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IC Insights will release its October Update to the 2016 McClean Report later this week.  This Updateincludes a review of IC Insights’ latest 2016 IC market forecast, an update on the rebounding DRAM market, and an extensive analysis of the optoelectronics, sensor/actuator, and discrete (O-S-D) markets. An excerpt from the October Update, describing the upgraded 2016 IC market forecast, is shown below.

IC Insights has raised its IC market forecast for 2016 by three percentage points from a 2% decline to a 1% increase and its 2016 IC unit volume shipment growth rate forecast from 4% to 6%.  A large portion of this revision is due to a strengthening DRAM market.

Although the average third quarter sequential increase in the worldwide IC market since 2002 has been 8%, last year’s 3Q growth rate was barely positive with a meager 1% increase.  However, 3Q16 results were slightly above the past 15-year average and posted a strong 9% jump.  Moreover, with an anticipated increase of 1% next quarter, the total 4Q16 IC market is forecast to climb to $76.9 billion, a new quarterly record high, surpassing the previous high of $76.7 billion posted in 4Q14.

It should be noted that the average second half versus first half of the year growth rate in the IC market since 1990, including the forecast for 2016, is 8.9% (Figure 1).  However, IC Insights is forecasting that the 2H16 IC market will be up 12.3% as compared to 1H16, a strong turnaround from the extremely poor second half result of -1.2% posted last year and the highest second half growth rate since 2009.

With expectations for slightly better worldwide GDP growth in 2017 as compared to 2016 and continued firming of both DRAM and NAND memory prices, IC Insights believes that the worldwide IC market will grow by 4% next year (IC Insights’ detailed 2016-2020 IC market forecast by product type will be presented in the November Update).

history of ic growth

Semiconductor Manufacturing International Corporation (“SMIC”; NYSE:  SMI; SEHK: 981), the largest and most advanced foundry in mainland China, announces the laying of the foundation stone to mark the official launch of its capacity expansion project at SMIC’s TianJin facility. After the project’s completion, SMIC TianJin is expected to become the world’s largest integrated 8-inch IC production line.

SMIC TianJin is located in the Xiqing Economic Technological Development Area, Tianjin, and currently has a mature 8-inch IC production line with a capacity of 45,000 wafers/month. After completion of the expansion project, SMIC TianJin’s capacity will reach 150,000 8-inch wafers/month. The project’s progress and capacity arrangement will depend on customers’ needs. The main product applications supported by the project include IoT related IC’s, fingerprint identification, power management, mixed signal processing, and automotive electronics.

The Chairman of SMIC, Dr. Zixue Zhou, said: “The launch of capacity expansion of our 8-inch production line is another milestone in the history of SMIC TianJin. SMIC TianJin has long been running at full capacity, and this expansion will significantly ease the balance of demand and supply and provide more high-quality capacity to our clients. Moreover, SMIC’s capacity distribution throughout mainland China will be further optimized.”

The TianJin Deputy Mayor, Mr. Shushan He, the Secretary of Xiqing Area, Mr. Xuewang Wang attended the ceremony. The Chairman of SMIC, Dr. Zixue Zhou, and the CEO and Executive Director of SMIC, Dr. Tzu-Yin Chiu, together laid the foundation stone for the new project.

LED remains the dominant sapphire application in 2016. Overall, rates of usage in smartwatches have been disappointing and have decreased below 2015 levels. In parallel, smartphone display screen opportunities haven’t taken off. Within the highly competitive sapphire industry, players are chasing any opportunity to survive and optimize their cost structure. Prices seem to have reached bottom and stabilized after a rough ride over the last 12 months. After a dip in the second half of 2015, LED substrate demand has been growing strongly through 2016 and is now at record high levels, even triggering a limited shortage of high-quality 4″ materials and wafers. According to Yole Développement (Yole), the worldwide quarterly sapphire wafer consumption for LEDs has reached 28.5 million of TIE (Q3, 2016).

In its new report, Sapphire Market 2016: Substrates & Consumer Electronics Applications (September 2016, Yole Développement), Yole, the More than Moore market research and strategy consulting company, has analyzed the sapphire industry’s latest technology and market trends. Yole used a dedicated methodology based on both top-to-bottom and bottom-up approaches that included interviews across the entire value chain and a strong knowledge of the industry to review the status and prospects of sapphire technologies for LEDs, camera lenses, and fingerprint reader covers, as well as smartwatch and smartphone displays.

