Tag Archives: letter-pulse-tech

Modern life will be almost unthinkable without transistors. They are the ubiquitous building blocks of all electronic devices: each computer chip contains billions of them. However, as the chips become smaller and smaller, the current 3D field-electronic transistors (FETs) are reaching their efficiency limit. A research team at the Center for Artificial Low Dimensional Electronic Systems, within the Institute for Basic Science (IBS), has developed the first 2D electronic circuit (FET) made of a single material. Published on Nature Nanotechnology, this study shows a new method to make metal and semiconductor from the same material in order to manifacture 2D FETs.

In simple terms, FETs can be thought as high-speed switches, comprised of two metal electrodes and a semiconducting channel in between. Electrons (or holes) move from the source electrode to the drain electrode, flowing through the channel. While 3D FETs have been scaled down to nanoscale dimensions successfully, their physical limitations are starting to emerge. Short semiconductor channel lengths lead to a decrease in performance: some electrons (or holes) are able to flow between the electrodes even when they should not, causing heat and efficiency reduction. To overcome this performance degradation, transistor channels have to be made with nanometer-scale thin materials. However, even thin 3D materials are not good enough, as unpaired electrons, part of the so-called “dangling bonds” at the surface interfere with the flowing electrons, leading to scattering.

Passing from thin 3D FETs to 2D FETs can overcome these problems and bring in new attractive properties. “FETs made from 2D semiconductors are free from short-channel effects because all electrons are confined in naturally atomically thin channels, free of dangling bonds at the surface,” explains Ji Ho Sung, first author of the study. Moreover, single- and few-layer form of layered 2D materials have a wide range of electrical and tunable optical properties, atomic-scale thickness, mechanical flexibility and large bandgaps (1~2 eV).

The major issue for 2D FET transistors is the existence of a large contact resistance at the interface between the 2D semiconductor and any bulk metal. To address this, the team devised a new technique to produce 2D transistors with semiconductor and metal made of the same chemical compound, molybdenum telluride (MoTe2). It is a polymorphic material, meaning that it can be used both as metal and as semiconductor. Contact resistance at the interface between the semiconductor and metallic MoTe2 is shown to be very low. Barrier height was lowered by a factor of 7, from 150meV to 22meV.

IBS scientists used the chemical vapor deposition (CVD) technique to build high quality metallic or semiconducting MoTe2 crystals. The polymorphism is controlled by the temperature inside a hot-walled quartz-tube furnace filled with NaCl vapor: 710°C to obtain metal and 670°C for a semiconductor.

The scientists also manufactured larger scale structures using stripes of tungsten diselenide (WSe2) alternated with tungsten ditelluride (WTe2). They first created a thin layer of semiconducting WSe2 with chemical vapor deposition, then scraped out some stripes and grew metallic WTe2 on its place.

It is anticipated that in the future, it would be possible to realize an even smaller contact resistance, reaching the theoretical quantum limit, which is regarded as a major issue in the study of 2D materials, including graphene and other transition metal dichalcogenide materials.

Entegris Inc. (NASDAQ: ENTG), a specialty materials provider, announced at SEMICON Taiwan today the availability of its Oktolex membrane technology for advanced point-of-use photolithography applications. Oktolex’s membranes remove critical photochemical contaminants by enhancing the native retention mechanisms of each membrane type to match the needs of each chemistry. By matching membrane characteristics with specific contaminant-adsorption mechanisms, Oktolex membranes further optimize removal performance with no adverse interactions with the chemical composition.

“Breaking from convention, we’ve developed a cleaner, faster, and more effective way to remove the most challenging contaminants with a tailored approach to the specific contamination control needs of ArF, KrF, and EUV applications for Logic, DRAM, and 3D NAND devices,” noted Entegris Senior Vice President and General Manager of Microcontamination Control, Clint Haris. “The true advantage of this technology is its ability to create membranes that effectively remove the targeted contaminants, while not altering the chemical composition. This combination enables us to collaborate with customers to create precise contaminant removal solutions that meet the needs of advanced nodes and reduce tool downtime.”

Oktolex technology is currently available in Entegris Impact 8G point-of-use photochemical filters.

