Tag Archives: letter-pulse-business

Veeco Instruments Inc. (Nasdaq: VECO) today announced that ON Semiconductor (Nasdaq: ON) has ordered its Propel® High-volume Manufacturing (HVM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system. Based on its successful beta evaluation of the Propel HVM tool, ON Semiconductor ordered the production-level Propel system for GaN power electronics manufacturing. As the industry’s first single-wafer cluster platform, the Propel GaN MOCVD system is specifically designed for high-voltage power-management devices used in data centers; automotive, information and communication technology; defense; aerospace and power distribution systems, among other applications.

“Our prior learning with Veeco’s K465i™ GaN MOCVD system drove us to investigate the Propel HVM platform for our production ramp,” said Marnix Tack, PhD, senior director of corporate R&D and Open Innovation at ON Semiconductor. “The beta test results demonstrated superior device performance with high uniformity and within-wafer and wafer-to-wafer repeatability, while meeting our cost-of-ownership targets for six- and eight-inch wafers. As such, the Propel HVM system proved to be the most suitable platform for our power electronics manufacturing needs.”

The Propel HVM platform is based on Veeco’s innovative single-wafer system with proprietary IsoFlange™ and SymmHeat™ technologies that provide homogeneous laminar flow and uniform temperature profile across the entire wafer. The system enables production of power electronics, laser diodes, RF devices and advanced LEDs with higher performance and production yields while ensuring very low cost-of-ownership.

“The Propel HVM platform is rapidly gaining traction in the industry as innovative companies like ON Semiconductor recognize the benefits of GaN-on-silicon, which will partially replace current silicon technology for power electronics,” commented Peo Hansson, PhD, senior vice president and general manager of Veeco MOCVD operations. “With its highly controlled doping, run-to-run stability, superior wafer uniformity, high productivity and uptime, Propel HVM extends the benefits of our TurboDisc® platform to a unique single-wafer architecture. These capabilities benefit customers that seek a superior solution for manufacturing while providing a path for scaling to eight-inch wafers and expansion to RF and other advanced applications.”

GaN is a wide band gap semiconductor material with specific advantages over conventional technologies such as gallium arsenide (GaAs) and silicon carbide (SiC). GaN has enormous potential in the short term due to its benefits in terms of thermal behavior, efficiency, weight and size. According to market research firm Yole Développement, the GaN power device business was worth $14 million in 2016, and projects that it will reach $460 million by 2022, with a compound annual growth rate (CAGR) of 79 percent. GaN-based devices will be used increasingly in RF amplifiers, LEDs and high voltage applications among others, primarily due to their abilities to operate at high frequency, power density and temperature with improved efficiency and linearity.

Veeco is discussing the power of its innovative MOCVD and wet etch systems in the “5G: Where Are We and What’s Next?” track at the CS International Conference this week in Brussels, Belgium. Somit Joshi, senior director of MOCVD marketing is presenting a session titled, “Enabling GaN RF and Power Electronics through Innovative MOCVD and Wet Etch Process Technologies,” on Wednesday, April 11, and the Veeco team will also be accepting the CS Industry 2018 Award for Innovation for its GENxcel™ R&D MBE System at the awards ceremony held during the conference.

POET Technologies Inc. (“POET”) (TSX Venture:PTK) (OTCQX:POETF), a designer, developer and manufacturer of optoelectronic devices, including light sources, passive wave guides and Photonic Integrated Circuits (PIC), today announced a master collaboration agreement with SilTerra, a Malaysia-based semiconductor wafer foundry, for the co-development of certain fabrication processes and the manufacturing of POET’s Optical Interposer Platform. The partnership is expected to accelerate the path to commercial production of the Optical Interposer, which will enable optical engines for single-mode transceiver modules and other high bandwidth devices.

Together, the companies will bring-up critical waveguide processes previously developed by POET for its Optical Interposer, and implement the process flows on newly purchased equipment at SilTerra’s world-class 8″ silicon foundry in Kulim, Malaysia. In support of this activity, SilTerra has agreed to assist financially with the purchase of specialized semiconductor fabrication and testing equipment, as well as to share certain costs associated with facilities enhancements and installation of equipment for manufacturing the Optical Interposer. Additionally, the collaboration includes a wafer purchase agreement for the manufacturing of prototype, initial production and volume production wafers.

