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Crossbar, Inc. announced an agreement with Microsemi Corporation, the largest U.S. commercial supplier of military and aerospace semiconductors, in which Microsemi will license Crossbar’s ReRAM core intellectual property. As part of the agreement, Microsemi and Crossbar will collaborate in the research, development and application of Crossbar’s proprietary ReRAM technology in next generation products from Microsemi that integrate Crossbar’s embedded ReRAM with Microsemi products manufactured at the 1x nm process node.

“We are pleased to have Microsemi in our growing list of licensees,” said George Minassian, CEO of Crossbar. “Together, we can bring unique integration of ReRAM into highly integrated, advanced node semiconductor solutions for a wide range of high-performance, low-power solutions.”

The unique nanofilament technology of Crossbar ReRAM is built upon standard CMOS processes and is fully scalable to below 10nm without impacting performance. Highly integrated semiconductor solutions with unique embedded memory architectures can be built to offer a highly secure, low-power platform with fast access times for advanced applications including edge computing, communications infrastructure, artificial intelligence, Industrial IoT and automotive.

“We are very pleased with the Crossbar license as their unique and highly scalable ReRAM technology allows us to plan power-efficient, high performance products across a multi-generation roadmap,” said Jim Aralis, Microsemi CTO. “This technology collaboration with Crossbar furthers our commitment to becoming the leading supplier of semiconductor solutions differentiated by performance, reliability, security and power while delivering truly innovative solutions.”

ON Semiconductor Corporation announced the expansion of their manufacturing facility in Rochester, New York. The site develops and manufactures image sensor devices for commercial, industrial and professional imaging applications, including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

ON Semiconductor is a global company with manufacturing facilities around the world – the end-to-end manufacturing strategy at the Rochester location enables success in these specialized markets. Located on a 4.2-acre site with over 260,000 square feet of building space, the expanded facility supports all four disciplines of the semiconductor business, wafer fab, wafer probe, assembly, and test and packaging operations for specialized high-performance CCD and CMOS image sensors.

“Not only is the screen on your smart phone or TV likely inspected with image sensors manufactured at the Lake Avenue site, but image sensors manufactured at this facility are also on the surface of Mars, orbiting Jupiter and the Moon, and used in commercial satellites that monitor the Earth’s surface,” said Michael Miller, general manager and director of operations at ON Semiconductor. “This expansion would have not been possible without the support and grant from Empire State Development and their willingness to partner with us. We owe them a debt of gratitude, thank you Governor Cuomo.”

“Manufacturing is a core competency for ON Semiconductor and the majority of ON Semiconductor’s manufacturing operations are done internally through the company’s industry leading cost structure,” said Bill Schromm, executive vice president and chief operating officer. “This expansion is important to our company, as it significantly increases our assembly capacity at the ON Semiconductor Rochester location.”

“Rochester is known for its innovations in digital imaging, including the design and development of state-of-the art image sensors over the past decades. Assembly and test has always been a key part of the equation, and as the resolution and complexity of the sensors continues to increase, these operations have become critical,” said Herb Erhardt, general manager, Industrial Solutions Division. “The increased level of capability and capacity enabled by this expansion is our answer to meeting these critical market needs, and the fact that we are doing it here in Rochester speaks to the capabilities of the teams we build here.”

The expansion is due in part to partnerships with local and state officials, including the Mayor and County Executive, Governor’s office and state officials, as well as members of Congress, all recognizing the opportunity to grow the local economy and leverage the unique advantages that Rochester can bring.

Greater Rochester Chamber of Commerce President and CEO Bob Duffy said, “Rochester Chamber congratulates member ON Semiconductor on the opening of its new assembly and test operation. With its global customer base, ON Semiconductor is a terrific example of the Rochester and Finger Lakes region’s emerging high-tech economy. Rochester Chamber stands ready to assist ON Semiconductor in any way that it can to help the company along on its path of growth and prosperity.”

“High-tech companies like ON Semiconductor recognize the highly skilled workforce that can be tapped into in the Finger Lakes,” said Howard Zemsky, president, CEO and commissioner at Empire State Development. “ON Semiconductor’s Eastman Business Park expansion is yet another great addition to the innovation ecosystem being established in the region.”

