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SEMI today announced its plans to deliver specialized programs at SEMICON West 2017 (July 11-13 at Moscone Center in San Francisco, Calif.) in partnership with IEEE (Institute of Electrical and Electronics Engineers), Society of Automotive Engineers International (SAE), and imec. The programs will focus on key growth and innovation drivers for the industry, including advances in semiconductor scaling, autonomous motoring, and IoT (Internet of Things).  Register for SEMICON West now.

In recent years, IoT devices and applications have seen explosive growth, as have the microcontrollers, MEMS, sensors, and actuators underpinning IoT device architecture. In conjunction with IEEE, SEMI will offer two World of IoT sessions focusing on Understanding Risks and Opportunities in Transformative Technologies (the future of advanced IoT device architectures and emerging applications):

The sessions will feature presentations from: Ramesh Ramadoss,  IEEE Santa Clara Valley Section (Calif.); Ryan O’Leary, Threat Research Center at WhiteHat Security;  Phil Hummel, Dell EMC;  Todd Miller, General Electric Global Research; and Oleg Logvinov, IEEE Internet Initiative and IoTecha Corp.  Maciej Kranz, Cisco’s VP of Strategic Innovations, and author of the New York Times bestseller Building the Internet of Things, will also present.

On the automotive front, SEMI has partnered with SAE International to create two dynamic SMART Automotive sessions:

SMART Automotive attendees will get an insider’s view from Timothy Cavanaugh of SAE International, Luca De Ambroggi of IHS Markit, and key influencers from Qualcomm, NVIDIA, Mentor Graphics, and Continental Automotive Systems.

SEMI maintains a long-standing partnership with imec, a nanoelectronics research institute and organizer of an annual conference on emerging opportunities in semiconductor technology and smart electronics systems. This year’s event — Semiconductor and System Scaling Beyond Tomorrow — will be held July 10 in San Francisco, and feature a presentation from Dave Anderson, president, SEMI Americas, plus presentations from Luc Van den Hove, president and CEO, imec; An Steegen, SVP, imec; and Martin van den Brink, president and CTO, ASML.

In addition, recognizing the growing need for training and education, IEEE will be hosting a training workshop “Introduction to Embedded Systems/IoT Development“ for $149. Instructor Rob Oshana of Freescale will share practical techniques and guidelines for developing embedded system software.

Lam Research Corp. (Nasdaq:LRCX), an advanced manufacturer of semiconductor equipment, today announced that Dr. Young Bum Koh has joined the company’s board of directors effective as of May 10, 2017. Dr. Koh held many executive positions at Samsung Electronics Co., Ltd in South Korea.  Prior to his most recent position as Advisor until December 2016, he served from December 2011 to December 2013 as Executive Vice President, Head of the Mechatronics R&D Center; from January 2010 to July 2011 as Executive Vice President, Head of the Manufacturing Operation Center, LCD Business; and from January 2004 to June 2007 as Senior Vice President, Head of Manufacturing Technology Center, Memory Business.  Dr. Koh also served as Executive Vice President and President of Samsung Austin Semiconductor LLC located in Texas from August 2007 to December 2009.

“We are honored to welcome Dr. Koh as a Director of Lam Research,” said Stephen G. Newberry, chairman of Lam Research. “Dr. Koh brings to the Lam Research board substantial high technology operations knowledge and expertise built over the course of his distinguished career. His intimate understanding of the semiconductor industry paired with his international leadership experience in research, development and manufacturing will be a tremendous asset in our boardroom.”

Lam Research Corp. (Nasdaq:LRCX) is a global supplier of wafer fabrication equipment and services to the semiconductor industry.

FlexTech’s annual Flexible Electronics Conference and Exhibit – 2017FLEX – is set for the Hyatt Regency Hotel & Spa in Monterey, Calif.  from June 19-22, 2017. Consistently attracting 500+registrants, the event is the premier technology conference for the emerging flexible electronics industry. Twenty-six sessions will cover the landscape of flexible hybrid electronics and printed electronics, including R&D, manufacturing and applications. Short courses and networking events round out 2017FLEX.

According to Zion Research, “global demand for the flexible electronics market was valued at $5.13 billion in 2015 and is expected to generate revenue of $16.5 billion by 2021, growing at a CAGR of slightly above 21 percent between 2016 and 2021.”  Key elements of the market include flex displays, sensors, batteries, and memory. Applications also abound in the automotive, consumer electronics, healthcare, and industrial sectors.