POET’s Chief Executive Officer, Dr. Suresh Venkatesan, commented, “Following several months of preliminary collaborative work together, this agreement with SilTerra represents a significant milestone toward our goal of commercializing POET’s Optical Interposer Platform. The combined resources and investments of the two companies enables us to establish a unique manufacturing process as well as a reliable supply of wafers for our Optical Interposer. SilTerra offers POET a truly unique combination of advanced 90 nanometer lithography, cost-effective 8″ silicon processing copper metallization and MEMS capabilities, all of which are needed for our Optical Interposer. As a result of this partnership, POET has now secured a key element in the commercialization process allowing us to establish more engagements with prospective customers.”

Firdaus Abdullah, SilTerra’s Chief Executive Officer stated, “SilTerra is delighted to be working with POET in what we regard as a key strategic engagement to address the increasing need for cost-effective solutions for Data Center Interconnects through the innovative use of silicon in photonics.  POET’s Optical Interposer is a major advance over other approaches to optical interconnects and facilitates the co-packaging of electronics and photonics devices in a single Multi-Chip-Module (MCM). POET’s “Photonics-in-a-package” solution has the potential to address even larger markets in the future for the integration and co-optimization of ASIC’s and DSP’s with photonics at the interposer and chip level.  We at SilTerra look forward to a long and prosperous relationship between our two companies and our teams.”

The Master Collaboration Agreement between POET Technologies and SilTerra Malaysia Sdn Bhd was signed on April 6, 2018 and includes provisions for multiple co-development projects, consignment by POET of newly purchased equipment to be installed in SilTerra’s Malaysian foundry, various support services to be provided by SilTerra and the purchase of wafers containing Optical Interposer devices from SilTerra over an initial three-year term.

GLOBALFOUNDRIES Inc. (GF) and Toppan Photomasks, Inc. (TPI) today announced a multi-year extension to their Advanced Mask Technology Center (AMTC) joint venture in Dresden, Germany. Opened in 2002, the AMTC provides GF’s fabs in Dresden, Malta and Singapore with high-end production and development masks at world-class cycle times in support of the foundry’s ambitious technology roadmap. The AMTC also supports TPI customers worldwide from Dresden.

Owned equally by TPI and GF, the AMTC joint venture was previously extended in 2012 to further increase tool capability and capacity. This new extension to the agreement aims to continue the current charter for manufacturing production masks as well as developing mask technology for ever smaller geometries. GF is both TPI’s partner in the joint venture and a strategic and critical customer, while TPI is GF’s preferred mask supplier, leveraging AMTC and TPI’s global manufacturing network to support GF’s worldwide operations.

The AMTC provides one of the most essential and complex elements in the semiconductor manufacturing process, which puts the latest technology innovations at consumers’ fingertips.

Since its inception, the output of AMTC has grown continuously with growth rates exceeding 10 percent in recent years. Sizeable investments have enabled the AMTC to keep up with the rapid technological developments and challenges of this dynamic market sector; in 2017 alone more than 100 million euros (US$124 million) were invested.

“From computing to communication, and from automotive to medtech – our dual roadmap allows us to provide innovative technologies for the benefit of our customers around the world,” said Geoff Akiki, World Wide Mask Operations Executive at GF. “Regardless if they choose FD-SOI with its focus on energy efficiency or FinFET with its focus on high performance, both require leading-edge lithographic masks. AMTC is a great partner and provider of those masks. We are especially pleased that the experience of AMTC will be fully utilized to support us at the leading edge of chip technology.”

“Having been in place for more than 15 years, this joint venture is one of the lengthiest in the mask industry,” said Mike Hadsell, TPI CEO. “This is a testament to the synergy and commitment of the partners, as well as the strength of the AMTC and Toppan Dresden team members. AMTC is truly a best-of-breed effort that has provided high-quality masks to TPI’s customer base, both in Europe and globally.”

