Tag Archives: letter-pulse-business

Synopsys, Inc. (Nasdaq:  SNPS) today announced the successful tapeout of multiple customer test chips with DesignWare Logic Libraries and Embedded Memories for TSMC’s 7-nanometer (nm) FinFET process. The tapeouts mark a significant milestone in Synopsys’ and TSMC’s collaboration on the development of DesignWare Logic Library, Embedded Memory and Interface IP for TSMC’s 7-nm FinFET process. The collaboration extends Synopsys’ long history of successful IP development on TSMC advanced FinFET processes for high-performance, low-power system-on-chips (SoCs).

“TSMC and Synopsys have a long track record of successful collaboration on advanced FinFET processes, providing our mutual customers with a low-risk path to integrating a broad portfolio of high-quality, silicon-proven IP into their SoCs,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “Achieving multiple customer tapeouts of Synopsys DesignWare IP on TSMC’s 7-nm process demonstrates the benefits of our collaboration and gives designers confidence that they will meet their power, performance and area targets while accelerating their time to market.”

“As a leading provider of physical IP, Synopsys continues to provide early access to IP in the most advanced process technologies, helping designers incorporate necessary functionality and accelerate their design schedules,” said John Koeter, vice president of marketing for IP and prototyping at Synopsys. “With multiple customer tapeouts of DesignWare IP for TSMC’s 7-nm process, Synopsys enables designers to reduce integration risk and differentiate their products with this latest technology.”

As part of an initiative to optimize service to the growing global polymer processing market, Nordson Corporation (Nasdaq:NDSN) today announced it plans to combine its existing screw and barrel operations in Youngstown, Ohio; New Castle, Pennsylvania; and Pulaski, Virginia into a single expanded manufacturing center of excellence in Austintown, Ohio.

“We expect this initiative to drive efficiencies in manufacturing processes, decrease lead times, enhance customer service, improve competitiveness and accelerate growth,” said John Keane, Nordson Corporate Senior Vice President. “Our plan is for Austintown to join similar regional hubs for our screw and barrel products in Thailand and Germany. No other single supplier will be able to provide the polymer industry with such localized service on a global scale.”

Nordson expects the transition to an existing facility in Austintown to be completed over the next 18 months, subject to the conclusion of customary negotiations with local and state officials. The transition will occur in stages to minimize any potential impact to current customers. Planned investments in the facility over the period include upgraded bi-metallic processing and machining systems to improve product quality, precision and throughout.

The majority of positions in the existing Youngstown, New Castle and Pulaski facilities will transfer to the Austintown facility. Total employment in Austintown is expected to be approximately 260. Nordson will be actively recruiting for any positions not being filled by current employees.

SEMI, the global industry association representing more than 2,000 companies in the electronics manufacturing supply chain, announced that MEMS & Sensors Industry Group (MSIG) will become a SEMI Strategic Association Partner effective January 1, 2017.

Through this strategic partnership, SEMI and MSIG members will benefit from stronger consolidated representation in the MEMS and sensors segments. Members will access SEMI’s global platforms, including its SEMICON expositions and International Standards program, and MSIG’s events, including MEMS & Sensors Executive Congresses, MEMS & Sensors Technical Congress and MSIG Conference Asia. MSIG also brings member-focused initiatives, such as the TSensors initiative, as well as industry Standards and community-building to the new partnership.

“SEMI members are increasingly engaged with MEMS and sensors manufacturing,” said Denny McGuirk, president and CEO of SEMI. “The convergence of IC technology, flexible hybrid electronics (FHE), and MEMS and sensors for consumer electronics and IoT applications makes this partnership a clear win for the combined membership. The synergies between our associations will result in increased member value, a unified voice for the MEMS and sensors sector, and a strong platform for global industry collaboration. Ultimately, it will accelerate our joint strategic objectives at a global level and provide greater opportunities to advance the growth and prosperity of members.”

“Our partnership with SEMI reflects our commitment to our members, who have supported us since MSIG’s inception in 2001,” notes Karen Lightman, executive director, MEMS & Sensors Industry Group. “MSIG members will benefit from this relationship with increased access to global resources and service offerings, the expertise of a complementary industry and fast-track entry to worldwide programs. Ultimately, MSIG members will gain broader reach as they pursue new business opportunities. We are delighted to have such a capable and accomplished partner and look forward to our strategic association partnership with SEMI.”

