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With a combined 500 booths, the exhibitions and conferences of LED Taiwan, opening tomorrow in Taipei, will attract over 12,000 visitors. Organized by SEMI and the Taiwan External Trade Development Council (TAITRA), LED Taiwan will be held simultaneously with 2017 Taiwan International Lighting Show (TiLS), serving as a one-stop platform for exchanging and sourcing LED manufacturing and lighting technologies, offering opportunities to meet potential partners, industry elites, and over 150 leading companies from the LED supply chain. The event is held at TWTC Nangang Exhibition Hall April 12-15.

The four-day LED Taiwan showcases a wide range of technology innovations and solutions in the six pavilions ─ High-Brightness LED, LED components, LED Manufacturing Equipment and Material Pavilion, IR/UV, Laser, and Sapphire. Leading players in the areas of LED equipment, materials, components and packaging ─ like Aurora Optoelectronics, Crystalwise Technology, EPILEDS, EPISTAR, Evest Corporation, Lite-On, NAURA Microelectronics Equipment, RAPITECH, Sentec, TAIKKISO and Yellow Stone Corp ─ are showcasing their products in the exhibition to help local and foreign visitors understand the structure, manufacturing processes and technologies of Taiwan’s LED industry.

To enable innovation and energize the show floor, events at TechSTAGE will focus on three topics this year, with presenters from leading companies:

  • LED Manufacturing Equipment & Materials: Atom Semicon, Aurotek, Galaxy Technology Development, Materials Analysis Technology,  Monocrystal, and Sil-More Industrial,
  • LED Advanced Technologies: ALLOS Semiconductors, CORIAL, Epileds Technologies, EPISTAR, MIRDC,TAIKKISO, UTITECH Technology, and Yole Developpement
  • Smart Lighting & Automobile Lighting: Billion Electric, High Power Lighting, MacAdam, National Chung Cheng University, Osram Taiwan, and PlayNitride

In addition, the IR/UV Summit focuses on IR and UV technologies and application products, with the latest research and development findings. The Academia Poster Section includes 46 papers from experts.

More than 12,000 visitors from over 60 countries and leading manufacturers will convene at LED Taiwan 2017.  Business events, forums, networking sessions and meetings enable Taiwan exhibitors and attendees to expand connections and secure business opportunities by gathering leading members of global industrial and academic circles.

To gain insights into the latest technologies and opportunities, attend LED Taiwan (April 12-15). Please visit:  www.ledtaiwan.org/en/ (English) or www.ledtaiwan.org/zh/ (Chinese).

MagnaChip Semiconductor Corporation (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.

The primary purpose of the Foundry Technology Symposium is to showcase MagnaChip’s most up-to-date technology offerings and to provide an in-depth understanding of MagnaChip’s manufacturing capabilities, its specialty technology processes, target applications and end-markets. Furthermore, during the symposium, MagnaChip plans to discuss current and future semiconductor foundry business trends, and also cover presentations in key markets through guest speeches.

While providing an in-depth overview of its specialty processes, MagnaChip will also highlight its technology portfolio and its future roadmap, including technologies such as mixed-signal, which supports applications in the Internet of Things (IoT) and RF switch sector and Bipolar-CMOS-DMOS (BCD) for high-performance analog and power management applications. In addition, MagnaChip will also feature applications regarding Ultra-High Voltage (UHV), such as LED lighting and AC-DC chargers, and cover Non-Volatile Memory (NVM)-related technologies, such as Touch IC, Automotive MCUs and other customer specific applications. Furthermore, MagnaChip will present its technologies used in applications including smartphones, tablet PCs, automotive, industrial, LED lighting and the wearables segments. MagnaChip will also review its customer-friendly design environment and an on-line customer service tool known as “iFoundry.”

“We are very pleased to host MagnaChip’s Annual Foundry Technology Symposium in the US again this year,” said YJ Kim, Chief Executive Officer of MagnaChip. “We plan to offer participants an opportunity to better understand the foundry and the application market dynamics, and to provide insights into MagnaChip’s specialty process technologies.” MagnaChip has approximately 466 proprietary process flows it can utilize and offer to its foundry customers.

SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the worldwide semiconductor photomask market was $3.32 billion in 2016 and is forecasted to reach $3.57 billion in 2018. After increasing 1 percent in 2015, the photomask market increased 2 percent in 2016. The mask market is expected to grow 4 and 3 percent in 2017 and 2018, respectively, according to the SEMI report. Key drivers in this market continue to be advanced technology feature sizes (less than 45nm) and increased manufacturing in Asia-Pacific. Taiwan remains the largest photomask regional market for the sixth year in a row and is expected to be the largest market for the duration of the forecast.

Revenues of $3.32 billion place photomasks at 13 percent of the total wafer fabrication materials market, behind silicon and semiconductor gases. By comparison, SEMI reports that photomasks represented 18 percent of the total wafer fabrication materials market in 2003. Another trend highlighted in the report is the increasing importance of captive mask shops. Captive mask shops, aided by intense capital expenditures in 2011 and 2012 continue to gain market share at merchant suppliers’ expense. Captive mask suppliers accounted for 63 percent of the total photomask market last year, up from 56 percent in 2015. Captive mask shops represented 31 percent of the photomask market in 2003.

A recent published SEMI report, 2016 Photomask Characterization Summary, provides details on the 2016 Photomask Market for seven regions of world including North America, Japan, Europe, Taiwan, Korea, China, and Rest of World. The report also includes data for each of these regions from 2003 to 2018 and summarizes lithography developments over the past year.

Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. (Shanhai Capital), today jointly announced the completion of the approximately $500 million acquisition of Analogix Semiconductor. China Integrated Circuit Industry Investment Fund Co., Ltd. (China IC Fund) joined Shanhai Capital’s fund as one of the limited partners.

“We are very pleased to have completed the transaction,” said Dr. Kewei Yang, Analogix Semiconductor’s chairman and CEO. “Enhanced by the strong financial support of our new investors, Analogix’s future is brighter than ever. We are excited to continue building and growing Analogix into a global leader in high-performance semiconductors.”

“As Analogix’s key financial partner and investor, we look forward to leveraging our resources to accelerate the company’s growth into new markets,” said Mr. Xianfeng Zhao, Chairman of Shanhai Capital. “We will build on the strength of the company’s core technology and customer relationships to create an exceptional semiconductor company that will be publicly listed in China.”

Sino-American International Investment Ltd, and Needham & Company, LLC served as financial advisors to Analogix Semiconductor. O’Melveny & Myers LLP served as legal counsel to Analogix Semiconductor.

Pillsbury Winthrop Shaw Pittman LLP and Jingtian & Gongcheng acted as legal counsel to Beijing Shanhai Capital Management Co.

2016 was a turning point for fan-out packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution, the market changed. Thus advanced packaging leaders decided large investments for the development of fan-out platforms, impacting the related equipment and materials market.

“Indeed, both equipment and materials markets for FOWLP will reach an impressive 40% CAGR,” confirmed Jérôme Azémar, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement (Yole).

A detailed description of both markets and a list of equipment and materials studied by Yole is available in the new report Equipment and Materials for Fan-Out Packaging. According to this technology & market analysis, the total FOWLP equipment market is expected to reach about US$694 million in 2021 at an impressive CAGR of 42.5% between 2015 and 2021. Similarly, FOWLP’s total materials market is expected to reach about US$148 million in 2021 at a CAGR of 40% during the same period.

fowlp 2017

How is Fan-Out success driving the equipment & materials market? What is the impact of the huge investments listed during the 2015-2016 period? Under this dynamic context, where are the business opportunities? Yole’s advanced packaging team is expecting lot of changes in the coming years and offers you today a snapshot of these industries.

In its report, the “More than Moore” market research and strategy consulting company proposes a clear picture of new investments and future markets for equipment and materials in Fan-Out. This report focuses on FOWLP’s key process steps, which Yole believes are most essential to the platform: carrier bonding/debonding, chip placement, molding and RDL processing.

The equipment studied in the report that enables the aforementioned process steps includes pick-and-place bonders, lithography tools, sputter tools, molding tools, carrier debonding tools, and coaters/developers. In parallel, key materials investigated in Yole’s report include RDL dielectrics and photoresist, molding compound, and glass carriers.

As mentioned, 2015 – 2016 period saw large investments in FOWLP.

