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Applied Materials, Inc. announced today that Dr. Om Nalamasu, Senior Vice President and Chief Technology Officer, has been elected to the U.S. National Academy of Engineering (NAE), one of the highest professional honors for engineers. Dr. Nalamasu received the distinction for technical innovation spanning materials development, atomically controlled thin-film fabrication, and commercialization in microelectronics and energy generation and storage.

“Om has a passion for inspiring innovation and developing engineering talent,” said Gary Dickerson, President and CEO of Applied Materials. “This well-deserved recognition honors the many contributions Om has made throughout his career to pursue technical breakthroughs and advance the technology that is now part of our everyday lives.”

Dr. Nalamasu is a world-renowned expert in materials science and has made seminal contributions to the fields of optical lithography and polymeric materials science and technology. As a champion for a global innovation culture, he has built a world-class team to support Applied’s leadership in materials engineering, and solidified strategic relationships with universities, government organizations and research institutes around the world. He also serves as president of Applied Ventures, LLC, the venture capital fund of Applied Materials, where he oversees investments in early- and growth-stage companies. Prior to joining Applied in 2006, Om was a NYSTAR Distinguished Professor of materials science and engineering at Rensselaer Polytechnic Institute, where he also served as Vice President of Research. Before that he served in several leadership roles at Bell Laboratories.

“It is a tremendous honor to join such a distinguished community of engineers and technologists,” said Dr. Nalamasu. “There has never been a more exciting time to be an engineer and develop innovative solutions that help solve the world’s toughest challenges.”

Dr. Nalamasu has received numerous awards, authored more than 180 papers, review articles and books, and holds more than 200 worldwide issued or pending patent applications. He is a member of the board of directors of The Tech Museum in Silicon Valley and serves on several national and international advisory boards. Born in Hyderabad, Telangana, India, he earned a B.Sc. from Osmania University, a M.Sc. from the University of Hyderabad and received his Ph.D. from the University of British Columbia, Vancouver, Canada.

Founded in 1964, the NAE strives to advance the well-being of the nation by promoting a vibrant engineering profession and by marshalling the expertise and insights of eminent engineers to provide independent advice to the federal government on matters involving engineering and technology.

The flat-panel display (FPD) industry is in the midst of a historic wave of building new factories to manufacture active matrix organic light emitting diode (AMOLED) displays. This will drive $9.5 billion worth of AMOLED-specific production equipment purchases in 2017, according to IHS Markit (Nasdaq: INFO).

amoled equipment

According to the IHS Markit Display Supply Demand & Equipment Tracker, the equipment used for producing TFT backplanes will account for 47 percent of the total market in 2017, worth $4.4 billion in revenues. Organic light-emitting layer deposition and encapsulation tools will generate record revenues of $2.2 billion and $1.2 billion, respectively, this year.

“A variety of approaches can be used to deposit OLED materials. However, fine metal mask (FMM) evaporation tools, used for high-resolution mobile display production, account for the majority of the deposition equipment revenue in the current wave of new factory construction,” said Charles Annis, senior director at IHS Markit.

Evaporation machines are technically highly complicated, consisting of multiple cluster vacuum tools linked by robots. Each tool consists of evaporation sources and mask-docking capabilities, and requires substantial pumping systems. The tools are typically very large and can exceed 100 meters in length at a high-volume production factory. This subsequently requires significant capital outlays.

“The market for high-performance AMOLED deposition equipment is dominated by Canon Tokki, which accounted for over half of the market in 2016,” Annis said. “At least five other evaporation makers are rushing to take advantage of the explosive market opportunity. However, with strong panel maker interest in Canon Tokki’s unrivaled mass production experience, we expect the company to make further market share gains in 2017.”

AMOLEDs also require high-performance encapsulation to prevent sensitive organic light-emitting materials from environmental degradation. Encapsulation barriers are typically fabricated from metal, glass or stacks of thin films. However, a substantial share of the new AMOLED factories now under construction will target production of plastic, flexible displays, which rely on cost intensive, multi-layer thin film encapsulation (TFE).

