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The global market for gallium nitride (GaN) semiconductor devices is largely consolidated, with the top four companies commanding a share of over 65% of the overall market in 2015, states Transparency Market Research (TMR) in a new report. The dominant company among these four top vendors, Efficient Power Conversion Corporation, accounted for a 19.2% share of the global market in the said year. The other three topmost companies of the global market, which collectively enjoyed a considerably large share in the overall global market in the said year, are NXP Semiconductors N.V., GaN Systems Inc., and Cree Inc.

Looking at the on-going research and development activities undertaken in the market, attempts made to eliminate issues related to reliability of GaN semiconductors is expected to be an important area of focus of key vendors in the near future. Transparency Market Research states that the global GaN semiconductor devices market will expand at a high 17.0% CAGR over the period between 2016 and 2024. With such exponential growth, the market, which had a valuation of $870.9 mn in 2015, is projected to rise to $3,438.4 mn by 2024. Of the key end-use industries utilizing GaN semiconductors, the aerospace and defense sector dominates, accounting for a share of over 42% of the global market in 2015.

Rising set of applications and focus on R&D to boost demand in North America and Europe

North America and Europe are presently the dominant regional markets for GaN semiconductor devices and are expected to retain dominance over the next few years as well. The rising focus of the Europe Space Agency (ESA) on the increased usage of GaN semiconductors across space projects and the use of GaN-based transistors in the military and defense sectors in North America will help the GaN semiconductor devices market gain traction.

In the past few years, GaN technology has witnessed rapid advancements and vast improvement in the ability of GaN semiconductors to work under operating environments featuring high frequency, power density, and temperature with improved linearity and efficiency. These advancements has boosted the usage of GaN semiconductor devices across an increased set of applications and have played an important role in the market’s overall growth lately.

Along with this factor, the increased usage of GaN semiconductor devices in the defense sector has also emerged as a key driver of the global GaN semiconductor devices market. The continuous rise in defense budgets of developing and developed countries as well as the demand for inclusion of the technologically most advanced products in the arsenal of national and international armies will propel the global GaN semiconductor devices market in the near future.

Relatively higher costs of GaN semiconductor devices to hinder market growth

GaN semiconductors are relatively expensive as compared to silicon-based semiconductors owing to the high production costs of gallium nitride as compared to silicon carbide. Further addition in the cost of GaN semiconductors is ensued due to the high cost of fabrication, packaging, and support electronics. Silicon-based semiconductors have witnessed a significant decline in their costs over the past few years, making high cost of GaN semiconductors a foremost challenge that could hinder their large-scale adoption.

The issue can be tackled by producing GaN in bulk. However, there is currently no widespread method that can be used for the purpose owing to the requisition of high operating pressure and temperature and limited scalability of the material.

The IC industry’s original system-on-chip (SoC) product category—microcontrollers—is expected to steadily reach record-high annual revenues through the second half of this decade despite an overall slowdown in unit growth during the next five years. Microcontroller sales barely increased in 2015, rising less than a half percent, to set a new record high of slightly more than $15.9 billion, thanks to a 15% increase in MCU shipments that lifted worldwide unit volumes to an all-time peak of 22.1 billion last year (Figure 1). Strong unit growth—driven by smartcard MCUs and 32-bit designs—enabled the MCU market to overcome a 13% drop in the average selling price (ASP) of microcontrollers to a record-low $0.72 in 2015. Price erosion—especially in 32-bit MCUs—has weighed down MCU sales growth in three of the last four years, but ASPs are now expected to stabilize and increase slightly in the 2015-2020 forecast period, rising by a CAGR of 1.6% compared to a -7.7% annual rate of decline between 2010 and 2015.

Fig 1

Fig 1

While ASP erosion is expected to end, MCU unit shipments are forecast to rise at a much lower rate than in the first half of this decade, primarily because of a slowdown in the growth of smartcard microcontrollers and tighter reins on IC inventories for the “next big thing”—the Internet of Things (IoT). IC Insights’ forecasts MCU sales will rise in 2016 to nearly $16.6 billion, which is a 4% increase from $15.9 billion in 2015. MCU unit volumes are expected to grow by 2% in 2016 to 22.4 billion, and the ASP for total microcontrollers is forecast to rise 2% this year to $0.74. Between 2015 and 2020, microcontroller sales are projected to grow by a CAGR of 5.5% to nearly $20.9 billion in the final year of the forecast. Since the middle 1990s, worldwide MCU sales have grown by a CAGR of 2.9%.