Once again this year, the consulting company collaborated with CIOE to present a powerful program at the International Forum on Sapphire Market & Technologies, 2nd edition (Shenzhen, China – Sept. 6 & 7, 2016 – Agenda). Sapphire industry leaders attended the conference and discussed the latest innovations and market challenges.

What is the status of the sapphire industry? After the 2014 crash, the episode with Apple, and GTAT’s bankruptcy, are there still some survivors? What are their today’s strategies? Beyond existing applications, could we expect emerging applications? Yole’s analysts offer you an overview of the current sapphire industry and announce 2017 trends.

The LED sector still has the highest demand for sapphire. However, Yole’s analysts confirm: the expected volumes cannot sustain the one hundred or so sapphire producers currently competing in the industry. As a consequence, some sapphire companies are leaving the most commoditized markets and shifting their development strategies toward niche markets with higher added-value such as medical, industrial, and military applications. Other business opportunities could materialize, including microLED arrays and other consumer applications. Meanwhile, lower quality production is being dumped on a large grey market serving a multitude of applications including optical, mechanical, industrial, watches, etc.

In Shenzhen, China, at the beginning of September, more than 100 executives gathered and discussed the sapphire industry’s status. With an impressive program including 18 presentations, multiple debates and networking sessions, the sapphire industry’s future was defined and analyzed by sapphire leaders. Yole and its partner CIOE collected good feedback from attendees and are already thinking about a 2017 session.

During this Forum, many relevant and exciting presentations took place, mainly focused on optimizing costs and identifying new markets. Dr. Eric Virey from Yole highlighted the sapphire industry, its latest technical and market trends with a special focus on emerging applications. (See Dr. Eric Virey presentation – 2nd Int. Forum on Sapphire Market & Technologies).

In the same session, leading sapphire manufacturers Monocrystal and Aurora Sapphire also reviewed their insights as key sapphire market players:

•  Mikhail Berest, VP of Sales at Monocrystal, detailed Monocrystal strategies: “The market is challenging not only for sapphire producers, but also for our customers. Our major focus is to strongly support our customers during this market storm by providing them with the highest quality product at a competitive price. We make this possible because Monocrystal’s sapphire is industry-leading due to its low internal stress and low etch pit density. This translates into longer LED lifetime and narrow wavelength distribution on our customers’ side…” (Full discussion on i-micronews, compound semi. news)

•  Xinhong Yang, VP & Technology Director, Aurora Sapphire, presented the latest technology innovations. He also focused his presentation on the future of the sapphire industry.

•  On the application side, Unionlight’s CTO, Huang XiaoWei, discussed military applications of sapphire in the last sapphire Forum session.

Reducing costs and improving quality were major topics discussed at the Forum. Fujian Jing’an Optoelectronics highlighted the importance of subsurface damages. Edouard Brunet, R&D Manager Grains & Powders Asia, Saint-Gobain High Performance Materials, introduced a 1-step polishing process with significant potential for cost reductions. Bernard Jones, VP of Technology & Product Development at Fametec, showed an innovative growth technology for large diameter LED wafers, and Ivan Orlov, Scientific Visual’s CEO, triggered extensive discussions after his presentation on automated ingot inspection and mapping equipment and standardization proposals.

“Once again, the International Forum on Sapphire Market & technologies brought together many players”,comments Jean-Christophe Eloy, President & CEO, Yole Développement. “It showed that in the difficult market environment we’ve experienced since late 2015, the industry needs to gather and exchange information in order to optimize ownership costs and enable new applications.”
Yole & CIOE’s sapphire Forum provided a great platform to stimulate discussion and new ideas with extensive networking opportunities for people and companies to find new partners for the next stage.

“The International Forum on Sapphire Market and Technologies is the key industry event for the main sapphire makers,” asserts Oleg Kachalov, CEO of Monocrystal.“For Monocrystal, it is a chance to meet long-term partners and experts and reach our customers with our new developments, which will allow them to strengthen their position in the LED market.”

