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STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has been ranked among the world’s top 10 semiconductor equipment manufacturing companies in the 2016 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world’s largest professional association for the advancement of technology. This is the seventh consecutive year that STATS ChipPAC has been recognized in the annual scorecards.

The 2016 Patent Power Scorecards are based on objective, quantitative benchmarking of U.S. Patent and Trademark Office records by 1790 Analytics, an Intellectual Property (IP) evaluation firm. The patent portfolios of more than 6,500 leading commercial enterprises, academic institutions, nonprofit organizations, and government agencies worldwide were reviewed through the end of 2015.  The scorecards rate the most valuable IP portfolios based on several factors including the size of an organization’s patent portfolio, quality, impact, originality and general applicability.

STATS ChipPAC was ranked eighth in the Semiconductor Equipment Manufacturing scorecard, the highest ranking received by an Outsourced Semiconductor Assembly and Test (OSAT) provider for the year. As of the end of 2015, STATS ChipPAC had been granted more than 1,500 patents by the U.S. Patent and Trademark Office (USPTO). STATS ChipPAC has been the leading U.S. patent holder among OSAT providers worldwide since 2011 and has built up a patent portfolio in which advanced or future technologies comprise more than 65% of its IP, significantly higher than other OSATs in the industry.

“Year after year we have continued to focus on technology innovation and prioritized our investments in key areas such as wafer level packaging, flip chip interconnection, System-in-Package (SiP), 2.5D and 3D integration. By driving technology development in these areas, we are able to provide innovative integration solutions that enable our customers to differentiate their products in the marketplace,” said Shim Il Kwon, Chief Technology Officer, STATS ChipPAC. “With the combined strength of the JCET Group, we offer our customers an IP portfolio that is unmatched in the OSAT industry.”

Analog Devices, Inc. (NASDAQ: ADI), a developer of high-performance semiconductors for signal processing applications, today announced that Mark M. Little, former Senior Vice President, GE Global Research and Chief Technology Officer of General Electric Company, has been elected as a Director of the Company, and that the Board of Directors of the Company intends to elect Robert H. Swanson, Executive Chairman of Linear Technology Corporation, as a Director following the closing of the Company’s acquisition of Linear Technology Corporation. Richard Beyer and John Hodgson will retire from the Company’s Board of Directors, effective as of the Company’s 2017 Annual Meeting of Shareholders.

“We are very grateful to Rich and John for their years of dedicated service to ADI, and for their wise counsel as members of our Board,” said Ray Stata, ADI Chairman of the Board. “We are pleased to welcome Mark Little as a new Director, and we are also looking forward to Bob Swanson joining the Board following our acquisition of Linear Technology Corporation.”

Dr. Little is the former Senior Vice President, GE Global Research and Chief Technology Officer of General Electric Company, a global digital industrial company. Dr. Little joined GE in 1978, and during his 37-year tenure, held management positions in engineering and business, culminating with his most recent position, which he held from 2005 to 2015. In addition to his technology leadership, Dr. Little led several multi-billion dollar business units at GE including GE Energy’s power-generation segment. Dr. Little holds bachelor’s and master’s degrees in mechanical engineering from Tufts and Northeastern universities, respectively, and a Ph.D. in mechanical engineering from Rensselaer Polytechnic Institute.

Mr. Swanson, a founder of Linear Technology, has served as Executive Chairman of the Linear Technology board of directors since January 2005. Prior to that time, he served as Chairman and Chief Executive Officer of Linear Technology since its incorporation in 1981. Mr. Swanson has a B.S. degree in Industrial Engineering from Northeastern University.

On July 26, 2016, ADI and Linear Technology entered into an agreement and plan of merger that provides for the acquisition of Linear Technology by the Company. The Company and Linear Technology currently expect the acquisition to be completed by the end of the Company’s second fiscal quarter of 2017, subject to receipt of the remaining required regulatory approvals and subject to the satisfaction or waiver of the other conditions contained in the merger agreement. The Board of Directors of the Company intends to elect Mr. Swanson to the Board at the later of the completion of the acquisition or the Board of Directors meeting following the Company’s 2017 Annual Meeting of Shareholders, currently anticipated to be held on March 8, 2017.

TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan- out WLP (FO-WLP). Driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices such as smart watches, fitness bands, and virtual reality headsets, fan-in WLPs are projected to have a >10% growth rate from 2015 to 2020. Starting from shipments of a few hundred million packages in 2015, FO-WLP shows a staggering growth rate of 82% over the five-year period. The use of FO-WLP for RF, audio CODEC, and power management ICs, coupled with Apple’s adoption of TSMC’s InFO FO-WLP as the bottom package-on-package (PoP) in Apple’s iPhone 7, is driving unit volume shipments. Automotive radar, connectivity modules, and other applications promise continued growth for FO-WLPs. Cost-reduction pressures are driving the development of alternatives to reconstituted wafer FO-WLP in the form of large area panel processing and flip chip on coreless or thin core substrates. Chip package interaction (CPI) is analyzed for WLPs and flip chip.

TechSearch International’s new study, Flip Chip and WLP: Market Forecasts and Technology Analysis, provides detailed analysis of the drivers for fan-in WLP, FO-WLP, and flip chip. The detailed analysis is based on the company’s 29-year history of studying markets and critical technology and infrastructure issues.

Driven by small size devices such as filters, low noise amplifiers, power amplifiers, and switches found in smartphones, flip chip growth shows >13% CAGR in unit volume from 2015 to 2020. Documentation of the continued transition to Cu pillar is provided. Flip chip applications, bump types, and pitch trends are based on extensive interviews and research. Flip chip assembly options are discussed. Growth in gold bumping for LCD driver ICs is included. A critical analysis of planned capacity and utilization is provided for each geographic region, showing projections for strong growth in China.

The 115-page report with full references provides forecasts for the flip chip wafer bumping market by application, device type, number of wafers, and die shipments. Merchant and captive capacity is included. Forecasts for fan-in and FO-WLP demand are projected in number of die and wafer shipments. Bumping, wafer level packaging, substrate suppliers, assembly equipment, underfill material, and contract assembly service providers are listed. A set of 78 PowerPoint slides accompanies the report.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 17,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.

According to the latest market study released by Technavio, the global large area displays market is expected to reach USD 78.41 billion by 2021, growing at a CAGR of close to 2%.

This research report titled ‘Global Large Area Displays Market 2017-2021’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. The report takes into consideration the unit shipments of liquid crystal display (LCD) and organic light-emitting diode (OLED)/active matrix OLED (AMOLED) displays greater than 9 inches in size and the revenues generated from their sales during the forecast period.

OLED displays are thinner, lighter, more flexible, and emit brighter colors than other existing display technologies such as LCDs. Unlike LCDs, these do not require a backlight and have a fast response time of 0.01 milliseconds. OLED displays are flexible. Curved OLED TVs and other devices that utilize this feature offer a better viewing angle to users. OLED displays consume less power because of the phosphorescent organic material, which has better conversion rate than LCDs.

Technavio’s hardware and semiconductor analysts categorize the global large area displays market into the following segments by application:

  • Televisions
  • Notebooks
  • Monitors
  • Tablets
  • Others (public displays and digital signage)

The top three application segments of the global large area displays market are:

Global large area television displays market

In 2016, the television segment dominated the market, accounting for a share of 39.2% in terms of unit shipments, primarily because of strong growth of 4K TVs of 40 inches and larger. In 2015, many manufacturers introduced 4K TVs of size 50 inches and above.

According to Chetan Mohan, a lead displays research analyst from Technavio, “Broadcast companies such as Netflix have already started broadcasting 4K UHD content because of the popularity of this format. In 2014, Netflix began streaming popular TV series House of Cards and Breaking Bad in UHD format, which is likely to boost the demand for 4K televisions.”

Global large area notebook displays market

The new operating system and the calculating platform drive the market for new notebooks. Windows 10, which was launched in the third quarter of 2015, generated renewed interest among notebook users. This resulted in more than 10% growth in unit shipment compared with second quarter of 2015.

“Vendors including Dell, Lenovo, and HP recorded a quarterly rise in the third quarter of 2015. Apple, which launched 12-inch MacBook Air in the second quarter of 2015, witnessed growing demand in the third quarter,” says Chetan.