Actions Semiconductor Co., Ltd. (NASDAQ:  ACTS), one of China’s leading fabless semiconductor companies that provides comprehensive portable multimedia and mobile internet system-on-a-chip (SoC) solutions for portable consumer electronics, today announced that it has entered into a definitive merger agreement on September 12, 2016 pursuant to which the Company will be acquired by a consortium of investors, including Supernova Investment Ltd. and other certain shareholders of the Company: Surrey Glory Investments Inc., Tongtong Investment Holding Co., Ltd., Perfectech Int’l Ltd, Allpremier Investment Limited, Octovest International Holding Co., Ltd., Ventus Corporation, Middlesex Holdings Corporation Inc, Rich Dragon Consultants Limited, Nutronics Technology Corporation, Uniglobe Securities Limited, New Essential Holdings Limited, Embona Holdings (Malaysia) Limited, Suffolk Dragon Ventures Ltd and Top Best Development Limited.

Pursuant to the terms of the Merger Agreement, at the effective time of the merger, a wholly owned subsidiary of Parent will merge with and into the Company, with the Company continuing as the surviving company, and each of the Company’s ordinary shares, par value US$0.00001 per share, issued and outstanding immediately prior to the effective time of the merger (the “Shares”) will be cancelled and cease to exist in exchange for the right to receive US$0.366 in cash without interest, and each American Depositary Share (“ADS”) of the Company, every ADS representing six Shares, will be cancelled in exchange for the right to receive US$2.20 in cash without interest, except for (a) certain Shares owned by the Rollover Shareholders, each of which will continue to exist and become one ordinary share, par value of $0.00001 each, of the Surviving Company, (b) Shares (including Shares represented by ADSs) owned by the Company or any of its subsidiaries, (c) Shares reserved (but not yet issued and allocated) by the Company for issuance and allotment upon exercise of any share incentive awards issued under the Company’s employee share incentive plans, and (d) Shares held by shareholders who have validly exercised and not effectively withdrawn or lost their rights to dissent from the merger pursuant to Section 238 of the Companies Law of the Cayman Islands (the “Dissenting Shares”), which will be cancelled and cease to exist in exchange for the right to receive the payment of fair value of the Dissenting Shares in accordance with Section 238 of the Companies Law of the Cayman Islands.

The merger consideration represents a premium of 49.7% to the closing price of the Company’s ADSs on May 18, 2016, the last trading day prior to the Company’s announcement of its receipt of a “going-private” proposal, and a premium of 40.6% to the volume weighted average closing price of the Company’s ADSs during the 30 trading days prior to its receipt of a “going-private” proposal. The Buyer Consortium intends to fund the merger through available cash of the Company and its subsidiaries.

The Company’s board of directors (the “Board”), acting upon the unanimous recommendation of a committee of independent and disinterested directors established by the Board (the “Special Committee”), approved the Merger Agreement and the merger and resolved to recommend that the Company’s shareholders vote to authorize and approve the Merger Agreement and the merger. The Special Committee negotiated the terms of the Merger Agreement with the assistance of its independent financial and legal advisors.

The merger, which is currently expected to close during the last quarter of 2016, is subject to customary closing conditions including the approval of the Merger Agreement by an affirmative vote of holders of Shares representing at least two-thirds of the voting power of the Shares present and voting in person or by proxy at a meeting of the Company’s shareholders which will be convened to consider the approval of the merger agreement and the merger. Pursuant to a voting and support agreement entered among Parent and the other Rollover Shareholders, the Rollover Shareholders have agreed to vote all the Shares and ADSs beneficially owned by them in favor of the authorization and approval of the Merger Agreement and the merger. If completed, the merger will result in the Company becoming a privately-held company and its ADSs will no longer be listed on The NASDAQ Select Global Market.

The Company will prepare and file with the U.S. Securities and Exchange Commission (the “SEC”) a Schedule 13E-3 transaction statement, which will include a proxy statement of the Company. The Schedule 13E-3 will include a description of the Merger Agreement and contain other important information about the merger, the Company and the other participants in the merger.

