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NXP Semiconductors N.V. (NASDAQ:NXPI) announced that it had received the 2017 Excellence in Quality award from Cisco.

This prestigious award recognizes NXP for Excellence in Quality for displaying the highest quality standards, practices, and methodologies in their products and processes, and differentiating through their quality management systems and alignment to Cisco’s strategies and values.

The distinction was awarded during Cisco’s 26th Annual Supplier Appreciation Event, held August 31 at the Santa Clara Convention Center in California.

“The theme this year for our Supplier Appreciation event is ‘Connecting the Unconnected: Transforming to the Digital Supply Chain,’ which highlights our laser focus on enabling break-through value in operational commitments and customer satisfaction through digital orchestration,” said Jeff Gallinat, senior vice president, Global Manufacturing Operations, Cisco.

“As we continue on our digitization journey, our strong relationships and close collaboration with our supplier and partner ecosystem will continue to play a critical role in our continued innovation, productivity and ultimately success.”

Cisco presented awards to its partners and suppliers in recognition of their contributions to Cisco’s success in the fiscal year 2017.  At the event, Cisco celebrated the collective achievements of its most strategic suppliers and partners, and reaffirmed its commitment to a strong, continued partnership that will further accelerate innovation, alignment and operational excellence.

Nordson Corporation (Nasdaq: NDSN) today announced the launch of its initial Corporate Responsibility and Sustainability Report, available as a dedicated web site at www.nordson.com/responsible-and-sustainable.

The report enhances transparency in the environmental, social and governance (ESG) areas determined to be most material to the company and its stakeholders. These areas include: Community Investment, Product Quality & Safety, Ethics & Compliance, Environmental Footprint, Talent Management & Development, Innovation, Customer Relations & Satisfaction, Management Systems & Operational Excellence, Workplace Health & Safety, and Supply Chain.

“On behalf of all Nordson employees, we are proud to publish our inaugural corporate responsibility and sustainability report,” said Michael F. Hilton, Nordson President and Chief Executive Officer. “Since Nordson’s founding in 1954, we have held fast to our values of Integrity, Respect for People, Customer Passion, Excellence and Energy. Our report is a reflection of these values and our enduring commitment to grow and produce wealth for our stakeholders. Managing our economic, environmental, social and governance impacts enhances our ability to continue creating and delivering positive results over the long term.”

The report is the result of a detailed effort begun in late 2016 with the goal of increasing the robustness of the company’s corporate responsibility practices and reporting. A thorough materiality assessment guided by an independent third party identified Nordson’s potential universe of ESG topics. Topics were prioritized based upon evidence provided by internal and external stakeholders, including Nordson’s executive leadership team, investors, customers, industry associations, competitors and suppliers. Stakeholder interviews were supplemented with best practice research from sources related to the external stakeholder groups. These steps created a robust data set, which was analyzed through a rigorous scoring process. At the conclusion of the process, Nordson executive leaders reviewed the results and verified the approach, providing the impetus for the creation of the report.

“This report is another step in an ongoing journey and aligns with our longstanding commitment to be a responsible corporate citizen,” added Hilton. “The priorities described in the report have long been embedded within our overall strategy, which remains focused on accelerating organic growth, further optimizing our operations, enhancing our organizational capability, and sharing our success.”

Except for historical information and comparisons contained herein, statements included in this release may constitute “forward-looking statements,” as defined by the Private Securities Litigation Reform Act of 1995. These statements involve a number of risks, uncertainties and other factors, as discussed in the company’s filing with the Securities and Exchange Commission that could cause actual results to differ.

Nordson Corporation engineers, manufactures and markets differentiated products for the precision dispensing of adhesives, coatings, sealants, biomaterials, polymers and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.

