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New extreme-ultraviolet (EUV) lithography equipment unveiled by ASML, announcement by Intel of eight EUV programs ready to be rolled out, and introduction by IMEC of the industry’s first comprehensive solution for EUVL-enabled high-volume manufacturing systems were among highlights at SPIE Advanced Lithography 2017 in San Jose earlier this month.

Sponsored by SPIE, the international society for optics and photonics, the annual event is the year’s primary forum for the industry. Attendance was up this year over last, with nearly 2,300 participating, and ran 26 February through 2 March.

Speakers from ASML, Intel, KLA-Tencor, JSR Corp, IMEC, Samsung, and other organizations emphasized progress being made toward manufacturing computer chips using sub-10nm node lithography, sparking much discussion about when, where, and how — plus the occasional if — the next generation of lithography tools will enable high-volume and high-throughput manufacturing at an EUV wavelength of about 13.5nm. Presentation recordings are viewable on the SPIE Newsroom on SPIE.org.

Product System Engineer Mark van de Kerkhof reported on ASML’s NXE:3400B EUV scanner, which enables sub-10nm-node lithography — ASML’s first scanner that can produce 125 wafers/hour, the throughput rate needed in production fabs.

With ever-smaller feature sizes being designed, mask makers must continuously advance their technologies as EUV sources and other lithography tools advance, noted plenary speaker Frank Abboud, Vice President of Technology and Manufacturing Group at Intel, and General Manager, Intel Mask Operation.

“Almost every module in the mask shop is touched,” he said, including blank preparation, fiducial mark patterning, device patterning, black-border patterning, and metrology/characterization.”

Plenary speaker Ben Tsai, Chief Technology Officer and Executive Vice President of Corporate Alliances at KLA-Tencor, spoke on the return on investment of defect detection.

Inspection and metrology can involve 1,000 process steps for an advanced graphics processing unit, each requiring extremely high accuracy, he noted. In such a process model, if each step was 99.5% perfect, fewer than 1% of manufactured devices would work, illustrating the importance of investment in inspection and metrology to identify and resolve essentially all defects.

Starting with a vision of drivers for next-generation computing such as artificial intelligence (AI) and the computational power required, Nobu Koshiba, President and CEO of JSR Corporation, pointed out the extent to which the information explosion trending for years is continuing, with estimated data traffic in 2020 being 7× greater than in 2015.

The growth is stimulating AI advances, as are autonomous driving, precision medicine, genomic science, and cognitive computing, he said.

In a keynote talk, Philippe Leray, IMEC Group Leader of Advanced Metrology, described development of the first comprehensive solution for EUVL enablement in high-volume manufacturing. The approach serves as a basis for industry requirements for power, performance, area and cost, and includes proposals for design rules, masks, photoresists, etching, and metrology and an extensive process variation assessment, Leray said.

Donis Flagello, President, CEO, and COO of Nikon Research Corporation of America (NRCA), was presented with the 2017 Frits Zernike Award for Microlithography.

Semiconductor pioneer Burn Lin (National Tsin Hua University) was honored on the 30th anniversary of the Optical Microlithography conference in recognition of his serving as the first chair of the conference in 1988, and of his outstanding contributions to the lithography community. Lin was the founding editor of the SPIE Journal of Microlithography, Microfabrication, and Microsystems (JM3).

Six new Fellows of SPIE were recognized: Emily Gallagher (IMEC), Yuri Granik (Mentor Graphics), Qinghuang Lin (IBM Thomas J. Watson Research Center), David Pan (University of Texas, Austin), Mark Phillips (Intel Corp.), and James Thackarey (Dow Electronic Materials).

Bruce Smith, Rochester Institute of Technology, served as symposium chair, and Will Conley of Cymer, an ASML company, was symposium co-chair.

SPIE Advanced Lithography included seven conferences on lithographic topics, along with technical courses taught by experts from industry and academia, and a two-day exhibition.

Micron Technology, Inc. (NASDAQ:MU), a developer of advanced semiconductor systems, today announced that on March 14 it successfully won the auction for Cando Corporation assets, which will be utilized in establishing a back-end site for Micron Taiwan. Micron has now completed the title acquisition process for the new site.