In connection with the merger, Houlihan Lokey (China) Limited is serving as financial advisor to the Special Committee; Jones Day is serving as U.S. legal counsel to the Special Committee; Maples and Calder is serving as Cayman Islands legal counsel to the Special Committee. K&L Gates LLP is serving as U.S. legal counsel to the Buyer Consortium.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, announced worldwide sales of semiconductors reached $27.1 billion for the month of July 2016, an increase of 2.6 percent compared to the previous month’s total of $26.4 billion. July marked the global market’s largest month-to-month sales increase since September 2013, though sales were down 2.8 percent compared to the July 2015 total of $27.9 billion. Underscoring the welcome uptick, month-to-month sales increased in all regional markets for the first time since October 2015. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The modest increase in global semiconductor sales in July was the global market’s largest month-to-month growth in nearly three years, an encouraging sign of potentially stronger sales during the remainder of 2016 and beyond,” said John Neuffer, president and CEO, Semiconductor Industry Association. “After months of lagging sales, the Americas region was a bright spot in July, posting 3.3 percent growth to lead all regional markets. Meanwhile, most major semiconductor product categories saw increased sales in July compared to the previous month, with DRAM leading the way with 7.1 percent growth.”

In addition to the month-to-month growth in the Americas, sales also increased in China (3.2 percent), Japan (3.1 percent), Asia Pacific/All Other (1.8 percent), and Europe (0.7 percent). Year-to-year sales increased in China (4.7 percent), but dropped in Japan (-1.1 percent), Europe (-4.9 percent), Asia Pacific/All Other (-6.8 percent), and the Americas (-7.5 percent).

“As Congress returns to Washington this week, we urge policymakers to work together to advance initiatives that promote growth and innovation in the semiconductor industry and throughout the U.S. economy,” Neuffer said. “One such measure is the Trans-Pacific Partnership (TPP), a landmark agreement that would tear down barriers to trade with Pacific-Rim countries. Congress should do what’s right for U.S. businesses, consumers, and our economy and approve the TPP.”

To find out how to purchase the WSTS Subscription Package, which includes comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, please visit http://www.semiconductors.org/industry_statistics/wsts_subscription_package/.

July 2016 GSR table and graph

SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts. The new product was announced during the press conference at SEMICON Taiwan, where 43,000 industry professionals are convening this week. SEMI FabView tracks spending and capacities of over 1,100 facilities, including over 60 future facilities, across industry segments from Analog, Power, Logic, MPU, Memory, and Foundry to MEMS and LED fabs.

semi fabview

SEMI FabView features high-level fab data such as capacity, technology nodes, and equipment spending, with other device manufacturing insights such as fabs by region, wafer size, product type and construction status. This new online platform enables anytime access on the changes taking place in fab construction and expansion, production volume, device types, and more. The ability to quickly access the latest data for quarterly business reviews or earnings calls, or to validate an investment decision, is a key feature of this new product.

“SEMI FabView, an online platform, provides SEMI members and customers access to the industry benchmark World Fab Forecast database information in an entirely new way,” said Dan Tracy, senior director of SEMI Industry Research & Statistics for SEMI. “By adding the interactive elements of SEMI FabView, subscribers now have on-the-go real-time access to expert analysis that can be implemented in their models or forecasts.”

SEMI FabView users can:

  • view forecast for equipment and construction spending, capacity changes, and fab status from new plans to closures
  • organize data views by filtering data and accessing analyst commentary for each company and fab to see the latest SEMI forecast
  • access forecast data by company, geographical region, wafer size, technology geometry and specific stages of fab life cycle ─ from announced and planned new fabs to fabs that are in transition (e.g., when a cleanroom is converting to a larger wafer size or a different product type)

SEMI FabView is available for a product demo; contact [email protected]. Learn more about SEMI FabView here: www.semi.org/en/semi-fabview

Qualcomm Incorporated (NASDAQ:  QCOM) today announced the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first foray into providing manufacturing services for semiconductors. By working with Amkor Technology, Inc., one of the world’s leading providers of contract semiconductor assembly and test services, the new company will combine Amkor’s extensive test services experience and cleanroom facilities with Qualcomm Technologies’ industry leadership in cutting-edge product engineering and development.