“Flexible AMOLED makers have done an incredible job simplifying their TFE structures over the past several years. Even so, the productivity of depositing high-quality inorganic films and printing organic layers all in a closed environment remains a complicated challenge,” Annis said. “The requirement of a large number of deposition chambers and auxiliary tools make TFE lines one of the largest segments of the AMOLED equipment market.”

With an estimated $23 billion of expenditures on AMOLED production equipment between 2016 and 2018, equipment makers, particularly those offering deposition and encapsulation solutions, will be enjoying a historic sales opportunity.

The IHS Markit Display Supply Demand & Equipment Tracker covers metrics used to evaluate supply, demand and capital spending for all major FPD technologies and applications.

Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc., supplier of on-chip network (NoC) and power management technologies and services, was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman.

“It is an honor and a privilege to be named chairman of the ESD Alliance by my peers on the board,” remarks Pierce. “This is a great opportunity to help guide the organization through the transformation it began in 2016 to broaden its focus to system issues encompassing hardware, software, and design. My experience at Sonics straddling both the system-on-chip IP hardware and design software businesses should serve as a strong unifying asset in this leadership role on the board.”

In a related move, Bob Smith, executive director of the ESD Alliance, joined the board of directors as part of a recent amendment that updated the ESD Alliance bylaws to reflect the broader mission of the organization.

Other board members are:

  • Aart de Geus, chairman and CEO of Synopsys, Inc.
  • Dean Drako, president and CEO at IC Manage
  • Amit Gupta, president and CEO from Solido Design Automation
  • John Kibarian, president, CEO and co-founder of PDF Solutions, Inc.
  • Lucio Lanza, managing director at Lanza techVentures
  • Walden C. Rhines, chairman and CEO from Mentor Graphics Corporation
  • Simon Segars, ARM’s CEO
  • Lip-Bu Tan, president and CEO of Cadence Design Systems

“I’m pleased with the board’s selection of Grant Pierce to chair our organization,” says Smith. “He is an active board member, whose varied industry experience and well-honed skillset will help us forge ahead. He and I had the opportunity to work together on several projects and I welcome the chance to work more closely with him.”

Grant A. Pierce, a co-founder of Sonics, Inc., was elected to the ESD Alliance (formerly the EDA Consortium) Board of Directors in 2014 and will serve as chairman until the next board elections in 2018. He has served as Sonics’ CEO and president and as chairman of the board of directors since 1997. Over the earlier part of his more than 30-year career in high technology, Pierce served in senior management roles in a wide range of companies that built digital media and communications devices, object-oriented software development environments, fabless semiconductors, mini-computer systems, and peripherals. Pierce is a former certified public accountant and began his career with Arthur Andersen and Co.

Toshiba Corporation (TOKYO:6502) today announced that it has started construction of a new semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.

Fab 6 will be dedicated to production of BiCS FLASH, Toshiba’s 3D Flash memory. Like Fab 5, construction will take place in two phases, allowing the pace of investment to be optimized against market trends, with completion of Phase 1 scheduled for summer 2018. Toshiba will determine installed capacity and output targets and schedules by closely monitoring the market.

Toshiba will also construct a Memory R&D Center adjacent to the new fab, with completion targeting December 2017. The facility will advance development of BiCS FLASH and new memories.

Toshiba is determined to enhance its competitiveness in the memory business by timely expansion of BiCS FLASH production in line with market trends, and to retain leadership in innovation in the memory business.

SEMICON Korea 2017, opening today at COEX in Seoul, celebrates its 30th anniversary with its largest-ever exhibition. The gathering of the Korean semiconductor and electronics supply chain, SEMICON Korea runs February 8 to 10 and features 600 exhibiting companies and expects more than 40,000 attendees.