TowerJazz, the global specialty foundry, today announced the release of its advanced 5V 65nm power process providing customers with multiple advantages over 0.18um 5V technologies. The advanced 5V 65nm technology increases TowerJazz’s footprint in the 5V power market by offering enhanced Rdson efficiency with an attractive die cost advantage over 0.18um 5V processes. This technology is based on TowerJazz’s automotive 300mm 65nm process platform manufactured in its Uozu, Japan facility and supports both best in class quality and manufacturing cycle time.

The advanced 5V 65nm contains a rich portfolio of analog features and many different metal combinations to optimize cost/performance for any application. The first products, for several strategic customers, were already prototyped with outstanding performance. The technology is now fully released and supports Multi-layer Masking (MLM) and an MPW option to reduce engineering costs. The first MPW is targeted for November 2017.

TowerJazz’s 5V 65nm power technology offers high Rdson efficiency using tighter design rules for power devices, and a thick copper top metal for large current applications, enabling the 5V transistors using a 65nm design to achieve dense digital capabilities and a dense analog periphery, with a low number of manufacturing masks. The technology offers an average of 30% area reduction for a given 5V power transistor and typically a 35% die size reduction for a mixed-signal chip. An optimization effort to minimize cost and manufacturing layers needed to support 5V enables highly competitive solutions for many different markets such as automotive, industrial and consumer. The advanced 5V 65nm supports high current power applications such as PMIC, DC/DC converters, load switches and point of load ICs using single and dual 3.3um thick copper metal layers.

“Streamlining our feature rich automotive quality 65nm technology allows TowerJazz to provide very attractive 5V power and mixed-signal solutions with the high quality standard set required for servicing the automotive market,” said Shimon Greenberg, Vice President and General Manager of Mixed-Signal and Power Management Business Unit, TowerJazz. “This technology is utilized for relatively high current power ICs at 5V which have large growth drivers to advanced analog and mixed-signal ICs.”

Many seashells, minerals, and semiconductor nanomaterials are made up of smaller crystals, which are assembled together like the pieces of a puzzle. Now, researchers have measured the forces that cause the crystals to assemble, revealing an orchestra of competing factors that researchers might be able to control.

The work has a variety of implications in both discovery and applied science. In addition to providing insights into the formation of minerals and semiconductor nanomaterials, it might also help scientists understand soil as it expands and contracts through wetting and drying cycles. In the applied realm, researchers might use the principles to develop new materials with unique properties for energy needs.

The results, published in the Proceedings of the National Academy of Sciences in July, describe how the arrangement of the atoms in the crystals creates forces that pull them together and align them for docking. The study reveals how the attraction becomes stronger or weaker as water is heated or salt is added, both of which are common processes in the natural world.

The multinational team, led by chemists Dongsheng Li and Jaehun Chun from the Department of Energy’s Pacific Northwest National Laboratory, explored the attractive forces between two crystal particles made from mica. A flaky mineral that is commonly used in electrical insulation, this silicon-based mineral is well-studied and easy to work with because it chips off in flat pieces with nearly-perfect crystal surfaces.

Forces and faces

Crystallization often occurs through assembly of multi-faceted building blocks: some faces on these smaller crystals line up better with others, like Lego blocks do. Li and Chun have been studying a specific crystallization process called oriented attachment. Among other distinguishing characteristics, oriented attachment occurs when smaller subunits of fledgling crystals align their best matching faces before clicking together.

The process creates various nonlinear forms: nanowires with branches, lattices that look like complicated honeycombs, and tetrapods — tiny structures that look like four-armed toy jacks. The molecular forces that contribute to this self-assembly are not well understood.

Molecular forces that come into play can attract or repel the tiny crystal building blocks to or from each other. These include a variety of textbook forces such as van der Waals, hydrogen bonding, and electrostatic, among others.

To explore the forces, Li, Chun and colleagues milled flat faces on tiny slabs of mica and put them on a device that measures the attraction between two pieces. Then they measured the attraction while twisting the faces relative to each other. The experiment allowed the mica to be bathed in a liquid that includes different salts, letting them test real-world scenarios.