“Businesses like ON Semiconductor are bolstering the reputation of Rochester as a target area for high-tech investment,” said Lieutenant Governor of New York Kathy Hochul. “There is an enthusiasm throughout the City and the region that is contagious. Our economic investments have built new buildings and provided new job opportunities for residents of the Finger Lakes region. Most importantly, the Finger Lakes Forward strategy has brought back hope. I thank ON Semiconductor for their investment and continuing to believe in the Rochester community.”

The site celebrated the grand opening of the ON Semiconductor Assembly and Test facility with a ribbon-cutting, Wednesday May 9, 2018 at 11 a.m. WHAM-TV news anchor Ginny Ryan presided as the master of ceremonies for the event. Special guests included: Lt Governor Kathy Hochul, Howard Zemsky, president and CEO of Empire State Development, Robert Duffy, president and CEO of the Rochester Chamber of Commerce, Rochester City Mayor Lovely Warren, Vincent Esposito, Regional Director – Finger Lakes – Rochester Region Empire State Development and Monroe County Executive Cheryl Dinolfo.

ON Semiconductor is focused on energy efficient innovations in an effort to reduce global energy use. The company offers a comprehensive portfolio of over 80,000 energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices utilized in, computing, consumer, industrial, medical and military/aerospace applications. The company operates a network of manufacturing facilities, sales offices and design centers which are located in key markets throughout North America, Europe and in the Asia Pacific region.

Adesto Technologies, a provider of innovative application-specific semiconductors for the IoT era, announced it has acquired Dublin-based S3 Semiconductors, a global supplier of mixed-signal and RF application specific integrated circuits (ASICs) and an extensive library of design IP. The transaction is valued at approximately $35 million, with an additional earn-out provision based on certain milestones to the end of calendar year 2019.

Highlights of expected benefits of the transaction include:

  • Expands Adesto’s portfolio of products and technologies with analog, mixed-signal, and RF solutions and IP
  • Accelerates revenue and customer growth in communications and industrial IoT with immediate cross-selling opportunities and nominal customer overlap
  • Increases dollar content potential for IoT edge nodes
  • S3 Semiconductors is a highly-valued design partner of Arm Holdings
  • Adds high-value embedded systems expertise and mixed-signal engineering team
  • Immediately accretive to gross margin and adjusted EBITDA

“Building on our leadership position in IoT memories, today we take a meaningful step in becoming a supplier of a broad range of innovative semiconductor products and solutions for the IoT markets,” said Narbeh Derhacobian, CEO of Adesto. “S3 Semiconductors has a proven track record of designing and delivering differentiated ASIC products, and an extensive IP portfolio developed by a talented team of design engineers over many years. Through this acquisition, we are significantly expanding our customer base and SAM with a broader product portfolio and comprehensive systems expertise to deliver a complete solution to our customers.”

Dermot Barry, vice president and general manager of S3 Semiconductors, commented, “Over the years, S3 Semiconductors has built a first-class team that is focused on creating complex, high-quality custom products. Joining forces with Adesto gives us access to a broader sales channel with a diversified group of top-tier customers who will benefit from our ability to deliver highly optimized ASICs with unrivaled cost economies. Moreover, the combined company is well-positioned to gain increasing traction in IoT to drive toward the next phase of innovation and growth.”

S3 Semiconductors will become a business unit of Adesto and will continue to operate under its current operating model across existing global sites, including its four design centers in Dublin, Cork, Prague and Lisbon.

Adesto financed the transaction with existing cash and a new credit facility in the amount of $35 million. Concurrent with the close of the new credit facility, Adesto terminated its former credit facility with Western Alliance Bank, which included paying off an outstanding term loan with a principal amount owed of $12 million.

ROTH Capital is serving as financial advisor and placement agent to Adesto, and Menalto Advisors is serving as financial advisor to S3 Group.

 

Air Liquide Advanced Materials, Inc. (ALAM) has been chosen by the New Jersey chapter of the Association for Corporate Growth as an honoree for the 2018 Corporate Growth Awards.

The ACG NJ Corporate Growth Awards were established in 2015 and honor companies that exemplify sustained innovation, excellence and corporate growth. ALAM has been a strong presence in the New Jersey business community since 2013 when it acquired Voltaix, a Branchburg, NJ-based electronics materials company founded in 1986. As the leading manufacturer of speciality chemicals in the semiconductor industry, ALAM is committed to continued long-term growth and engagement with the communities in which it operates.