“I was impressed by the quality of content presented at Yole & CIOE’s sapphire Forum 2016, which provided not only trend analysis but also deep insights”, says Margaret Connolly, VP of UBM Asia. “The event was well attended by the industry’s key decision makers. The collaboration between CIOE and Yole has been quite successful as the teams are committed to the common objective which is to support long term technology development and innovations. I look forward to attending the 2017 edition in Shenzhen.” UBM owns 100% of eMedia Asia, the majority owner of the annual CIOE.

What can we expect for 2017 and the years after?

Massive adoption of sapphire in display screens now seems unlikely. Many companies have partially or completely exited the industry over the last 12 months. Independent crystal growers in Korea such as DK-Aztek, OCI, and Unid LED have all stopped their sapphire activities. Historical players in Taiwan such as Tera-Xtal, Crystal Applied Technology or Procrystal appear to be on the verge of bankruptcy and U.S. leader Rubicon recently shut down its facility in Malaysia and exited the LED wafer market to refocus on the optical, industrial, and defense markets. But key players are still investing.

So, is there still hope for 2017? To answer that question, both Yole and CIOE are already working on a new sapphire Forum in 2017 in Shenzhen, China. Agenda & registration will be available soon. Stay tuned!

SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2016–2018. The SEMI forecast shows polished and epitaxial silicon shipments totaling 10,444 million square inches in 2016; 10,642 million square inches in 2017; and 10,897 million square inches in 2018 (refer to table below). Total wafer shipments this year are expected to exceed the market high set in 2015 and are forecast to continue shipping at record levels in 2017 and 2018.

“Silicon shipment volumes have been gaining strength in recent months, after a soft start at the beginning of the year,” said Denny McGuirk, president and CEO of SEMI. “This positive momentum is expected to continue and result in modest annual growth for the segment this year, 2017 and into 2018.”

2016 Silicon Shipment Forecast

Total Electronic Grade Silicon Slices* – Does not Include Non-Polished Wafers

(Millions of Square Inches, MSI)

Actual

Forecast

2014

2015

2016

2017

2018
MSI

9,826

10,269

10,444

10,642

10,897
Annual Growth

11%

5%

2%

2%

2%

Source: SEMI, October 2016

* Shipments are for semiconductor applications only and do not include solar applications

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or “chips” are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers and epitaxial silicon wafers shipped by the wafer manufacturers to the end-users. Data do not include non-polished or reclaimed wafers.

200mm fabs on the rise


October 11, 2016

One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has issued an October 2016 update, with the improved and expanded report forecasting 200mm fab trends out to 2020.  This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity have changed worldwide.  SEMI’s analysts updated information on almost 200 facilities, including new facilities and closures of existing facilities.

Examining 200mm capacity over the years, the highest level of 200mm capacity was recorded in 2007 and the lowest following this peak in 2009 (see figure). The capacity decline from 2007 to 2009 was driven by the 2008/2009 global financial crisis, which caused the closure of many facilities, and the transition of memory and MPU fabrication to 300mm fabs from 200mm.

Global_200mm_chart_700px

Since 2009, installed 200mm fab capacity has increased, and by 2020, 200mm capacity is expected to reach 5.5 million wafers per month (wpm), though still less than the 2007 peak.  According to SEMI’s data, by 2019, installed capacity will reach close to 5.38 million wpm, almost as high as capacity in 2006.  From 2015 to 2020, 200mm facilities are forecast to add 618,000 wpm net capacity. This increase is a combination of fabs adding capacity and fabs losing capacity

Two applications account for the growing demand for 200mm: mobile devices and IoT. Rising fab capacity from 2015 to 2020 will be driven by MEMS devices, Power, Foundry and Analog.  By region, the greatest increases in capacity are expected to be in China, Southeast Asia, Americas, and Taiwan. Another trend is also observed: 200mm fabs are increasing the capacity to provide process capability below 120nm. Higher capacity does not mean more fabs, but fewer, larger fabs. In fact, the number of fabs in 2020 is almost the same as the count seen in 2009.  So 2020 capacity heads toward industry highs while in comparison 2009 had the lowest levels off the 2007 peak.

