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According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.

In this report, Technavio covers the present scenario and growth prospects of the global semiconductor capital equipment market education market for 2016-2020. To calculate the market size, the report considers the revenue generated from each equipment of the semiconductor production process.

The electrification and automation of automobiles have led to the increasing need for semiconductor wafers. Different types of semiconductor ICs are used in a number of automotive products like navigation control, infotainment systems and collision detection systems. There is also a growing demand for hybrid and electric vehicles (HEVs) with increased environmental awareness and emissions legislations. The demand for driverless and smart cars will generate demand for advanced sensors over the next four years.

“With advances like the emergence of 3D and ultra-high definition (UHD) TVs and hybrid laptops in the consumer electronics sector, the demand for semiconductor ICs will further increase during the forecast period. This rise in demand for semiconductor ICs will, in turn, generate demand for semiconductor devices,” said Asif Gani, one of Technavio’s lead industry analysts for semiconductor equipment.

“Technavio researchers expect the semiconductor market to grow at a CAGR of 6.42% during the forecast period. The increase in sales of microelectronics and consumer electronic devices is anticipated to support the growth of the semiconductor market,” added Asif.

Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, announces that the Snapdragon 425 processor and MDM9x07 has passed customer qualification and begun mass production in Beijing, after the successful technology transfer from SMIC’s Shanghai 12-inch fab to SMIC’s majority owned joint venture fab in Beijing. The successful production of 28nm Snapdragon products in Beijing represents an important step for SMIC’s 28nm technology.

This achievement is a result of close collaboration between Qualcomm and SMIC’s Beijing and Shanghai teams. SMIC’s successful 28nm production demonstrates its continued leadership in Mainland China and enhanced global competitiveness in advanced node technology.

The Qualcomm Snapdragon 425 processor is redefining the entry-point of mid-tier processors. With 802.11ac Wi-Fi, a 64-bit CPU, and a 16 megapixel dual image sensor processor, the Snapdragon 425 is making cutting-edge experiences more accessible with advanced computing, smooth graphics and remarkable camera quality. SMIC’s Beijing fab is located in the Beijing Economic Development Zone and is capable of manufacturing 28nm and above process technology nodes.

“The successful mass production of Snapdragon 28nm in the Beijing fab represents a major achievement for SMIC in expanding our production at 28nm,” said Dr. Haijun Zhao, Chief Operating Officer and Executive Vice President of SMIC. “Through parallel production of 28nm at both Shanghai and Beijing fabs, SMIC is able to expand our 28nm services to Qualcomm and global customers and to continue our progress in advanced node technology production.”

Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS (NYSE: IHS), a global source of critical information and insight.

A flurry of mergers and acquisitions last year caused the competitive landscape to shift, including the merger of NXP and Freescale, which created the largest automotive semiconductor supplier in 2015 with a market share of 14.3 percent, IHS said. The acquisition of International Rectifier (IR) helped Infineon overtake Renesas to secure the second-ranked position, with a market share of 9.8 percent. Renesas slipped to third-ranked position in 2015, with a market share of 9.1 percent, followed by STMicroelectronics and Texas Instruments.

“The acquisition of Freescale by NXP created a powerhouse for the automotive market. NXP increased its strength in automotive infotainment systems, thanks to the robust double-digit growth of its i.MX processors,” said Ahad Buksh, automotive semiconductor analyst for IHS Technology. “NXP’s analog integrated circuits also grew by double digits, thanks to the increased penetration rate of keyless-entry systems and in-vehicle networking technologies.”

NXP will now target the machine vision and sensor fusion markets with the S32V family of processors for autonomous functions, according to the IHS Automotive Semiconductor Intelligence Service Even on the radar front, NXP now has a broad portfolio of long- and mid-range silicon-germanium (SiGe) radar chips, as well as short-range complementary metal-oxide semiconductor (CMOS) radar chips under development. “The fusion of magnetic sensors from NXP, with pressure and inertial sensors from Freescale, has created a significant sensor supplier,” Buksh said.

The inclusion of IR, and a strong presence in advanced driver assistance systems (ADAS), hybrid electric vehicles and other growing applications helped Infineon grow 5.5 percent in 2015. Infineon’s 77 gigahertz (GHz) radar system integrated circuit (RASIC) chip family strengthened its position in ADAS. Its 32-bit microcontroller (MCU) solutions, based on TriCore architectures, reinforced the company’s position in the powertrain and chassis and safety domains.