The new manufacturing facility demonstrates Qualcomm Technologies’ commitment to continue to invest and help develop semiconductor expertise in China, and is indicative of growth in semiconductor market leadership in the country. Through the ownership and operation of a semiconductor test center, Qualcomm Technologies will enhance its focus on customer service, continue to develop its expertise in operational excellence, and increase its business presence in China.

“The test facility is part of our continued mission to streamline supply chain operations and improve operational efficiency,” said Roawen Chen, senior vice president, QCT global operations, Qualcomm Technologies, Inc.

“Qualcomm Technologies continually strives to improve our manufacturing footprint in China and the formation of Qualcomm Communication Technologies in Shanghai is another example of this dedication,” said Frank Meng, chairman, Qualcomm China.

“We are excited to work with Qualcomm Technologies in their new test operation in China,” said Steve Kelley, Amkor’s president and chief executive officer. “Amkor offers the most advanced outsourced assembly and test technologies in China, and this expanded relationship is a natural extension of the long history of close collaboration between our two companies.”

The Shanghai-based facility is set to begin operations on October 18, 2016.

Synopsys, Inc. (Nasdaq: SNPS) and GLOBALFOUNDRIES today announced that Synopsys has joined the foundry’s FDXcelerator Partner Program, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) designs. This program enables designers to deploy Synopsys’ comprehensive RTL-to-GSDII solution with superior power and performance metrics for FDX-based designs. The collaboration accelerates the development of innovative products in applications spanning systems for intelligent clients, 5G connectivity, augmented and virtual reality and automotive.

Through the FDXcelerator Partner Program, Synopsys and GLOBALFOUNDRIES offer easy access to a complete 22FDX Reference Flow based on the Synopsys Galaxy Design Platform. This includes validated 22FDX “plug & play” support for tools, including Design Compiler, IC Compiler II, IC Validator, PrimeTime, StarRC, Custom Compiler, HSPICE and CustomSim solutions. The collaboration enables Synopsys’ tools to enhance support for differentiating GLOBALFOUNDRIES FD-SOI design features, including support for the adaptive body bias that unlocks FDX SoC performance and ultra-low-power operation, while lowering barriers of migration from bulk nodes. This allows engineers to create optimized designs, while minimizing development costs.

“Synopsys’ close collaboration with GLOBALFOUNDRIES provides designers access to a trusted EDA solution with advanced technical capabilities to address the requirements for developing differentiated FD-SOI-based designs,” said Bijan Kiani, vice president of product marketing for Synopsys’ Design Group. “We are helping designers adopt GLOBALFOUNDRIES’ innovative FDX offering by delivering comprehensive tools and methodologies to take advantage of the power, performance and cost advantages of the FDX technologies.”

“We are thrilled that Synopsys is an initial FDXcelerator partner,” said Alain Mutricy, senior vice president of Product Management at GLOBALFOUNDRIES. “Through this collaboration, our mutual customers can now take full advantage of the FDX value proposition by leveraging the validated Synopsys-based reference flow. The FDX-enabled Galaxy Design Platform will offer seamless support of body bias and other critical FDX performance management capabilities. The program will also enable access to Synopsys FDX EDA experts available for proactive training and support of mutual 22FDX design customers.”

With the recent announcement of the company’s next-generation 12FDX technology, the FDXcelerator Partner Program builds upon GLOBALFOUNDRIES’ industry-first FD-SOI roadmap, a lower-cost migration path for designers desiring advanced node design. By participating in FDXcelerator and continuing to invest in expanding the feature set of its tools to further support FDX customers, Synopsys is well positioned to participate in the adoption and growth of the FDX market. Moreover, the FDXcelerator Partner Program broadens the qualification and quality assurance collaboration between the companies, including tighter interlock around quality testing and methodology.

Additional Synopsys tools and features will be enhanced for FDX, and more information will be shared with the FDX design community in the months to come. Customers and partners interested in learning more about FDXcelerator can visit www.globalfoundries.com/fdxcelerator

GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) design and reduce time-to-market for its customers.

With the recent announcement of the company’s next-generation 12FDX™ technology, the FDXcelerator Partner Program builds upon GLOBALFOUNDRIES industry-first FD-SOI roadmap, a lower cost migration path for customers desiring advanced node design.

