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Peregrine Semiconductor Corp., a Murata company and the founder of RF SOI (silicon on insulator), today announces the acquisition of Arctic Sand Technologies. An MIT spin-off, Arctic Sand designs and manufactures low-power semiconductors for use in DC-DC power conversion applications. This strategic acquisition will accelerate Murata’s vision to revolutionize power electronics with the world’s smallest, most efficient power solutions.

“Arctic Sand is the epitome of an innovative startup,” says Jim Cable, chairman and CTO of Peregrine Semiconductor and global R&D director at Murata Manufacturing. “With this acquisition, Peregrine and Murata gain Arctic Sand’s disruptive technology, strong IP portfolio and world-class team. With a vision to revolutionize the power electronics industry, we’re building the power integrated circuit (IC) ‘dream team’. We will now leverage Peregrine’s semiconductor expertise to accelerate the adoption of Arctic Sand’s technology and their ability to ship in volume. With this acquisition, we’re one step closer to dramatically smaller, lighter, faster and more efficient power solutions.”

Through this acquisition, Arctic Sand’s low-power semiconductors will be added to Murata’s existing product lineup in order to enhance and expand its power module business in not just the telecommunications market, but also the data communications and industrial electrical markets. Furthermore, Murata will be able to accelerate Arctic Sand’s existing business targeting applications in mobile computing, smartphones and LCD display panels. Arctic Sand will continue to develop high efficiency power conversion ICs and now has the added benefit of Peregrine’s SOI semiconductor expertise and Murata’s industry-leading inductors, capacitors and packaging.

“Bringing together Arctic Sand’s low-power semiconductor technologies and Murata’s technologies will allow us to lead the way in providing products that satisfy the needs of customers in growing markets where there is demand for small footprints, low profiles and power savings,” says Norio Nakajima, executive vice president, Communication & Sensor Business Unit/Energy Business Unit, Murata Manufacturing Co., Ltd.

Arctic Sand’s technology delivers industry-leading power conversion efficiency so that platforms for a variety of applications can be made thinner. In certain applications, Arctic Sand’s technology reduces the space occupied by power components by 50 percent, reduces the height of component by 3x, reduces losses in power management by up to one half and increases platform run time by more than one hour. Combining this technology with Murata’s modular technologies will make it possible to provide solutions with high integration and excellent conversion efficiency in a wide range of low-power fields. Demand for these technologies is expected to grow even further as electrical and electronic components become smaller and thinner.

Peregrine, a subsidiary of Murata, originally identified Arctic Sand’s technology as a key component for successful development of disruptive power management solutions. Peregrine became a Murata company in Dec. 2014 and has since added a power electronics design team with focused efforts on fast switching active devices and innovative circuit design. With design centers in London and San Diego, Peregrine’s power IC team will integrate and collaborate with Arctic Sand’s teams in Boston and Silicon Valley.

“This highly synergistic acquisition will enable Arctic Sand’s disruptive technology to gain widespread market traction,” says Gary Davison, CEO of Arctic Sand Technologies, “With the added strengths of Murata and Peregrine, we can bring game-changing innovation to a power electronics market that desperately needs it.”

SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that it has moved its headquarters office to Milpitas, Calif. The new SEMI office is approximately five miles (eight kilometers) from the former location in San Jose, Calif.

SEMI is a global organization with offices in the U.S., China, Europe, India, Japan, Korea, Singapore and Taiwan. SEMI’s headquarters houses its global leadership and administration staff as well as Americas region personnel. Through maintaining its headquarters in Silicon Valley, SEMI continues to be connected to the region’s unique innovation ecosystem.

In addition to providing efficient and cost-effective office space for SEMI staff, the new facility features a dedicated conference center with configurable seminar rooms, modern infrastructure and amenities. The new facility better supports SEMI member networking and collaboration needs ─ from SEMI Standards and Special Interest Groups to SEMI’s network of Strategic Association Partners, including FlexTech, MEMS & Sensors Group (MSIG), and the Fab Owners Association (FOA).