Global large area monitor displays market

Monitors were the third largest segment in 2016, accounting for 19.45% of the market share. The majority of desktop monitors use LCD technology. LCDs consume low power, less space, and are lighter compared with CRT displays. LCD monitors are mainly used by enterprises for office use and by consumers for video and audio entertainment use. However, advances in technology and the rising demand for HD and UHD content as compared with SD content are likely to drive the demand for OLED/AMOLED displays for PC monitors, especially gaming PCs.

Unlike consumers, enterprises that purchase monitors for office use do not put enough emphasis on technological aspects such as high resolution and wide-viewing angle. Technavio analysts expect that Microsoft’s Windows 10 desktop will revive the PC market during the forecast period.

The top vendors highlighted by Technavio’s research analysts in this report are:

  • LG Display
  • Samsung Display
  • Innolux
  • AU Optronics
  • BOE Technology

Mentor Graphics Corporation (NASDAQ: MENT) today announced that company chairman and CEO Dr. Walden C. Rhines has been named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). Dr. Rhines is being recognized for leadership and technology innovation in integrated circuit design and automation.

The IEEE Grade of Fellow is conferred by the IEEE Board of Directors upon a person with an outstanding record of accomplishments in any of the IEEE fields of interest. The total number selected in any one year cannot exceed one-tenth of one percent of the total voting membership. IEEE Fellow is the highest grade of membership and is recognized by the technical community as a prestigious honor and an important career achievement.

During Dr. Rhines’ tenure at Mentor Graphics, revenue has nearly quadrupled, enterprise value increased by 8X and Mentor has grown the industry’s number one market share solutions in four of the ten largest product segments of the electronic design automation (EDA) industry. At Mentor Graphics, he has built leading industry positions in areas outside of traditional EDA, including system design, embedded software, automotive and hardware emulation. This has led to innovation and growth of the entire EDA industry.

Prior to joining Mentor Graphics, Rhines was executive vice president of Texas Instruments (TI) Semiconductor Group, sharing responsibility for TI’s Components Sector, and having direct responsibility for the entire semiconductor business with more than $5 billion of revenue and over 30,000 people.

During his 21 years at TI, Rhines managed TI’s thrust into digital signal processing and supervised that business from inception with the TMS 320 family of DSPs through growth to become the cornerstone of TI’s semiconductor technology. He also supervised the development of the first TI speech synthesis devices (used in “Speak & Spell”) and is co-inventor of the GaN blue-violet light emitting diode (now important for DVD players and low energy lighting). He was president of TI’s Data Systems Group and held numerous other semiconductor executive management positions.

Dr. Rhines received the 2015 Phil Kaufman Award for Distinguished Contributions to EDA, presented by the Electronic System Design Alliance (ESDA), formerly the Electronic Design Automation Consortium, and the IEEE Council on EDA (CEDA). The award honors individuals who have had demonstrable impact on the field of EDA through technology innovations, education/mentoring, or business or industry leadership. Dr. Rhines was recognized for growing the EDA and integrated circuit (IC) design industries through his efforts as a leading voice of EDA and for pioneering the evolution of IC design to system-on-chip (SoC) design.

Rhines has served five terms as ESDA chairman and is currently serving as a director. He is also a board member of the Semiconductor Research Corporation. He has previously served as chairman of the Semiconductor Technical Advisory Committee of the Department of Commerce and as a board member of the Computer and Business Equipment Manufacturers’ Association (CBEMA), SEMI-Sematech/SISA, University of Michigan National Advisory Council, Lewis and Clark College and SEMATECH.

Dr. Rhines holds a Bachelor of Science degree in metallurgical engineering from the University of Michigan, a Master of Science and Ph.D. in materials science and engineering from Stanford University, a master of business administration from Southern Methodist University and Honorary Doctor of Technology degrees from the University of Florida and Nottingham Trent University.

Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions. Offering targeted solutions for cutting-edge LED designs – such as chip scale (CSP) and chip on-board (COB) packaging – the three new products also deliver versatile processing options ranging from conventional dispensing to emerging printing methods.

All introduced under the Dow Corning label, the three new products include WR-3001 Die Edge Coat, WR-3100 Die Edge Coat and WR-3120 Reflective Coating. In the future, products are planned to be added to match customer required processes.

