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Scientists from the NUST MISIS Laboratory of Inorganic Nanomaterials together with their international colleagues have proved it possible to change the structural and conductive properties of nanotubes by stretching them. This can potentially expand nanotubes’ application into electronics and high-precision sensors such as microprocessors and high-precision detectors. The research article has been published in Ultramicroscopy.

Carbon nanotubes can be represented as a sheet of graphene rolled in a special way. There are different ways of «folding» it, which leads to the graphene edges interconnecting at different angles, forming either armchair, zigzag or chiral nanotubes (Pic.1).

Nanotubes are considered to be promising materials for use in electronics and sensors because they have high electrical conductivity, which would work well in things like microprocessors and high-precision detectors. However, when producing carbon nanotubes it is hard to control their conductivity. Nanotubes with metallic and semiconducting properties can grow into a single array while microprocessor-based electronics require semiconducting nanotubes that have the same characteristics.

Scientists from the NUST MISIS Laboratory of Inorganic Nanomaterials jointly with a research team from Japan, China and Australia, led by Professor Dmitri Golberg, have proposed a method that allows for the modification of the structure of ready-made nanotubes and thus changes their conductive properties.

«The basis of the nanotube – a folded layer of graphene – is a grid of regular hexagons, the vertices of which are carbon atoms. If one of the carbon bonds in the nanotube is rotated by 90° degrees, a pentagon and a heptagon are formed at this [junction] instead of a hexagon, and a so-called Stone-Wales defect is obtained in this case. Such a defect can occur in the structure under certain conditions. Back in the late 90s, it was predicted that the migration of this defect along the walls of a highly heated nanotube with the application of mechanical stress could lead to a change in its structure – a sequential change in the chirality of the nanotube, which leads to a change in its electronic properties. No experimental evidence for this hypothesis has previously been obtained, but our research paper has presented convincing proof of it», said Associate Professor Pavel Sorokin, Doctor of Physical & Mathematical Sciences and head of the «Theoretical Materials Science of Nanostructures» infrastructure project at the NUST MISIS Laboratory of Inorganic Nanomaterials.

Scientists from the NUST MISIS Laboratory of Inorganic Nanomaterials have conducted simulations of the experiment at the atomic level. At first, the nanotubes were lengthened to form the first structural defect consisting of two pentagons and two heptagons (a Stone-Wales defect, pic.2a), where the prolonged lengthening of the tube began to «spread» to the sides, rearranging other carbon bonds (pic.2b). It was at this stage that the structure of the nanotubes changed. With further stretching, more and more Stone-Wales defects began to form, eventually leading to a change in the nanotubes’ conductivity (Pic. 2).

«We were responsible for the theoretical modeling of the process on a supercomputer in the NUST MISIS Laboratory for Modeling and Development of New Materials for the experimental part of the work. We are glad that the simulation results [support] the experimental data», added Dmitry Kvashnin, co-author of the research work, Candidate of Physical & Mathematical Sciences and a researcher at the NUST MISIS Laboratory of Inorganic Nanomaterials.

The proposed technology is capable of helping in the transformation of «metallic» nanotubes’ structure for their further application in semiconductor electronics and sensors such as microprocessors and ultrasensitive detectors.

Computer bits are binary, with a value of 0 or 1. By contrast, neurons in the brain can have all kinds of different internal states, depending on the input that they received. This allows the brain to process information in a more energy-efficient manner than a computer. University of Groningen (UG) physicists are working on memristors, resistors with a memory, made from niobium-doped strontium titanate, which mimic how neurons work. Their results were published in the Journal of Applied Physics on 21 October.

The brain is superior to traditional computers in many ways. Brain cells use less energy, process information faster and are more adaptable. The way that brain cells respond to a stimulus depends on the information that they have received, which potentiates or inhibits the neurons. Scientists are working on new types of devices which can mimic this behavior, called memristors.