The difference in this work was the liquid setup. Similar experiments by other researchers have been done dry under vacuum; in this work, the liquid created conditions that better simulate how real crystals form in nature and in large industrial methods. The team performed some of these experiments at EMSL, the Environmental Molecular Sciences Laboratory, a DOE Office of Science User Facility at PNNL.

Twist and salt

One of the first things the team found was that the attraction between two pieces of mica rose and fell as the faces twisted relative to each other, like when trying to make a sandwich out of two flat refrigerator magnets (go on, try it). In fact, the attraction rose and fell every 60 degrees, corresponding with the internal architecture of the mineral, which is almost hexagonal like a honeycomb cell.

Although other researchers more than a decade ago had predicted this cyclical attraction would happen, this is the first time scientists had measured the forces. Knowing the strength of the forces is key to manipulating crystallization in a research or industrial setting.

But other things were abuzz in the mica face-off as well. Between the two surfaces, the liquid environment housed electrically charged ions from salts, normal elements found during crystallization in nature. The water and the ions formed a somewhat stable layer between the surfaces that partly kept them separated. And as they moved toward each other, the two mica surfaces paused there, balanced between molecular attraction and repulsion by water and ions.

The team also found they could manipulate the strength of that attraction by changing the type of ions, their concentration, and the temperature. Different types of ions and their concentrations changed electrostatic repulsion between the mica surfaces. The size of the ions and how many charges they carried also created more or less space within the meddling layer.

Lastly, higher temperatures increased the strength of the attraction, contrary to how temperature behaves in simpler, less complex scenarios. The researchers built a model of the competing forces that included van der Waals, electrostatic, and hydration forces.

In the future, the researchers say, the principles gleaned from this study can be applied to other materials, which would be calculated for the material of interest. For example, manipulating the attraction might allow researchers to custom-build crystals of desired sizes and shapes and with unique properties. Overall, the work provides insights into crystal growth through nanoparticle assembly in synthetic, biological, and geochemical environments.

A powdery mix of metal nanocrystals wrapped in single-layer sheets of carbon atoms, developed at the Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab), shows promise for safely storing hydrogen for use with fuel cells for passenger vehicles and other uses. And now, a new study provides insight into the atomic details of the crystals’ ultrathin coating and how it serves as selective shielding while enhancing their performance in hydrogen storage.

The study, led by Berkeley Lab researchers, drew upon a range of Lab expertise and capabilities to synthesize and coat the magnesium crystals, which measure only 3-4 nanometers (billionths of a meter) across; study their nanoscale chemical composition with X-rays; and develop computer simulations and supporting theories to better understand how the crystals and their carbon coating function together.

The science team’s findings could help researchers understand how similar coatings could also enhance the performance and stability of other materials that show promise for hydrogen storage applications. The research project is one of several efforts within a multi-lab R&D effort known as the Hydrogen Materials — Advanced Research Consortium (HyMARC) established as part of the Energy Materials Network by the U.S. Department of Energy’s Fuel Cell Technologies Office in the Office of Energy Efficiency and Renewable Energy.

Reduced graphene oxide (or rGO), which resembles the more famous graphene (an extended sheet of carbon, only one atom thick, arrayed in a honeycomb pattern), has nanoscale holes that permit hydrogen to pass through while keeping larger molecules at bay.

This carbon wrapping was intended to prevent the magnesium — which is used as a hydrogen storage material — from reacting with its environment, including oxygen, water vapor and carbon dioxide. Such exposures could produce a thick coating of oxidation that would prevent the incoming hydrogen from accessing the magnesium surfaces.

But the latest study suggests that an atomically thin layer of oxidation did form on the crystals during their preparation. And, even more surprisingly, this oxide layer doesn’t seem to degrade the material’s performance.

“Previously, we thought the material was very well-protected,” said Liwen Wan, a postdoctoral researcher at Berkeley Lab’s Molecular Foundry, a DOE Nanoscale Science Research Center, who served as the study’s lead author. The study was published in the Nano Letters journal. “From our detailed analysis, we saw some evidence of oxidation.”

Wan added, “Most people would suspect that the oxide layer is bad news for hydrogen storage, which it turns out may not be true in this case. Without this oxide layer, the reduced graphene oxide would have a fairly weak interaction with the magnesium, but with the oxide layer the carbon-magnesium binding seems to be stronger.