The acquisition includes the cleanroom and tools that are adjacent to Micron’s existing Taichung fab, bringing the company’s fabrication and back-end together in one location. The new site will be focused on establishing a centralized back-end operation.

“This marks a significant step in our plan to create a center of excellence for leading-edge DRAM in Taiwan,” said Wayne Allan, VP, Global Manufacturing. “Bringing fabrication and back end together, all in one location, builds an efficient support structure for end-to-end manufacturing with quicker cycle times that benefit our business and customers.”

The new back-end site is expected to begin production in August, and the new integrated center of excellence is expected to bring greater operational cost efficiency that will benefit Micron’s DRAM business on a global scale. These cost efficiencies are part of the overall US$500 million of ongoing operational enhancement opportunities cited at the company’s 2017 analyst conference.

The strategic acquisition, with a winning bid of US$89.2 million, also highlights Micron’s goal to grow its presence in Taiwan – where it is the largest foreign employer and investor – from its current wafer manufacturing function to a broader center of expertise in the global memory industry. The back-end site will further enhance the company’s strong presence on the island, which already includes 300mm wafer fabrication facilities in Taichung and Taoyuan, as well as sales and technical support offices in Taipei.

The back-end operation will be led by site director Mike Liang, who joined Micron in November 2016 with more than 35 years of experience in the semiconductor industry. Having previously served in leadership roles at Ti-Acer, KYEC and Amkor Taiwan, Liang brings significant expertise in both front-end wafer fabrication and back-end assembly and test manufacturing.

Many large companies and startups are currently working on microLED technologies for display applications: from LED makers such as Epistar, Nichia or Osram to display makers like AUO, BOE or CSOT and OEMs such as Apple or Facebook/Oculus. Due to the multiplicity of players and the diversity of strategies, KnowMade, part of Yole Group of Companies underlines a complex and heavy patent landscape. “Enabling large scale microLED displays manufacturing requires to bring together 3 major disparate know-how and supply chain bricks including LED manufacturing, display manufacturing and technology transfer & assembly”, asserts Dr Eric Virey, Senior Technology & Market Analyst at Yole Développement (Yole), part of Yole Group of Companies. The microLED displays supply chain is therefore still under construction. Participants have to find the way to collaborate together and define the most efficient manufacturing approach.

display supply chain

While very promising in terms of performance, there are still multiple manufacturing challenges that need to be addressed to enable cost effective, high volume manufacturing of microLED displays. Based on its latest microLED display technology & market report , the “More than Moore” market research and strategy consulting company Yole proposes a live event titled Microled Displays: hype and reality | Hopes & challenges. Taking place on March 29 at 5:00 PM CET this webcast powered by I-micronews.com welcomes Dr Eric Virey from Yole. During this event, Dr Virey will expose the technical challenges and market opportunities of the microLED technologies. To register, click MicroLED Display.

“Even if the remaining technology roadblocks are removed, no company beside Apple and its startup Luxvue acquired in 2014 currently appear to have the positioning and leverage to enable the supply chain,” comments Yole’s expert. So what could happen?

If successful, microLED displays could have a profound impact on both the LED and display supply chains. Indeed, the development of large scale microLED displays requires the combination of three major disparate technologies: LED, TFT backplane and chip transfer. The supply chain is complex and lengthy compared with that of traditional displays. Each process is critical and managing every aspect effectively will be challenging. “No single player can solve all the issues and it seems unlikely that any will fully vertically integrate”, comments Dr Virey from Yole. And he details:

• Small companies could bring together the different technologies to serve the AR/MR market, but for high volume consumer applications such as mobiles or TVs, only a strong push from a leading OEM can enable a supply chain.
• Apple has a unique market positioning: and appears to be the most likely candidate with enough leverage and financial strength to bring all partners together.
• Other candidates including Oculus for example, have also invested in microLEDs for AR/MR applications.

So what will be the next step? Yole confirms: each company will attempt to capture as much added value as it can.

For LED makers, low defect requirements and high resolution features of microLED mean large investments in new clean room and lithography equipment which might be better suited to CMOS foundries.

Traditional display makers are used to manufacturing both back and front planes in an integrated fashion and delivering finished panels to OEMs. With microLEDs, they will push back against becoming component suppliers, only providing a TFT backplane to whichever participant will produce the final display assembly: OEMs or OSAT players.