Memory

UG researcher Anouk Goossens, the first author of the paper, tested memristors made from niobium-doped strontium titanate. The conductivity of the memristors is controlled by an electric field in an analog fashion: ‘We use the system’s ability to switch resistance: by applying voltage pulses, we can control the resistance, and using a low voltage we read out the current in different states. The strength of the pulse determines the resistance in the device. We have shown a resistance ratio of at least 1000 to be realizable. We then measured what happened over time.’ Goossens was especially interested in the time dynamics of the resistance states.

She observed that the duration of the pulse with which the resistance was set determined how long the ‘memory’ lasted. This could be between one to four hours for pulses lasting between a second and two minutes. Furthermore, she found that after 100 switching cycles, the material showed no signs of fatigue.

Forgetting

‘There are different things you could do with this’, says Goossens. ‘By “teaching” the device in different ways, using different pulses, we can change its behavior.’ The fact that the resistance changes over time can also be useful: ‘These systems can forget, just like the brain. It allows me to use time as a variable parameter.’ In addition, the devices that Goossens made combine both memory and processing in one device, which is more efficient than traditional computer architecture in which storage (on magnetic hard discs) and processing (in the CPU) are separated.

Goossens conducted the experiments described in the paper during a research project as part of the Master in Nanoscience degree programme at the University of Groningen. Goossens’ research project took place within the group of students supervised by Dr. Tamalika Banerjee of Spintronics of Functional Materials. She is now a Ph.D. student in the same group.

Questions

Before building brain-like circuits with her device, Goossens plans to conduct experiments to really understand what happens within the material. ‘If we don’t know exactly how it works, we can’t solve any problems that might occur in these circuits. So, we have to understand the physical properties of the material: what does it do, and why?’

Questions that Goossens want to answer include what parameters influence the states that are achieved. ‘And if we manufacture 100 of these devices, do they all work the same? If they don’t, and there is device-to-device variation, that doesn’t have to be a problem. After all, not all elements in the brain are the same.’

Samsung Electronics Co., Ltd. today announced several groundbreaking additions to its comprehensive semiconductor ecosystem that encompass next-generation technologies in foundry as well as NAND flash, SSD (solid state drive) and DRAM. Together, these developments mark a giant step forward for Samsung’s semiconductor business.

Unveiled at its annual Samsung Tech Day include:

  • 7nm EUV process node from Samsung’s Foundry Business, providing significant strides forward in power, performance and area.
  • SmartSSD, a field programmable gate array (FPGA) SSD, that will offer accelerated data processing and the ability to bypass server CPU limits.
  • QLC-SSD for enterprise and datacenters that offer 33-percent more storage per cell than TLC-SSD, consolidating of storage footprints and improving total cost of ownership (TCO).
  • 256-gigabyte (GB) 3DS (3-dimensional stacking) RDIMM (registered dual in-line memory module), based on 10nm-class 16-gigabit (Gb) DDR4 DRAM that will double current maximum capacity to deliver higher performance and lower power consumption.

“Samsung’s technology leadership and product breadth are unparalleled,” said JS Choi, President, Samsung Semiconductor, Inc. “Bringing 7nm EUV into production is an incredible achievement. Also, the announcements of SmartSSD and 256GB 3DS RDIMM represent performance and capacity breakthroughs that will continue to push compute boundaries. Together, these additions to Samsung’s comprehensive technology ecosystem will power the next generation of datacenters, high-performance computing (HPC), enterprise, artificial intelligence (AI) and emerging applications.”

Advanced Foundry Technology

Initial wafer production of Samsung’s 7nm LPP (Low Power Plus) EUV process node represents a major milestone in semiconductor fabrication. The 7LPP EUV process technology provides great advances, including a respective maximum of 40-percent area reduction, 50-percent dynamic power reduction and 20-percent performance increase over 10nm processes. The 7LPP process represents a clear demonstration of the foundry business’ technology roadmap evolution, providing Samsung’s customers a direct path forward to 3nm.

Powering Server-less Computing

Samsung enables the most advanced providers of server-less computing through products including the new SmartSSD, quad-level cell (QLC)-SSD, 256GB 3DS RDIMM as well as High Bandwidth Memory (HBM) 2 Aquabolt. By accelerating data processing, bypassing server CPU limits and reducing power demands, these products will enable datacenter operators to continue to scale at faster speeds while containing costs.