From lifesaving smart headsets for truck drivers to gliding electric skateboards, five companies using MEMS and sensors will compete for audience votes during the Technology Showcase at the SEMI | MSIG MEMS & Sensors Executive Congress on November 1-2 in Napa Valley, Calif. As a featured event at the MEMS & Sensors Industry Group (MSIG) annual professional forum for executives from MEMS/sensors manufacturing and their end-user customers, the Technology Showcase highlights the newest and most unique MEMS/sensors-enabled applications in the industry.

“This year’s Technology Showcase finalists at the MEMS & Sensors Executive Congress are as fascinating as they are diverse,” said Frank Shemansky, CTO of SEMI | MSIG. “Imagine, for example, a MEMS-based switching element the width of a human hair, enabling RF switching that is 1,000 times faster and lasts 1,000 times longer than traditional mechanical switches. That is the kind of MEMS technology that could dramatically improve wireless applications, and it is just one of our Tech Showcase finalists ─  the others are equally compelling. The Tech Showcase is always a big draw at the Executive Congress because it gives attendees the chance to personally interact with the finalists’ demos to decide their vote for the winner – one of whom will be ‘crowned’ at the close of the conference.”

Tech Showcase Finalists

The LEIF eSnowboard by LEIF Technologies is the world’s first light electric vehicle that moves just like a snowboard. The LEIF brings to the pavement the smooth, sliding moves only found on a mountain or a wave — up to 23 mph and 15 miles per battery pack.

The Maven Co-Pilot by Maven Machines is the first smart headset for truck drivers. Employing MEMS, sensor fusion, wearable technology, machine intelligence and mobile-cloud architecture, the Maven Co-Pilot monitors drivers’ fatigue and distraction levels 50 times per second to provide accurate instantaneous early warnings to both drivers and fleet managers.

Menlo Digital-Micro-Switch Technology by Menlo Micro demonstrates fundamental materials’ advancements that improve the size, speed, power handling and reliability of MEMS switches. Smaller than the width of a human hair, Menlo Micro’s switching elements are so small that hundreds of them fit in a space smaller than 10mm2. Menlo Micro switches operate 1,000x faster than traditional mechanical switches — in a few microseconds rather than milliseconds. Their scalable architecture allows the handling of 100s of volts and 10s of amps without arcing. Menlo Micro’s devices last 1,000x longer than traditional mechanical switches, supporting billions of cycles without performance degradation.

The Berries Smart Sensor series by eLichens are patented autonomous non-dispersive infrared (NDIR) gas sensors offered in a 2 x 2 x 1cm package. These sensors integrate a dual-channel feature for a calibration-free long-life cycle. The miniaturized optical gas sensor is a complete system in package (SIP) integrating a proprietary infrared MEMS emitter and detectors, a highly efficient patented optical sampling chamber, and signal processing. The Berries series address the demanding requirements of the gas-sensing industries, where accuracy, auto-calibration and low power consumption are essential for new generations of gas- and air-detection products.

Coupled Time Domain Simulation for MEMS Sensors and System Integration by PZFlex lets engineers model and simulate a wide range of physics in new MEMS areas such as piezoelectric micromachined ultrasonic transducers (PMUTs) for fingerprint sensing. Engineers can conduct large-scale time-domain finite element analysis (FEA) simulation using PZFlex to gain insights into discrete device performance, device array performance, and full system performance for a PMUT fingerprint sensor embedded within a smartphone touch-display stackup.

MEMS & Sensors Executive Congress 2017 will take place November 1-2 at the Silverado Resort and Spa in Napa Valley, Calif. For more information, please contact SEMI via email: [email protected] or visit: www.semi.org/en/mems-sensors-executive-congress-2017.

In a flexible display, the backplane, frontplane, and any encapsulants are all made from flexible materials. To date, such displays have been used primarily because they are thinner, lighter, and more durable than comparable rigid displays, and to a lesser extent because they are conformable to rigid but non-flat surfaces in devices such as mobile phone handsets, automobile dashboards, and appliance control panels.