SEMI, the global industry association representing more than 2,000 companies in the electronics manufacturing supply chain, and host of global SEMICONs, held a press conference this morning.  SEMI’s Dan Tracy reported the global semiconductor industry has an upbeat outlook for 2017 with key electronics drivers including storage, industrial, wireless and automotive. For overall semiconductor equipment, demand is expected to increase 9 percent, according to the SEMI 2016 Year-End Equipment Forecast.

Korea is expected to make the largest regional investment, globally, in semiconductor fab equipment at a projected US$9.7 billion in 2017, a 36 percent increase over 2016. For fab materials markets, Tracy expects 3.1 percent growth globally in 2017, and 4.3 percent in Korea ($4.8 billion).

Highlights of SEMICON Korea:

  • At the Opening Ceremony on February 8, in honor of SEMICON Korea’s 30-year anniversary, Yong-Han LEE, Chairman of SEMI’s Board of Directors (BoD), will address the attendees, followed by SEMI BoD members and Korean industry leaders cutting the ceremonial ribbon and opening the doors.
  • Four industry thought leaders ─ from SK Hynix, Hewlett-Packard, imec and Microsoft ─ will present keynote insights on the future of the global semiconductor industry, immediately following the opening ceremony.
  • The Supplier Search Program has been expanded this year with 70 meetings arranged; seven of the world’s leading companies (Samsung, SK Hynix, Intel, Micron, SONY, Toshiba and Lam Research) will look for new suppliers.
  • The Presidents Reception – an exclusive VIP networking event with more than 450 global industry leaders ─ is the premier executive connection opportunity, continuing to mark the growth of the Korea semiconductor industry over the last 50 years.
  • A sold-out exhibition brings the top companies to SEMICON Korea to connect with customers and decision makers and to demonstrate product and technology leadership. The exposition includes deep technical networking and business programs that give insight into the full Korean electronics manufacturing ecosystem.

SEMICON Korea 2017 is the leading semiconductor technology event for market trends and breaking technology developments, featuring technical forums, business programs and standards activities. The event is an opportunity to meet and learn from more 100 global experts.

For more information on SEMICON Korea, visit www.semiconkorea.org/en/.

UniPixel, Inc. (NASDAQ: UNXL), a provider of high performance metal mesh capacitive touch sensors to the touchscreen and flexible display markets, announced today positive results from in-house testing conducted on its XTouch touch screen sensors for use in future flexible/foldable display devices such as smartphones, tablets, and wearable devices.

  • UniPixel conducted tests in which its XTouch sensors were folded and opened more than 200,000 times at a 2-millimeter radius at the fold.
  • During the tests, as well as at the conclusion of those tests, there was no damage to the XTouch sensors and no degradation to their performance capabilities.

Flexible displays will also need to have a thin and pliable cover lens that will bend consistently without damage.

  • UniPixel’s Diamond Guard scratch resistant cover lens technology is an excellent complement to XTouch sensors as it is applied in a very thin layer and will bend and seamlessly fold as it protects the underlying touch sensor metal mesh from abrasion damage.

Jalil Shaikh, chief operating officer of UniPixel, commented, “The results of our in-house testing were very positive. As flexible displays require thin and pliable touch sensors and cover lenses, our proprietary XTouch sensors and Diamond Guard are ideally suited for flexible display applications. We have already demonstrated to a major original equipment manufacturer (“OEM”) that our XTouch sensors deliver optimal performance with a lens coating as minute as five microns. As far as we are aware our XTouch sensors are the only sensors available that operate effectively with such a thin cover lens coating.

“We believe that as flexible technologies make their way to the market, our proprietary XTouch and Diamond Guard technologies can become staple components in a broad array of products. While foldable displays are in early consideration by OEMs, our products now meet the early specifications OEMs have targeted to create devices that work effectively with the necessary durability for broad market acceptance.”

Nexperia, the former Standard Products division of NXP, today announced the formal completion of its launch as a separate entity. Headquartered in Nijmegen, Netherlands and backed by a consortium of financial investors consisting of Beijing Jianguang Asset Management Co. Ltd and Wise Road Capital Ltd, Nexperia is a stand-alone, world-class leader in discretes, logic and MOSFETs, retaining all the expertise, manufacturing resources and key personnel of the former NXP division, while bringing a new focus and powerful commitment to these product areas.