Samsung’s industry-leading flash memory products for future datacenters will also include Key Value (KV)-SSD and Z-SSD. KV-SSD eliminates block storage inefficiency, reducing latency and allowing datacenter performance to scale evenly when CPU architectures max out. The company’s next-generation Z-SSD will be the fastest flash memory ever introduced, with dual port high availability, ultra-low latency and a U.2 form factor, designed to meet the emerging needs of enterprise clients. Z-SSD will also feature a PCIe Gen 4 interface with a blazing-fast 12-gigabytes-per-second (GB/s) sequential read, which is 20 times faster than today’s SATA SSD drives.

Accelerating Application Learning

A range of revolutionary Samsung solutions will enable the development of upcoming machine learning and AI technologies. The Tech Day AI display highlighted astounding data transfer speeds of 16Gb GDDR6 (64GB/s), ultra-low latency of Z-SSD and industry-leading performance of Aquabolt, which is the highest of any DRAM-based memory solution currently in the market. Together, these solutions help Samsung’s enterprise and datacenter clients open new doors to application learning and create the next wave of AI advancements.

Streamlining Data Flow

Samsung’s new solutions will enable not just faster speeds and higher performance but also improved efficiency for its enterprise clients. Enterprise products on display at Tech Day included D1Y 8Gb DDR4 Server DRAM, which incorporates the most advanced DRAM process, resulting in lower power usage. Samsung’s 256GB 3DS RDIMM also helps to improve enterprise performance and enables memory-intensive servers capable up to 16-terabytes (TB).

Additionally, Samsung’s dual-port x4 PCIe Gen 4 32TB SSD offers 10GB/s performance. Samsung’s 1Tb QLC-SSD presents a cutting-edge storage option for enterprise clients with competitive efficiency when compared to hard disk drives (HDD), while KV-SSD allows server performance to scale even as CPU architectures max out, also providing a competitive TCO, write amplification factor (WAF) improvement and scalability.

Breaking Performance Barriers

With their leading-edge specs, Samsung’s QLC-SSD, Z-SSD and 8GB Aquabolt help high-performance computing clients blast through performance barriers and reach new heights. The 8GB Aquabolt provides the fastest data transmission speed and highest performance of any DRAM-based memory solution on the market today at 307GB/s per HBM cube. QLC-SSD and Z-SSD, both powerful on their own, are also offered in a tiered storage solution that results in a 53-percent increase in overall system performance.

Enabling Future Innovation

Emerging tech requires the most innovative and flexible components. Samsung’s SmartSSD will increase speed and efficiency, and lower operating costs by pushing intelligence to where data lives. Movement of data for processing has traditionally caused increased latency and energy consumption while reducing efficiency. Samsung’s new SmartSSDs will overcome these issues by incorporating an FPGA accelerator into the SSD unit. This allows for faster data processing through bypassing server CPU limits. As a result, SmartSSDs will have higher processing performance, improved time-to-insight, more virtual machines (VM), scalable performance, better de-duplication and compression, lower power usage and fewer CPUs per system.

Unparalleled Product Ecosystem

Samsung’s comprehensive product portfolio with state-of-the-art solutions set new standards for data processing speed, capacity, bandwidth and energy conservation. By leveraging such solutions, data centers, enterprise companies, hyper-scalers and emerging tech platforms are able to configure product solutions based on their requirements and develop exciting new tech offerings such as 5G, AI, enterprise and hyperscale data centers, automotive, networking and beyond.

Samsung will continue to push boundaries in tomorrow’s semiconductor technologies through innovations such as its sixth-generation V-NAND built on a single structure, or with ‘1-stack technology,’ and sub-10nm DRAM with EUV for super-high density and performance.

Experts across the industry, including Apple co-founder, Steve Wozniak, were invited at Samsung Tech Day to address the advancements and challenges in today’s semiconductor market, and offer insights for the future of semiconductors. More than 400 customers, partners and industry influencers attended the event.