“AMTC was founded with a mission to be its customers’ first choice for photomasks. To achieve this goal, our experienced and dedicated team pursues cost-effective and timely manufacturing of high-quality masks for multiple nodes. In the process, the partners have continued to strengthen their relationship while allowing AMTC to serve as a valuable resource for our demanding global customer base,” noted Thomas Schmidt, AMTC’s general manager. “AMTC was established to support AMD’s microprocessor production in Dresden at the 65nm/90nm node. We have moved way beyond that and are looking beyond the current 14nm node.”

AMTC was founded in 2002 by AMD, Infineon Technologies and DuPont Photomasks, which became TPI in 2005. Subsequently, GF and TPI became the ownership partners in 2009. AMTC has seen a cumulative investment of more than US$600 million since 2002. The mask facility employs more than 250 engineers and other specialists. The company is currently expanding its team.

SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that after several years of incremental increases the worldwide semiconductor photomask market surged 13 percent to a record high $3.75 billion in 2017 and is forecast to exceed $4.0 billion in 2019. The mask market is expected to grow 5 percent and 4 percent in 2018 and 2019, respectively, according to the SEMI report. Key photomask market drivers remain advanced technology feature sizes (less than 45nm) and Asia-Pacific manufacturing growth. Taiwan is again the largest photomask regional market for the seventh year in a row and is expected to retain the top spot for the duration of the forecast. Korea rose in the rankings to claim the second spot.

With the $3.75 billion in revenues, photomasks accounted for 13 percent of the total wafer fabrication materials market, behind silicon and semiconductor gases, in 2017. By comparison, SEMI reports that photomasks represented 18 percent of the total wafer fabrication materials market in 2003. Reflecting their growing importance, captive mask shops, aided by intense capital expenditures in 2011 and 2012, continue to gain market share at merchant suppliers’ expense. Captive mask suppliers accounted for 65 percent of the total photomask market last year, up from 63 percent in 2016. In 2013, captive mask shops represented 31 percent of the photomask market.

The recently published SEMI report, 2017 Photomask Characterization Summary, provides details on the 2017 Photomask Market for seven regions of the world including North America, Japan, Europe, Taiwan, Korea, China, and Rest of World. The report also includes data for each of these regions from 2003 to 2019 and summarizes lithography developments over the past year.

Technavio market research analysts forecast the global carbon nanotubes market to grow at a CAGR of more than 20% during the period 2018-2022, according to their latest report.

This market research report segments the global carbon nanotubes market into the following applications (chemicals, plastics, and composites, electronics; and energy, battery, and capacitors), products (single-walled carbon nanotubes and multi-walled carbon nanotubes) and key regions (the Americas, APAC, and EMEA).

In this report, Technavio analysts highlight the miniaturization of semiconductor components as a key factor contributing to the growth of the global carbon nanotubes market:

Miniaturization of semiconductor components

The focus on the production of miniaturized components is one of the biggest drivers for the market. There has been strong growth in miniaturized components as they are used in many consumer electronic devices. Miniaturization continues to be the key trend that is driving the electronics industry. Components are designed to nano-sized physical dimensions, which enables more number of surface mount devices (SMDs) to be placed on a printed circuit board (PCB). Therefore, the bulkiness of a PCB is reduced with more functionalities being added. Several components can be placed on a PCB with the help of miniaturization. Miniaturization can be seen in various devices, from mobile phones, computers, car engines, and even phone adapters. However, with the decrease in feature size, the dimensional tolerance and diversity must be maintained. This will impact the materials that are required for fabrication purposes.

According to a senior analyst at Technavio for semiconductor equipment, “For example, PCBs are required to support micro-components and will have to have the ability to support many components without breakage. An optimal design on the PCB needs to be stenciled, and placement of the component is done as per the stencil. The need to pack a higher component density in a PCB assembly is being fueled by the increasing demand for miniaturization of components.”

Technavio’s sample reports are free of charge and contain multiple sections of the report such as the market size and forecast, drivers, challenges, trends, and more.

Global carbon nanotubes market segmentation

Of the three major applications, the chemicals, plastics, and composites segment held the largest market share in 2017, accounting for nearly 56% of the global carbon nanotubes market.