“With the FOWLP adoption spreading from mobile/wireless and automotive to MEMS, RF SiP, and medical, a wealth of lucrative business opportunities exist for fan-out equipment and materials suppliers,” detailed Jérôme Azémar.

2017 will not see the same investment level, but the potential for new moves is high. Capacity enlargement is still an option for players considering it; in fact it may be required in two years if fan-out keeps growing in high-density applications. Newcomers will gain some market share, necessitating entry into volume production. However, with 4.5 million wafers to be produced in 2021, capacity must also be increased by TSMC and/or other actors. Therefore, a second wave of investment must occur soon or capacity will not be sufficient to address the FOWLP market if it continues growing.

As a consequence, growth will be significant for all equipment and material types, indicating broad benefit from the FOWLP platform’s success. However the challenges and market landscapes are very different from process step and the market is quite diversified. For example, lithography for patterning RDL represents one of the largest market components thanks to the equipment’s high value and the large volume of photoresist. In lithography, a “stepper”-type litho tool is used for FOWLP RDL patterning in order to achieve low-resolution (down to 2µm today), but its cost is high and manufacturers are under strong pressure to reduce their prices.

“This market is currently dominated by Ultratech, which supplies TSMC, and Rudolph which has enjoyed success with OSATs,” said Santosh Kumar, Senior Technology & Market Research Analyst at Yole. And he adds: “We expect other players to penetrate this area, potentially with different approaches like laser ablation.”

Other steps, i.e. mold compound processing, may be more prone to domination by a single player. This symbolic step, which creates a reconstituted wafer out of a mold in which the IC are encapsulated, is almost entirely owned by Nagase Chemtex, almost 90% market share on the materials side. Nagase Chemtex’s dominance is the result of the complex approach such chemicals require in order to develop an optimum solution, and the long history Nagase has with the main producers including Nanium and STATS ChipPAC. LMC is currently the preferred FOWLP mold material, however, to break Nagase’s monopoly and reduce cost, other materials suppliers are working to develop GMC. By 2021, GMC is expected to have 29% of the total market. On the equipment side, things are more diversified, with APIC, Yamada, and Towa the key compression molding-tool suppliers for FOWLP.

Cadence Design Systems, Inc. (NASDAQ:  CDNS) today announced the release of the new Virtuoso Advanced-Node Platform supporting advanced 7nm designs. Through collaboration with early 7nm FinFET customers, Cadence has expanded the Virtuoso custom design platform with innovative new capabilities to manage design complexity and process effects introduced with this advanced-node process. The Virtuoso Advanced-Node Platform update supports all major advanced FinFET technologies with proven results, while improving designer productivity at 7nm.

To address the many technical challenges of 7nm design, the Virtuoso Advanced-Node Platform offers a variety of layout capabilities, including advanced editing with multi-pattern color awareness, FinFET grids, and module generator (ModGen) device arrays. Additionally, customers can take advantage of variation analysis in their circuit design flows utilizing Monte Carlo analysis across corners to address variability with the Spectre® Accelerated Parallel Simulator, the Virtuoso ADE Product Suite and the Virtuoso Schematic Editor.

“As a leader in mobile computing, we require the highest performance, lowest power and highest density possible to deliver innovative, advanced-node designs,” said Ching San Wu, general manager of Analog Design and Circuit Technology at MediaTek. “Through our strong collaboration and continued partnership with Cadence, we have been able to develop and deploy a custom design methodology based on the Virtuoso Advanced-Node Platform. With our recent successful tapeout, we took advantage of its many unique capabilities designed to manage the challenges presented at 7nm.”

Key features in the updated Virtuoso Advanded-Node Platform include:

  • Multi-patterning and color-aware layout: Provides essential new support of a variety of fully colored “multi-patterned” custom design flows, which are a baseline requirement for the 7nm process and enable users to be more productive in their designs.
  • ModGen device arrays: Offers designers a set of modules that have been co-developed in close collaboration with key partners to improve designer productivity and mitigate layout complexities at the 7nm process node.
  • Automated FinFET placement: Provides automatic FinFET grid placement that simplifies the overall FinFET-based coloring design methodologies needed at 7nm. By adhering to 7nm process constraints, the Virtuoso Advanced-Node Platform greatly simplifies layout creation and minimizes errors that can be pervasive when designing at 7nm, while decreasing layout design time by up to 50 percent on custom digital and analog blocks.
  • Variation analysis: Enables high-performance Monte Carlo analysis targeting FinFET technology and high-sigma analysis, which can reduce the overall time to run simulations by a factor of 10.