“That’s a benefit that ultimately enhances the protection provided by the carbon coating,” she noted. “There doesn’t seem to be any downside.”

David Prendergast, director of the Molecular Foundry’s Theory Facility and a participant in the study, noted that the current generation of hydrogen-fueled vehicles power their fuel cell engines using compressed hydrogen gas. “This requires bulky, heavy cylindrical tanks that limit the driving efficiency of such cars,” he said, and the nanocrystals offer one possibility for eliminating these bulky tanks by storing hydrogen within other materials.

The study also helped to show that the thin oxide layer doesn’t necessarily hinder the rate at which this material can take up hydrogen, which is important when you need to refuel quickly. This finding was also unexpected based on the conventional understanding of the blocking role oxidation typically plays in these hydrogen-storage materials.

That means the wrapped nanocrystals, in a fuel storage and supply context, would chemically absorb pumped-in hydrogen gas at a much higher density than possible in a compressed hydrogen gas fuel tank at the same pressures.

The models that Wan developed to explain the experimental data suggest that the oxidation layer that forms around the crystals is atomically thin and is stable over time, suggesting that the oxidation does not progress.

The analysis was based, in part, around experiments performed at Berkeley Lab’s Advanced Light Source (ALS), an X-ray source called a synchrotron that was earlier used to explore how the nanocrystals interact with hydrogen gas in real time.

Wan said that a key to the study was interpreting the ALS X-ray data by simulating X-ray measurements for hypothetical atomic models of the oxidized layer, and then selecting those models that best fit the data. “From that we know what the material actually looks like,” she said.

While many simulations are based around very pure materials with clean surfaces, Wan said, in this case the simulations were intended to be more representative of the real-world imperfections of the nanocrystals.

A next step, in both experiments and simulations, is to use materials that are more ideal for real-world hydrogen storage applications, Wan said, such as complex metal hydrides (hydrogen-metal compounds) that would also be wrapped in a protective sheet of graphene.

“By going to complex metal hydrides, you get intrinsically higher hydrogen storage capacity and our goal is to enable hydrogen uptake and release at reasonable temperatures and pressures,” Wan said.

Some of these complex metal hydride materials are fairly time-consuming to simulate, and the research team plans to use the supercomputers at Berkeley Lab’s National Energy Research Scientific Computing Center (NERSC) for this work.

“Now that we have a good understanding of magnesium nanocrystals, we know that we can transfer this capability to look at other materials to speed up the discovery process,” Wan said.

For the first time, physicists have successfully imaged spiral magnetic ordering in a multiferroic material. These materials are considered highly promising candidates for future data storage media. The researchers were able to prove their findings using unique quantum sensors that were developed at Basel University and that can analyze electromagnetic fields on the nanometer scale. The results – obtained by scientists from the University of Basel’s Department of Physics, the Swiss Nanoscience Institute, the University of Montpellier and several laboratories from University Paris-Saclay – were recently published in the journal Nature.

Multiferroics are materials that simultaneously react to electric and magnetic fields. These two properties are rarely found together, and their combined effect makes it possible to change the magnetic ordering of materials using electric fields.

This offers particular potential for novel data storage devices: multiferroic materials can be used to create nanoscale magnetic storage media that can be deciphered and modified using electric fields.

Magnetic media of this kind would consume very little power and operate at very high speeds. They could also be used in spintronics – a new form of electronics that uses electrons’ spin as well as electrical charge.

Spiral magnetic ordering

Bismuth ferrite is a multiferroic material that exhibits electric and magnetic properties even at room temperature. While its electrical properties have been studied in depth, there was no suitable method for representing magnetic ordering on the nanometer scale until now.

The group led by Georg-H.-Endress Professor Patrick Maletinsky, from the Swiss Nanoscience Institute and the University of Basel’s Department of Physics, has developed quantum sensors based on diamonds with nitrogen vacancy centers. This allowed them, in collaboration with colleagues at the University of Montpellier and the University Paris-Saclay in France, to depict and study the magnetic ordering of a thin bismuth ferrite film for the first time, as they report in Nature.