ALAM is one of five New Jersey companies to receive the distinction at the ACG NJ Corporate Growth Conference and Awards on May 8, 2018 at The Palace at Somerset Park, NJ for a half-day event including a CEO panel discussion and awards ceremony.

Paul Burlingame, Air Liquide Advanced Materials, Inc. President & CEO said, “We are proud to receive the 2018 ACG NJ Corporate Growth Award in recognition of the innovation, operational agility, and customer focus exhibited by Air Liquide Advanced Materials employees every day. As a result of these efforts Air Liquide Advanced Materials remains committed to continued growth fueled by new products, collaborations and markets.”

By Heidi Hoffman, Sr. Director of FHE, MEMS and Sensors Marketing, SEMI

Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.

These were among the insights foreshadowing the future of the FHE, electronic textiles, IoT, MEMS and sensors industries at the FLEX Japan and MEMS & Sensors Forum Japan 2018. At the April event, organized by SEMI-FlexTech-MSIG, nearly 200 attendees shared their observations and lessons learned in the development of processes, products and applications. Presentations and discussions revealed these five takeaways.

1. Expect the unexpected with FHE development

Flexible Hybrid Electronics (FHE) continues to shrink the size and weight of products, enabling new markets and concepts. “FHE takes printed electronics and adds ICs for getting performance out of the PE structure,” said Wilfried Bair of NextFlex, adding that “peel- and-stick electronic products are one example of unexpected new markets enabled by FHE capabilities.” One potential application is large peel-and-stick safety sensors adhered to buildings to warn of structural dangers.

2018FLEX Japan

 

Another surprising turn: With new insights into OLED technology originally developed for flexible displays, Cambridge Display Technology (CDT) has devised an innovative medical diagnostic tool for markets such as biomedical and agricultural monitoring. The tool features an atmosphere-processable OLED component with a simplified OLED structure encapsulated in aluminum foil.

2. IoT and FHE devices should change hardware business models

This is the standard business model for many new FHE products: develop a product, manufacture it, find customers and sell. FHE and IOT device developers were encouraged by Jam Kahn of Gemalto to consider flipping the script: During FHE product development, explore building an after-market revenue stream by controlling and mining the data for trends it reveals. Because of its data harvesting potential, IoT is an excellent emerging technology for this strategy.

The “Experience Economy” could create 200 connectable items per person, generating strong revenue streams from the collection and analysis of massive amounts of sensor-generated data. The key is for the data to be actionable. That means hardware suppliers must extend their focus to software development. “A recent study of California investors found that by 2025, 60 percent of global business profits will be from data,“ noted Harri Koopla of VTT, who advised hardware producers to examine business models that produce continuous value by leveraging software. “With FHE, we are creating the path to digitization for non-digital industries, and these industries need complete solutions,” he said.

Xenoma smartshirt features

 

Hardware provider Xenoma, for example, sells an electronic shirt with sensors for measuring muscle movements, heart rate and other health-related data. Xenoma’s Ichiro Amimori said the company offers its open-source software development kit for free under one condition: The developer must share the collection data with Xenoma. The idea is that the more data collected, the greater Xenoma’s ability to improve human health over the long term and achieve its long-term vision of alleviating disease.

3. Roll-to-roll and sheet-to-sheet manufacturing will meet in the middle

One of the big advantages of flexible and printed electronics was its promise to enable the manufacturing of electronics on a roll-to-roll (R2R) process in atmospheric (or close) conditions, like newspaper, rather than one sheet at a time, as with displays or wafers. But as development of inks and interconnects progressed, along with the placement of discrete and thinned-die components and basic flexible substrates on a moving web, most research and development (R&D) and limited-production runs moved to sheet-fed systems to control material costs for experiments and low-volume production. R&D on printing electronics processes split into two camps: the simple printed components camp on R2R, and the camp backing more flexible hybrid electronics development on a sheet-by-sheet basis. But progress didn’t stop.

R2R functional testing

 

Harri Koopla of VTT highlighted new R2R inspection and test capabilities in the VTT pilot line in Finland. R2R processing advances incorporate ideas from biology, chemistry, optics, optoelectronics, advanced inspection and test capability, illustrating the multidisciplinary nature of FHE. While accurate, high-speed, pick and place of thinned, bare die remains the domain of sheet-to-sheet manufacturing, look for more improvements in accuracy and speed.