While technology advancement and accelerating to manufacturing are the primary themes of the FLEX Conference, applications and business trends are highlighted on the opening day:

  • Applied Materials Keynote by Brian Shieh, corporate VP and GM, Display Business Group, on the flexible display market
  • Flex, the global EMS provider, and NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, on the challenges and solutions for manufacturing flexible and stretchable electronics
  • Libelium on how new IOT platforms that integrate sensors to monitor and control body parameters will lead to better healthcare for billions
  • Experience Co-Creation Partnership on the ten starting points for the development of flexible/hybrid sensors for agriculture and food
  • NovaCentrix on the OE-A Roadmap 2017, giving an outlook on organic and printed electronics developments and prospects
  • Gartner Group on when flexible electronics will reach critical mass

Sessions are planned for FHE manufacturing, standards and reliability, substrates, conductors, inspection, encapsulation and coating, nanoparticle inks, direct write, and 3D printing, among others. Well-known companies will present, such as Molex, Panasonic, Eastman Chemical, and Northrup Grumman, as well as leading universities, and the U.S. Army and U.S. Air Force Research Laboratories.

Among the R&D organizations presenting at 2017FLEX are CEA-LITEN (France), ETRI (South Korea), Flexible Electronics & Display Center (USA), Fraunhofer Institute (Germany), Holst Center (Netherlands), National Research Council (Canada), PARC (USA), and VTT (Finland). Topics of the presentations range from new forms of flexible substrates to TFT and OLED pilot lines to printed health monitoring sensors.

The exhibit floor, short courses and networking opportunities round out the event, as well as many member-only meetings.  FlexTech, the Nano-Bio Manufacturing Consortium (NBMC) and NextFlex hold member and planning meetings for the governing councils, technical councils and technology working groups.  Initiatives in manufacturing, mobile power, e-health, as well as project proposals will be discussed, all buoyed by the information shared during the technical conference.

For more information on 2017FLEX, please visit:  www.semi.org/en/2017-flex

ON Semiconductor Corporation (Nasdaq: ON) announced that it is has been named the winner of the Gold Stevie Award for Large Manufacturing Company of the Year in The 15th Annual American Business Awards (ABAs). The ABAs are a business award program in the United States and open to all public and private organizations.

“This award highlights ON Semiconductor’s ability to gain market share and to stay ahead of the industry growth curve,” says Keith Jackson, president and CEO of ON Semiconductor. “In order to succeed in this fast-paced environment, we have scaled both in terms of our technology portfolio and ability to innovate with a solutions-based approach that allows customers to focus efforts on their own core competencies, providing them with faster time to market.”

In 2016, the company shipped more than 55 billion units through its global logistics network and delivered products with greater than 95 percent average on time delivery to requested dates for all key customers.

More than 3,600 nominations from private and public organizations of all sizes were submitted this year.

“Each year the judges find the quality and variety of the nominations to be greater than the year before. The 2017 competition was intense and every organization that has won should be proud,” said Michael Gallagher, president and founder of the Stevie Awards.

Renesas Electronics Corporation (TSE: 6723, “Renesas Electronics”), a provider of advanced semiconductor solutions, today announced that, following the approval of Renesas Electronics’ Board of Directors on May 12, 2017, it will consolidate its subsidiary Renesas System Design, Co., Ltd. (“Renesas System Design”) through an absorption-type merger.

The Merger will be conducted through an absorption-type merger method in which Renesas Electronics will be the surviving company, and Renesas System Design will be dissolved as the absorbed company.

There will be no changes to the company name, business activities, headquarters address, representative, capital, and end of fiscal year of Renesas Electronics as a result of the merger.

Since the Merger involves Renesas Electronics and Renesas Electronics’ consolidated wholly-owned subsidiary, no major impact is anticipated on Renesas Electronics’ consolidated financial results.

In October 2013, Renesas embarked on structural reforms aimed at building a reliable corporate structure capable of generating sustainable profit a stable business foundation. On November 2, 2016 Renesas announced its “mid-term growth strategy.” One element of the strategy was the decision to acquire Intersil Corporation (“Intersil”), which is engaged in the development, manufacturing, sale, and service of analog semiconductor devices. As of February 24, 2017, Renesas completed the acquisition of Intersil.

Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, has appointed Stephen Lin to the newly created position of vice president of strategic business development in China, a key region for the company’s future growth plans. Stephen Lin brings to Soitec nearly 30 years of experience leading semiconductor business operations in China and the U.S.

“Working with our executive team, Stephen is in charge of strengthening Soitec’s business interests within China as well as growing market demand for SOI wafer products,” said Thomas Piliszczuk, Soitec’s executive vice president, Business and Strategic Development. “Stephen will be instrumental in our efforts to continue growing China’s microelectronics ecosystem as he works closely with our customers as well as government agencies, institutions and the financial and investor communities.”

China is home to all key elements of the electronics value chain including semiconductor manufacturers, fabless device designers, and consumer end markets. Soitec is already highly engaged in China, working to expand the semiconductor ecosystem while also driving demand for silicon on insulator (SOI) wafer products with its direct and indirect customers. The company also collaborates closely with its Shanghai-based manufacturing partner Simgui and the National Silicon Industry Group (NSIG), which recently invested in Soitec.