In 2017, key flexible display components achieved cost and performance parity with their rigid counterparts for the first time, thus removing a key market barrier and opening the door to rapid adoption in a variety of otherwise-rigid devices such as e-readers and wearables. Such displays may also be incorporated into truly flexible devices such as credit cards, shelving labels, and smart signage, and in the near future they may form the basis of rollable and foldable devices that define entirely new market categories.

According to a new report from Tractica, the four leading technologies in flexible displays are LED, LCD, OLED, and e-paper, and the main applications for these technologies are phones and tablets, wearables, shelving labels, signage, automotive dashboards, appliance control panels, TV and video displays, smart cards, e-writers, and e-readers. The market intelligence firm forecasts that flexible display shipments will increase from 169.9 million units in 2017 to 642.6 million units annually by 2022.

“The effect of flexible and conformable displays will be transformational,” says senior analyst Wil McCarthy. “They will literally change the appearance and function of our personal devices, our vehicles, our homes, and the built environment.”

Tractica’s report, “Flexible Displays”, examines the market trends and technology issues surrounding flexible displays and presents 6-year market forecasts, segmented by world region, for flexible display unit shipments, square meters, device pricing and revenue, and software applications during the period from 2017 through 2022. Flexible display applications are analyzed in depth, and the report also includes detailed profiles of 13 key industry players. An Executive Summary of the report is available for free download on the firm’s website.

Providing deep insights and perspectives on the challenges and opportunities in automotive electronics, the second edition of “FUTURECAR: New Era of Automotive Electronics Workshop” will be held November 8-10 at Georgia Tech in Atlanta, Georgia. SEMI (http://www.semi.org) and Georgia Tech, collaborators for the event, see unprecedented technical challenges and opportunities in electrical, mechanical and thermal designs, and new digital, RF, radar, LiDAR, camera, millimeter wave, high-power and high-temp technologies. The workshop will highlight rapid advancements in automotive electronics technologies and applications, and explore technical and business barriers and opportunities that are best addressed collectively across the supply chain.

The focus of the 2017 FUTURECAR workshop is on electronics in the car of the future. Autonomous driving, in-car smartphone-like infotainment, privacy and security, and all-electric cars will be among the topics presented, with particular emphasis on how these advancements impact devices and packaging with respect to materials, tools, processes, substrates, packages, components and integrated functions in R&D and in manufacturing. This event provides a unique opportunity for the semiconductor manufacturing and automotive supply chains to connect, collaborate and identify areas for new solutions.

The plenary session on November 8 will feature presentations from leading experts from Mercedes Benz, Porsche, Bosch, Qualcomm, SAE International and Yole Développement. The workshop sessions on November 9-10 include:

  • Power devices and packaging
  • High-temperature materials and reliability
  • Sensing electronics
  • Computing and communications
  • Student posters

FUTURECAR draws on the synergy between Georgia Tech in R&D and its industrial partners, as well as SEMI in global electronics manufacturing stewardship across the supply chain. Key to the depth of the workshop is support and expertise from the technical co-sponsors International Electronics Manufacturing Initiative (iNEMI), IEEE Electronics Packaging Society (IEEE EPS) and International Microelectronics Assembly and Packaging (IMAPS), as well as SAE International, the global association representing engineers and experts in the aerospace, automotive and commercial vehicle industries.

Workshop co-chairs are Prof. Rao Tummala, Georgia Tech; Bettina Weiss, SEMI; Grace O’Malley, iNEMI; Christian Hoffman (Qualcomm), IMAPS; and Patrick McCluskey, IEEE.

For more information on FUTURECAR 2017 and to register, please visit http://www.prc.gatech.edu/FUTURECAR

 

Today, SEMI announced the lineup of keynotes coming to SEMICON Japan’s “SuperTHEATER” ─ focusing on the future of the electronics manufacturing supply chain. SEMICON Japan 2017, the largest exhibition in Japan for electronics manufacturing, will take place at Tokyo Big Sight in Tokyo on December 13-15. Registration is now open for the exhibition and programs.