Another new manufacturing concept that turns business models on their heads – “minimal fabs” – focuses on creating limited-run equipment and processes that use 3D printing and do not require cleanrooms. With a relatively low cost of entry, the approach enables electronics to be produced affordably anywhere.

4. Powering the IoT is a grand challenge

The requirement for edge devices to function without intervention for long periods raises hard questions about how to power the devices. Using organic photovoltaics (OPV) in textiles to harvest energy from light could be one solution, according to Kasimaesttro Sugino of the Suminoe Textile Technical Center.  

ULVAC’s answer to the IoT power issue are requirements for edge device micro-batteries to be environmentally benign, safe, flexible and compatible with semiconductor processing less than .1 mm in height. The micro-batteries must also feature a long life and support continuous power output, high power density, low self-discharge (over 10 years) and mass production, said Shunsuke Sasaki of ULVAC. The batteries are being built on silicon, glass and stainless steel with dry, thin-film vacuum processing.

5. Flexible displays bring any surface to life

With their durability, flexibility, low-cost processing and programmability, flexible displays can transform any surface into a content-rich display with messages that make lives healthier, simpler and safer.

FlexEnable

 

One example is FlexEnable’s organic thin-film transistor (OTFT), a device made possible not only by recent advances such as the ability to build organic material transistors on plastic and the increasing clarity of new film materials but by continuous manufacturing process improvements. These advances are improving switching times and the color and video capabilities of thin-film transistors while retaining their flexibility, low power consumption and communication capabilities. Simon Jone of FlexEnable gave the examples of wrapping a display around the blind spots of automobiles or replacing side-view mirrors with interior monitors showing feeds from an external camera, approaches that would improve safety while reducing wind drag and increasing fuel efficiency.

E Ink’s reflective technology and flexible products are coming to market with a wider color spectrum. The company’s Michael McCreary said its designers are specifying the panels for innovative projects such as the exterior walls of the San Diego International Airport parking garage. Used to communicate with airport visitors, the installation is weather-proof, programmable and self-powered.

Originally published on the SEMI blog.

 The 2018 Critical Materials Council (CMC) Conference—held April 26-27 at the Hilton Chandler in Arizona— was a great gathering with presentations from Everspin, Intel, GlobalFoundries, and NXP discussing current fab challenges, and the relationships to near-term materials solutions. Held immediately following private CMC face-to-face meeting, this public event enabled targeted discussions on problems, opportunities, and issues in the present and future materials market.

Session 1 presentations from Keller&Heckman, KPMG, Semico, VLSI Research, and the United States’ Environmental Protection Agency reminded attendees of the many environmental, financial, and political factors impacting global fab supply-chains. Jeff Morris, the US EPA’s Director of the Office of Pollution Prevention and Toxics, reviewed the status of enforcement of the Toxic Substances Control Act (TSCA) with a focus on N-Methylpyrrolidone (NMP), per- and poly-fluorinated Substances (PFAS, PFOS, PFOA), and Photo-Acid Generators (PAG) used in semiconductor manufacturing.

Session 2 covering materials issues in fabs today explored the evolving specifications needed in silicon wafers, ion-implantation, noble gases, and metal depositions including atomic-layer (ALD) chemical-vapor (CVD) physical-vapor (PVD) and electro-chemical (ECD). The Figure shows 200mm-diameter silicon wafer global supply and manufacturing demand from 2015 to 2020, as modeled by TECHCET President and CEO Lita Shon-Roy in her presentation on materials markets. TECHCET expects that this year will see a balancing and then an excess of supply in this wafer size used for manufacturing Opto-electronics, Sensors, and Discretes (OSD) along with Radio Frequency (RF) communications chips.

The presentations on cobalt processing from Air Liquide, Applied Materials, Fraunhofer, and Fujimi—mostly in Session 3—provided fantastic perspectives on solutions to inherent integration challenges with this metal. Cobalt has been used as a barrier or a liner for on-chip copper interconnect lines for many years, but the material is now being integrated as the entire interconnect material for the smallest metal lines in the most aggressively scaled IC structures. Nicolas Blasco of Air Liquide discussed the complex path to discovering novel ALD precursors, while Michelle Garza of Fujimi discussed ways to manage the complexity of developing new Chemical-Mechanical Planarization (CMP) slurries for application-specific cobalt integration.