Since beginning his semiconductor career at LSI Logic, Stephen Lin has held senior executive positions within several major electronics companies including NXP Semiconductors, Microsemi, Intel and Siemens. He also has launched start-up companies in China and the U.S. including Mobility Ventures. He earned his master in electrical engineering degree from McGill University in Quebec and his MBA from Santa Clara University in California. He is the author of multiple publications including “The Fabless Semiconductor China Handbook.”

Synopsys, Inc. (Nasdaq:  SNPS) today announced that its IC Validator was successfully deployed on some of the industry’s largest and most advanced designs to accelerate design rule checking (DRC) closure. Through near-linear distributed processing and efficient resource management, IC Validator delivers industry-leading turnaround time, enabling physical signoff within hours on designs with 10 billion+ transistors. Technology advancements in the latest releases of IC Validator reduce both memory and disk usage requirements by 2x. This significant improvement in resource efficiency enables excellent performance scaling to several hundreds of CPUs by taking advantage of the smaller and more readily available machines in the customers’ existing compute farms.

“Increasing manufacturing complexity at advanced nodes makes it challenging for customers to complete physical signoff within schedule,” said Bijan Kiani, vice president, product marketing, Design Group at Synopsys. “Through high-performance scalability and readily available, optimized runsets from all major foundries, IC Validator is providing our customers with the fastest path to production silicon.”

IC Validator, part of the Synopsys Digital Design Platform, is a comprehensive and highly scalable physical signoff solution including DRC, LVS, programmable electrical rule checks (ERC), dummy fill and DFM enhancement. IC Validator is configured for today’s extremely large designs by enabling 8 CPUs with a single license. It uses both multi-threading and distributed processing over multiple machines to provide near linear scalability benefits that extend to several hundreds of CPUs. IC Validator enables coding at higher levels of abstraction and is architected for scalability to maximize utilization of mainstream hardware, using smart memory-aware load scheduling and balancing technologies.

IC Validator is a companion product to Synopsys IC Compiler™ II In-Design physical signoff. In-Design allows place-and-route engineers to perform independent signoff-quality analysis earlier, before the design is finalized and while correction can be automated. In-Design technology enables new high-productivity functionality within the place-and-route environment, including automatic DRC repair, improved timing quality-of-result with timing-aware metal fill, and rapid ECO validation. In-Design physical signoff eliminates expensive iterations with downstream analysis tools and maintains a convergent design flow to physical signoff.

Altair Semiconductor (altair-semi.com), a provider of LTE chipsets, today announced that it has become an Associate Member of the GSMA, with a focus on accelerating the delivery of new connected devices and services in the Internet of Things (IoT) space. The GSMA represents the interests of mobile operators worldwide, uniting nearly 800 mobile operators and 300 companies in the broader mobile ecosystem.

Altair plays a pivotal role in actualizing the Internet of Things with a portfolio of low-cost and power-efficient LTE chipsets. The company provides secure and robust cellular connectivity for a range of IoT applications. It recently announced the ALT1250 dual-mode CAT-M1 and NB1 IoT chipset that features ultra-low power consumption, integrated GNSS location services and embedded hardware-based security features.

“We’re pleased to welcome Altair to the GSMA,” said Gregory Geodjenian, Director of Membership for the GSMA. “Altair is among the leading players in cellular IoT, and we look forward to the company taking an active role in our industry work.”

With a portfolio supporting a wide range of LTE categories and use cases – from cutting edge, high-speed broadband equipment to ultra-low power, IoT-optimized devices – Altair’s LTE and IoT connectivity solutions are used by the world’s leading operators, OEMs and ODMs.

“Joining the GSMA provides Altair with the platform to enhance and strengthen our global profile, becoming part of a community of industry leaders for potential collaboration and strategic partnerships,” said Eran Eshed, Co-founder and VP of Worldwide Sales and Marketing for Altair. “Altair is in a strong market position to drive the development and adoption of cellular-based IoT solutions.”

SEMI today announced that SEMICON West (July 11-13 in San Francisco, Calif.) experience packages are now available for purchase, allowing attendees to choose the programs and events most relevant to their interests. The Thought Leadership Pass is already seeing strong interest from pre-registration. The Thought Leadership Pass focuses on the industry’s key business and technical challenges and opportunities and provides access to all Keynotes and Executive Panels, the TechXPOT Theaters, and much more, including the perennial favorites, the SEMI/Gartner Symposium and the Bulls & Bears Industry Outlook on Thursday morning.