As shown in Figure 1, no downturns are anticipated in MCU sales through 2020. Total MCU revenue growth is expected to gradually strengthen between 2016 and 2019 (when sales are forecast to grow 9%) before easing back to a 4% increase in 2020. MCU unit shipments are now projected to grow by a CAGR of 3.9%.

A major factor in slower MCU unit growth through 2020 is the maturing of the smartcard market, which in recent years has accounted for nearly half of microcontroller shipments and about 15-16% of total revenue. By 2020, smartcard MCUs are expected to represent 38% of total microcontroller unit shipments and about 12% of sales.

According to the latest market study released by Technavio, the global front-end-of-the-line (FEOL) semiconductor equipment market recorded a revenue of over USD 22 billion in 2015 and this growth is expected to exceed $24 billion in 2020.

This research report titled ‘Global Front-end-of-the-line Semiconductor Equipment Market 2016-2020’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various market segments and all geographical regions.

FEOL equipment experienced a decline in 2015 due to a decline in sales of PCs and oversupply of DRAM. However, it will gain pace 2016 onward with the growing memory market and the increasing investments in fabs. The semiconductor market will see a high demand for semiconductor chips and memory devices from 2017 onward due to the growing adoption of IoT, high demand for connected devices, and increased vehicle automation.

Sunil Kumar Singh, a lead analyst at Technavio, specializing in research on semiconductor equipment, says, “Semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment for new facilities will be for the development of memory and logic ICs due to their high demand.”

Based on end-user, the report categorizes the global FEOL semiconductor equipment market into three segments. They are:

  • Foundry
  • Memory
  • Integrated device manufacturers (IDMs)

Foundry

The foundry segment dominated the global FEOL semiconductor equipment market in 2015 and will grow at a CAGR of 2.25% during the forecast period. In 2015, the foundry segment saw a decline in capital expenditure due to a decline in the sales of tablets and PCs, which impacted the demand for new equipment by the foundries. However, the market will see a positive growth rate 2016 onward until 2019. The foundry segment will gain momentum during the forecast period due to the increasing number of fab construction — some of which are scheduled to start construction in 2016 while some already started construction in 2015. Around seven foundry fabs are expected to be completed by 2017. The R&D spending by TSMC, the industry’s biggest pure-play foundry, rose by 10% in 2015 compared with 2014.

Memory

The memory segment will grow at a CAGR of 2.58% during the forecast period. In 2015, the memory segment saw a strong growth primarily due to structural changes such as segment consolidation in DRAM, higher market entry barriers, and more diversified demand. The major change includes the transition from planar to second-generation 3D NAND. The memory market is gradually transitioning to 3D NAND and next-generation non-volatile memory (NVM) technologies. The major memory customers are ramping up 3D NAND volume production, which will result in the growth of production equipment. For instance, Intel entered the 3D NAND business in 2016, partnering with Micron, which will significantly increase the spending levels on semiconductor capital equipment such as FEOL semiconductor equipment.

IDM

The IDM segment will decline during the period of 2015-2016 due to the cyclical nature of the semiconductor industry. The manufacturing of ICs is a long and expensive process, from the conceptualization to the actual production and thus mandates high investment for the installation of equipment and machines like lithography equipment for chip fabrication. The shift of the IC manufacturing companies to the fabless model for reducing the pressure on their cash reserves and improving the focus on their core strengths will steady the decline in price after 2016.

The top vendors highlighted by Technavio’s research analysts in this report are:

  • Applied Materials
  • ASML
  • TEL
  • Lam Research
  • KLA-Tencor

According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

This research report titled ‘Global MEMS Market 2016-2020’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. To calculate the market size, the report considers revenue generated from the sales of MEMS. The report also presents the vendor landscape and a corresponding detailed analysis of top vendors in the market, as well as other prominent vendors.