Senior Analyst with TECHCET Ed Korczynski presented an update on the latest lithography materials to enable patterning the smallest possible commercial IC devices, including recently disclosed Self-Aligned Multi-Patterning (SAMP) technology options to improve IC yields. Cost models for different multi-patterning process flows were recently presented at the 2018 SPIE Advanced Lithography conference showing how Extreme Ultra-Violet (EUV) lithography can be cost-effective despite double the tool costs. Key to cost-effective use of EUV will be control of stochastic yield losses which are colloquially termed “Black Swans”.

The Wednesday night reception and the Thursday night break-out roundtable discussions gave everyone time to make new connections and have discrete discussions on metrology, specifications, and technology integration. Block your calendar in 2019 for the 4th annual CMC Conference, tentatively scheduled for April 25-26 in the US. www.cmcfabs.org www.techcet.com

ABOUT CMC: The Critical Materials Council (CMC) of Semiconductor Fabricators (CMCFabs.org) is a membership-based organization that works to anticipate and solve critical materials issues in a pre-competitive environment. The CMC is a unit of TECHCET.

ABOUT TECHCET: TECHCET CA LLC is an advisory service firm focused on process materials supply chains, electronic materials technology, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the SEMATECH Critical Material Reports, covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. For additional information about these reports or about CMC Fabs membership or associate-membership for suppliers please contact Diane Scott at [email protected]  +1-480-332-8336, or go to www.techcet.com or www.cmcfabs.org.

Osram has added to its expertise in semiconductor-based optical security technology by acquiring US-based Vixar Inc. Already a technology leader in infrared LEDs and infrared laser diodes, Osram will have a unique breadth of technological expertise and an expanded product portfolio after bringing on board Vixar’s specialist capabilities in the field of VCSEL. While currently known primarily for identification applications in mobile devices, VCSEL also can be used to recognize gestures and measure distances in medical, industrial and automotive applications. Vixar was founded by pioneers in the VCSEL industry, having first brought VCSEL to the data communication market in the late 1990s, and more recently by founding Vixar in 2005 to pursue sensing applications. Approximately 20 employees of the company, which is based in Plymouth, Minnesota, will transfer to Osram as a result of the acquisition. Vixar is profitable both on an operational and net results level. The parties to the deal have agreed not to disclose financial details. Closing of the transaction is expected in summer.

“The acquisition of Vixar is adding to our expertise, particularly in the fast-growing market for security technologies,” said Olaf Berlien, CEO of OSRAM Licht AG. Osram is a technology leader in infrared optical semiconductors and has already succeeded in bringing to market light sources for fingerprint sensors, iris scanners, and 2D facial recognition. The acquired capabilities will pave the way for further security technologies, including ultra-compact 3D facial recognition. In addition to unlocking smartphones and other consumer electronics devices, such technologies also can be used for high-security access controls in industry.

The way in which VCSEL technology captures 3D environmental data has applications in everything from gesture recognition, augmented reality, robotics and proximity sensors to autonomous driving. VCSEL stands for vertical cavity surface emitting laser and is a special type of laser diode in which the light is emitted perpendicular to the surface of the semiconductor chip. Vixar is a fabless semiconductor company, and has developed a robust volume supply chain consisting of merchant foundries serving the optoelectronic market. Osram’s depth and breadth of semiconductor experience will further strengthen the manufacturing capabilities for the rapidly growing VCSEL market.

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new building will house EVG’s “Manufacturing III” facility, which will more than double the floor space for the final assembly of EVG’s systems.

“With our innovative manufacturing solutions for the high-tech industry as well as new biomedical applications, we operate in very dynamic markets with great future prospects,” stated Dr. Werner Thallner, executive operations and financial director at EV Group. “In light of the high capacity utilization in all areas of our existing facilities, as well as the positive market outlook, we decided to implement our plans for building our Manufacturing III facility this year. This will support our long-term growth targets at our corporate headquarters in St. Florian am Inn.”

EVG Manufacturing III Photo 1

The new Manufacturing III building, adjacent to the new test room site that was opened just a few months ago, will be built next to the river Inn. The ultramodern building will provide approximately 4,800 square meters of additional space in total, which will benefit not only manufacturing but other departments as well. In addition to an expansion of warehouse space, a new delivery area with a dedicated packaging site designed for cleanroom equipment will be created, along with an airfreight security zone and new truck loading docks for the shipment of the completed systems to EVG’s worldwide customers.