“Manufacturers are aggressively seeking to design smaller, more efficient and cost-effective LED packages, which is driving demand for advanced new reflective materials that enable evolving application processes such as printing, and withstand increasingly stringent operating conditions,” said Takuhiro Tsuchiya, global marketing manager at Dow Corning. “These three cutting-edge coatings are only the first of a range of new products that we have in store for the industry. A proactive and collaborative innovator, Dow Corning formulated these three reflective silicone coatings specifically to help customers overcome today’s greatest design challenges and deliver highly reliable and differentiated products in the fiercely competitive LED market.”

As with all of Dow Corning reflective materials, the three new grades maintain high reflectivity at low thicknesses and retain their performance at sustained temperatures of 150°C – a temperature at which many organic coatings crack and yellow. Listed in order of increasing hardness, the new products include:

  • WR-3001 Die Edge Coat targets high-power CSP applications that demand LED materials with high thermal- and photostability. It is compatible with conventional dispensing processes.
  • WR-3100 Die Edge Coat is formulated for CSP applications and low- to middle-power LED package designs. Compatible with conventional dispensing equipment, it delivers comparatively high hardness of Shore D 65 after cure, making it suitable with chip dicing processes.
  • WR-3120 Reflective Coating also provides high thermal- and photostability suitable for high-power LED packaging applications, as well as the highest hardness of Dow Corning’s three new products. Suitable for printing processes, this advanced silicone further offers the highest reflectivity for enhanced LED performance.

A market leader in materials, expertise and collaborative innovation for LED lighting concepts, Dow Corning offers solutions that span the entire LED value chain, adding reliability and efficiency for sealing, protecting, adhering, cooling and shaping light across all lighting applications.

IBM (NYSE: IBM) this week announced new, all-flash storage solutions designed for midrange and large enterprises, where high availability, continuous up-time, and performance are critical. These are built to provide the speed and reliability needed for workloads ranging from enterprise resource planning (ERP) and financial transactions to cognitive applications like machine learning and natural language processing. The solutions announced today are designed to support cognitive workloads which clients can use to uncover trends and patterns that help improve decision-making, customer service and ROI.

IBM continues to push the boundaries in the design of flash solutions developed with the performance to manage the most demanding workloads such as “six nines availability,” ensuring continuous operations 99.9999 percent of the time. Through deep integration between IBM Storage and IBM z Systems, co-developed software that provides data protection, remote replication and optimization for midrange and large enterprises, is embedded in these new solutions. This advanced microcode is ideal for cognitive workloads on z Systems and Power System requiring the highest availability and system reliability possible.

“The DS8880 All-Flash family is targeted at users that have experienced poor storage performance due to latency, low server utilization, high energy consumption, low system availability and high operating costs. These same users have been listening, learning and understand the data value proposition of being a cognitive business,” said Ed Walsh, general manager, IBM Storage and Software Defined Infrastructure. “In the coming year we expect an awakening by companies to the opportunity that cognitive applications, and hybrid cloud enablement, bring them in a data driven marketplace.”

Today’s IBM is announcing a new family of DS8880 all-flash systems designed to meet a wide variety of business applications, workloads, and use cases where microsecond response times and uncompromised availability are sought. The family includes:

· Business Class Storage – the IBM DS8884F has been designed for traditional applications such as ERP, order processing, database transactions, customer relationship management and human resources information systems. It offers the lowest entry cost for midrange enterprises with 256 GB Cache (DRAM) and between 6.4-154 TB of Flash Capacity.

· Enterprise Class Storage – the IBM DS8886F has been engineered for high speed transactional operations like high-performance online transaction processing, high-speed commercial data processing, high-performance data warehouse and data mining and critical financial transaction systems. It provides users 2 TB Cache (DRAM) and between 6.4-614.4 TB of Flash Capacity.

· Analytic Class Storage – the IBM DS8888F is ideal for cognitive and real-time analytics and decision making including predictive analytics, real time optimization, machine learning and cognitive systems, natural language speech and video processing. To support this it delivers 2 TB Cache (DRAM) and between 6.4 TB-1.22 PB of Flash Capacity providing superior performance and capacity able to address the most demanding business workload requirements.