The Global 200mm Fab Outlook to 2020, published by SEMI in October 2016, includes two files: a 92-page pdf file featuring trend charts, tables and summaries and an Excel file covering 2009 to 2020 detailing on quarterly basis and fab-by-fab developments.

Flat-panel display (FPD) equipment sales are expected to attain their highest sustained three-year level in the history of the industry. FPD equipment spending will rise 89 percent, hitting $12.9 billion in 2016. Increased spending levels will continue, reaching $13 billion in 2017, then declining slightly to $11.8 billion in 2018, according to IHS Markit (Nasdaq: INFO).

fpd equipment

“Investments in new FPD factories had been trending upwards for the past several years as Chinese panel makers continue to relentlessly build new FPD factories to make the country the largest FPD producing region in the world,” said Charles Annis, senior director at IHS Markit. “In fact, China will surpass long-dominant South Korea in capacity share by the second quarter of 2017.”

According to the IHS Markit Display Supply Demand & Equipment Tracker, in addition to the substantial number of sixth-generation (Gen 6) and Gen 8 factories (fabs) being built in China, the two largest panel makers in the country, BOE and China Star, are rushing to construct Gen 10.5 fabs that process enormous glass substrates, targeting efficient production of 65-inch and 75-inch panels. FPD makers in South Korea and Japan have now started ceding the LCD market to producers of lower-cost displays in China. They are also starting to shutter their large-area LCD factories, to focus on active-matrix organic light-emitting diode (AMOLED) panel production, where they still have a technology edge. Declining capacity in other regions is now balancing supply and demand, which is further encouraging Chinese makers to press their advantage and build even more factories. China will account for sixty-five percent of all FPD equipment spending, on average, between 2016 and 2018.

The FPD industry is in the midst of an unprecedented and rapid display technology shift from LCD to AMOLED for mobile applications. Samsung Display has led this change to-date with the success of its own AMOLED displays for Galaxy-based products and expansion of AMOLED panel sales to other smartphone makers looking to differentiate their products with high-end displays. Panel makers in South Korea and Japan are rushing to build new AMOLED fabs, so as not to miss out on the market shift. Chinese makers, backed by joint ventures with regional governments, are also building a large number of AMOLED factories, because they view AMOLED as a potential opportunity to upgrade from trailing-edge to leading-edge display manufacturing.

“Not only are there an extraordinary number of new FPD factories under construction, but many of the new factories are also some of the most expensive ever built,” Annis said. “Of course, the Gen 10.5 factories have much more capacity, but the capital costs are more than twice that of typical Gen 8 factories, due to the size of machines and unique facility requirements.”

Almost all of the new AMOLED factories plan to produce flexible, plastic-based displays. Most of these new factories are adopting highly complicated, high-mask-count LTPS-TFT processes that require more high-resolution exposure lines and other supporting equipment. The new flexible AMOLED lines now under construction are almost 50 percent more expensive than the rigid AMOLED factories constructed only a few years ago.

“FPD equipment makers are scrambling to ramp-up capacity to meet customer demand and take advantage of the best sales opportunity ever,” Annis said. “Even so, equipment companies know how cyclical the market is, so they need to manage the additional capacity and staff they are now putting in place, when the market eventually starts to slow down.”

The IHS Markit Display Supply Demand & Equipment Tracker covers metrics used to evaluate supply, demand and capital spending for all major FPD technologies and applications.

Nothing raises more suspicion today: 2015 – 2016 have been exciting years for the GaN power business: 600V GaN is today commercially available, after many ups and downs. And GaN power IC has debuted, opening new market perspectives for GaN companies. According to Yole Développement (Yole), the “More than Moore” market research and strategy consulting company, GaN power business is expected to reach US$280 million in 2021, with an 86% CAGR between 2015 and 2021. The market is driving by emerging applications including power supply for datacenter and telecom – AC fast charger – Lidar – ET – And wireless power.

gan hype circle

“Numerous powerful developments and key collaborations have been announced during this period and confirmed a promising and fast-growing industry,” commented Dr. Hong Lin, Technology & Market Analyst from Yole. Integrated Device Technology (IDT) and Efficient Power Conversion (EPC) – Infineon Technologies and Panasonic – Exagan and XFab – TSMC and GaN Systems for volume production and much more. All collaborations took place within only 2 years, between 2015 and 2016. In parallel Texas Instruments announced a 80V power stage in 2015 and a 600V power stage in 2016. From its side, Visic announced its first GaN product in 2015.