The construction of the new Manufacturing III building is set to be completed in early 2019.

Intel today announced that Jim Keller will join Intel as a senior vice president. He will lead the company’s silicon engineering, which encompasses system-on-chip (SoC) development and integration.

“Jim is one of the most respected microarchitecture design visionaries in the industry, and the latest example of top technical talent to join Intel,” said Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture & Client Group (TSCG). “We have embarked on exciting initiatives to fundamentally change the way we build the silicon as we enter the world of heterogeneous process and architectures. Jim joining us will help accelerate this transformation.”

Keller brings to Intel more than 20 years of experience in x86 and ARM-based microarchitecture design across a broad range of platforms, including PCs, servers, mobile devices and cars.

“I had a great experience working at Tesla, learned a lot, and look forward to all the great technology coming from Tesla in the future. My lifelong passion has been developing the world’s best silicon products,” Keller said. “The world will be a very different place in the next decade as a result of where computing is headed. I am excited to join the Intel team to build the future of CPUs, GPUs, accelerators and other products for the data-centric computing era.”

Keller, 59, joins Intel from Tesla, where he most recently served as vice president of Autopilot and Low Voltage Hardware. Prior to Tesla, he served as corporate vice president and chief cores architect at AMD, where he led the development of the Zen* architecture. Previously, Keller was vice president of Engineering and chief architect at P.A. Semi, which was acquired by Apple Inc. in 2008. He led Apple’s custom low-power mobile chip efforts with the original A4 processor that powered the iPhone 4*, as well as the subsequent A5 processor.

He will officially start in his new role at Intel on April 30.

Technavio’s latest market research report on the global lithography systems market provides an analysis of the most important trends expected to impact the market outlook from 2018-2022. Technavio defines an emerging trend as a factor that has the potential to significantly impact the market and contribute to its growth or decline.

According to Technavio market research analysts, the CAGR for the global lithography systems market is projected to be over 5% during the forecast period. However, the growth momentum of the market is expected to decelerate due to a decrease in the year-over-year growth.

One of the major drivers for the growth of the global lithography systems market is the increasing investments toward construction of new fabs and expanding older facilities. Growing investments in autonomous technologies (for cars) and increasing interest in robotics is creating a demand for semiconductor chips, which form a core component for the working of these devices. To meet this production of ICs, there will be an increasing demand for more number of fabs.

In this report, Technavio highlights the increasing sizes of wafers as one of the key emerging trends driving the global lithography systems market:

Increasing sizes of wafers

Increasing investments toward introducing a 400-mm wafer size is a major trend. A 450-mm wafer (18 inches) will have a larger surface area, which indicates that a high number of chips can be produced, at low manufacturing costs. Increasing the size of wafers reduces the manufacturing costs by almost 30%. Firms are showing an increasing interest in the production of 450-mm sized wafers. For example, Intel has invested in R&D for 450 mm and is building a production facility for the same.

According to a senior analyst at semiconductor equipment research, “One of the major undertakings to develop 450-mm wafers is the G450C, a consortium that includes major firms such as IBM, Intel, TSMC, Samsung, and GLOBALFOUNDRIES. The consortium aims to develop the 450-mm wafer and manufacture the required equipment to process 450-mm wafers.”

Technavio’s sample reports are free of charge and contain multiple sections of the report such as the market size and forecast, drivers, challenges, trends, and more.

Global lithography systems market segmentation

This market research report segments the global lithography systems market by technology (ArF immersion lithography systems, EUV lithography systems, KrF lithography systems, ArF dry lithography systems, and i-line lithography systems), by end-user (IDMs and pureplay foundries), and key regions (the Americas, APAC, and EMEA).

The IDMs segment dominated the market in 2017, accounting for a share of over 68%, followed by the pureplay foundries segment. Firms that have dedicated logic and dedicated memory foundries are considered under this segment. Memory chips such as DRAM and NAND chips are made in dedicated memory chip factories, while logic chips process information in electronic devices.

APAC dominated the global lithography systems market in 2017, accounting for a share of close to 71%, followed by the Americas and EMEA. APAC is expected to witness an increase of close to 1% in its market share while the other two regions are expected to witness a decline by 2022.