Working through a network of offices, supported by a team of over 850, the Health Insurance Institute of Slovenia (Zavod za zdravstveno zavarovanje Slovenije), provides health insurance to approximately two million customers. In order to successfully manage its new customer-facing applications (e.g. electronic ordering processing and electronic receipts) its storage system required additional capacity and performance. After completing research of solutions capable of managing these applications – which included both Hitachi and EMC – the organization deployed the IBM DS8886 along with IBM DB2 for z System/OS data server software to provide an integrated data backup and restore system.

“As long-time users of IBM storage infrastructure and mainframes, our upgrade to the IBM DS8000 with IBM business partner Comparex was an easy choice. Since then, its high performance and reliability have led us to continually deploy newer DS8000 models as new features and functions have provided us new opportunities,” said Bojan Fele, CIO of Health Insurance Institute of Slovenia. “Our DS8000 implementation has improved our reporting capabilities by reducing time to actionable insights. Furthermore, it has increased employee productivity, ensuring we can better serve our clients.”

According to Scott Sinclair, a senior analyst at ESG, the announcement by IBM on its family of new all-flash DS8880 solutions is very impressive in regards to performance gains and the move to offer flash across the portfolio a great step. By moving data to another path IBM is at the next level of innovation in order to take advantage of next generation technologies. Further to this, the classification of the new family of DS8880 into business, enterprise, and analytic solutions makes a lot of sense.

The new family of DS8880 all-flash data systems will be available worldwide on January 20, 2017 from IBM and through IBM Business Partners.

The global gallium arsenide (GaAs) components market is expected to grow at a CAGR of over 4% during the forecast period, according to Technavio’s latest report.

In this report, Technavio covers the market outlook and growth prospects of the global GaAs components market for 2017-2021. By end-users, this market is divided into mobile devices and wireless communications segments.

The global GaAs components market is expected to grow to USD 9.13 billion by 2021, with over 54% of the revenue being generated from the mobile devices segment. The quickly developing 3G and 4G networks are enabling the quick growth of the market segment.

The rising adoption of smartphones and tablets is acting as a major driving factor for this market, with number of smartphone shipments expected to hit 2 billion by 2020. This growth in number of shipments will drive the demand for GaAs components used in mobile handsets, particularly GaAs power amplifiers.

Technavio’s research study segments the global GaAs components market into the following regions:

  • APAC
  • Americas
  • EMEA

APAC: largest GaAs component market segment

“APAC is the global leader in the market, accounting for almost 78% of the total market revenue in 2016. The market dominance is primarily because of the high demand for GaAs components from communication device manufacturers in the region. Also, increasing demand for power applications, along with high-growth economies, is a major driver of the GaAs components market in the region,” says Sunil Kumar Singh, one of the lead analysts at Technavio for embedded systems research.

The increasing smartphone penetration in developing countries and rapidly developing wireless infrastructure are driving the high adoption of GaAs components in the region. Companies such as Samsung, LG, HTC, and Sony are investing heavily to launch better smartphones, which is compatible with 3G/4G technologies. These new-generation mobile phones integrate three to four times more power amplifiers when compared to previous generation smartphones, which means increased demand for GaAs components.

Technavio’s sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more.

Americas: expansion of 4G networks driving GaAs components market the region

Analysts at Technavio forecast the Americas to showcase a CAGR of 4.31% during the forecast period, of which most of the growth will be driven by the expansion of 4G networks in the region. North America is witnessing rapid expansion of its 4G network to make an easier transition to the upcoming 5G network. Apple and Skyworks Solutions are among the biggest consumers of GaAs components for their application in mobile power amplifiers.

GaAs components also find wide application in radar and defense systems. Currently, the US Department of Defense(DoD) is investing significantly in GaAs components to improve the efficiency of its current radar applications. Additionally, GaAs components are expected to attract demand from the military sector, thereby boosting the revenue contribution from the region.

EMEA: high demand from the automotive industry

“The GaAs components saw maximum adoption from the thriving automotive industry in the region. The region will also invest in the adoption of LEDs for the general lighting and automotive sectors, all of which consume GaAs components. In the defense sector, UMS, an MMIC solution provider from the UK, creates a significant demand for GaAs components,” says Sunil.