Graphene Flagship researchers have shown in a paper published in Science Advanceshow heterostructures built from graphene and topological insulators have strong, proximity induced spin-orbit coupling which can form the basis of novel information processing technologies.

Scanning Electron Microscope micrograph of a fabricated device showing the graphene topological insulator heterostructure channel. Credit: Dmitrii Khokhriakov, Chalmers University of Technology

Spin-orbit coupling is at the heart of spintronics. Graphene’s spin-orbit coupling and high electron mobility make it appealing for long spin coherence length at room temperature. Graphene Flagship researchers from Chalmers University of Technology (Sweden), Catalan Institute of Nanoscience and Nanotechnology – ICN2 (Spain), Universitat Autònoma de Barcelona (Spain) and ICREA Institució Catalana de Recerca i Estudis Avançats (Spain) showed a strong tunability and suppression of the spin signal and spin lifetime in heterostructures formed by graphene and topological insulators. This can lead to new graphene spintronic applications, ranging from novel circuits to new non-volatile memories and information processing technologies.

“The advantage of using heterostructures built from two Dirac materials is that, graphene in proximity with topological insulators still supports spin transport, and concurrently acquires a strong spin-orbit coupling,” said Associate Professor Saroj Prasad Dash, from Chalmers University of Technology.

“We do not just want to transport spin we want to manipulate it,” said Professor Stephan Roche from ICN2 and deputy leader of the Graphene Flagship’s spintronics Work-Package, “the use of topological insulators is a new dimension for spintronics, they have a surface state similar to graphene and can combine to create new hybrid states and new spin features. By combining graphene in this way we can use the tuneable density of states to switch on/off – to conduct or not conduct spin. This opens an active spin device playground.”

The Graphene Flagship, from its very beginning, saw the potential of spintronics devices made from graphene and related materials. This paper shows how combining graphene with other materials to make heterostructures opens new possibilities and potential applications.

“This paper combines experiment and theory and this collaboration is one of the strengths of the Spintronics Work-Package within the Graphene Flagship,” said Roche.

“Topological insulators belong to a class of material that generate strong spin currents, of direct relevance for spintronic applications such as spin-orbit torque memories. As reported by this article, the further combination of topological insulators with two-dimensional materials like graphene is ideal for enabling the propagation of spin information with extremely low power over long distances, as well as for exploiting complementary functionalities, key to further design and fabricate spin-logic architectures,” said Kevin Garello from IMEC, Belgium who is leader of the Graphene Flagships Spintronics Work-Package.

Professor Andrea C. Ferrari, Science and Technology Officer of the Graphene Flagship, and Chair of its Management Panel added “This paper brings us closer to building useful spintronic devices. The innovation and technology roadmap of the graphene Flagship recognises the potential of graphene and related materials in this area. This work yet again places the Flagship at the forefront of this field, initiated with pioneering contributions of European researchers.”

Organic semiconductor materials have the potential to be used in innovative applications such as transparent and flexible devices, and their low cost makes their potential use particularly attractive. The properties of organic semiconductor materials can be tuned by controlling their structure at the molecular level through parts of the structure known as electron-accepting units. A group of researchers centered at Osaka University has specifically tailored an electron-accepting unit that was then successfully used in an organic semiconductor applied in solar cell device that showed high photovoltaic performance. Their findings were published in NPG Asia Materials.

Chemical structures and photovoltaic characteristics. Credit: Osaka University

“Electron-accepting units are important elements of organic semiconductors,” study corresponding author Yoshio Aso says. “Through the controlled addition of electronegative fluorine groups to a widely used electron-accepting material, we were able to show precise control of the energy levels within the resulting semiconductor. This ability to tune the band gap translates to selectivity over the injection and transport of holes and/or electrons within the material, which is important in potential applications.”

The fluorinated electron-acceptor unit was used to prepare a thin film solar cell that was compared with a cell based on a non-fluorinated analogue. The researchers found that the fluorinated material showed enhanced power conversion efficiency, up to 3.12%. The morphology of the fluorinated film was also found to be good, which supported the efficient charge generation and transport that is necessary for successful application.