The dollar-to-yen exchange rate worked against the revenue ranking for Renesas for the third consecutive year. A major share of Renesas business is with Japanese customers, which is primarily conducted in yen. Even though Renesas’ automotive semiconductor revenue fell 12 percent, when measured in dollars, the revenue actually grew by about 1 percent in yen. Renesas’ strength continues to be its MCU solutions, where the company is still the leading supplier globally.

STMicroelectronics’ automotive revenue declined 2 percent year over year; however, a larger part of the decline can be attributed to the lower exchange rate of the Euro against the U.S. dollar in 2015, which dropped 20 percent last year. STMicroelectronics’ broad- based portfolio and its presence in every growing automotive domain of the market helped the company maintain its revenue as well as it did. Apart from securing multiple design wins with American and European automotive manufacturers, the company is also strengthening its relationships with Chinese auto manufacturers. Radio and navigation solutions from STMicroelectronics were installed in numerous new vehicle models in 2015.

Texas Instruments has thrived in the automotive semiconductor market for the fourth consecutive year. Year-over-year revenue increased by 16.6 percent in 2015. The company’s success story is not based on any one particular vehicle domain. In fact, while all domains have enjoyed double-digit increases, infotainment, ADAS and hybrid-electric vehicles were the primary drivers of growth.

IHS_Auto_Semis_Ranking_2015

Other suppliers making inroads in automotive

After the acquisition of CSR, Qualcomm rose from its 42nd ranking in year 2014, to become the 20th largest supplier of automotive semiconductors in 2015. Qualcomm has a strong presence in cellular baseband solutions, with its Snapdragon and Gobi processors; while CSR’s strength lies in wireless application ICs — especially for Bluetooth and Wi-Fi. Qualcomm is now the sixth largest supplier of semiconductors in the infotainment domain.

Moving from 83rd position in 2011 to 37th in 2015, nVidia has used its experience, and its valuable partnership with Audi, to gain momentum in the automotive market. The non-safety critical status of the infotainment domain was a logical stepping stone to carve out a position in the automotive market, but now the company is also moving toward ADAS and other safety applications. The company has had particular success with its Tegra processors.

Due to the consolidation of Freescale, Osram entered the top-10 ranking of automotive suppliers for the first time in 2015. Osram is the global leader in automotive lighting and has enjoyed double-digit growth over the past three years, thanks to the increasing penetration of light-emitting diodes (LEDs) in new vehicles.

Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI. More than 700 companies exhibit at SEMICON West and 26,000+ professionals attend, from the electronics manufacturing supply chain. The “Best of West” award was established to recognize new products moving the industry forward with technological developments in the electronics supply chain.

The Best of West 2016 Finalists will be displaying their products on the show floor at Moscone Center from July 12-14:

  • Coventor: SEMulator3D – A 3D semiconductor process modeling platform that can predicatively model any fabrication process applied to any semiconductor design. Starting from a “virtual” silicon wafer, the product performs a series of unit processes like those in the fab to create highly accurate 3D computer models of the predicted structures on wafer. (Facilities and Software category; Booth #2622)
  • CyberOptics: WaferSense® and ReticleSense® Auto Multi Sensors (AMS) – Wireless sensor devices capable of multiple measurements (leveling, vibration and relative humidity) to save time and expense while improving yields. WaferSense AMS travels through virtually any tool with its thin and light form factor, while ReticleSense AMSR has the same measurement capabilities in a reticle shaped form factor. (Metrology and Test category; Booth #2323)
  • Graphenea: Graphene Integration on CMOS-Fab – Allows large-scale manufacture of 200mm CMOS-compatible graphene wafers (SEMI Standards), with low metal contamination levels. The industrial production method will produce uniform, large-scale/high-performance graphene in high yields and a reliable manner. (Advanced Materials and Materials Management category; Booth #632)
  • Kulicke & Soffa Industries: IConn MEM PLUS High Performance Wire Bonder for Memory Devices – A new high-performance memory device bonder for gold and silver alloy wire bonding. With its advanced process, looping, overhang control and ease of use capabilities, it delivers high quality and productivity benefits in complex multi die stack package applications. (Assembly/Packaging Solutions category, Booth #6060)
  • Rorze Automation: Rorze N2 Purged LP – Maintains low humidity during critical steps. A typical bottom purged LP can only offer control of an average of 30 percent RH. However, N2 purge LP from Rorze (patent pending) can offer a humidity control that is better than 5 percent. (Components and Subsystems category; Booth #1613)
  • SPTS Technologies (an Orbotech company): Rapier-300S – A production silicon DRIE module, designed specifically for dicing of 300mm  wafers mounted on 400mm frames. It builds on SPTS experience in plasma singulation of framed 150mm and 200mm wafers, and employs patent-protected end-pointing and process control techniques, critical to delivering stronger die than traditional dicing methods. (Assembly/Packaging Solutions category; Booth #1417)

The Best of West Award winner will be announced during SEMICON West (www.semiconwest.org) on Wednesday, July 13, 2016.