Yole’s analysts propose you to discover the status of the Power GaN industry with a new technology & market analysis titled Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends. This report gives a deep understanding of GaN penetration in different applications (power supply, PV , EV/HEV , UPS , lidar…) and the state-of-the-art GaN power devices. It also review the industrial landscape, market dynamics and market projection.

Up until late 2014, 600V/650V GaN HEMTs’ commercial availability was still questionable, despite some announcements from different players. Fast-forward to 2016 end users can now buy not only low-voltage GaN (<200V) devices from EPC Power, but also high-voltage (600V/650V) components from several players, including Transphorm, GaN Systems, and Panasonic.

In parallel a new start-up, Navitas Semiconductor, announced their GaN power IC in March 2016, followed by Dialog Semiconductors revealing their GaN power IC in August 2016. The idea of bringing GaN from the power semiconductor market to the much bigger analog IC market is of interest to several other players too. For example, EPC Power and GaN Systems are both working on a more integrated solution, and Texas Instruments, a well-established analog IC player, has also been engaged in GaN activities, releasing an 80V power stage and 600V power stage in 2015 and 2016, respectively.

Despite these exciting developments, the GaN power market remains small compared to the gigantic US$335 billion silicon semiconductor market. In fact, according to Yole’s investigation, the GaN power business was less than US$10 million in 2015.

“But before you think twice about GaN, remember that a small market size is not unusual for products just appearing on the market,” commented Dr Hong Lin. Indeed first GaN devices were not commercially available until 2010. According to Yole’s analysts, the most important point to be noticed is the potential of GaN power. Indeed they expect the GaN power business to grow, reaching a market size of around US$300 million in 2021 at a 2016 – 2021 CAGR of 86%. “The current GaN power market is mainly dominated by low voltage (<200V) devices in the forecasted period but the 600V devices should take off,” commented Zhen Zong, Technology & Market Analyst at Yole.

“More than 200 patent applicants are involved in the power GaN industry,” explained KnowMade in its GaN for Power Electronics: Patent Investigation report (KnowMade, August 2015). Such figure is showing the strong interest from power players in the GaN business. The take-off of patenting activity took place in the 2000s with a first wave of patent publications over the 2005-2009 period mainly due to American and Japanese companies. A second wave started in 2010 while first commercial GaN products, collaborations and mergers and acquisitions emerged.

“In the today’s power GaN market, it is crucial to understand the global patent landscape thorough in-depth analyses,” commented Nicolas Baron, CEO & Co-founder of Knowmade. “This approach helps the companies to anticipate the changes, identify and evaluate business opportunities, mitigate risks and make strategic choices.”

Enormous financial and technology hurdles continue to plague the development of 450mm wafers. Ambitious goals to put 450mm wafers to use have been scaled back.  IC manufacturers are instead maximizing their manufacturing efficiency using 300mm and 200mm wafers.  IC Insights’ Global Wafer Capacity 2016-2020 report shows that worldwide capacity by wafer size was dominated by 300mm wafers in 2015 and is forecast to continue increasing through 2020 (Figure 1).

Figure 1

Figure 1

  • 300mm wafers represented 63.1% of worldwide capacity at the end of 2015 and are forecast to increase to about 68% by the end of 2020.
  • The share of the industry’s monthly wafer capacity represented by 200mm wafers is expected to drop from 28.3% in 2015 to 25.3% in 2020. But, 200mm wafer capacity is predicted to increase every year over the next several years.
  • Capacity for wafers of ≤150mm diameter is forecast to remain relatively flat during the forecast period.

The number of 300mm wafer fabrication facilities in operation is forecast to keep increasing through 2020 (Figure 2). For the most part, 300mm fabs are, and will continue to be, limited to production of high-volume, commodity-type devices like DRAMs and flash memories; image sensors and power management devices; and complex logic and microcomponent ICs with large die sizes; and by foundries, which can fill a 300mm fab by combining wafer orders from many sources.