Knowing how the electron spins behave and how the magnetic field is ordered is of crucial importance for the future application of multiferroic materials as data storage.

The scientists were able to show that bismuth ferrite exhibits spiral magnetic ordering, with two superimposed electron spins (shown in red and blue in the image) adopting opposing orientations and rotating in space, whereas it was previously assumed that this rotation took place within a plane. According to the researchers, the quantum sensors now show that a slight tilt in these opposing spins leads to spatial rotation with a slight twist.

“Our diamond quantum sensors allow not only qualitative but also quantitative analysis. This meant we were able to obtain a detailed picture of the spin configuration in multiferroics for the first time,” explains Patrick Maletinsky. “We are confident that this will pave the way for advances in research into these promising materials.”

Vacancies with special properties

The quantum sensors they used consist of two tiny monocrystalline diamonds, whose crystal lattices have a vacancy and a nitrogen atom in two neighboring positions. These nitrogen vacancy centers contain orbiting electrons whose spins respond very sensitively to external electric and magnetic fields, allowing the fields to be imaged at a resolution of just a few nanometers.

Scientists at the University of Montpellier took the magnetic measurements using the quantum sensors produced in Basel. The samples were supplied by experts from the CNRS/Thales laboratory at University Paris-Saclay, who are leading lights in the field of bismuth ferrite research.

Quantum sensors for the market

The quantum sensors used in the research are suitable for studying a wide range of materials, as they provide precisely detailed qualitative and quantitative data both at room temperature and at temperatures close to absolute zero.

In order to make them available to other research groups, Patrick Maletinsky founded the start-up Qnami in 2016 in collaboration with Dr. Mathieu Munsch. Qnami produces the diamond sensors and provides application advice to its customers from research and industry.

Researchers from North Carolina State University are rolling out a new manufacturing process and chip design for silicon carbide (SiC) power devices, which can be used to more efficiently regulate power in technologies that use electronics. The process – called PRESiCE – was developed with support from the PowerAmerica Institute funded by the Department of Energy to make it easier for companies to enter the SiC marketplace and develop new products.

“PRESiCE will allow more companies to get into the SiC market, because they won’t have to initially develop their own design and manufacturing process for power devices – an expensive, time-consuming engineering effort,” says Jay Baliga, Distinguished University Professor of Electrical and Computer Engineering at NC State and lead author of a paper on PRESiCE that will be presented later this month. “The companies can instead use the PRESiCE technology to develop their own products. That’s good for the companies, good for consumers, and good for U.S. manufacturing.”

Power devices consist of a diode and transistor, and are used to regulate the flow of power in electrical devices. For decades, electronics have used silicon-based power devices. In recent years, however, some companies have begun using SiC power devices, which have two key advantages.

First, SiC power devices are more efficient, because SiC transistors lose less power. Conventional silicon transistors lose 10 percent of their energy to waste heat. SiC transistors lose only 7 percent. This is not only more efficient, but means that product designers need to do less to address cooling for the devices.

Second, SiC devices can also switch at a higher frequency. That means electronics incorporating SiC devices can have smaller capacitors and inductors – allowing designers to create smaller, lighter electronic products.

But there’s a problem.

Up to this point, companies that have developed manufacturing processes for creating SiC power devices have kept their processes proprietary – making it difficult for other companies to get into the field. This has limited the participation of other companies and kept the cost of SiC devices high.

The NC State researchers developed PRESiCE to address this bottleneck, with the goal of lowering the barrier of entry to the field for companies and increasing innovation.

The PRESiCE team worked with a Texas-based foundry called X-Fab to implement the manufacturing process and have now qualified it – showing that it has the high yield and tight statistical distribution of electrical properties for SiC power devices necessary to make them attractive to industry.

“If more companies get involved in manufacturing SiC power devices, it will increase the volume of production at the foundry, significantly driving down costs,” Baliga says.

Right now, SiC devices cost about five times more than silicon power devices.

“Our goal is to get it down to 1.5 times the cost of silicon devices,” Baliga says. “Hopefully that will begin the ‘virtuous cycle’: lower cost will lead to higher use; higher use leads to greater production volume; greater production volume further reduces cost, and so on. And consumers are getting a better, more energy-efficient product.”