The different domains of defense – radar, communication, and smart ammunition are supplied with designs done by UMS or their customers and are based on the UMS technology platform. However, this region will grow at a slower rate when compared to the other two segments as most semiconductor foundries and manufacturing units are present in APAC and the Americas.

The top vendors in the global GaAs market highlighted in the report are:

  • Skyworks Solutions
  • Qorvo
  • Broadcom

Synopsys, Inc. (Nasdaq:  SNPS) today announced it has completed its acquisition of certain assets of Forcheck b.v., a privately held software company based in the Netherlands that provides a static analysis tool for detecting coding defects and anomalies in Fortran applications. This acquisition provides Synopsys with additional static analysis technology to extend the capabilities of its Software Integrity Platform and create new business opportunities.

Forcheck technology will be integrated into Synopsys’ Coverity® static analysis solution to provide support for software written in the Fortran programming language, which is a popular choice for numerically intensive scientific and engineering applications in industries such as oil and gas, military, defense and aerospace.

The terms of the deal, which is not material to Synopsys financials, have not been disclosed.

The addition of Fortran to the growing list of languages and frameworks supported by Coverity aligns with Synopsys’ overarching strategy to extend its best of breed software testing solutions to a broader audience, from organizations developing web and mobile applications to software embedded in critical infrastructure and safety-critical systems. Coverity also supports analysis of software written in C/C++, Objective-C, C#, Java, JavaScript, PHP, Python, Ruby, node.js, and Android.

“Synopsys is committed to expanding its Software Integrity Platform to improve the security and quality of business-, mission- and safety-critical software,” said Andreas Kuehlmann, senior vice president and general manager of Synopsys’ Software Integrity Group. “The acquisition of Forcheck technology provides Synopsys with unique capabilities and extends the utility of the Software Integrity Platform for organizations developing and maintaining critical infrastructure systems written in Fortan.”

Through its Software Integrity Platform, Synopsys provides advanced solutions for improving the security and quality of software. This comprehensive platform of automated analysis and testing technologies integrates seamlessly into the software development process and enables organizations to detect and remediate security vulnerabilities, quality defects and compliance issues early in the software development lifecycle, as well as to gain security assurance with and visibility into their software supply chain.

Coupling Wave Solutions, S.A. (CWS) and STMicroelectronics (NYSE:STM) today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs. RF Designers and design managers will now be able to enhance their designs of RF SOI switches that propel the next generation cellular and Wi-Fi communication chips. STMicroelectronics’ product development kits with SiPEX are available immediately.

“We are thrilled to partner with STMicroelectronics to provide our customers with a breakthrough design productivity solution,” said Brieuc Turluche, chairman of the board of directors and chief executive officer of CWS. “SiPEX™ accurately models interactions between devices, back-end-of-line, and silicon on insulator (SOI) substrates enabling RF Front End Module designers to fully simulate layout and design changes in less than 15 minutes, an accomplishment not possible until now. Our tool also helps simulation take into account physical effects that were only measurable on silicon in the past. This enhanced capability is fundamental to successfully designing high-performance RF SOI switches for the next generation communication chips.”

For the first time ever, with STMicroelectronics’ product development kits, customers can simulate the impact of layout geometry on RF switch losses and non-linearities (H2/H3 distortions), including active devices, metal interconnects, and substrate contributions. This design capability is empowered by the interaction of Spice models, Mentor XRC tool, and the SiPEX substrate simulation tool. This is significant because customers will now be able to design RF SOI Switches reaching a level of performance never achieved before.

“RF front-end components are complex to design. The right design tool is critical for our RF SOI customers to close the gap between simulation and silicon measurements, and optimize the layout to achieve the best linearity in their chips. Partnering with CWS allows our customers to eliminate design re-spins and accelerate time-to-market,” said Cyril Colin-Madan, head of Design Platform at STMicroelectronics.

Thanks to the SiPEX tool, substrate-aware RF switch simulation flow is now part of the H9 SOI FEM PDK design kit which supports RF SOI designs integrated in H9 SOI FEM technology for Cellular and Wi-Fi applications.

“By combining H9 SOI STM technology with substrate modeling via the CWS tool, we produce the world’s highest performance SOI Switches for IoT and Smart Phone applications,” said Greg Caltabiano, CEO of ACCO Semiconductor.