MEMS are miniaturized devices and structures that are made using the techniques of microfabrication. These combine mechanical, optical, and fluidic elements with electronics. The size of the devices can range from less than one micron up to a number of millimeters. These devices are integrated with a number of devices such as smartphones, tablets, wearables, vehicles, medical devices, and industrial devices for carrying out different types of automated functions. Consumer electronics is the largest market for MEMS. IoT will boost up the MEMS demand, as a large number of MEMS would be required for smart homes, building and industrial automation, and smart grid applications.

Technavio’s hardware and semiconductor analysts categorize the market into three major segments by end user. They are:

  • Automotive
  • Consumer electronics
  • Industrial

Global MEMS market for consumer electronic segment

The consumer electronic segment was valued at USD 5.83 billion in 2015 and will reach USD 10.84 billion by 2020, growing at a CAGR of over 13% during the forecast period. MEMS are integrated into consumer electronics such as smartphones, tablets, cameras, gaming consoles, and wearables. The features such as display control, motion control, navigation, and gesture recognition are enabled by MEMS. Therefore, consumer electronics are integrated with MEMS. The global MEMS market for consumer electronics will primarily be driven by the increase in demand for smartphones. This is due to the decreasing cost of smartphones, which, in turn, boosts the market for MEMS.

According to Sunil Kumar Singh, a lead sensors research analyst from Technavio, “With the declining ASPs and increasing benefits such as low space and high accuracy, the demand for MEMS is increasing. MEMS are small enough to be soldered directly onto the circuit boards. This provides technology with a price advantage.”

Global MEMS market for automotive segment

The automotive segment was valued at USD 3.3 billion in 2015 and will reach USD 5.22 billion by 2020, growing at a CAGR of almost 10% during the forecast period. Government regulations and consumer awareness campaigns such as the Global New Car Assessment Program (NCAP) are driving the demand for MEMS in the automotive segment. Global NCAP demands the integration of minimum vehicle safety standards for both crash protection and crash avoidance in all new cars sold worldwide by 2020. This requires the installation of different types of MEMS in vehicles. MEMS provide safety features such as airbag systems, vehicle security systems, inertial brake lights, headlight levelling, rollover detection, automatic door locks, and active suspension.

“The UN Road Safety Collaboration has introduced a global plan for the decade 2011-2020. The plan focuses on road safety activities such as improving the safety of road infrastructure and broader transport networks; building road safety management capacity; enhancing the behavior of road users; further developing the safety of vehicles; and improving post-crash care,” says Sunil.

MEMS microphones are mainly used in the automotive segment for speech or voice recognition in automobile audio systems. This will enable the passengers to stay connected and be entertained in a safe environment, as they can communicate with the audio system verbally. This has the possibility to reduce road accidents, as people are often distracted by factors such as adjusting the car audio system or speaking on mobile phones.

Global MEMS market for industrial segment

The industrial segment was valued at USD 1.2 billion in 2015 and will reach USD 1.95 billion by 2020, growing at a CAGR of above 10% during the forecast period. MEMS are used in many industrial applications such as construction equipment, agricultural machinery or platform leveling, and for testing applications. MEMS accelerometers are used for vibration sensing conditions such as automotive testing or monitoring the pitch and roll of an aircraft.

MEMS are also used with IoT for industrial automation. MEMS technology is helpful for industrial robots, as it can be applied to tactile sensors, navigation, or proximity sensors. MEMS are used for condition monitoring of transportation and industrial equipment, vibration and rotational speed monitoring, asset and parcel tracking and monitoring, shock detection and logging, building and structure monitoring, and vibration and tilt monitoring.

In a short term, UV curing will drive the UV LED market, announces Yole Développement (Yole) in its new LED report entitled UV LEDs: Technology, Manufacturing and Applications Trends.

But UVC LED’s recent price reduction will see the UV disinfection/purification market take over the UV curing market by 2019/2020. In this context, Yole’s analysts expect the UVC LED market to strongly grow from US$7 million in 2015 to US$610 million by 2021.

uv led curing

With an increased penetration rate in all applications, the UVA LED market will grow from US$107 million in 2015 to US$357 million by 2021. In addition to a moderated growth due to price pressure, Yole announces a very strong increase in number of devices.

Under this new UV LED report, 2016 edition, Yole details the latest technology and market trends. This comprehensive survey provides a deep understanding of the UV lamp business and its technological transition to UV LEDs. It is a thorough analysis of each UV lamp application (UVA/UVB/UVC) with a specific focus on UV curing, UV disinfection/purification and analytical instruments using UV light. Yole’s report highlights the global UV LED industry trends, from substrate to system and details the main challenges and axis of research.