“Through constant innovation and strategic partnerships with industry leaders, Cadence has solidified its leading role in providing advanced-node custom design tools,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. “Through our extensive work with customers such as MediaTek, we’ve been able to validate that our approaches greatly reduce the overhead inherent in designing at 7nm in order to help deliver the best possible silicon. We currently have many customers that have completed successful tapeouts and delivered production designs using the Virtuoso Advanced-Node Platform.”

Ultratech, Inc. (Nasdaq: UTEK), a supplier of lithography, laser­ processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received multiple commitments for its LM7 laser melt anneal system. After its recent introduction in Q416, two leading North American semiconductor manufacturers will target use of the LM7 melt system at 7nm and below nodes. Ultratech plans to ship both systems in the first half of 2017 to the customers’ facilities in the U.S.

As the industry faces the challenges of device manufacturing at 7nm and below, laser melt anneal technology has received attention as a solution not only for front-end-of-line, but also for middle- and back-end-of-line applications.  In particular, scaling at these nodes has resulted in scrutiny of the contact structure between the transistor and the first metal layer. The focus is not solely on the transistor device performance, but issues related to the resistance at the contact, which are becoming a limiting factor in the operation of the transistor, increasing drive current and limiting overall speed. A paper presented in December at the 2016 IEEE International Electron Devices Meeting (IEDM), which used Ultratech’s laser melt anneal system, provided data to support the system’s capability to enable contact scaling consistent with transistor performance targets for the 7-nm node and beyond.

“As we continue to scale to smaller nodes, contact resistance is widely acknowledged to be one of the gating issues that must be addressed,” said Yun Wang, Ph.D., Senior Vice President and Chief Technologist, Laser Processing at Ultratech. “Ultratech’s laser melt anneal technology addresses emerging annealing requirements for 7nm and beyond, with applications spanning the front end where the focus is on device performance and leakage improvement, the middle-of-line for contact resistance, and at the back-end-of-line where the focus is on material modifications and reduction of resistive capacitive (RC) delay. Over the last few years, Ultratech has been engaged with multiple customers on all of these applications, running wafers at our facility using our laser melt anneal technology. We look forward to working with these two customers and to providing our laser melt technology to meet their aggressive technology roadmaps.”

Ultratech LM7 Laser Melt Annealing System
The LM7 laser melt annealing system is based on the production-proven LSA201 laser spike anneal platform with ambient control. Built on this proven hardware/software platform, the LM7 provides a novel solution for melt annealing applications for 7nm and below nodes. The LM7 uses a unique dual-laser process that provides nanosecond-scale melt anneal with reduced pattern effects compared to conventional melt anneal approaches.  Ultratech’s LM7 laser melt anneal system provides the industry with a low cost-of-ownership solution for advanced annealing requirements for high-volume manufacturing at 7nm and beyond.

2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.

“And 2017 seems to be following the same path,” said Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole.

Year after year, the advanced packaging industry has attracted more and more of the spotlight.

ic market forecast

“According to our estimates, advanced packaging revenues represented more than US$22 billion in 2016 and will increase to almost US$30 billion by 2020”, confirmed Jérôme Azemar from Yole.

What is the status of the advanced packaging industry? Who is leading the market today? What are the platforms that will drive the tomorrow’s industry? What could we expect in term of technology evolution? NCAP China and Yole propose you a 2-day conference to answer these questions and get the opportunity to meet the advanced packaging leaders. They announced today the 3rd Advanced Packaging & System Integration Technology Symposium. The 2017 edition takes place in Wuxi, China, on April 20 & 21.
   • Click program & registration to discover schedule, list of speakers, abstracts, and much more.
• The 2017 symposium is sponsored by BESI, Plasma-Therm, SPTS Technologies, UnitySC and Simco-Ion
   • This year again, ASTRI is a partner of the Advanced Packaging & System Integration Technology Symposium.