The researchers have already licensed the PRESiCE process and chip design to one company, and are in talks with several others.

“I conceived the development of wide bandgap semiconductor (SiC) power devices in 1979 and have been promoting the technology for more than three decades,” Baliga says. “Now, I feel privileged to have created PRESiCE as the nation’s technology for manufacturing SiC power devices to generate high-paying jobs in the U.S. We’re optimistic that our technology can expedite the commercialization of SiC devices and contribute to a competitive manufacturing sector here in the U.S.,” Baliga says.

The paper, “PRESiCE: PRocess Engineered for manufacturing SiC Electronic-devices,” will be presented at the International Conference on Silicon Carbide and Related Materials, being held Sept. 17-22 in Washington, D.C. The paper is co-authored by W. Sung, now at State University of New York Polytechnic Institute; K. Han and J. Harmon, who are Ph.D. students at NC State; and A. Tucker and S. Syed, who are undergraduates at NC State.

KLA-Tencor Corporation (NASDAQ: KLAC) today introduced five patterning control systems that help chipmakers achieve the strict process tolerances required for multi-patterning technologies and EUV lithography at the sub-7nm logic and leading-edge memory design nodes. Within the IC fab, the ATL™ (Accurate Tunable Laser) overlay metrology system and the SpectraFilm™ F1 film metrology system characterize processes and monitor excursions during fabrication of finFET, DRAM, 3D NAND and other complex devices. The Teron™ 640e reticle inspection product line and the LMS IPRO7 reticle registration metrology system facilitate development and qualification of EUV and advanced optical reticles at mask shops. The 5D Analyzer® X1 advanced data analysis system is the foundation of an open architecture approach that supports fab-customized analyses and real-time process control applications. These five new systems extend KLA-Tencor’s diverse portfolio of metrology, inspection and data analysis systems that enable identification and correction of process variations at the source.

“At the 7nm and 5nm design nodes, it is becoming increasingly difficult for chipmakers to find specific sources of on-product overlay error, critical dimension non-uniformity and hotspots,” said Ahmad Khan executive vice president of the Global Products Group at KLA-Tencor. “Our customers are looking beyond scanner corrections to understand how variations from all reticle and wafer process steps affect patterning. Through open access to fab-wide metrology and inspection data, IC engineers can quickly pinpoint and manage process issues directly where they occur. Our systems, such as the five introduced today, deliver our strongest technology to our customers’ experts, enabling them to drive down the patterning error contributions of every wafer, reticle and process step.”

The five new systems that support patterning control for sub-7nm design node devices include:

  • The ATL overlay metrology system utilizes unique tunable laser technology with 1nm resolution to automatically maintain highly accurate and robust overlay error measurements in the presence of process variations, supporting fast technology ramps and accurate wafer disposition during production.
  • The SpectraFilm F1 film metrology system employs new optical technologies that determine single- and multi-layer film thicknesses and uniformity with high precision to monitor deposition processes in production, and deliver bandgap data that predict device electrical performance earlier than end-of-line test.
  • The Teron 640e reticle inspection product line incorporates optical, detector and algorithm enhancements that detect critical pattern and particle defects at high throughput, advancing the development and qualification of EUV and optical patterned reticles in leading-edge mask shops.
  • The LMS IPRO7 reticle registration metrology system leverages a new operating mode to accurately measure on-device reticle pattern placement error with fast cycle time, enabling comprehensive reticle qualification for e-beam mask writer corrections and reduction of reticle-related contributions to device overlay errors in the IC fab.
  • The 5D Analyzer X1 data analysis system offers an extendible, open architecture that accepts data from a wide range of metrology and process tools to enable advanced analysis, characterization and real-time control of fab-wide process variations.