“The UVC LED industry is still small but strong growth is expected in the next 18 months due to dramatic price reductions”, explains Pierrick Boulay, Market & Technology Analyst, LED & OLED at Yole. And he adds: “In 2016 prices are 1/8-1/10 of what they were in 2015.”
This has been triggered by the industry’s development, its transition to mass production and improved device performance. With most of the industry believing that US$1-US$4/mW is the price that would trigger mass market adoption we are getting close to a UVC LED market boom. Another positive sign is that most UVC LED manufacturers are now focusing on developing cost-effective solutions rather than improving device power output. In parallel, the UVC LED industry continues to work on increasing lifetime and developing lower wavelength devices, below 280nm.

In parallel, UVA LEDs continue to progress in the UV curing space. “Continuous improvement of device performance coupled with price reduction has allowed the technology to be increasingly adopted in UV curing applications”, asserts Pars Mukish, Business Unit Manager, at Yole. “Penetration of UV LEDs is increasing but we observe differences in adoption rates depending on application.” Small size and low speed applications like spot adhesive and digital inkjets have the highest adoption rate, and most new developments use UV LEDs. This is due to the small module size and low irradiance level needed that limits the extra cost of integrating UV LEDs compared to the total price of systems like inkjet printers. On the other hand, applications that need high speed processes and/or high levels of irradiance such as screen printing or coating applications have lower adoption rates. This is because UV LED performance is not yet good enough to fully replace traditional mercury lamps.

“Today UVA still represents the largest UV LED market but this trend could change in the future as UV LED performances increase,” announces Yole’ analysts. UV LEDs also enable new applications inaccessible to UV lamp. If these new applications take off, they could represent and additional revenue of nearly US$143 million in 2021.

Yole’s UV LED report highlights the market structure, UV LED market drivers and associated technical challenges, recent trends and new applications created by UV LEDs. It also includes UV LED market size split by application, and much more.

Researchers discovered a procedure to restore defective graphene oxide structures that cause the material to display low carrier mobility. By applying a high-temperature reduction treatment in an ethanol environment, defective structures were restored, leading to the formation of a highly crystalline graphene film with excellent band-like transport. These findings are expected to come into use in scalable production techniques of highly crystalline graphene films.

Transmission electron microscope images observed from the reduced graphene oxide films prepared by ethanol treatment at (a) 900ºC and (b) 1100ºC. For the high temperature treatment, the periodic bright spots are observed in the reduced graphene oxide films. This means that the crystallinity of the reduced graphene oxide is efficiently improved by high temperature treatment in ethanol environment. Credit: Osaka University

Transmission electron microscope images observed from the reduced graphene oxide films prepared by ethanol treatment at (a) 900ºC and (b) 1100ºC. For the high temperature treatment, the periodic bright spots are observed in the reduced graphene oxide films. This means that the crystallinity of the reduced graphene oxide is efficiently improved by high temperature treatment in ethanol environment. Credit: Osaka University

Graphene is a material with excellent electric conductivity, mechanical strength, chemical stability, and a large surface area. Its structure consists of a one-atom-thick layer of carbon atoms. Due to its positive attributes, research on its synthesis and application to electronic devices is being conducted around the world. While it is possible to create graphene from graphene oxide (GO), a material produced by chemical exfoliation from graphite through oxidative treatment, this treatment causes defective structures and the existence of oxygen-containing groups, causing GO to display low conducting properties. So far, carrier mobility, the basic indicator with which transistor performance is expressed, remained at a few cm2/Vs at most. A group of researchers led by Ryota Negishi, assistant professor, and Yoshihiro Kobayashi, professor, Graduate School of Engineering, Osaka University; Masashi Akabori, associate professor, Japan Advanced Institute of Science and Technology; Takahiro Ito, associate professor, Graduate School of Engineering, Nagoya University; and Yoshio Watanabe, Vice Director, Aichi Synchrotron Radiation Center, have developed a reduction treatment through which the crystallinity of GO was drastically improved.