SEMI Headquarters new location is:

SEMI

673 S. Milpitas Blvd.

Milpitas, CA 95035

“Our new location with its enhanced operational capabilities and efficiencies will help us better serve the growth and evolving needs of our members,” said Rich Salsman, CFO and VP of Operations at SEMI.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week announced its support for the House “Better Way” corporate tax reform proposal as an appropriate starting point for reform. The proposal is expected to be considered by Congress this year.

“The “Better Way” corporate tax reform blueprint would make America’s corporate tax system more competitive and allow U.S. semiconductor companies to grow, innovate, and create more jobs here in the United States,” said John Neuffer, president and CEO, Semiconductor Industry Association. “While there are many details of significance to our industry that need to be understood and addressed, we support the proposal as a framework for moving forward with tax reform.

“We recognize the debate is just getting underway. SIA intends to work closely with Congress and the Administration to pass corporate tax reform to improve the competitiveness of the United States as a location for semiconductor research, design, manufacturing, and export.”

The American Institute for Manufacturing Integrated Photonics (AIM Photonics), a public-private partnership advancing the nation’s photonics manufacturing capabilities, and Coventor, Inc., a semiconductor process modeling software company, today announced Coventor as the newest member of AIM Photonics.   Coventor will provide access to its unique, physics-driven 3D modeling technology to improve the performance and manufacturability of complex, integrated photonic designs.

“AIM Photonics partnership with Coventor is another key building block in expanding this vital ecosystem,” said John Maggiore, New York State photonics board of officers chairman. “We are creating nothing short of a revolution in integrated photonics for our members, companies in NY’s Photonic Valley, and across the U.S.”

“Tasked with fostering advanced research in integrated photonics to enable the United States to achieve global manufacturing leadership, AIM Photonics is building a membership that includes the country’s most innovative technology companies. Each member brings vital expertise to the initiative,” said Mr. Robert Duffy, chairman of the AIM Photonics Leadership Council. “Coventor’s process modeling capabilities are strategic to our success and will help ensure the manufacturability of photonic designs produced in the United States.”

AIM Photonics, managed by SUNY Polytechnic Institute, was established in 2015 as part of the National Network for Manufacturing Innovation, a federal initiative designed to foster innovation and deliver new capabilities that can ultimately create a nationwide manufacturing infrastructure for integrated photonics.

Coventor’s SEMulator3D platform provides a complete virtual fabrication environment that models actual semiconductor processes and parallels the capabilities of actual fabs. Coventor’s platform enables photonic device designers to perform “virtual” fabrication of their devices and accurately predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.

“We are excited to be working with AIM Photonics and SUNY Polytechnic Institute, two leading institutions in the development of the emerging photonic integrated circuit industry,” said Michael Jamiolkowski, President and CEO of Coventor. “Building upon our commercial experience in the semiconductor industry, we see our membership in AIM Photonics as essential to our mission in supporting the design and manufacturing of next generation, photonic integrated components.”

“Coventor’s expertise in process modeling brings value to AIM Photonics and its membership and is key to scaling and integrating photonic design into commercial applications,” said Dr. Michael Liehr, CEO of AIM and executive vice president of technology and innovation for SUNY Polytechnic Institute. “We look forward to working with Coventor on next-generation electronic-photonic design platforms that support first pass, high-yield manufacturing of advanced silicon photonic devices.”

Synopsys, Inc. (Nasdaq:  SNPS) today announced its collaboration with TSMC to develop DesignWare Interface, Analog and Foundation IP for TSMC’s 12FFC process. By offering a wide range of IP on TSMC’s latest low-power process, Synopsys is enabling designers to take advantage of the low leakage and small area advantages of the new process. Synopsys and TSMC have partnered on the development of Synopsys IP for advanced process technologies for more than two decades, resulting in a robust portfolio of IP supporting process technologies down to 7nm. Synopsys DesignWare IP for the 12FFC process enables designers to accelerate development of mobile SoCs that incorporate logic libraries, embedded memories, embedded test and repair, USB 3.1/3.0/2.0, USB-C 3.1/DisplayPort 1.3, DDR4/3, LPDDR4X, PCI Express 4.0/3.1/2.1, SATA 6G, HDMI 2.0, MIPI M-PHY and D-PHY and data converter IP.