With the theme “Dreams Start Here,” SEMICON Japan 2017 will bring together the connections between people, technologies and businesses across the electronics manufacturing supply chain ─ extending to the internet of things (IoT) applications that inspire the dreams that shape the future.

Japan has the world’s third-largest 300mm wafer installed fab capacity and the world’s largest 200mm and smaller wafer fab capacity (including discrete devices production). Japan also supplies one third of the semiconductor equipment and more than half of the semiconductor materials that are purchased in the global market.

The SuperTHEATER offers nine keynote forums, all with simultaneous English-Japanese translation. On December 13, keynotes at SEMICON Japan’s SuperTHEATER include:

  • Opening Keynotes ─ Visions of the Game Changing Era
    • Soft Bank:  Ken Miyauchi, president and CEO, “The Information Revolution beyond the Singularity”
    • Qualcomm Technologies: Raj Talluri, senior VP of product management, “Qualcomm Viewpoint: Accelerating the Internet of Things”
       
  • Semiconductor Executive Forum ─ Growth Strategy in New Business Environment
    • TowerJazz Semiconductor: Russell Ellwanger, CEO, “Value Creation”
    • SMIC: Haijun Zhao, CEO, Considerations in Developing Manufacturable IC Technologies”
    • Micron Technology: Wayne Allan, senior VP of global manufacturing, “Enabling Smart Manufacturing in Today’s Industry 4.0”

The SEMI Market Forum, also on December 13, will offer presentations from IHS Markit and SEMI, with the theme “In the Light and Shadow of Awaking China”

Additional SEMICON Japan 2017 highlights include:

  • IT/AI Forum on U.S. companies’ artificial intelligence strategies
  • IoT Global Trends Forum on semiconductors for IoT
  • IoT Key Technology Forum on Smart Transportation
  • Manufacturing Innovation Forum n “Manufacturing Technology for the Diversified Future”
  • Electronics Trends
  • Mirai (the Future) Vision

 

For more information and to register for SEMICON Japan, visit www.semiconjapan.org/en/

COMET Group, a global provider of high-quality systems, components and services such as x-ray, ebeam and radio frequency technologies, today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

Scheduled to open October 4th, Lab One will bring Comet Group’s three core technologies under one roof for the first time:

  • RF power – Comet Plasma Control Technologies (PCT) designs and manufactures the technology used to make semiconductors and is used by leading chip manufacturers that power the industry’s most popular mobile devices (e.g. Apple, Samsung) and electronics (e.g. flat panel displays)
  • X-ray – Yxlon’s industrial X-ray and computed tomography – systems and services enable customers to improve the quality of their products and processes by non-destructive testing, measuring and decision support in industries such as electronics, automotive, aerospace, medtech, science and new technologies. They are based on highly compact Comet x-ray components and sources
  • ebeam – ebeam technology inactivates harmful pathogens that can cause food borne illnesses and provides safe, environmentally friendly packaging materials that reduce waste and improve food security

The working Lab and testing environment will act as an extension to many leading Silicon Valley businesses – providing access to a variety of testing and inspection services, as well as opportunities to collaborate with Comet Group’s industry experts, who will be available for consultation, brainstorming and problem solving.

“Our new Lab One facility can save local businesses time by providing local inspection services, save them money by finding costly flaws, and solve their logistic inspection services headaches with quick answers to their non-destructive test needs,” said Paul Smith, Sr. Vice President at Comet Technologies USA. “It’s a place where ideas are jointly transformed into solutions and solutions into business success.” 

With pioneering solutions for a wide range of industries, Comet Group will support its clients by bringing greater safety and security, mobility, sustainability and efficiency to numerous areas of life.