ATL, SpectraFilm F1, Teron 640e, LMS IPRO7 and 5D Analyzer X1 are part of KLA-Tencor’s unique 5D Patterning Control Solution™, which also includes systems for patterned wafer geometry measurements, in-situ process measurements, critical dimension and device profile metrology, lithography and patterning simulation, and discovery of critical hotspots. Several ATL, SpectraFilm F1 and 5D Analyzer X1 systems are in use at leading-edge IC manufacturers worldwide, supporting a range of patterning control applications. Through upgrades and new tool shipments, the Teron 640e and LMS IPRO7 expand KLA-Tencor’s strong installed base of reticle inspection and metrology systems in advanced mask shops. To maintain the high performance and productivity demanded by IC manufacturing, ATL, SpectraFilm F1, Teron 640e, LMS IPRO7 and 5D Analyzer X1 are backed by KLA-Tencor’s global comprehensive service network. More information on the five new systems can be found on the advanced patterning control web page.

Researchers at Caltech have developed a prototype miniature medical device that could ultimately be used in “smart pills” to diagnose and treat diseases. A key to the new technology–and what makes it unique among other microscale medical devices–is that its location can be precisely identified within the body, something that proved challenging before.

“The dream is that we will have microscale devices that are roaming our bodies and either diagnosing problems or fixing things,” says Azita Emami, the Andrew and Peggy Cherng Professor of Electrical Engineering and Medical Engineering and Heritage Medical Research Institute Investigator, who co-led the research along with Assistant Professor of Chemical Engineering and Heritage Medical Research Institute Investigator Mikhail Shapiro. “Before now, one of the challenges was that it was hard to tell where they are in the body.”

A paper describing the new device appears in the September issue of the journal Nature Biomedical Engineering. The lead author is Manuel Monge (MS ’10, PhD ’17), who was a doctoral student in Emami’s lab and a Rosen Bioengineering Center Scholar at Caltech, and now works at a company called Neuralink. Audrey Lee-Gosselin, a research technician in Shapiro’s lab, is also an author.

Called ATOMS, which is short for addressable transmitters operated as magnetic spins, the new silicon-chip devices borrow from the principles of magnetic resonance imaging (MRI), in which the location of atoms in a patient’s body is determined using magnetic fields. The microdevices would also be located in the body using magnetic fields–but rather than relying on the body’s atoms, the chips contain a set of integrated sensors, resonators, and wireless transmission technology that would allow them to mimic the magnetic resonance properties of atoms.

Illustration of an ATOMS microchip localized within the gastrointestinal tract. The chip, which works on principles similar to those used in MRI machines, is embodied with the properties of nuclear spin. Credit: Ella Marushchenko for Caltech

Illustration of an ATOMS microchip localized within the gastrointestinal tract. The chip, which works on principles similar to those used in MRI machines, is embodied with the properties of nuclear spin. Credit: Ella Marushchenko for Caltech

“A key principle of MRI is that a magnetic field gradient causes atoms at two different locations to resonate at two different frequencies, making it easy to tell where they are,” says Shapiro. “We wanted to embody this elegant principle in a compact integrated circuit. The ATOMS devices also resonate at different frequencies depending on where they are in a magnetic field.”

“We wanted to make this chip very small with low power consumption, and that comes with a lot of engineering challenges,” says Emami. “We had to carefully balance the size of the device with how much power it consumes and how well its location can be pinpointed.”

The researchers say the devices are still preliminary but could one day serve as miniature robotic wardens of our bodies, monitoring a patient’s gastrointestinal tract, blood, or brain. The devices could measure factors that indicate the health of a patient–such as pH, temperature, pressure, sugar concentrations–and relay that information to doctors. Or, the devices could even be instructed to release drugs.

“You could have dozens of microscale devices traveling around the body taking measurements or intervening in disease. These devices can all be identical, but the ATOMS devices would allow you to know where they all are and talk to all of them at once,” says Shapiro. He compares it to the 1966 sci-fi movie Fantastic Voyage, in which a submarine and its crew are shrunk to microscopic size and injected into the bloodstream of a patient to heal him from the inside–but, as Shapiro says, “instead of sending a single submarine, you could send a flotilla.”

The idea for ATOMS came about at a dinner party. Shapiro and Emami were discussing their respective fields–Shapiro engineers cells for medical imaging techniques, such as MRI, and Emami creates microchips for medical sensing and performing actions in the body–when they got the idea of combining their interests into a new device. They knew that locating microdevices in the body was a long-standing challenge in the field and realized that combining Shapiro’s knowledge in MRI technology with Emami’s expertise in creating microdevices could potentially solve the problem. Monge was enlisted to help realize the idea in the form of a silicon chip.