“The more we are able to fine tune organic semiconductor behavior on the molecular level, the more possibilities there will be for demonstrating their macroscopic applications,” co-author Yutaka Ie says. “It is our hope that the band gap control and high photovoltaic performance we have demonstrated will lead to our material being applied in devices such as organic light-emitted diodes, field-effect transistors, and thin film solar cells.”

The straightforward demonstration of the link between high electronegativity, greater electron-accepting tendency, and enhanced semiconductor performance, highlights both the potential and versatility of organic semiconductors. Further elegant solutions such as this one could substantially broaden the range of ƒÎ-conjugated materials, and reinforce the case for organic electronics.

Researchers from Graduate School of Bio-Applications and Systems Engineering at Tokyo University of Agriculture and Technology (TUAT) have sped up the movement of electrons in organic semiconductor films by two to three orders of magnitude. The speedier electronics could lead to improved solar power and transistor use across the world, according to the scientists.

They published their results in the September issue of Macromolecular Chemistry and Physics, where the paper is featured on the cover.

Led by Kenji Ogino, a professor at Graduate School of Bio-Applications and Systems Engineering at TUAT, Japan, the team found that adding polystyrene, commonly known as Styrofoam in North America, could enhance the semiconducting polymer by allowing electrons to move from plane to plane quickly. The process, called hole mobility, is how electrons move through an electric field consisting of multiple layers. When a molecule is missing an electron, an electron from a different plane can jump or fall and take its place.

Through various imaging techniques, it’s fairly easy to follow the electron trail in the crystal-based structures. In many semiconducting polymers, however, the clean, defined lines of the crystalline skeleton intertwine with a much more difficult-to-define region. It’s actually called the amorphous domain.

“[Electrons] transport in both crystalline and amorphous domains. To improve the total electron mobility, it is necessary to control the nature of the amorphous domain,” Ogino said. “We found that hole mobility extraordinarily improved by the introduction of polystyrene block accompanied by the increase of the ratio of rigid amorphous domain.”

The researchers believe that the way the crystalline domain connects within itself occurs most effectively through the rigid amorphous domain. The addition of polystyrene introduced more amorphous domain, but contained by flexible chains of carbon and hydrogen atoms. Even though the chains are flexible, it provides rigidity, and some degree of control, to the amorphous domain.

Electrons moved two to three times quicker than normal.

“The introduction of a flexible chain in semicrystalline polymers is one of the promising strategies to improve the various functionalities of polymer films by altering the characteristics of the amorphous domain,” Ogino said. “We propose that the rigid amorphous domain plays an important role in the hole transporting process.”

Enhanced hole mobility is a critical factor in developing more efficient solar devices, according to Ogino. Next, Ogino and the researchers plan to examine how the enhanced hole mobility affected other parameters, such as the chemical composition and position of the structures within the polymer film.

Just like their biological counterparts, hardware that mimics the neural circuitry of the brain requires building blocks that can adjust how they synapse, with some connections strengthening at the expense of others. One such approach, called memristors, uses current resistance to store this information. New work looks to overcome reliability issues in these devices by scaling memristors to the atomic level.

A group of researchers demonstrated a new type of compound synapse that can achieve synaptic weight programming and conduct vector-matrix multiplication with significant advances over the current state of the art. Publishing its work in the Journal of Applied Physics, from AIP Publishing, the group’s compound synapse is constructed with atomically thin boron nitride memristors running in parallel to ensure efficiency and accuracy.

Hardware that mimics the neural circuitry of the brain requires building blocks that can adjust how they synapse. One such approach, called memristors, uses current resistance to store this information. New work looks to overcome reliability issues in these devices by scaling memristors to the atomic level. Researchers demonstrated a new type of compound synapse that can achieve synaptic weight programming and conduct vector-matrix multiplication with significant advances over the current state of the art. They discuss their work in this week’s Journal of Applied Physics. This image shows a conceptual schematic of the 3D implementation of compound synapses constructed with boron nitride oxide (BNOx) binary memristors, and the crossbar array with compound BNOx synapses for neuromorphic computing applications. Credit: Ivan Sanchez Esqueda

The article appears in a special topic section of the journal devoted to “New Physics and Materials for Neuromorphic Computation,” which highlights new developments in physical and materials science research that hold promise for developing the very large-scale, integrated “neuromorphic” systems of tomorrow that will carry computation beyond the limitations of current semiconductors today.