In parallel, some companies will benefit from microLED displays independently of how the supply chain is shaped. These beneficiaries include MOCVD reactor and other LED equipment manufacturers as well as wafer suppliers.

North America-based manufacturers of semiconductor equipment posted $1.97 billion in billings worldwide in February 2017 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in February 2017 was $1.97 billion. The billings figure is 6.1 percent higher than the final January 2017 level of $1.86 billion, and is 63.8 percent higher than the February 2016 billings level of $1.20 billion.

“Billings levels remain elevated as memory and foundry manufacturers continue to invest in advanced semiconductor technologies,” said Ajit Manocha, president and CEO of SEMI. “These investments are paving the way for the ramp of 3D NAND and 1X-nm devices.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Year-Over-Year

September 2016

$1,493.3

-0.1%

October 2016

$1,630.4

20.0%

November 2016

$1,613.3

25.2%

December 2016

$1,869.8

38.5%

January 2017 (final)

$1,859.4

52.3%

February 2017 (prelim)

$1,973.1

63.8%

Source: SEMI (www.semi.org), March 2017

 

SEMI ceased publishing the monthly North America Book-to-Bill report in January 2017.  The decision to discontinue the Book-to-Bill report was based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program is no longer considered a necessary component of their industry analysis.

Research information that will be posted in the March Update to the 20th anniversary 2017 edition of IC Insights’ McClean Report shows that fabless IC suppliers represented 30% of the world’s IC sales in 2016 (up from only 18% ten years earlier in 2006).  As the name implies, fabless IC companies do not have an IC fabrication facility of their own.

Figure 1 depicts the 2016 fabless company share of IC sales by company headquarters location.  As shown, at 53%, the U.S. companies held the dominant share of fabless IC sales last year, although this share was down from 69% in 2010 (due in part to the acquisition of U.S.-based Broadcom by Singapore-based Avago).  Although Avago, now called Broadcom Limited after its merger with fabless IC supplier Broadcom became official on February 1, 2016, has fabrication facilities that produce III-V discrete devices, it does not possess its own IC fabrication facilities and is considered by IC Insights to be a fabless IC supplier.

Figure 1

Figure 1

Figure 2 shows that in 2009, there was only one Chinese company in the top-50 fabless IC supplier ranking as compared to 11 in 2016.  Moreover, since 2010, the largest fabless IC marketshare increase has come from the Chinese suppliers, which held a 10% share last year as compared to only 5% in 2010. However, when excluding the internal transfers of HiSilicon (over 90% of its sales go to its parent company Huawei), ZTE, and Datang, the Chinese share of the fabless market drops to about 6%.

Figure 2

Figure 2

European companies held only 1% of the fabless IC company marketshare in 2016 as compared to 4% in 2010.  The reason for this loss of share was the acquisition of U.K.-based CSR, the second largest European fabless IC supplier, by U.S.-based Qualcomm in 1Q15 and the purchase of Germany-based Lantiq, the third largest European fabless IC supplier, by U.S.-based Intel in 2Q15.  These acquisitions left U.K.-based Dialog ($1.2 billion in sales in 2016) as the only Europe-headquartered fabless IC supplier in the fabless top 50-company ranking last year (Norway-based Nordic Semiconductor just missed making the top 50 ranking with 2016 sales of $198 million).

There is also only one major fabless Japanese firm—Megachips, which saw its sales increase by 20% in 2016 (8% using a constant 2015 exchange rate), one major South Korean fabless IC company (Silicon Works), and one major Singapore-based (Broadcom Ltd.) fabless supplier.

The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces Keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

The ConFab 2017 is excited to welcome these distinguished Keynote speakers: Hans Stork, Senior Vice President and Chief Technical Officer at ON Semiconductor; Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory, as well as the Laboratory for Intelligent and Safe Automobiles at the University of California San Diego; Dr. Alissa Fitzgerald, Founder and Managing Member of A.M. Fitzgerald & Associates, and Bill McClean, President of IC Insights.