“TSMC and Synopsys share a long history of providing designers with a wide range of high-quality IP on TSMC’s advanced FinFET processes,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “By developing IP on the latest TSMC 12FFC process, Synopsys is paving the way for designers to improve their SoCs’ leakage and lower overall costs.”

“As SoCs continue to incorporate more advanced functionality, designers are constantly challenged with meeting aggressive performance, power and area requirements,” said John Koeter, vice president of marketing for IP at Synopsys. “Our close collaboration with TSMC on the development of a broad range of IP for the 12FFC process will ensure that designers have timely access to the high-quality, proven IP solutions they need to achieve their design goals and quickly get their product to market.”

Synopsys is a provider of high-quality, silicon-proven IP solutions for SoC designs.

STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).  In high volume production for over seven years, STATS ChipPAC has led the industry in FOWLP technology innovations and unit shipments.

“As an early adopter of FOWLP, STATS ChipPAC set an aggressive course in pushing the boundaries of advanced package architecture and manufacturing capabilities long before its peers. We have delivered a number of breakthrough achievements in package density, form factor and heterogeneous integration while continually driving innovations in the manufacturing process to provide a proven, cost effective advanced packaging platform for our customers,” said Shim Il Kwon, Chief Technology Officer, STATS ChipPAC. “Shipping 1.5 billion eWLB packages is a testament to the growing adoption of this technology and the performance, size and cost advantages it provides to our customers.”

FOWLP or eWLB is an advanced packaging technology platform that provides ultra-high density interconnection, superior electrical performance and the ability to integrate multiple heterogeneous dies in a cost effective, low-profile semiconductor package. STATS ChipPAC has a comprehensive portfolio of eWLB package designs, including small die, large die, multi-die, multi-layer, Micro-Electro-Mechanical Systems (MEMS), 2.5D and 3D Package-on-Package (PoP) and System-in-Package (SiP) architectures. A number of eWLB technology milestones have been driven by STATS ChipPAC such as dense vertical interconnections as high as 500 – 1,000 I/O, very fine line width and spacing down to 2um/2um and ultra-thin package profiles below 0.3mm (including solderball) for single packages and below 0.6mm for a stacked PoP with proven warpage control.

Although there are multiple variations of fan-out packaging in development in the industry, eWLB is the only FOWLP solution in the market today that has been in high volume manufacturing for over seven years. STATS ChipPAC has been instrumental in driving important optimizations in the manufacturing process and infrastructure. The eWLB manufacturing process has evolved into the innovative FlexLineTM manufacturing method which was introduced and implemented by STATS ChipPAC in 2014.  The FlexLineTM method delivers unprecedented flexibility in producing both fan-out eWLB and fan-in wafer level chip scale packages (WLCSP) on the same manufacturing line for higher economies of scale and lower cost.

“The depth of production experience we have gained over the years has enabled STATS ChipPAC to continually refine and optimize the eWLB manufacturing process to drive higher output and lower cost per unit. We have made significant capital investments over the years to expand our capacity and continue to increase our production volume to support growing customer demand,” said Cindy Palar, Managing Director, STATS ChipPAC Singapore. “Our 1.5 billion unit milestone reflects the confidence our customers have in eWLB technology and our ability to deliver an advanced packaging solution that best meets the cost and performance targets for their product requirements.”

Currently all leading mobile products as well as some consumer electronics contain eWLB packages that are baseband processors, RF transceivers, connectivity devices, near field communication (NFC), security devices, MCUs, memory, memory controllers, RF MEMS and power management ICs (PMICs). The compelling performance, integration and size advantages of eWLB are also accelerating customer adoption in new and emerging market segments such as the Internet of Things (IoT), wearable electronics, millimeter wave (mmWave) technology for 5G wireless devices, MEMS and sensors, and automotive applications such as Advanced Driver Assistance Systems (ADAS).