“There’s a lot of interest in using new types of materials for memristors,” said Ivan Sanchez Esqueda, an author on the paper. “What we’re showing is that filamentary devices can work well for neuromorphic computing applications, when constructed in new clever ways.”

Current memristor technology suffers from a wide variation in how signals are stored and read across devices, both for different types of memristors as well as different runs of the same memristor. To overcome this, the researchers ran several memristors in parallel. The combined output can achieve accuracies up to five times those of conventional devices, an advantage that compounds as devices become more complex.

The choice to go to the subnanometer level, Sanchez said, was born out of an interest to keep all of these parallel memristors energy-efficient. An array of the group’s memristors were found to be 10,000 times more energy-efficient than memristors currently available.

“It turns out if you start to increase the number of devices in parallel, you can see large benefits in accuracy while still conserving power,” Sanchez said. Sanchez said the team next looks to further showcase the potential of the compound synapses by demonstrating their use completing increasingly complex tasks, such as image and pattern recognition.

As artificial intelligence has become increasingly sophisticated, it has inspired renewed efforts to develop computers whose physical architecture mimics the human brain. One approach, called reservoir computing, allows hardware devices to achieve the higher-dimension calculations required by emerging artificial intelligence. One new device highlights the potential of extremely small mechanical systems to achieve these calculations.

A group of researchers at the Université de Sherbrooke in Québec, Canada, reports the construction of the first reservoir computing device built with a microelectromechanical system (MEMS). Published in the Journal of Applied Physics, from AIP Publishing, the neural network exploits the nonlinear dynamics of a microscale silicon beam to perform its calculations. The group’s work looks to create devices that can act simultaneously as a sensor and a computer using a fraction of the energy a normal computer would use.

A single silicon beam (red), along with its drive (yellow) and readout (green and blue) electrodes, implements a MEMS capable of nontrivial computations. Credit: Guillaume Dion

The article appears in a special topic section of the journal devoted to “New Physics and Materials for Neuromorphic Computation,” which highlights new developments in physical and materials science research that hold promise for developing the very large-scale, integrated “neuromorphic” systems of tomorrow that will carry computation beyond the limitations of current semiconductors today.

“These kinds of calculations are normally only done in software, and computers can be inefficient,” said Guillaume Dion, an author on the paper. “Many of the sensors today are built with MEMS, so devices like ours would be ideal technology to blur the boundary between sensors and computers.”

The device relies on the nonlinear dynamics of how the silicon beam, at widths 20 times thinner than a human hair, oscillates in space. The results from this oscillation are used to construct a virtual neural network that projects the input signal into the higher dimensional space required for neural network computing.

In demonstrations, the system was able to switch between different common benchmark tasks for neural networks with relative ease, Dion said, including classifying spoken sounds and processing binary patterns with accuracies of 78.2 percent and 99.9 percent respectively.

“This tiny beam of silicon can do very different tasks,” said Julien Sylvestre, another author on the paper. “It’s surprisingly easy to adjust it to make it perform well at recognizing words.”

Sylvestre said he and his colleagues are looking to explore increasingly complicated computations using the silicon beam device, with the hopes of developing small and energy-efficient sensors and robot controllers.

Researchers at the universities in Linköping and Shenzhen have shown how an inorganic perovskite can be made into a cheap and efficient photodetector that transfers both text and music. “It’s a promising material for future rapid optical communication”, says Feng Gao, researcher at Linköping University.