North America-based manufacturers of semiconductor equipment posted $1.75 billion in orders worldwide in May 2016 (three-month average basis) and a book-to-bill ratio of 1.09, according to the May Equipment Market Data Subscription (EMDS) Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.09 means that $109 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in May 2016 was $1.75 billion. The bookings figure is 9.6 percent higher than the final April 2016 level of $1.60 billion, and is 13.1 percent higher than the May 2015 order level of $1.55 billion.

The three-month average of worldwide billings in May 2016 was $1.60 billion. The billings figure is 9.6 percent higher than the final April 2016 level of $1.46 billion, and is 2.8 percent higher than the May 2015 billings level of $1.56 billion.

“Bookings and billings for new semiconductor equipment continue to improve,” said Denny McGuirk, president and CEO of SEMI. “The data are consistent with higher spending expectations for the second half of the year.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
December 2015

$1,349.9

$1,343.5

1.00
January 2016

$1,221.2

$1,310.9

1.07
February 2016

$1,204.4

$1,262.0

1.05
March 2016

$1,197.6

$1,379.2

1.15
April 2016 (final)

$1,460.2

$1,595.4

1.09
May 2016 (prelim)

$1,601.1

$1,749.3

1.09

Source: SEMI (www.semi.org), June 2016

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the SEMI Equipment Market Data Subscription (EMDS).

Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16% CAGR during this period. China has the world’s largest population, and its economy will continue to grow at a high pace: the economists predict a 6% growth, reaching around US$16 trillion by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. Today, no business can afford to ignore China.

advpackaging_china_waferforecastyole_june2016_373x280

Under this context, the “More than Moore” market research and strategy consulting company, Yole explores the advanced packaging industry in China and details, in its latest advanced packaging report entitled “Status & Prospects for the Advanced Packaging Industry in China”, the status of this industry, its market drivers and key market data and technology trends. Yole’s analysts propose a clear vision of the Chinese government commitment within the advanced packaging industry in China and point out the huge China’s IC investments fund. Business opportunities, technical challenges and more are also part of Yole’s market & technology analysis.

China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 – 2020, while the Chinese IC market will grow by 7% over the same period. According to Yole, the Chinese IC market is expected to reach about US$149 billion by 2020, around 40% of the total IC market.

“There is a huge gap between China’s IC consumption and its manufacturing,” commented Santosh Kumar, Senior Technology & Market Analyst at Yole. And he details: “In 2015, China produced only 12.5% roughly of the IC it consumes, and the gap between IC consumption and production is about US$91 billion. Currently, IC is China’s #1 import commodity, exceeding oil.”

China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments.

The Chinese government has employed a multi-pronged strategy to support domestic IC industry development in order to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2030. Over the last few decades the Chinese government has supported the domestic IC industry, but with limited success. One key reason for failure was the bureaucratic approach to resource allocation, which was by nature inefficient. This time around, the government is adopting a market-based approach where funding is available for investment in the form of equity investments rather than subsidies in invested companies. The goal is to generate return on investment while simultaneously aligning with government policy.

Out of more than 200 firms, there are 128 companies having significant advanced packaging & assembly (A&P) operations in China. Yole’s analysts identified around 147 plants all over China, mostly based in Jiangsu (43), Guangdong (30) and Shanghai (22) regions. In this part of the globe, more than 50% of A&P plants belongs to IDMs . A number of Taiwan-HQ OSAT plants are concentrated in Jiangsu, especially in the Suzhou Industry Park. Indeed global OSATs such as Amkor Technology and SPIL are investing in advanced packaging capability of their own Chinese operations: China (Shanghai) operation is the Amkor’s second-largest factory by revenue. The advanced packaging market growth is led by JCET/STATSChipPAC, Huatian, NFME & China WLCSP. And the Chinese advanced packaging market is offering a wide range of platforms including:

  •  Flip-chip technology is the largest advanced packaging market segment in China reaching US$ 1,8 billion in 2015. The Flip-chip market is covering bumping and assembly steps. “We see a huge ramping of bumping capacity in China, especially by Chinese players with 12” Cu pillar process,” comments Santosh Kumar from Yole. “This growth is mainly supported by the Flip-chip industry in China showing a 16% CAGR between 2015 and 2020”. Flip-chip platform is followed by WLCSP technology with US$ 343 million in 2015 as well.
•  Fan-out and 2.5/3D platforms are only emerging in China and will have less than 1% market share by 2020.