Figure 2

Figure 2

  • The number of active volume-production 300mm fabs declined for the first time in 2013. A few fabs that were scheduled to open in 2013 were delayed until 2014. In addition, two large 300mm fabs owned by ProMOS closed in 2013.
  • At the end of 2015, there were 95 production-class IC fabs utilizing 300mm wafers (there are numerous R&D IC fabs and a few high-volume fabs around the globe that make “non-IC” products using 300mm wafers, but these are not included in the count).
  • Currently, there are eight 300mm wafer fabs scheduled to open in 2017, which would be the highest number in one year since 2014 when nine were added.
  • By the end of 2020 there are expected to be 22 more fabs in operation, bringing the total number of 300mm fabs used for IC fabrication to 117. The peak number of 300mm fabs may be somewhere around 125. For comparison, the most volume-production 200mm wafer fabs in operation was 210 (in December 2015 there were 148).

KLA-Tencor Corporation (NASDAQ:  KLAC) and Lam Research Corp. (NASDAQ:  LRCX) today announced that they have agreed to terminate their proposed merger agreement. The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating. No termination fees will be payable by either the Company or Lam Research in connection with the termination of the Merger Agreement.

“Although we are disappointed with this outcome, KLA-Tencor’s performance over the past several quarters demonstrates the Company is executing our strategies at a high level and creating compelling value for the industry and for our stockholders,” commented Rick Wallace, President and Chief Executive Officer of KLA-Tencor.

“Today our customer engagement and market leadership is strong and KLA-Tencor is delivering superior financial results. Growth and earnings momentum is expected to continue as we go forward, fueled by new products in the marketplace today, and with many more products in the pipeline,” continued Mr. Wallace. “Additionally, our collaboration over the past year with Lam Research and with our customers has affirmed the value of closer cooperation between process and process control for new, enabling solutions. For that reason, we plan to explore collaboration opportunities with Lam Research around programs identified as beneficial to our customers.”

After the initial announcement of the proposed merger, which was expected to close mid-year 2016, analysts voiced concern over whether the deal would be approved. Robert Maire of Semiconductor Advisors wrote: “We think this is going to be the obvious biggest issue after the failed AMAT & TEL merger.  We think there will likely be opposition in the semi industry but probably less so than we heard the screaming related to AMAT/TEL.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $28.0 billion for the month of August 2016, an increase of 3.5 percent compared to the previous month’s total of $27.1 billion and an uptick of 0.5 percent over the August 2015 total of $27.9 billion. August marked the market’s largest month-to-month growth since May 2013 and its first year-to-year growth since June 2015. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Following months of sluggish global semiconductor sales, the global market recently has shown signs of a rebound, punctuated by solid growth in August,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The Americas market was particularly encouraging, topping 6 percent month-to-month growth for the first time in nearly three years to lead all regional markets. China also stood out, posting by far the strongest year-to-year growth of all regions in August. All told, global sales are still behind last year’s pace, but appear to be on the right track as 2017 draws closer.”

Month-to-month sales increased across all regions: the Americas (6.3 percent), Japan (4.8 percent), China (3.1 percent), Asia Pacific/All Other (2.7 percent), and Europe (0.7 percent). Year-to-year sales increased in China (7.1 percent) and Japan (2.2 percent), but fell in Asia Pacific/All Other (-2.7 percent), the Americas (-3.1 percent), and Europe (-3.3 percent).

 

August 2016

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.10

5.43

6.3%

Europe

2.70

2.71

0.7%

Japan

2.60

2.73

4.8%

China

8.56

8.82

3.1%

Asia Pacific/All Other

8.12

8.34

2.7%

Total

27.08

28.03

3.5%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.60

5.43

-3.1%

Europe

2.81

2.71

-3.3%

Japan

2.67

2.73

2.2%

China

8.23

8.82

7.1%

Asia Pacific/All Other

8.57

8.34

-2.7%

Total

27.88

28.03

0.5%

Three-Month-Moving Average Sales

Market

Mar/Apr/May

Jun/Jul/Aug

% Change

Americas

4.79

5.43

13.2%

Europe

2.63

2.71

3.3%

Japan

2.55

2.73

6.9%

China

8.09

8.82

9.0%

Asia Pacific/All Other

8.00

8.34

4.2%

Total

26.07

28.03

7.5%