs: JUMP (Joint University Microelectronics Program) and nCORE (nanoelectronics Computing Research), which will advance new technologies focused on high- performance, energy-efficient microelectronics for communications, computing and storage needs for 2025 and beyond.

“The entire SRC team joins me in welcoming SK hynix to our distinguished membership of industry leaders from around the world”, said Ken Hansen, President and CEO of SRC. “SK hynix has an impressive history that showcases how ingenuity and innovative thinking can advance technology at a progressive pace. We look forward to a long, successful relationship with SK hynix as we push the limits of imagination and innovation.”

“SK hynix’s fundamental objective to surpass technological boundaries through propelling innovation has brought us to this association with SRC”, said Jinkook Kim, Head of R&D at SK hynix. “We recognize the significant impact that collaborative research programs such as those underway at SRC have in moving our industry forward. Strategic partnerships in research and development will help drive the Fourth Industrial Revolution with AI and autonomous vehicles leading the way.”

Today’s announcement is significant as the top 5 global semiconductor companies are now members of SRC. SK hynix represents the 8th non-U.S. headquartered company to join SRC as it seeks to expand its global presence. Industry sponsors are invited to explore the possibilities at SRC.

Veeco Instruments Inc. (Nasdaq: VECO) and ALLOS Semiconductors GmbH announced today the completion of another phase of their mutual effort to provide the industry with leading GaN-on-Silicon epiwafer technology for microLED production. The purpose of the companies’ most recent collaboration was to demonstrate the reproducibility of ALLOS’ 200 mm GaN-on-Si epiwafer technology on Veeco’s Propel® MOCVD reactor when producing epiwafers for many prominent global consumer electronics companies.

“To bring microLED technology into production, simply presenting champion values for a single metric is insufficient. It is essential to achieve the whole set of specifications for each wafer with excellent repeatability and yield,” said Peo Hansson, Ph.D., senior vice president and general manager of Veeco’s Compound Semiconductor business unit. “This successful joint effort reaffirms the power of combining Veeco’s superior MOCVD expertise with ALLOS’ GaN-on-Silicon epiwafer technology to provide customers a novel, proven and reliable approach to accelerate microLED adoption.”

Sorting and binning are standard methods to achieve wavelength consistency for conventional LEDs. But microLEDs are too small and numerous to be sorted and binned; therefore, the uniformity of the epitaxial deposition is even more critical. The most important success factor for turning the promise of microLED displays into mass production reality is to achieve extremely good emission wavelength uniformity, which eliminates the need to test and sort individual microLED chips. Depending on the application and mass transfer approach, the target requirements of the industry are between +/-1 nm and +/-4 nm bin (min/max) on the epiwafer. Through this collaborative project, Veeco and ALLOS further improved the critical wavelength uniformity with the best wafer having a standard deviation of just 0.85 nm, representing an industry first on a production system.

“Veeco and ALLOS validated wafer-to-wafer reproducibility with an average wavelength standard deviation for all wafers of 1.21 nm and the peak wavelength within a +/- 0.5 nm range. With these results we made another significant leap towards the +/-1 nm bin goal on an epiwafer,” said Burkhard Slischka, CEO of ALLOS. “Our technology is already available on 200 mm wafer diameter, which enables the use of low-cost and high yield silicon lines for microLED chip production. Additionally, we have a clear roadmap to enable 300 mm.”

Innovators in display technology are focusing on microLED as the next significant technological shift. According to research firm Yole Développement, the market for microLED displays could potentially reach 330 million units by 2025. This optimism is fueled by the promise of microLED technology (sub-100 micrometer edge length), which is considered the critical enabler to achieving the ultimate display with much lower power consumption. However, development of such displays has been hindered by high material costs and low yield and throughput of microLED mass transfer technology. This joint technical effort effectively addresses these challenges as Veeco and ALLOS continue to work with customers to further improve GaN-on-Si epiwafer and microLED mass transfer technology.

Veeco and ALLOS will showcase details of their breakthrough achievements at the International Workshop on Nitride Semiconductors (IWN) in Kanazawa, Japan on Nov. 12, 2018.

Pfeiffer Vacuum, a provider of high-tech vacuum solutions for the semiconductor, industrial, coating, analytical and R&D markets, opened up a new 27,000 square foot building in Nashua, NH, on October 25. This modern two-story construction will be the home of the North American headquarters for administration, sales, product management, marketing and customer care. In parallel, the former 24,000 square foot administration building has been converted into a Service Center of Excellence, bringing together under one roof all service activities for the major part of the Pfeiffer Vacuum product portfolio. State-of-the-art automated cleaning and test equipment is being utilized resulting in high-quality, fast repairs of the highest standards. Together with the service center in Austin, Texas with its strong presence in the semiconductor industry, Pfeiffer Vacuum has an ideal organization to serve the North American customers.

“With the completion of the two facilities, Pfeiffer Vacuum will be able to better support our valued customers throughout North America, while at the same time providing a modern, best-in-class work environment for our staff,” said Daniel Saelzer, President of Pfeiffer Vacuum Inc.