Created in 2014, the Advanced Packaging & System Integration Technology Symposium is attracting more and more attendees each year. The powerful program designed by Yole and NCAP China gathers numerous valuable discussions, meetings and business collaborations.

 This year again, both partners are excited to welcome the leaders of the advanced packaging industry and are expecting a great success. They have announced an impressive list of executive speakers including:
   • Tetsukazu Sugiya, Group Leader, Technology Solutions Group at DISCO Corp.
   • Lianming Tong, Lead Marketing Manager at Dow Electronics Materials
   • Kenji Kawada, Staff Engineer at Infineon Technologies Japan
   • Daquan Yu, CTO & VP, Kunshan Huatian Technology Electronics
   • Howard Huang, Director, Kingyoup Optronics
   • Tae-Hoon Kim, Ex. President, nepes Corporate
   • Dr David Lishan, Principal Scientist at Plasma-Therm
   • Richard Barnett, Etch Product Manager, SPTS, an Orbotech Company …

And much more. List of speakers, biographies and abstracts are available on i-micronews.com website. To download the PDF version, click Program. 2017 edition also includes two keynote speakers from Huawei and Brewer Science.

Partnership between both organizations, NCAP China and Yole has been signed 3 year ago and all benefits of this collaboration are serving the development of the advanced packaging industry in China and all around the world. Based on a strategic thinking, NCAP China and Yole combined their expertise and their brand to support the development of this dynamic industry. Both organizations became indispensable players. And as strong influencer, the NCAP China and Yole Symposium is today the relevant indicator of the status of advanced packaging industry.

“We are very pleased to have the opportunity this year again to host the “Advanced Packaging & System Integration Technology Symposium,” saidDr Cao LiQiang, NCAP’s CEO. And he adds: “Mixing together worldwide companies and laboratories, all experts in the advanced packaging arena is just key for the development of the industrial activities in China. It is a relevant contribution to shape the future of the advanced packaging ecosystem. Under this context, we are looking forward to welcome advanced packaging leaders and get powerful presentations and debates during the Symposium.”

Advanced packaging revenue in China is expected to reach US$4.6 billion in 2020 at an impressive 16% CAGR .

“Indeed we are experiencing a key momentum in the semiconductor industry,” announced Thibault Buisson, Business Unit Manager, Advanced Packaging & Semiconductor Manufacturing at Yole. “Lot of technical challenges are now being transferred from the chip to the package itself. This is why industrial companies from different business models are willing to get involved in the exciting advanced packaging field. Under a highly competitive landscape, innovative platforms such as FO packages, 3D & 2.5D interposers and SiP are getting more and more interest from the end users and therefore are changing the packaging ecosystem. NCAP China & Yole Symposium is the place to get a clear understanding of the status of this industry and get answers to future market evolutions, the industry will face tomorrow.”

The symposium represents an exciting opportunity for advanced packaging companies to develop, exchange and expand their activities in China and also in all other countries. NCAP and Yole are very enthusiastic about this 3rd edition. Make sure you will attend the Symposium and book your place right now on i-micronews website or click: Registration. To see the full schedule, please click here: Program.

Telit, a global enabler of the Internet of Things (IoT), today announced that it is celebrating the 100th installation of its secureWISE software platform in a 300mm semiconductor fabrication plant.

As part of Telit’s IoT Factory Solutions, secureWISE has been providing over 12 years of secure remote IoT connectivity to tool manufacturers (OEMs) for the semiconductor industry. Telit’s IoT Factory Solutions focuses the company’s vision of connected factories, connected machines, and connected consumers and ties directly into its core IoT business. Building on 15 years of experience in industrial automation solutions deployed worldwide and connecting more than $300 billion in manufacturing assets, Telit is making it easy for customers to take advantage of the IIoT opportunity with multiple paths to deployment.

Telit’s secureWISE has been widely recognized as the de-facto solution for highly-secure remote access to semiconductor equipment. The software serves 18 of the top 20 OEMs and is used by every major integrated device manufacturer (IDM) and foundry to securely connect over 250 different tool types with their manufacturers. Connecting more fabs and OEMs than any other platform in the industry, secureWISE delivers secure, configurable end-to-end remote IoT connectivity across a closed, private network. It allows fabs and OEMs to remotely collaborate in ways that improve equipment performance at every stage of the process and lifecycle while protecting valuable intellectual property (IP).