The new Get Smart: SEMI/Gartner, Bulls & Bears Industry Outlook is a “must attend” event, co-sponsored by SEMI and Gartner. It features the latest, mid-year snapshot industry outlook, market analysis and forecast for semiconductors, capital equipment, materials and adjacent markets ─ in addition to market trends, opportunities and issues. The session also features a panel discussion, where leading Wall Street analysts weigh in with financial perspectives on the electronics industry.

Other Thought Leadership Pass highlights include:

  • A presentation by Maciej Kranz, Cisco VP of Strategic Innovations, and author of the New York Times bestseller, Building the Internet of Things
  • New SEMI/IEEE sessions focusing on the future of advanced IoT device architectures and emerging applications like home automation, smart cities, industrial and environmental monitoring, and MedTech
  • Two dynamic Smart Automotive sessions covering the latest technologies and performance upgrades that are shaping the future of transportation and meeting the growing need for speed, intelligence, and memory in today’s automotives (in partnership with SAE International)
  • All TechXPOTs on the show floor, which covers High-Volume Manufacturing, Advanced Packaging,  Lithography, MEMS & Sensors, Materials, Smart Manufacturing, Smart Automotive, Smart MedTech, 5G Communications and Next-Gen Cloud

If attendees would like access to everything that SEMICON West has to offer, then an All-in Pass is available for purchase. Or, attendees can purchase an Expo-only Pass that provides access to the Keynotes and Executive Panels, in addition to the Exposition Hall (note: SEMI members also get access to TechXPOTs with this pass). Attendees can also purchase select events and workshops on an à la carte basis, and students can register for a free, student one-day pass.

SEMICON West 2017 Admission Packages

Expo-Only Pass*

Thought Leadership Pass

All-In Pass
  • Expo Halls
  • Keynotes 
  • Executive Panels

 

 *SEMI Members with “Expo- Only” Pass also get access  to: 

  •  TechXPOTs 
  •  MicroE Career Development & Recruitment Forum
  Expo-Only Pass 

 

 Plus:

  • TechXPOTs 
  • MicroE Career Development & Recruitment Forum
  • SEMI/Gartner, Bulls & Bears 
  • Test Vision & Reception
  • SAE Smart Automotive
  • IEEE World of IoT: Risks & Opportunities in Transformative Technologies
  Expo-Only Pass

 

 Thought Leadership Pass

 

Plus: 

  • Summerfest at AT&T Park
  • Speaker & sponsor breakfasts
  • Smart Pass (VIP registration & reserved seating at Keynotes & Exec Panel sessions)

Plan to attend SEMICON West 2017 (July 11-13 in San Francisco, Calif.). The three-day  conference offers an exposition with 600+ exhibitors, educational programs, networking events, and technical training workshops ─ providing the knowledge and insights needed to stay competitive and plan for the future amidst today’s rapidly changing technical and supply chain environment. For more information, visit www.semiconwest.org. Register now for best pricing!

Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.  The new conference, 2017FLEX Korea, focusing on the theme “A Practical Path to Flexible Hybrid Electronics,” is brought to action with a market-focused agenda and presentations on Displays, Wearables, Sensors, OLED, Quantum Dot, Micro LED, Head Up Display, Roll-to-Roll and 3D Printing by experts from both the industry and academia.

2017FLEX Korea features a technical conference, a Short Course, and networking opportunities. The two-day technical conference includes four sessions on critical areas for FHE success. The four sessions will feature 14 technology experts from Korea, America, Asia and Europe representing organizations active in the FHE area, including:

  • Display Applications: KIMM and UIN3D
  • Wearables and Sensors Applications: KT and KITECH
  • Emerging Markets Applications: EyeDis, KOPTI, and KITECH
  • Core Technology Applications: Coatema Coating Machinery GmbH, Daelim Chemical, Dankook University, DuPont, Kolon Industries, Nanosys, and Universal Display Corporation

Three keynotes will set the stage for all of the other topics, including:

  • LG Display: “Flexible Display Changes Your Life” by Joon Young Yang, head of OLED Advanced Research Division
  • FlexTech: “Emerging Product Opportunities and the Worldwide Ecosystem of FHE” by Melissa Grupen-Shemansky, Chief Technology Officer
  • Samsung Advanced Institute of Technology: “Quantum Dot Display” by Shinae Jun, research master

Combining traditional IC manufacturing with printed electronics, FHE is the leading technical approach to design and manufacture devices for fast-growth markets. Flexible and printed electronics applications have the potential to create business opportunities in growing market opportunities such as wearables, health care, flexible displays and other advanced applications. A 3-hour Short Course is intended for individuals and organizations seeking a comprehensive overview on the Printed Electronics industry.

“We are pleased to hold the 2017FLEX Korea conference,” said Hyun-Dae CHO, president of SEMI Korea. “We hope the conference will provide you with the insights into the FHE industry and you will also find networking opportunities at the event.”

Register by May 26 to reserve your spot with a discounted price: http://www.semi.org/ko/flex-korea-register