The film in the new perovskite, which contains only inorganic elements (caesium, lead, iodine and bromine), has been tested in a system for optical communication, which confirmed its ability to transfer both text and images, rapidly and reliably. Credit: Thor Balkhed

“Perovskites of inorganic materials have a huge potential to influence the development of optical communication. These materials have rapid response times, are simple to manufacture, and are extremely stable.” So says Feng Gao, senior lecturer at LiU who, together with colleagues who include Chunxiong Bao, postdoc at LiU, and scientists at Shenzhen University, has published the results in the prestigious journal Advanced Materials.

All optical communication requires rapid and reliable photodetectors – materials that capture a light signal and convert it into an electrical signal. Current optical communication systems use photodetectors made from materials such as silicon and indium gallium arsenide. But these are expensive, partly because they are complicated to manufacture. Moreover, these materials cannot to be used in some new devices, such as mechanically flexible, light-weight or large-area devices.

Researcher have been seeking cheap replacement, or at least supplementary, materials for many years, and have looked at, for example, organic semi-conductors. However, the charge transport of these has proved to be too slow. A photodetector must be rapid.

The new perovskite materials have been extremely interesting in research since 2009, but the focus has been on their use in solar cells and efficient light-emitting diodes. Feng Gao, researcher in Biomolecular and Organic Electronics at LiU, was awarded a Starting Grant of EUR 1.5 million from the European Research Council (ERC) in the autumn of 2016, intended for research into using perovskites in light-emitting diodes.

Perovskites form a completely new family of semi-conducting materials that are defined by their crystal structures. They can consist of both organic and inorganic substances. They have good light-emitting properties and are easy to manufacture. For applications such as light-emitting diodes and efficient solar cells, most interest has been placed on perovskites that consist of an organic substance (containing carbon and hydrogen), metal, and halogen (fluorine, chlorine, bromine or iodine) ions. However, when this composition was used in photodetectors, it proved to be too unstable.

The results changed, however, when Chunxiong Bao used the right materials, and managed to optimise the manufacturing process and the structure of the film. The film in the new perovskite, which contains only inorganic elements (caesium, lead, iodine and bromine), has been tested in a system for optical communication, which confirmed its ability to transfer both text and images, rapidly and reliably. The quality didn’t deteriorate, even after 2,000 hours at room temperature.

“It’s very gratifying that we have already achieved results that are very close to application,” says Feng Gao, who leads the research, together with Professor Wenjing Zhang at Shenzhen University.

MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge (Qg) (“”90R1K4P”). The device with two package types, I-PAK and D-PAK, will sample to customers in November 2018 and will be manufactured in high volume in early first quarter of next year.

90R1K4P features the maximum peak voltage of 950V and a breakdown voltage as high as 900V, which enables enhanced system stability and reliability. It is well-suited for high-voltage applications such as:

  • an auxiliary power supply for industrial smart metering, which uses a three-phase input power to alternate current electric power generation, transmission, and distribution.
  • the lighting of flyback topology in both AC/DCand DC/DC high-speed switching converters.
  • a power supply for lighting equipment due to its characteristics of high stability that help prevent an unstable system condition that could lead to outages.

90R1K4P increases its switching speed due to its low total gate charge (Qg), which reduces heat generation in the system, keeps power loss down and improves energy efficiency. It also enables smaller form factors than the High-Voltage Planar MOSFET, since the die size of 90R1K4P is more than 50% smaller under the same condition of conduction loss.

To enable the use of 90R1K4P product in small form factors, MagnaChip will house the device in a small I-PAK package type under the code MMIS90R1K4P. As a result of the die size reduction and choice of packaging, this new MOSFET has the potential to be adopted in a wide range of applications.

Moreover, to ensure 90R1K4P product can be adopted for applications where space is at a premium, the company also can mount the Super Junction MOSFET into the slim SMD (Surface-Mount Devices) package type, D-PAK. It will be available under the code MMD90R1K4P.

“MagnaChip’s High-Voltage Super Junction MOSFET with a high breakdown voltage and a low total gate charge (Qg) will provide customers with high system reliability and energy efficiency,” said YJ Kim, CEO of MagnaChip. “We will continue to develop products based on the newly launched High-Voltage Super Junction MOSFET and extend our product portfolio with a diverse line of Super Junction MOSFETs with improved performance.”