By Yoichiro Ando, SEMI Japan

Shinzo Abe, the prime minister of Japan, plans to stage a Robot Olympics in 2020 alongside the summer Olympic Games to be hosted in Tokyo. Abe said he wants to showcase the latest global robotics technology, an industry in which Japan has long been a pioneer. Japan’s Robot Strategy developed by the Robot Revolution Initiative Council plans to increase Japanese industrial robot sales to 1.2 trillion JPY by 2020. This article discusses how the robotics industry is not just a key pillar of Japan’s growing strategy but also a key application segment that may lead Japan’s semiconductor industry growth.

Japan leads robotics industry

According to International Federation of Robotics (IFR), the 2015 industrial robot sales increased by 15 percent to 253,748 units compared to the 2014 sales. Among the 2015 record sales, Japanese companies shipped 138,274 units that represent 54 percent of the total sales according to Japan Robot Association (JARA). The robotics companies in Japan include Yaskawa Electric, Fanuc, Kawasaki Heavy Industries, Fujikoshi and Epson.

Source: International Federation of Robotics (global sales) and Japan Robot Association (Japan shipment)

Source: International Federation of Robotics (global sales) and Japan Robot Association (Japan shipment)

The automotive industry was the most important customer of industrial robots in 2015 that purchased 97,500 units or 38 percent of the total units sold worldwide. The second largest customer was the electrical/electronics industry (including computers and equipment, radio, TV and communication devices, medical equipment, precision and optical instruments) that showed significant growth of 41 percent to 64,600 units.

Semiconductors devices used in robotics industry

Robotics needs semiconductor devices to improve both performance and functionality. As the number of chips used in a robot increases and more advanced chips are required, the growing robotics market is expected to generate significant semiconductor chip demands.

FEA-RO-IA-R2000-SpotWeld-3

Semiconductor devices in robots are used for collecting information; information processing and controlling motors and actuators; and networking with other systems.

  • Sensing Devices: Sensors are used to collect information including external information such as image sensors, sound sensors, ultrasonic sensors, infrared ray sensors, temperature sensors, moisture sensors and pressure sensors; and movement and posture of the robot itself such as acceleration sensors and gyro sensors.

    Enhancing these sensors’ sensitivity would improve the robot performance. However, for robot applications, smaller form factors, lighter weight, lower power consumption, and real-time sensing are also important. Defining all those sensor requirements for a specific robot application is necessary to find an optimal and cost-effective sensor solution.

    In addition, noise immunity is getting more important in selecting sensors as robot applications expand in various environments that include noises. Another new trend is active sensing technology that enhances sensors’ performance by actively changing the position and posture of the sensors in various environments.

  • Data Processing and Motor Control Devices: The information collected by the sensors is then processed by microprocessors (MPUs) or digital signal processors (DSPs) to generate control signals to the motors and actuators in the robot. Those processors must be capable of operating real-time to quickly control the robot movement based on processed and analyzed information. To further improve robot performance, new processors that incorporate artificial intelligence (AI) and ability to interact with the big data cloud database are needed.
  • As robotics is adapted to various industry areas as well as other services and consumer areas, the robotics industry will need to respond to multiple demands. It is expected that more field programmable gate arrays (FPGAs) will be used in the industry to manufacture robots to those demands.

    In the control of motors and actuators, power devices play important roles. For precise and lower-power operation of the robot, high performance power devices using high band gap materials such as Silicon Carbide and Gallium Nitride will likely used in the industrial applications.

  • Networking Devices: Multiple industrial robots used in a production line are connected with a network. Each robot has its internal network to connect its components. Thus every robot is equipped with networking capability as a dedicated IC, FPGA or a function incorporated in microcontrollers.

Ando--industrial-automation

Smart Manufacturing or Industry 4.0 requires all equipment in a factory to be connected to a network that enables the machine-to-machine (M2M) communication as well as connection to the external information (such as ordering information and logistics) to maximize factory productivity. To be a part of such Smart Factories, industrial robots must be equipped with high-performance and high-reliability network capability.