The researchers coated a substrate with 1-3 extremely thin layers of GO and added a small amount of ethanol to the up to 1100°C high temperature reduction process. The addition of the carbon-based ethanol gas led to the effective restoration of the defective graphene structure. For the first time in the world, this group managed to observe a band-like transport reflecting the intrinsic electric transport properties in chemically reduced GO films. Band-like transport is a conduction mechanism in which the carriers use the periodic electric mechanisms in solid crystals as a transmission wave. The observed band transport in this study achieved a carrier mobility of ~210 cm2/Vs, currently the highest level observed in chemically reduced GO films.

The successful creation of thin graphene films achieved through the above reduction method has opened up the possibility of their application in a diverse set of electronic devices and sensors. The findings of this research group form a milestone in the development of scalable materials that utilize graphene’s excellent physical properties.

IC Insights released its August Update to the 2016 McClean Report earlier this month.  This Update included an update of the semiconductor industry capital spending forecast, a look at the top-25 semiconductor suppliers for 1H16, including a forecast for the full year ranking, and Part 1 of an extensive analysis of the IC foundry industry (the ranking of the top-10 pure-play foundries is covered in this research bulletin).

In 2014, the pure-play IC foundry market registered a strong 17% increase, the largest increase since 2010 and eight points greater than the 9% increase in the worldwide IC market.  In 2015, the pure-play foundry market showed a 6% increase, about one-third the rate of growth in the previous year, but seven points higher than the total IC market growth rate of -1%.  For 2016, the pure-play foundry market is expected to increase by 9% and greatly outperform the growth rate of total IC market, which is forecast to drop by 2% this year.

Figure 1 shows that the top 10 pure-play foundries are expected to hold 95% of the total pure-play foundry market this year.  This year, the “Big 4” pure-play foundries (i.e., TSMC, GlobalFoundries, UMC, and SMIC) are forecast to hold an imposing 84% share of the total worldwide pure-play IC foundry market.  As shown, TSMC is expected to hold a 58% marketshare in 2016, down one point from 2015, as its sales are forecast to increase by $2.1 billion this year, up from a $1.5 billion increase in 2015.  GlobalFoundries, UMC, and SMIC’s combined share is expected to be 26% this year, the same as in 2015.

The two top-10 pure-play foundry companies that are forecast to display the highest growth rates this year are Israel-based TowerJazz, which is expected to edge-out Powerchip for the 5th spot in the pure-play foundry ranking in 2016, and China-based SMIC, with 30% and 27% sales increases, respectively. TowerJazz and SMIC have been on a very strong growth curve over the past few years.  TowerJazz is expected to grow from $505 million in sales in 2013 to $1,245 million in 2016 (a 35% CAGR) while SMIC is forecast to more than double its revenue from 2011 ($1,220 million) to 2016 ($2,850 million) and register a 19% CAGR over this five-year timeperiod.

Figure 1

Figure 1

Eight of the top-10 pure-play foundries listed in Figure 1 are based in the Asia-Pacific region.  Israel-based TowerJazz, and U.S.-headquartered GlobalFoundries are the only non-Asia-Pacific companies in the top-10 group.  While LFoundry is currently headquartered in Avezzano, Italy, China-based SMIC agreed in 2Q16 to purchase 70% of the company for approximately $55 million.  Since LFoundry has an installed capacity of 40K 200mm wafers/month, the acquisition of a controlling interest in the company essentially serves to immediately expand SMIC’s capacity by 13% this year.

Although SMIC is forecast to register strong sales growth of 27% this year, Chinese foundries, in total, are expected to hold only 8.2% of the pure-play foundry market in 2016, down 5.1 points from the peak share of 13.3% reached in 2006 and 2007.  IC Insights believes that the total Chinese company share of the pure-play foundry market will increase through 2020, as the China-based foundries take advantage of the huge amount of government and private investment that will be flowing into the Chinese semiconductor market infrastructure over the next five years.

Research and Markets has announced the addition of the “China Semiconductor Industry: Expansion Plans Analysis and Trends (Government Policies and Guidelines, Import and Export Impact on Trade Partners, Key Concepts, Case Study, Key Strategies Adopted, Future Plans, and Recommendation to Players)” report to their offering.

The China semiconductor industry is expected to reach $157.66 billion by 2020, at a CAGR of 12.8% between 2016 and 2020, according to this report. The major driving factors for the China semiconductor industry are the growing demand for semiconductors from major verticals and favorable government initiatives. There are also various opportunities available for the growth of the China semiconductor industry such as investment from foreign players and emerging new concepts.