Under its latest advanced packaging report, Yole’s advanced packaging team points out the key market drivers of this industry. They list:
•  Long-term growth in China IC industry
•  Aggressive mergers & acquisitions
•  Numerous Chinese government initiatives
•  Investments led by global OSATs
This analysis also gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market.

Today, at the 2016 Symposia on VLSI Technology & Circuits, nano-electronics research center imec presented gate-all-around (GAA) n- and p-MOSFET devices made of vertically stacked horizontal silicon (Si) nanowires (NWs) with a diameter of only 8nm. The devices, which were fabricated on bulk Si substrates using an industry-relevant replacement metal gate (RMG) process, have excellent short-channel characteristics (SS = 65 mV/dec, DIBL = 42 mV/V for LG = 24 nm) at performance levels comparable to finFET reference devices.

GAA devices architectures offer optimal electrostatic control, thereby enabling ultimate CMOS device scaling. In addition, horizontal NWs are a natural extension of RMG finFETs, in contrast to vertical NWs which require more disruptive technology changes. Furthermore, stacking of NWs maximizes the drive current per footprint. Imec successfully combined these three aspects, and, for the first time, demonstrated vertically stacked horizontal Si NWs at scaled dimensions: 8-nm-diameter wires, 45-nm lateral pitch, and 20-nm vertical separation.

Compared to the conventional bulk FinFET flow, imec implemented two major differences in the process flow. First, shallow trench isolation (STI) densification at 750°C resulted to preserve sharp silicon-germanium (SiGe)/Si interfaces, which is essential for well-controlled Si NW release. Second, a low-complexity ground plane doping scheme was applied, suppressing the bottom parasitic channel.

“By demonstrating stacked nanowires with solid electrostatic control, at scaled dimensions, and using an industry-relevant RMG process on bulk silicon substrates, imec has achieved breakthrough results that can pave the way to realizing sub-10nm technology nodes,” stated Dan Mocuta, Director Logic Device and Integration at imec. “The upcoming research phase will focus on achieving even denser pitches and on leveraging this knowledge to develop gate-all-around lateral nanowire CMOS devices.”

Imec’s research into advanced logic scaling is performed in cooperation with imec’s key partners in its core CMOS programs including GlobalFoundries, Intel, Micron, SK Hynix, Samsung, TSMC, Huawei, Qualcomm and Sony.

TEM images of an NMOS GAASiNWFET(LG=70nm):(a)overview of the SiNW array; (b)detailed view of two stacked SiNWs

TEM images of an NMOS GAASiNWFET(LG=70nm):(a)overview of the SiNW array; (b)detailed view of two stacked SiNWs

Shipment area of wide color gamut (WCG)  displays is expected to reach 32 million square meters in 2018, which represents 17 percent of total display shipment area, according to IHS Inc. (NYSE: IHS),the leading global source of critical information and insight. WCG displays include organic light-emitting diode (OLED) and quantum dot technologies.

“As competition in the display market intensifies, display and TV manufacturers are looking for new and emerging technologies to differentiate their offerings from competitors and to provide consumers with higher screen resolution,” said Richard Son, senior analyst, IHS Technology. “WCG technologies are therefore becoming more popular.”

There are two different kinds of quantum dot materials. One is cadmium-included quantum dot and the other is cadmium-free (Cd-free) quantum dot. Since cadmium is an unsafe and toxic element, the display industry developed Cd-free quantum dot technology to replace it. Cd-free quantum dot displays are forecast to comprise 80 percent of the total quantum dot display market in 2016. Quantum dot is just beginning to be used in TV displays to compete against OLED displays. Active-matrix-OLED (AMOLED), by comparison, is primarily used in smartphone displays.

OLED WCG display shipment area is forecast to reach 4.4 million square meters in 2016, growing to 9.2 million square meters in 2018. Quantum-dot WCG display shipment area will reach 13.4 million square meters in 2018, rising from 6.1 million square meters in 2016.

wide color gamut