Pinnacle Imaging Systems, a developer of high dynamic range (HDR) Image Signal Processors (ISP) and HDR video solutions and ON Semiconductor, a provider of HDR capable image sensors, today jointly announced a new lower cost HDR video surveillance solution capable of capturing high contrast scenes (120 dB) with 1080p and 30 frames per second (fps) output. The new HDR video platform, running on the Xilinx Zynq 7030 SoC, meets the requirements to capture the highlight and shadow details of high contrast scenes, providing the market’s most-expansive dynamic range for surveillance and machine vision applications. The new surveillance solution will be demonstrated during the VISION trade fair (November 6-9, 2018). Camera, AI developers and media interested in seeing live product demonstrations can visit Avnet Silica /Avnet EMG GmbH booth (Hall 1 Stand 1C82) and talk to Pinnacle Imaging representatives.

The Pinnacle Imaging Systems Denali-MC HDR ISP IP Core has been ported to run on Xilinx technology and paired with ON Semiconductor’s AR0239 CMOS image sensor, maximizing the capability of the sensor’s unique three-exposure HDR. The Xilinx hardware-programmable SoC architecture enabled Pinnacle Imaging to develop a new custom sensor interface to support the AR0239 at a fraction of the cost and development time of other SoC or ASIC-based ISPs. Denali-MC’s advanced motion compensation algorithms minimize motion artifacts often associated with multi-exposure HDR capture and Pinnacle’s locally adaptive tone mapping algorithms accurately reproduce color and tonal gradations of high contrast scenes. With Pinnacle Imaging’s proprietary Ultra HDRTM technology, camera placement is no longer a concern. These powerful capabilities also provide camera and AI developers more accurate image data, increasing recognition system accuracy, making the solution ideal for surveillance cameras and machine vision systems, intelligent traffic systems, smart city, autonomous surveillance systems and more.

“As a technology partner, ON Semiconductor has been instrumental in providing the critical support necessary to bring this project to fruition,” said Alfred Zee, CEO of Pinnacle Imaging Systems. “The high dynamic range capabilities of the ON Semiconductor AR0239 sensor, coupled with the performance of the Xilinx Zynq SoC, make an ideal foundation for our Ultra HDR Surveillance Platform. Working closely with the ON Semiconductor team, we’ve been able to achieve the best possible HDR and low light performance from the AR0239 CMOS image sensor.”

Pinnacle Imaging also worked closely with the ON Semiconductor engineers to develop a new sensor interface to support the three-exposure HDR capture mode of the AR0239 CMOS image sensor.

“Pinnacle Imaging’s HDR merge and locally adaptive tone mapping IP achieve the best results from our AR0239 sensor not just in dynamic range but also with respect to accurate color and contrast reproduction,” said Gianluca Colli, VP and General Manager, Consumer Solutions Division of Intelligent Sensing Group at ON Semiconductor. “The flexibility of the Xilinx hardware programmable SoC architecture enabled them to be first-to-market to support our new three-exposure sensor design and serves as an important reference design going forward.”

The Pinnacle Imaging team further optimized its Denali-MC HDR ISP IP to fit into the smaller, cost-optimized Xilinx Zynq 7030 SoC, enabling competitive new markets for smart security and surveillance cameras.

“To be able to offer best in class solutions to our customers we evaluate many ISPs from different vendors. Pinnacle Imaging System’s Denali-MC ISP demonstrated exceptional image quality and HDR tone mapping results and we are excited to have Pinnacle using Xilinx,” said Christoph Fritsch, Senior Director, Industrial IoT Scientific and Medical Business Unit, Xilinx.

SkyWater Technology Foundry, the industry’s most advanced U.S.- based and U.S.-owned Trusted Foundry, today announced that Tom Legere has been appointed as Senior Vice President of Operations. In this role Legere will focus on evolving and enhancing SkyWater’s operations as they drive world-class foundry efficiency and customer support in support of the company’s long-term growth objectives.

“I’m extremely excited to have Tom join us at SkyWater as we accelerate our technology foundry transformation and work to blend best-in-class operational efficiency with a highly differentiated technology portfolio.” said Thomas Sonderman, President, SkyWater Technology Foundry. “Tom brings a unique set of operations leadership experiences across the semiconductor industry and the industry segments we serve. This deep understanding of our customers will be critical as we look to scale our business in 2019 and beyond.”

Legere brings an ideal combination of leadership and operational talent to the SkyWater executive team with extensive industry experience in aerospace and defense, life sciences, security, MEMS, renewable energy and semiconductors. He has led both mature and start-up organizations with extensive implementation experience in Design for Manufacturability (DFM), lean and six sigma principles, supply chain management and customer engagement. Over the last three decades Legere has held senior operational roles at a diverse range of companies, most notably Aurora Semiconductor, Sonavation, eSolar, SVTC, Cypress Semiconductor and Atmel.

Added Legere, “SkyWater brings a truly differentiated proposition to semiconductor industry, blending innovative advanced technology development with the ability to manufacture at scale. I’m excited to join the team as we look to further scale the business with an operationally efficient, customer-first approach.”