Hans Stork, Senior Vice President and Chief Technical Officer at ON Semiconductor

Hans Stork, Senior Vice President and Chief Technical Officer at ON Semiconductor

Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory

Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory

Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory

Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory

 

 

 

 

 

 

 

 

 

 

“The five hottest areas for semiconductor growth in the coming years are the Internet of Things (IoT), automotive, 5G, virtual reality/augmented reality (VR/AR), and artificial intelligence (AI). The ConFab 2017 program will take a close look at the challenges of these applications in the semiconductor industry, not just on the microprocessor and memory side, but on the MEMS, sensor, display, power and analog side. Many new innovations in packaging will also addressed,” said Pete Singer, Conference Chair of The ConFab and Editor-in-Chief of Solid State Technology.

In addition to our great Keynotes, the 2017 Agenda brings together sessions on heterogeneous integration and advanced packaging, starting with a talk from Islam Salama, Director with Intel, followed by Bill Chen, ASE Fellow, and Jan Vardaman, President of TechSearch. Siemens will speak on Smart Manufacturing, which will encompass the Industrial Internet of Things (IIoT). A panel discussion on Advanced Packaging will be moderated by Vinayak Pandey, Vice President of STATS ChipPAC with additional sessions that will focus on MEMS and sensors. Speakers include Kevin Shaw, CTO and Founder of Algorithmic Intuition and J.C. Eloy, President and CEO of Yole Développement. Another panel will look into the coming opportunities and changes in a range of diverse markets, including MEMS and Sensors, power electronics, biomedical, LEDs, displays and more. Those panelists include Valerie Marty of Connected Micro, Laura Rothman Mauer of Veeco, David Butler of SPTS and Mike Rosa of Applied Materials. Jason Marsh of NextFlex will provide an update on flexible electronics on Wednesday.

The ConFab is a high-level conference for decision-makers and influencers to connect, innovate and collaborate in multiple sessions, one-on-one private business meetings, and other networking activities. For more information, visit www.theconfab.com.

About The ConFab

The ConFab is the premier semiconductor manufacturing conference and networking event bringing over 200 notable industry leaders together. The ConFab is owned and produced by Extension Media and hosted by Pete Singer, Solid State Technology’s Editor-in-Chief, and Conference Chair. To inquire about participating – if you represent an equipment, material or service supplier, contact Kerry Hoffman, Director of Sales, at [email protected]. To inquire about attending, contact Sally Bixby, Sr. Events Director at [email protected]

About Extension Media

Extension Media is a privately held company operating more than 50 B2B magazines, engineers’ guides, newsletters, websites and conferences that focus on high-tech industry platforms and emerging technologies such as: chip design, semiconductor and electronics manufacturing, embedded systems, software, architectures and industry standards. Extension Media also produces industry leading events including The ConFab, the Internet of Things Developers Conference (IoT DevCon 2017) and the new Machine Learning Developers Conference (ML DevCon 2017), and publishes Embedded Systems Engineering, EECatalog.com, Embedded Intel® Solutions, EmbeddedIntel.com, Chip Design, ChipDesignMag.com, Solid State Technology and Solid-State.com.

By Dr. Phil Garrou, Contributing Editor

walkerJim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.

While Gartner 2020 projections show wireless and computer will still account for ~ 50% of the overall market activity, automotive, storage and industrial will show significant growth (7-9%) between now and then and account for ~ 30% of the total market (combined).

Gartner expects consolidation to continue “…with semi companies sitting on $135B in cash and profit margins decreasing there is a need to diversify into new markets” with specifics including:

– IoT related M&A activity will drive consolidation in MCU, analog and sensor technologies.

– Companies will initiate sale of unprofitable divisions and product lines to prepare themselves for M&A (i.e. make themselves more attractive to be acquired).

– China will continue to buy or invest in U.S. and European companies, even as governments impose restrictions.

5 Year Revenue Growth for Application Markets [source: Gartner]

5 Year Revenue Growth for Application Markets [source: Gartner]

Gartner sees the industries maturation resulting in traditional business models changes. The traditional semiconductor ecosystem is shown below.