Major semiconductor tool makers have introduced high availability service models that are tightly embedded into their machines installed at the fabs. OEMs are now able to use IoT and remotely collect data, to analyze, fix – as well as predict – any problem with their machines on the semiconductor production floor from any global location. They can offer immediate service and support from subject matter experts to the fabs. In turn, these new service models result in improved uptime and higher reliability of production tools.

The secureWISE eCentre server gives a fab full control of how, when, and what tools can be accessed, assuring that the OEM doesn’t have any unauthorized direct access to production tools. Furthermore, these built-in role-based access functions give fabs a detailed audit trail with comprehensive reporting and business analytics of all activities.

“We are proud of this milestone and the recognition that the semiconductor industry has made secureWISE their de-facto IoT software platform for secure remote monitoring and mediation of mission-critical manufacturing tools,” said Oozi Cats, CEO of Telit. “This is another testament to our fast-growing position around industrie 4.0 through our IoT Factory Solutions division, and it also illustrates how security is an integral part of our DNA, extending across all of Telit’s products and services.”

Spanning the globe, secureWISE is rapidly extending beyond 300mm fabs with new deployments across 200mm fabs, flat panel displays, solar and other manufacturing facilities.

Intermolecular, Inc. (NASDAQ: IMI) today announced a restructuring initiative to improve the overall effectiveness and efficiency of their materials services. In IMI’s statement, the company believes these changes will help IMI  become more customer-responsive and efficient while lowering costs by approximately $4M in 2017.

“Since joining IMI in August, I have been focused on building a broader and higher velocity pipeline to help grow our top line,” said Chris Kramer, president and Chief Executive Officer.  “The improvements made since September have centered on strengthening our commercial team, implementing a new approach towards building the sales pipeline and deepening our customer engagement.  Improving our effectiveness and efficiency is the next important step in our plan to grow IMI business and achieve profitability.”

The changes reflect the ongoing efforts to achieve IMI’s commercial, technical and financial objectives along the following lines:

  • Rapidly transition IMI into a more focused and nimble organization to create more value and move more quickly towards profitability
  • Focus primarily on materials innovation services for the semiconductor industry and its supply chain
  • Strengthen existing/returning customer relationships while building the sales pipeline with new clients
  • Focus on a limited R&D program in support of key services opportunities and licensed products

“I am confident the changes we are making will put IMI in a far better position for future growth and success,” added Kramer. “IMI provides highly valuable and needed materials innovation services now and for the future of the semiconductor industry.”

Concurrent to the restructuring initiative, IMI announced changes in its leadership team:

  • Bruce McWilliams, currently Executive Chairman, to transition to non-executive Chairman
  • Bill Roeschlein, currently Vice President of Finance and Corporate Controller to be named Chief Financial Officer following the retirement of Rick Neely

“Since Chris joined IMI in August 2016, he has demonstrated strong leadership and business acumen,” said Bruce McWilliams, Chairman of the Board. “In the last six months, he has focused on increasing IMI’s visibility, developing new customers and strengthening customer relationships while increasing the efficiency of our operation. Chris is an excellent executive and seasoned leader and I am looking forward to continuing to support him in his leadership role.”

“Bruce and Rick have been integral to IMI’s leadership team over the past years. I would like to thank them for the great expertise and support they have provided during my initial months at IMI,” said Kramer.  “I look forward to continuing to work with Bruce in his new role as non-executive Chairman and wish Rick all the best in his well-deserved retirement.  The Board and I know Bill very well, and we are confident he will do an outstanding job leading IMI’s financial activities going forward.”

Bill Roeschlein has served as IMI Vice President of Finance since August 2015.  Mr. Roeschlein has extensive experience as a finance executive. Prior to joining IMI, he was CFO at Aurora Algae, Power Integrations (POWI) and Determine Software, Inc. (formerly Selectica, Inc.). He also held senior financial management positions at Ultra Clean Technology, Asyst Technologies and Hewlett Packard.  Mr. Roeschlein is a CPA, with an MBA from Cornell University and a BA from UCLA.