SEMI, the global association connecting and representing the worldwide electronics manufacturing supply chain, today reported that worldwide sales of semiconductor manufacturing equipment totaled $41.24 billion in 2016, representing a year-over-year increase of 13 percent. 2016 total equipment bookings were 24 percent higher than in 2015. The data are available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report, now available from SEMI.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings and bookings figures for the global semiconductor equipment industry. The report, which includes data for seven major semiconductor producing regions and 24 product categories, shows worldwide billings totaled $41.24 billion in 2016, compared to $36.53 billion in sales posted in 2015. Categories cover wafer processing, assembly and packaging, test, and other front-end equipment. Other front-end includes mask/reticle manufacturing, wafer manufacturing, and fab facilities equipment.

Spending rates increased for Rest of World (primarily Southeast Asia), China, Taiwan, Europe and South Korea while the new equipment markets in North America and Japan contracted. Taiwan claimed the largest market for new semiconductor equipment for the fifth year in a row with $12.23 billion in equipment sales. South Korea remained the second largest market for the second year in a row. The market in China increased 32 percent, surpassing both Japan and North America to become the third largest market. The 2016 equipment markets in Japan and North America fell to fourth and fifth place, respectively. The global other front-end segment decreased 5 percent; the wafer processing equipment market segment increased 14 percent; total test equipment sales increased 11 percent; and the assembly and packaging segment increased 20 percent.

Semiconductor Capital Equipment Market by World Region (2015-2016)

2016
2015
% Change
Taiwan
12.23
9.64
27%
South Korea
7.69
7.47
3%
China
6.46
4.90
32%
Japan
4.63
5.49
-16%
North America
4.49
5.12
-12%
Rest of World
3.55
1.97
80%
Europe
2.18
1.94
12%
Total
41.24
36.53
13%

Source: SEMI (www.semi.org) and SEAJ, March 2017; Note: Figures may not add due to rounding.

Versum Materials, Inc. (NYSE: VSM), a materials supplier to the semiconductor industry, announced today it received the “Excellent Performance Award” by the world’s largest dedicated semiconductor foundry, Taiwan Semiconductor Manufacturing Company Limited (TSMC). TSMC maintains a rigorous supply chain, and each year recognizes its most valuable suppliers who have made an outstanding contribution to the supply of advanced materials and equipment used in semiconductor manufacturing processes. On February 23, 2017, Versum Materials received the prestigious “Excellent Performance Award” from TSMC in the Taiwanese city of Hsinchu for its contributions to TSMC.

SMC recognized Versum Materials for developing a new formulated post etch residue remover, a sustainable alternative to the material previously supplied for cleaning aluminum interconnects and pads. The new product advances TSMC’s green manufacturing initiatives by removing undesirable organic solvents in the product, process and eventually the waste stream. Furthermore, the new product reduces the required number of post-cleaning steps and cuts energy use during the manufacturing process at TSMC.

TSMC also credited Versum Materials for the positive impact its increased local presence had around improving the development responsiveness and cycle time affiliated with the new product development in the advanced materials realm. Additionally, TSMC cited superior technical support and reliable supply for our precursor offerings in the Advanced Deposition Materials (ADM) platform.

“We thank TSMC for recognizing Versum Materials with this prestigious award. The development of this new product demonstrates the importance of collaborating with our customers to drive technology forward, while also creating differentiated value for the customer. By working closely together with TSMC, we helped to further reduce their products’ environmental footprints,” stated Edward Shober, Senior Vice President, Materials at Versum Materials. “This award reflects the commitment that the entire company provides to TSMC, including our marketing, commercial, technology, operations, supply chain, procurement, EH&S and engineering teams.”