The Semiconductor Ecosystem

The Semiconductor Ecosystem

Gartner reports that a relatively new problem for some OEMs and Electronics Brands is that they are being bypassed by a direct relationship between the ODM/EMS Co. and a non- electronics brand owner buyer who could be in any industry. This model emerged with Operator branded handsets, although those were recognizable as say Nokia or Motorola. This (Brand) Direct to ODM/EMS business model is good for chip suppliers but bad for traditional electronics companies.

walker 3B

Another relatively new problem for some chip companies now is that they are being bypassed by a direct relationship between the foundry and the EMS/ODM company and the OEM –the OEM Direct model. These could be chips designed by Apple or Facebook (for example) and manufactured by TSMC.

walker 4

Walker specifically suggests we keep an eye on Hon Hai / Foxconn who appears to be building strong and broad manufacturing capabilities through acquisitions like Japans Sharp (Feb 2016) and bidding on the Toshiba memory business (2017).

Packaging is currently ~17% ($53B) of the $265B electronics market. By 2020, 55% of all packaging is expected to be done at OSATS with foundries like TSMC (and maybe others soon) becoming competitors with their own wafer based packaging offerings like InFO. Walker sees a bright future for IoT packaging, but cautions that it is composed of many small to mid sized applications, not one big one like the smart phone, and thus will require many custom packaging solutions.

Annual total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march in the next five years and are now expected to top one trillion units for the first time in 2018, according to data presented in IC Insights’ soon to be released March Update to the 2017 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry, and the 2017 O-S-D Report—A Market Analysis and Forecast for the Optoelectronics, Sensors/Actuators, and Discretes.

Semiconductor shipments totaled 868.8 billion in 2016 and are forecast to top one trillion units in 2018. Figure 1 shows that semiconductor unit shipments are forecast to climb to 1,002.6 billion devices in 2018 from 32.6 billion in 1978, which amounts to average annual growth of 8.9% over the 40 year period and demonstrates how dependent on semiconductors the world has become.

semiconductor unit growth

Figure 1

The largest annual increase in semiconductor unit growth during the timespan shown was 34% in 1984, and the biggest decline was 19% in 2001 following the dot-com bust.  The global financial meltdown and ensuing recession caused semiconductor shipments to fall in both 2008 and 2009; the only time that the industry experienced consecutive years in which unit shipments declined. Semiconductor unit growth then surged 25% in 2010, the second-highest growth rate across the time span.

Despite advances in integrated circuit technology and the blending of functions to reduce chip count within systems, the percentage split of IC and O-S-D shipments within total semiconductor units remains heavily weighted toward O-S-D devices.  In 2016, O-S-D devices accounted for 72% of total semiconductor units compared to 28% for ICs. Thirty-six years ago in 1980, O-S-D devices accounted for 78% of semiconductor units and ICs represented 22% (Figure 2).

Figure 2

Figure 2

Surprisingly, shipments of commodity-filled discretes devices category (transistor products, diodes, rectifiers, and thyristors) accounted for 44% of all semiconductor unit shipments in 2016. The long-term resiliency of discretes is primarily due to their broad use in all types of electronic system applications. Consumer and communications applications remain the largest end-use segments for discretes, but increasing levels of electronics being packed into vehicles for greater safety and fuel efficiency have boosted shipments of discretes to the automotive market as well. Discretes are used for circuit protection, signal conditioning, power management, high current switching, and RF amplification. Small signal transistors are still used in and around ICs on board designs to fix bugs and tweak system performance.

Among ICs, analog products accounted for the largest number of shipments in 2016. Analog ICs represented 52% of IC unit shipments in 2016, but only 15% of total semiconductor units. Figure 3 shows the split of semiconductor unit shipments by product type in 2016.

2016 semiconductor unit shipments

For 2017, semiconductor products showing the strongest unit growth rates are those that are essential building-block components in smartphones, new automotive electronics systems, and within systems that are helping to build out of Internet of Things.  Some of the fast-growing IC unit categories for 2017 include Consumer—Special Purpose Logic, Signal Conversion (Analog), Auto—Application-Specific Analog, and flash memory.  Among O-S-D devices, CCDs and CMOS image sensors, laser transmitters, and every type of sensor product (magnetic, acceleration and yaw, pressure, and other sensors) are expected to enjoy strong double-digit unit growth this year. More coverage about these semiconductor products and end-use applications are included in the 2017 editions of IC Insights’ McClean Report and O-S-D Report.

Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers – manufactured with Soitec’s Smart Cut technology – has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd. (Simgui) fully qualified by key Soitec customers. This successful implementation of a partnership model represents a key milestone for Soitec in managing its worldwide manufacturing capacity to meet market demand for 200mm SOI wafers used in fabricating semiconductors for the growing communications and power device markets.