Of the two major products, the multi-walled carbon nanotubes segment held the largest market share in 2017, accounting for nearly 88% of the market. The market share for this product is expected to decrease nearly 13% by 2022. The fastest growing product is single-walled carbon nanotubes, which will account for nearly 25% of the total market share by 2022.

Looking for more information on this market? Request a free sample report

Plasma-Therm today announced that it has acquired KOBUS, a plasma deposition company, which enables F.A.S.T, a valuable alternative to ALD where thick and conformal films are required.

This unique deposition method is at the crossroads of ALD and CVD: F.A.S.T. stands for “Fast Atomic Sequential Technology.” F.A.S.T. is enabled by proprietary CVD reactor design combined with pulsing capability, and while capable of depositing in traditional ALD mode, it is optimal for thick and conformal layer deposition and offers new solutions for 3D integration challenges.

KOBUS offers a unique portfolio of equipment for both mature and advanced materials deposition, which merges well with Plasma-Therm’s operation, expanding the plasma-based deposition and etch suite of products for all silicon and compound semiconductor emerging applications.

This acquisition will allow Plasma-Therm to establish a solid base in Europe and conduct R&D development in the Grenoble “Silicon Valley,” a region fueled with R&D, startups and large semiconductor corporations.

SEMI, the global association representing the worldwide electronics manufacturing supply chain, today reported that worldwide sales of semiconductor manufacturing equipment totaled $56.6 billion in 2017, a year-over-year increase of 37 percent from 2016 sales of $41.24 billion. The data are available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report, now available from SEMI.

Korea claimed the largest market for new semiconductor equipment for the first time, shattering all previous regional spending records with $17.95 billion in equipment sales. Taiwan fell to the second position with sales of $11.49 billion. Annual spending rates increased for South Korea, Europe, China, Japan and North America. However, new equipment markets in Taiwan and Rest of World (primarily Southeast Asia) contracted.

Equipment sales to China increased 27 percent as the region maintained the third largest market position for the second year in a row. The 2017 equipment markets in Japan and North America held onto fourth and fifth places, respectively, while the Europe market rose in the rankings to the sixth spot. The global other front-end segment increased 40 percent; the wafer processing equipment market segment rose 39 percent; the assembly and packaging segment jumped 29 percent; and total test equipment sales increased 27 percent.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. Categories cover wafer processing, assembly and packaging, test, and other front-end equipment. Other front-end includes mask/reticle manufacturing, wafer manufacturing, and fab facilities equipment.

Semiconductor Capital Equipment Market by World Region (2016-2017)
2017
2016
% Change
South Korea
17.95
7.69
133%
Taiwan
11.49
12.23
-6%
China
8.23
6.46
27%
Japan
6.49
4.63
40%
North America
5.59
4.49
24%
Europe
3.67
2.18
68%
Rest of World
3.20
3.55
-10%
Total
56.62
41.24
37%

Source: SEMI/SEAJ April 2018

Note: Summed subtotals may not equal the total due to rounding.

Technology companies Osram and Continental have successfully completed negotiations on their joint venture, which is expected to begin operations in the second half of calendar year 2018. The joint venture, in which each of the partners has a 50 percent stake, aims to combine Continental’s and Osram’s respective expertise in lighting, light control and electronics. Leading the joint venture are CEO Dirk Linzmeier from Osram and CFO Harald Renner from Continental.

“Digitalization is creating new possibilities in automotive lighting applications and, in turn, tremendous opportunities that we want to leverage with Continental,” said Hans-Joachim Schwabe, CEO of Osram’s Specialty Lighting division. “By joining forces, we will be in an even better position to drive innovations by working closely with the automotive industry, seamlessly integrating lighting, sensor technology and electronics in a single application. This will allow us to advance new intelligent light functions, such as the combination of lighting and sensor technology in a module or light-based communication between the driver, other road users and the vehicle’s surroundings.”

Andreas Wolf, head of Continental’s Body & Security business unit, added, “The joint venture puts us in a unique position to drive technological change in the automotive lighting market and to develop intelligent lighting solutions by combining our expertise in software and electronics with Osram’s automotive lighting expertise. The innovations Osram and Continental bring to this joint venture will allow us to offer our customers an unrivaled and unprecedented portfolio in the lighting market.”