Nexperia, which will produce around 85 billion devices a year and in 2016 had revenues exceeding US$1.1B, addresses three key trends: power efficiency; protection and filtering; and miniaturization. The Automotive sector is very strong for Nexperia and mostof its products are AECQ101 qualified. Other important markets include portable devices, industrial, communications infrastructure, consumer and computing. A significant portion of the company’s revenue is delivered through distribution channels.

Nexperia CEO Frans Scheper, formerly EVP and GM of NXP’s Standard Products Business Unit, comments: “Our history ensures that Nexperia is already regarded as a strong industry leader in discretes, logic and MOSFETs, which consistently delivers highly reliable and innovative products to our global customers. Under the new ownership and with a renewed sense of vigour we will invest in product development and best-in-class manufacturing practices and facilities to ensure that Nexperia becomes the byword for efficiency and quality. Together with our engaged and motivated employees this will enable us on a daily basis to exceed the needs and expectations of our customers.”

Nexperia has two front-end manufacturing facilities, in Manchester, UK and Hamburg, Germany, and three back-end packaging plants in Guangdong, China, Seremban, Malaysia and Cabuyao, Philippines. It currently employs about 11,000 personnel worldwide including an established and successful leadership team. Scheper continues: “Because Nexperia will continue to source its front end and back end production from its current manufacturing sites, there will be no disruption in our supply chain or other processes, so customers and partners can be fully assured that they will continue to receive excellent products and exceptional service.”

The company has an extensive IP portfolio and is certified to ISO9001, ISO/TS16949, ISO14001 and OHSAS18001.

Entegris, Inc. (NASDAQ: ENTG), a developer in specialty chemicals and advanced materials handling solutions for the microelectronics industry, announced today it has introduced a new platform for advanced gas purification that improves wafer yields for semiconductor and LED applications. The new family of GateKeeper Gas Purification Systems (GPS) applies new purification media to provide best-in-class gas purity at a wide range of flow rates with a reduced equipment footprint. With expanded capacity in South Korea, Entegris now manufactures GateKeeper GPS systems in both North America and Asia.

“Our customers face unprecedented contamination control challenges to efficiently manufacture today’s increasingly complex leading-edge-devices. The new Gatekeeper GPS family of systems provide the advanced solutions required to maximize yield in these environments,” said Entegris Senior Vice President of Microcontamination Control, Clint Haris. “In conjunction with these new technology introductions, we continue our investments in our North America and Asia facilities to expand our global service and manufacturing capabilities.”

Semiconductor processes for advanced nodes, as well as LED manufacturing requirements, call for increased purity to remove defect-causing contaminants found in process gases. The GateKeeper GPS family of systems removes a variety of contaminants from gas streams down to the parts-per-trillion level and can be configured to a wide range of flow rates. Gases purified include CDA, N2, H2, H2 for EUV, Ar and NH3. Additionally, manufacturers are looking for tools that require significantly less sub-fab floor space. The reduced footprint allows customers to devote valuable sub-fab floor space to other tool needs or increase purification capacity with additional systems.

“We collaborated closely with our customers to identify purity requirements to meet their need to remove new contaminants and increased sensitivity to known contaminants,” said Director of Gas Purification Product Management, Jordan Ruple. “As a result, we are proud to be the first to offer this level of purity – in a variety of gases and flow rates – for systems of this size.”

The latest GateKeeper system will be on display during the SEMICON Korea trade show in Seoul, February 8-10, 2017.

Kinetics Holding GmbH, a full-service process and mechanical contractor for high-technology markets worldwide, announced today the acquisition of Wafab International Inc., a global supplier of wet processing stations and components. Wafab’s line of specialized chemical deposition tools and established customer base immediately expands Kinetics’ current product portfolio and overall turnkey offering to broaden its global reach and better serve its semiconductor and solar customers from R&D to volume manufacturing.