Entegris Inc. (NASDAQ: ENTG), a manufacturer of specialty chemicals and advanced materials handling solutions for the microelectronics industry, today announced it has signed an agreement with Spectrum Materials (Fujian) Co., Ltd. to expand its presence in China. According to the agreement, Spectrum Materials, a manufacturer and distributor of specialty chemicals, will manufacture Entegris specialty chemicals products at Spectrum Materials’ Quanzhou facility.

“We are excited about this partnership, as it will significantly improve our capabilities to meet growing demands for specialty chemicals in the industries we serve,” stated Entegris Senior Vice President of Specialty Chemicals and Engineered Materials, Stuart Tison. “Spectrum Materials is a well-established company in China that has experience supplying related high-purity chemicals and shares our expectations for quality and manufacturing standards. As we have done in other global regions, we continue to look for ways to better serve our customers and to add value with local collaboration, business processes and resources.”

Entegris currently manufactures specialty chemicals in both the U.S. and South Korea and has business operations in Beijing, Shanghai and Xi’an, China. The partnership with Spectrum Materials will expand its capability in China and shorten its supply chain for Chinese customers. This relationship is part of a broader strategic commitment by Entegris to support the growing semiconductor and related microelectronics industries in China.

“We are pleased to partner with Entegris in the manufacturing of its industry-leading specialty chemical products in China,” said President of Spectrum Materials, Guofu Chen. “Our new expansion, combined with Entegris manufacturing technology, establishes a world-class facility for the production of Entegris’ semiconductor grade specialty chemicals in China.”

Spectrum Materials will use a copy-exact manufacturing process to match existing Entegris processes and equipment and will implement the same quality control system in the manufacturing process.

Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC). SEMICON China (March 14-16) offers the latest in technology and innovation for the electronics manufacturing industry. FPD China is co-located with SEMICON China, providing opportunities in this related market. Featuring nearly 900 exhibitors occupying nearly 3,000 booths, SEMICON China is the largest gathering of its kind in the world.

Worldwide fab equipment spending is expected to reach an industry all-time record, to more than US$46 billion in 2017, according to the latest version of the SEMI (www.semi.org) World Fab Forecast. In 2018, the record may break again, with spending close to the $50 billion mark.  SEMI forecasts that China will be third ($6.7 billion) for regional fab equipment spending in 2017, but its spending in 2018 may reach $10 billion – which would be a 55 percent increase year-over-year, placing China in second place for worldwide fab equipment spending in 2018.

On March 14, keynotes at SEMICON China include SMIC chairman of the Board Zhou Zixue. ASE Group director and COO Tien Wu, ASML president and CEO Peter Wennink, Intel VP Jun He, Lam Research CEO Martin Anstice, TEL CTO Sekiguchi Akihisa and imec president and CEO Luc Van den hove.

SEMICON China programs expand attendees’ knowledge, networking reach, and business opportunities. Programs this year feature a broad and deep range:

  • CSTIC: On March 12-13, the China Semiconductor Technology International Conference (CSTIC) precedes SEMICON China. CSTIC is organized by SEMI and imec and covers all aspects of semiconductor technology and manufacturing.
  • Technical and Business Programs: 
    • March 14: China Memory Strategic Forum.
    • March 15: Building China’s IC Ecosystem, Green High-Tech Facility Forum, and Smart Manufacturing Forum, in addition Power & Compound Semiconductor Forum (Day 1).
    • March 16: Smart Automotive Forum, MEMS & Sensors Conference Asia, plus Power & Compound Semiconductor Forum (Day 2)
  • Tech Investment Forum: On March 15, an international platform to explore investment, M&A, and China opportunities.
  • Theme Pavilions:  SEMICON China also features six exhibition floor theme pavilions: IC Manufacturing, LED and Sapphire, ICMTIA/Materials, MEMS, Touch Screen and OLED.
  • Networking Events: SEMI Industry Gala, China IC Night, and SEMI Golf Tournament

For additional information on sessions and events at SEMICON China 2017, please visit www.semiconchina.org/en/4.