“This chip is totally unique: there are no other chips that operate on these principles,” says Monge. “Integrating all of the components together in a very small device while keeping the power low was a big task.” Monge did this research as part of his PhD thesis, which was recently honored with the Charles Wilts Prize by Caltech’s Department of Electrical Engineering.

The final prototype chip, which was tested and proven to work in mice, has a surface area of 1.4 square millimeters, 250 times smaller than a penny. It contains a magnetic field sensor, integrated antennas, a wireless powering device, and a circuit that adjusts its radio frequency signal based on the magnetic field strength to wirelessly relay the chip’s location.

“In conventional MRI, all of these features are intrinsically found in atoms,” says Monge. “We had to create an architecture that functionally mimics them for our chip.”

While the current prototype chip can relay its location in the body, the next step is to build one that can both relay its location and sense body states.

“We want to build a device that can go through the gastrointestinal tract and not only tell us where it is but communicate information about the various parts of the body and how they are doing.”

Brooks Instrument will be exhibiting at SEMICON Taiwan 2017 with a new vaporization product, mass flow controllers with high-speed EtherCAT, and a broad range of other mass flow meters, controllers and capacitance manometers for semiconductor manufacturing.

The show runs September 13-15 at the Taipei Nangang Exhibition Center in Taipei, Taiwan. Brooks Instrument will be co-exhibiting with its regional business partner SCH Electronics Co., Ltd. at booth 168.

With more than 70 years of history in new technology developments, Brooks Instrument is focused on improving the precision and performance of mass flow, pressure and vacuum technologies to help enable advanced semiconductor manufacturing.

“At Brooks Instrument, we’re excited to be presenting for the first time at SEMICON Taiwan,” said Mohamed Saleem, Chief Technology Officer at Brooks Instrument. “We look forward to having one-on-one conversations with our colleagues from Taiwan and across the region about their key needs and the challenges they face implementing next-generation production tools and processes.”

A world leader in advanced flow, pressure, vacuum and vapor delivery solutions, Brooks Instrument will showcase key components in its portfolio designed to meet critical gas chemistry control challenges and improve process yields for 10nm and beyond nodes. This includes the new VDM300 vapor delivery module (VDM) as well as the company’s proven GF100 Series mass flow controllers (MFC) with high-speed EtherCAT® connectivity.

VDM300 Vapor Delivery Module: The self-contained VDM delivers precise amounts of ultra-high-purity deionized water (DIW) vapor to help ensure accurate and repeatable processing for functions such as plasma etching and photoresist stripping. Using proven vapor-draw vaporization technology, the VDM300 features an improved graphical user interface and firmware.

Full-scale flow capacity is up to 3,000 standard cubic centimeters per minute (sccm), with a better control turndown ratio of 20:1. Flow accuracy is ±1.0 percent of set point at 10-100 percent full-scale, while repeatability is less than ±0.2 percent of full-scale.

With its optional EtherCAT interface, the VDM300 joins the Brooks Instrument line of EtherCAT-enabled products, which also includes the company’s proven GF100 Series MFCs. The VDM300 uses the same signal processing and calibration techniques as the GF100 Series.

GF100 Series MFC with High-Speed EtherCAT Connectivity: Brooks Instrument has enhanced its industry-leading GF100 Series MFCs with high-speed EtherCAT interfaces for both high-flow and low-flow applications.

Responding to rapidly evolving requirements for next-generation tools and fabs, the GF100 Series includes several features to help boost process yields and productivity:

  • Embedded diagnostics to leverage real-time EtherCAT data acquisition capabilities for advanced fault detection and classification;
  • An ultra-stable flow sensor (less than ±0.15 percent of full-scale drift per year) enables tighter low set point accuracy and reduces maintenance requirements;
  • Improved valve shutdown reduces valve leak-by, minimizing potential first wafer effects;
  • Enhancements to the GF100 advanced pressure transient insensitivity to less than one percent of set point with five PSI per second pressure perturbations, which reduces crosstalk sensitivity for consistent mass flow delivery.