“Establishing this second source in China allows us to ensure the needed capacity of 200mm SOI wafers from two sites in different regions of the world, with each facility producing exactly the same products from a specifications and quality standpoint,” said Dr. Bernard Aspar, executive senior vice president of Soitec’s Communication & Power Business Unit. “Our partnership with Simgui is now running in an efficient way and our customers have been supportive and instrumental in this strategic move, which fully validates Soitec’s technology-transfer expertise and manufacturing strategy.”

“Simgui has been working on SOI materials for 16 years in China. Partnering with Soitec, Simgui is fully ready to support Soitec’s ramp up of 200mm SOI wafers manufactured with the Smart Cut technology at our facility in Shanghai and to help in developing the SOI ecosystem in China,” said Dr. Jeffrey Wang, CEO of Simgui.

The first 200mm SOI wafers produced at Simgui’s manufacturing facility in Shanghai using Soitec’s proprietary Smart Cut technology were qualified by the initial customers at the end of last year. Additional customers are currently in the process of qualifying the wafers. Producing the wafers in China has been a key objective of Soitec’s and Simgui’s licensing and technology-transfer agreement, signed in May 2014, and validates Smart Cut as a standard process. This wafer production line in China will boost the industrial manufacturing capacity of 200mm SOI wafers to meet increasing worldwide usage and also will be a key element in establishing the SOI ecosystem in China.

Soitec’s 200mm RF-SOI and Power-SOI products are dedicated to the mobile and automotive markets respectively. As the leading SOI substrate innovator and manufacturer, Soitec has the largest worldwide capacity and produces both 200mm and 300mm wafers at multiple fabs in France.

Simgui will be exhibiting Soitec’s Smart Cut-based 200mm product line in booth W5 #5159 at SEMICON China in Shanghai, March 14-16.

Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017.  The record is expected to be broken again in 2018, nearing the $50 billion mark. These record-busting years are part of three consecutive years of growth (2016, 2017 and 2018), which has not occurred since the mid-1990s. The report has been the industry’s most trusted data source for 24 years, observing and analyzing spending, capacity, and technology changes for all front-end facilities worldwide. See Figure 1.

fab equipment spending

Figure 1: Fab Equipment Spending (Front End Facilities)

SEMI‘s World Fab Forecast report (end of February 2017) provides updates to 282 facilities and lines equipping in 2017, 11 of which are expected to spend over $1 billion each in 2017. In 2018, SEMI’s data reflect 270 fabs to equip, with 12 facilities spending over $1 billion each.  The spending is mainly directed towards memory (3D NAND and DRAM), Foundry and MPU.  Other strong product segments are Discretes (with LED and Power), Logic, MEMS (with MEMS/RF), and Analog/Mixed Signal.

SEMI (www.semi.org) forecasts that China will be third for regional spending in 2017, although China’s annual growth is minimal in 2017 (about 1 percent), as many of the new fab projects are in the construction phase.  China is busy constructing 14 new fabs in 2017 and these new fabs will be equipping in 2018. China’s annual spending growth rate in 2018 will be over 55 percent (more than $10 billion), and ranking in second place for worldwide spending in 2018.  In total for 2017, China is equipping 48 fabs, with equipment spending of $6.7 billion; looking ahead to 2018, SEMI predicts that 49 fabs to be equipped, with spending of about $10 billion.

Other regions also show solid growth rates.  The SEMI World Fab Forecast indicates that Europe/Mideast and Korea are expected to make the largest leaps in terms of growth rates this year with 47 percent growth and 45 percent growth, respectively, year-over-year (YoY).  Japan will increase spending by 28 percent, followed by the Americas with 21 percent YoY growth.

The SEMI Industry Research & Statistics team has made 195 changes on 184 facilities/lines in the last quarter, with eight new facilities added and three fab projects cancelled. SEMI’s World Fab Forecast provides detailed information about each of these fab projects, such as milestone dates, spending, technology node, products, and capacity information. The World Fab Forecast Report, in Excel format, tracks spending and capacities for over 1,100 facilities including future facilities across industry segments.  The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, in-house equipment, and spending on facilities for equipment. Also check out the Opto/LED Fab Forecast.