Opportunities for semiconductor industry in Japan

Japanese semiconductor companies are well-positioned in the key semiconductor product segments for robotics such as sensors, microcontrollers and power devices. These products do not require the latest process technology to manufacture and can be fabricated on 200mm or smaller wafers at a reasonable cost. Japan is the region that holds the largest 200mm and smaller wafer fab capacity in the world and the lines are quite versatile in these product categories.

The robotics market will likely be a large-variety and small-volume market. Japanese semiconductor companies will have an advantage over companies in other regions because they can collaborate with leading robotics companies in Japan from early stages of development. Also, Japan may lead the robotics International Standards development which would be another advantage to Japanese semiconductor companies.

For more information about the robotics and semiconductor, attend SEMICON Japan on December 13 to 15 in Tokyo. Event and program information will be available at www.semiconjapan.org soon.

By James Amano, International Standards, SEMI

The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee. Emerging technologies will be accommodated into the scope of the new committee, as North American TC Chapter Co-Chair Sesh Ramaswami (Applied Materials) explains: “Multi-die integration, horizontally and vertically, leveraging substrate, fan-out, interposer and TSV technology is our future. Hence, the new charter and scope will enable the committee to be of more value to the industry.”

Charter:

To explore, evaluate, discuss, and create consensus-based specifications, guidelines, test methods, and practices that, through voluntary compliance, will:

  • include the materials, piece parts, and interconnection schemes, and unique packaging assemblies that provide for the communication link between the semiconductor chip and the next level of integration, either single- or multi-chip configurations. It relates to the technologies for heterogeneous and other multi-chip packaging such as Fan-out/Fan-in Wafer Level Packaging, Panel Level Packaging, Three-Dimensional Stacking IC, device embedded packaging, flexible electronics technology
  • promote mutual understanding and improved communication between users and suppliers, equipment, automation systems, devices, and services
  • enhance the manufacturing efficiency, capability and shorten time-to-market and reduce manufacturing cost

Scope:

To develop standards for semiconductor devices, including processed wafers, chips, or multi-chip configurations to the next level of integration, either in single- or multi-chip configurations.

  • materials needed for 3D applications, including prime silicon and glass wafers, temporary and permanent bonding material, specifications needed for processed wafers and/or chips to enter an integration step, etc.
  • the materials related to the elements of, interconnection schemes, and unique packaging assemblies that provide for the communication link between device and packaging.
  • the technologies for heterogeneous and other multi-chip packaging such as Fan-out/Fan-in Wafer Level Packaging, Panel Level Packaging, Three-Dimensional Stacking IC, device embedded packaging, and flexible electronics technology
  • metrologies to support these 3D integration and packaging technologies

Masahiro Tsuriya (iNEMI), Japan Co-Chair, further emphasizes “The new 3D Packaging & Integration Committee will be able to contribute to the advance of new, innovative semiconductor packaging technologies.”

The global committee currently has chapters active in Japan, North America, and Taiwan, which all meet throughout the year. To get involved, please join the SEMI International Standards Program at: www.semi.org/standardsmembership.

The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress. The proposal is expected to be considered by Congress in the coming weeks.

“Over the past three decades, the U.S. semiconductor industry has unleashed tremendous innovations that have transformed America’s economic, technological, and national security landscape. America’s corporate tax system, meanwhile, has remained largely unchanged, leaving U.S. businesses at a disadvantage to their overseas competitors.

“The tax reform framework is a step forward to make the U.S. corporate tax system more competitive and allow U.S. semiconductor companies to continue to grow and innovate here at home. The plan would advance the U.S. semiconductor industry’s core priorities for tax reform: a lower, globally competitive rate, a modern international tax system, and strong incentives for research and innovation.

“While there are many details of importance to our industry that need to be fleshed out, we support the plan as a framework for advancing corporate tax reform.  We look forward to working with Congress and the Administration to enact corporate tax reform that makes the United States more globally competitive and boosts U.S. leadership in semiconductor research, design, and manufacturing.”