The joint venture will be based within the region of Munich, but will operate globally to ensure rapid development cycles with customers in their local areas. The U.S. operations of Osram Continental will be based in Hendersonville, Tennessee. The product portfolio will feature semiconductor-based lighting modules such as LED modules for front and rear headlights, laser modules and light control units.

Nobuaki Kurumatani today took office as the first Chairman and CEO of Toshiba Corporation (TOKYO:6502) to be appointed from outside the company in over 50 years.

Commenting on his appointment as Representative Executive Officer and Chairman and CEO, Mr. Kurumatani said, “I am honored to be appointed CEO, and very much aware of the responsibilities I take on. Toshiba is not just any company. Its corporate DNA has realized countless Japan- and world-first technologies and products, made Toshiba a source of pride in Japan for nearly 145 years, and also made us a global leader.

“I believe that helping Toshiba back on its feet is my true calling. I am here at Toshiba to support change and transformation, and I see my role as to build on the company’s resilience and to lead its recovery. To secure growth, we must radically improve our earning power and reinforce our finances. We must move out of our comfort zone and promote fundamental reforms.”

Mr. Kurumatani most recently served as President of CVC Asia Pacific Japan (CVC). Before joining CVC in May 2017, he was Deputy President and a Director of Sumitomo Mitsui Financial Group, one of the largest financial institutions in Japan, where his career was devoted to corporate planning, public relations and internal auditing. He is a graduate of the University of Tokyo, where he studied Economics.

Satoshi Tsunakawa has taken on a new role in Toshiba as Representative Executive Officer and President, and Chief Operations Officer (COO). From today on, Mr. Kurumatani and Mr. Tsunakawa will together execute the management of Toshiba Group.

 SiFive, a provider of commercial RISC-V processor IP, today announced it raised $50.6 million in a Series C round led by existing investors Sutter Hill Ventures, Spark Capital and Osage University Partners alongside new investor Chengwei Capital, and strategic investors including Huami, SK Telecom and Western Digital and other companies that are among the most respected and iconic companies in the industry. This Series C round brings the total investment in SiFive to $64.1 million. Additionally, the company also announced it has signed a multi-year license to its Freedom Platform with Western Digital, which has pledged to produce 1 billion RISC-V cores.

This investment will enable SiFive to continue to innovate and provide leadership in bringing highly disruptive RISC-V technologies to the marketplace. “Over the past two years, SiFive has been at the forefront of the RISC-V ecosystem,” said Stefan Dyckerhoff, managing director at Sutter Hill Ventures and member of the SiFive board of directors. “Sutter Hill Ventures is confident that SiFive will continue to provide innovative solutions that will fundamentally change the semiconductor industry.”

Said Martin Fink, chief technology officer, Western Digital: “RISC-V delivers a platform for innovation unshackled from the proprietary interface of the past. This freedom allows us to bring compute closer to data to optimize special purpose compute capabilities targeted at Big Data and Fast Data applications. The next generation of applications like Machine Learning, AI, and Analytics require this ability to focus on a specific task. Western Digital is focused on the next generation of innovation to enable this new class of applications to deliver the possibilities of data.”

This Series C financing comes amid continued milestones for SiFive since its last round of funding in May 2017. Since then, SiFive has expanded its executive team with seasoned industry veterans including CEO Naveed Sherwani. The company also moved to a new, larger headquarters in Silicon Valley, a move that was prompted by a projected 3X growth in headcount.

“We are honored by the continued partnership with our investors and energized by new engagements with longtime industry leaders,” said Naveed Sherwani, CEO of SiFive. “This funding from our investors and licensing agreements with strategic partners establishes a strong financial foundation which will help us to continue our trailblazing path of engineering innovations and extend our market leadership around the world.”

SiFive’s mission is to democratize access to custom silicon through its IPs and platforms, globally. Since becoming available, HiFive1 and HiFive Unleashed software development boards have been deployed in more than 50 countries. Additionally, the company has engaged with multiple customers across its IP and SoC products, shipped the industry’s first RISC-V SoC in 2016 and the industry’s first RISC-V IP with support for Linux in October 2017.