Combining the two entities strengthens Kinetics’ U.S. capabilities and pushes it further into the equipment market with a deeper solution-based offering. In addition to its process media distribution systems, Kinetics can now offer customers a complete solution with an emphasis on process-driven applications that move business from the sub-fab into the cleanroom, resulting in higher margins and closer involvement with the end-customer. At the same time, Wafab’s core wet bench business will benefit from an international sales organization that can introduce Wafab products to customers around the globe.

“There is obvious synergy between our two companies, both in technology and business,” said Peter Maris, Kinetics CEO. “We’ve realized a good working relationship since we first began our cooperation in 2015, and this deal supports our vision for global expansion and continued leadership in providing turnkey process systems and sustaining services. Together with Wafab’s domestic equipment manufacturing capability and strength in wet bench technology, Kinetics is well positioned to benefit from its relationships within the university and research lab markets. Inheriting a solid customer base in conjunction with our newly combined service offering opens the doors to even further market penetration.”

In conjunction, as part of its overall turnkey strategy, Kinetics also announced that it has combined its equipment, facility management and equipment engineering businesses, including the Wafab products, into one global operating entity. This allows the company to provide a fully integrated solution to customers who want to simplify their supplier base. The newly established Kinetics Solutions Group (KSG) will have responsibility for all sales, product management, equipment engineering, manufacturing, startup and commissioning and technology innovation.

Wafab’s facility in Livermore, Calif will serve as the main hub for the U.S. equipment and facility management businesses. Wafab excels in developing process technology in a high purity environment; a niche market served by only a few equipment suppliers. Its core products comprise primarily new and refurbished wet benches for processing chemicals and etching wafers.

“Wafab has prided itself on delivering excellence in high purity chemical deposition tools to the R&D and university markets for 20-plus years,” said Jorge Freitas, Wafab general manager. “We are excited to become part of the Kinetics family and look forward to the exposure and opportunities that being part of this global organization will provide.”

Following economic leaders meeting in Switzerland for the World Economic Forum, electronics manufacturing executives will attend Europe’s SEMI Industry Strategy Symposium (ISS Europe) in Munich, Germany on 5-7 March. Hosted by SEMI Europe, the Symposium brings together leading analysts, researchers, economists, and technologists for critical insights on the forces shaping the electronics manufacturing supply chain. ISS Europe 2017 is the three-day flagship business event that discusses how to cope with the rapid changes and growing challenges of the digital revolution.

“ISS Europe is the leading European strategic platform where industry thought leaders across the electronics manufacturing value chain share the latest analysis and outlooks.  The conference covers global industry trends and challenges and opportunities from innovation, materials, design, and manufacturing – with a focus on end-applications in automotive, health care and smart manufacturing,” said Laith Altimime, president, SEMI Europe.

Twenty industry leaders will present insights into the current market developments, including:

  • AUDI AG: Berthold Hellenthal, Robust Design / Komponentenerprobung Elektronik, Cross-Industry Collaboration Networks Accelerate Innovations
  • Dresden University Hospital: Christopher Piorkowski, professor at the Heart Center, Digital Health in Cardiovascular Medicine: Patients, Sensors, and Clinical Care
  • Mentor Graphics: Wally Rhines, CEO, Semiconductor Consolidation versus Specialization: What’s the Driving Force for Mergers?
  • Imec: Ann Stegen, executive VP, Transformation into a 7nm Logic Node Solution with Fundamental Advantages
  • Robert Bosch: Birte Lübbert, senior VP, Smart Manufacturing by Bosch in Reutlingen Plant 2
  • TSMC Europe: Dan Kochpatarin, Senior Director, High Performance Applications to Drive Innovation and Collaboration

Join Europe’s strategic thinkers and business drivers at ISS Europe 2017 in Munich (Germany) from March 5-7, 2017!  Register here. For more information visit: www.semi.org/eu/iss-europe-2017