Integrated Circuit (IC) is expected to hold the largest market share by 2020. The IC segment accounted for almost two-thirds of the total semiconductor industry in China in 2015.

Key topics covered:

  • Market Penetration: Comprehensive information on semiconductor products and services offered by the top players in the China semiconductor industry
  • Mergers & Acquisitions: Detailed insights on latest merger and acquisition activities and expansion in the semiconductor industry
  • Market Diversification: Exhaustive information about mergers and acquisitions, contracts, untapped geographies, recent developments, and investments in the China semiconductor industry
  • Competitive Assessment: In-depth assessment of market shares, strategies, products, and manufacturing capabilities of the leading players in the China semiconductor industry

ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process. In their joint press releases, Intel and ARM said that the agreement will enable Intel Custom Foundry to use its upcoming 10nm FinFET platform for fabricating chip designs based on ARM’s Artisan Physical IP.

“The initial POP IP will be for two future advanced ARM Cortex-A processor cores designed for mobile computing applications in either ARM big.LITTLE or stand-alone configurations,” according to ARM’s press release. Intel’s release says that LG will be using the process to “produce a world-class mobile platform based on Intel Custom Foundry’s 10nm design platform.”

The Intel-ARM partnership could provide new foundry options for chipmakers like Qualcomm — and potentially Apple — beyond current industry bigwigs Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC).

Chips based on Intel’s 10nm process are expected at some point in 2017.

GlobalWafers Co., Ltd. and SunEdison Semiconductor Limited (NASDAQ:SEMI) announced today that they have entered into a definitive agreement for the acquisition by GlobalWafers of all of the outstanding ordinary shares of SunEdison Semiconductor in a transaction valued at US$683 million, including SunEdison Semiconductor outstanding net indebtedness.

Under the terms of the agreement, SunEdison Semiconductor shareholders will receive US$12.00 per share in cash for each ordinary share held, representing a 78.6% premium to the average closing price of SunEdison Semiconductor’s common stock for the 30 trading days prior to this announcement and a 44.9% premium to the closing price of SunEdison Semiconductor’s ordinary shares as of August 17, 2016, the last trading day prior to this announcement.  The transaction has been unanimously approved by both GlobalWafers’ and SunEdison Semiconductor’s boards of directors.

The transaction will be structured as a scheme of arrangement under Singapore law, and is subject to the approval of the shareholders of SunEdison Semiconductor, as well as other customary conditions including approvals from relevant regulatory authorities and the High Court of the Republic of Singapore.  SunEdison Semiconductor has requested and obtained a waiver from the Securities Industry Council of Singapore of the application of the Singapore Code on Take-overs and Mergers to the scheme of arrangement.

“We are very excited by this transaction,” said Doris Hsu, Chairperson and CEO of GlobalWafers.  “We believe this combination is unique in that it merges two of the market’s key suppliers with minimal overlap in customers, products and production capacities.  The combined company will bring together GlobalWafers’ unparalleled operating model and market strengths with SunEdison Semiconductor’s expansive global footprint and product development capabilities.  We will remain focused on our customers and will strengthen and build on our product offerings to deliver even greater value to our customers and shareholders,” Hsu concluded.

“We are pleased to have reached an agreement that delivers a significant premium to our shareholders,” said Shaker Sadasivam, President and Chief Executive Officer of SunEdison Semiconductor.  “We believe this transaction is in the best interest of our company.  We look forward to a smooth process to facilitate an efficient closing, which we hope can occur before the end of the year.”

GlobalWafers will finance the transaction, including payment of the purchase price and payment of SunEdison Semiconductor’s debt facilities at closing, through existing cash on hand and committed acquisition financing from the Bank of Taiwan, Hua Nan Commercial Bank, Mega International Bank, Taipei Fubon Bank, and Taishin International Bank.

GlobalWafers expects a number of strategic and operational benefits from this transaction, including:

  • Meaningful expansion of GlobalWafers’ production capabilities
  • Greater breadth in GlobalWafers’ product and global customer base, including greater access to the E.U. and Korea, as well as SOI product technologies
  • Significant increase in GlobalWafers’ financial scale

Related news: 

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