Together with GLOBALFOUNDRIES and FDXcelerator Partner solutions, customers will be able to build innovative 22FDX SoC solutions as well as ease migration to FD-SOI from bulk nodes such as 40nm and 28nm. Initial FDXcelerator Partners have committed a set of key offerings to the program, including:

  •  tools (EDA) that complement industry leading design flows by adding specific modules to easily leverage FDSOI body-bias differentiated features,
  •  a comprehensive library of design elements (IP), including foundation IP, interfaces and complex IP to enable foundry customers to start their designs from validated IP elements,
  • platforms (ASIC), which allow a customer to build a complete ASIC offering on 22FDX,
  • reference solutions (reference designs, system IP), whereby the Partner brings system level expertise in Emerging application areas, enabling customers to speed-up time to market,
  • resources (design consultation, services), whereby Partners have trained dedicated resources to support 22FDX technology, and;
  • product packaging and test (OSAT) solutions.

“22FDX is increasingly gaining momentum as the platform of choice to build differentiated, highly-integrated system solutions,” said Alain Mutricy, senior vice president of Product Management at GLOBALFOUNDRIES.  “Now is the time to step up industry collaboration to enable our customers to accelerate adoption of 22FDX. FDXcelerator will extend the reach of the FD-SOI ecosystem by creating a market place for truly innovative FDX-tailored solutions and services.”

The FDXcelerator Partner Program creates an open framework to allow selected Partners to integrate their products or services into a validated, plug and play catalog of design solutions. This level of integration allows customers to create high performance designs while minimizing development costs through access to a broad set of quality offerings, specific to 22FDX technology. The Partner ecosystem positions members and customers to take advantage of the broad adoption and accelerating growth of the FDX market.

FD-SOI technology has been gaining ground as designers leverage the process as an alternative to Fin-FET-based technologies for chips that require performance on demand and energy efficiency at the lowest solution cost. According to a recent Linley Group Microprocessor Report, FD-SOI Offers Alternative to FinFET, GLOBALFOUNDRIES’ FDX technologies provide an alternative path for applications that cannot accept the cost and complexity of FinFETs.

Initial partners of the FDXcelerator Partner Program are: Synopsys (EDA), Cadence (EDA), INVECAS (IP and Design Solutions), VeriSilicon (ASIC), CEA Leti (services), Dreamchip (reference solutions) and Encore Semiconductor (services). These companies have already initiated work to deliver advanced 22FDX SoC solutions and services. Additional FDXcelerator members will be announced in the following months.

SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced its collaboration with Novati Technologies, a global nanotechnology development center, to establish Novati’s new plasma dicing line at their fab in Austin, Texas. Novati has selected SPTS’s Rapier-300S plasma dicing solution over competing options to provide next-generation plasma dicing capabilities and services for customers.

“Plasma dicing has many advantages over conventional singulation methods and offers designers and manufacturers greater flexibility with regards to die shape, size and position,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “The Rapier-300S is the latest addition to our Mosaic™ plasma dicing platform which includes wafer handling solutions for 150mm, 200mm and 300mm wafers, both full thickness and taped to dicing frames. Novati selected the Rapier-300S to provide their customers with the latest dicing technology to complement their advanced semiconductor fabrication solutions and services.”

“Novati provides customers with technology building blocks, engineering expertise, professional program management and a broad complement of flexible processing equipment that enable the accelerated development of 200mm and 300mm production-worthy solutions,” stated John Behnke, President of Novati Technologies. “In order to remain at the forefront of novel process development, we must provide our foundry customers with the latest process solutions capable of manufacturing next generation devices.”

SPTS’s Mosaic plasma dicing system with the Rapier-300S overcomes many of the design limitations of conventional dicing methods, particularly for smaller, thinner, more fragile die, as well as offering the potential for significant increases in yield and throughput. By leveraging SPTS’s extensive expertise and experience in deep silicon etch which serves as the basis of Rapier-300S plasma dicing technology, customers are able to support the development of innovative More-than-Moore solutions.

To learn more about SPTS’s Rapier-300S and Mosaic plasma dicing platform and the benefits of Plasma Dicing for Next Generation Ultra Small and Ultra Thin Die, register now for a free webinar on Wed 14th Sept, 2016, with presentations from Amandine Pizzagalli, Analyst at Yole Developpment, and Richard Barnett from SPTS Technologies.