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GLOBALFOUNDRIES today revealed new details of its silicon photonics roadmap to enable the next generation of optical interconnects for datacenter and cloud applications. The company has now qualified the industry’s first 90nm manufacturing process using 300mm wafers, while also unveiling its upcoming 45nm technology to deliver even greater bandwidth and energy efficiency.

GF’s silicon photonics technologies are designed to support the massive growth in data transmitted across today’s global communication infrastructure. Instead of traditional interconnects that transmit data using electrical signals over copper wires, silicon photonics technology uses pulses of light through optical fibers to move more data at higher speeds and over longer distances, while also minimizing energy loss.

“The explosive need for bandwidth is fueling demand for a new generation of optical interconnects,” said Mike Cadigan, senior vice president of sales and ASIC business unit at GF. “Our silicon photonics technologies enable customers to deliver unprecedented levels of connectivity for transferring massive amounts of data, whether it’s between chips inside a datacenter or across cloud servers separated by hundreds and even thousands of miles. When combined with our advanced ASIC and packaging capabilities, these technologies allow us to deliver highly differentiated solutions to this marketplace.”

GF’s silicon photonics technologies enable the integration of tiny optical components side-by-side with electrical circuits on a single silicon chip. This “monolithic” approach leverages standard silicon manufacturing techniques to improve production efficiency and reduce cost for customers deploying optical interconnect systems.

Available today on 300mm

GF’s current-generation silicon photonics offering is built on its 90nm RF SOI process, which leverages the company’s world-class experience in manufacturing high-performance radio frequency (RF) chips. The platform can enable solutions that provide 30GHz of bandwidth to support client side data rates of up to 800Gbps, as well as long-reach capabilities of up to 120km.

The technology, which had previously been manufactured using 200mm wafer processing, has now been qualified on larger-diameter 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The migration to 300mm enables more customer capacity, greater manufacturing productivity, and up to a 2X reduction in photonic losses to improve reach and enable more efficient optical systems.

The 90nm technology is supported by a full PDK for E/O/E co-design, polarization, temperature and wavelength parametrics from Cadence Design Systems, as well as differentiated photonic test capabilities including five test sectors from technology verification and modeling to MCM product test.

A roadmap for tomorrow

GF’s next-generation monolithic silicon photonics offering will be manufactured on its 45nm RF SOI process, with production slated for 2019. By leveraging the more advanced 45nm node, the technology will enable reduced power, smaller form factor, and significantly higher bandwidth optical transceiver products to address next generation terabit applications.

SCREEN Semiconductor Solutions, a subsidiary of SCREEN Holdings Co., Ltd (TSE: 7735), with strong semiconductor equipment sales and service bases in Japan, and Axcelis Technologies, Inc. (Nasdaq: ACLS), a supplier of innovative, high-productivity solutions for the semiconductor industry, today announced a strategic agreement for distribution and support of Axcelis’ complete Purion ion implant product line in Japan. Under the agreement, the companies will establish a training and demonstration facility at SCREEN’s Process Technology Center in Hikone, Japan, as well as initiate a technical collaboration focused on developing advanced process technology for emerging implant, thermal processing and wafer cleaning applications.

Tadahiro Suhara, representative director president of SCREEN Semiconductor Solutions, commented, “We are very excited to introduce the Purion platform’s advanced ion implant technology to our Japanese customers, as well as the opportunity to leverage our combined strengths to develop next generation thermal processing capabilities through our technical collaboration. This agreement will allow us to continue to offer our customers a diversity of solutions to meet our customers’ evolving technological needs.”

Mary Puma, president and CEO of Axcelis Technologies, said, “We’re very pleased to announce our partnership with SCREEN Semiconductor Solutions, a company widely recognized for superior technology and customer satisfaction. It will enable us to bring our Purion product line to the Japan market, and provide us with strong opportunities for new customer penetrations and market share gains.”

Linde LienHwa, a key supplier of gases and chemicals to the electronics industry, continues to invest with its customers in Mainland China and Taiwan. On-site nitrogen generator plants are an early, tangible and significant demonstration of commitment to individual customers as they plan and execute new semiconductor and display panel plants.

The company is also expanding its production of electronic special gases (ESGs). This enhances its portfolio to meet the growing demand of local customers in the semiconductor and display industries. Linde LienHwa is leveraging access to global expertise to build first-in-kind capabilities in Taiwan to innovate locally for customers.

In March, Linde LienHwa will highlight its position in the electronics material sector with presentations by its executives at two industry forums held in Shanghai. The company invites customers and others in the electronics industry to visit its booth at the SEMICON China trade show for one-on-one discussions about their requirements and how Linde LienHwa is their local partner with global expertise.

Investing and growing with customers in Mainland China with on-site nitrogen production

Mainland China has made a large commitment to the electronics industry through the Sino IC Industry Investment Fund, more commonly known as The Big Fund. This has spurred an unprecedented number of new semiconductor and display projects launch in 2017, on top of very active preceding years in 2015 and 2016.

Nitrogen gas is used in high volumes at these facilities in almost all manufacturing steps to purge and inert chemically sensitive processes. For most facilities, it is much more economical to produce the required volume of nitrogen on-site, rather than to supply the gas by truck delivery. On-site nitrogen generators are built at an early phase of each project because nitrogen is required to be ready before the facility equipment arrives.

SPECTRA-N® nitrogen generators from the Linde Engineering division of the Linde Group support customers with their high quality products, flexible capacity and production and energy efficiency. These plants are designed, fabricated and executed by teams located in Hangzhou and Dalian, China.

Linde LienHwa has been successful in addressing the market needs with a number of new project signings. “These wins were punctuated in 2017 by a Linde LienHwa commitment of over RMB 1.5 billion investment in on-site gas production and bulk gas installations for electronics customers in Mainland China, which will fuel electronics revenue growth for us over the next five years,” said Stan Tang, President of LLH China. “This is only possible with a strong network of bulk gas production plants and fleet delivery throughout Mainland China, which back-up the on-site nitrogen plants as well as offer competitive supplies of oxygen, argon, hydrogen and other products.”

GeH4 precision blending and filling at Taichung Harbor

Linde LienHwa’s capability for blending and filling of germane in Taichung Harbor is the first and only of its kind in Taiwan. The facility produces mixtures between 1 to 20% germane in ultra-high purity hydrogen with extreme precision and state-of-the-art analysis. Germane-hydrogen mixtures are used by leading-edge semiconductor companies to make the most critical elements of computer chips, and precision of the blend is essential to making a working device.

Fluorine production at Guanyin

Another first in Taiwan is Linde LienHwa’s production of electronics-grade fluorine in Guanyin, a district of Taoyuan City. This special high-purity grade of fluorine is produced using generators from Linde developed for the electronics industry. The fluorine is typically blended with nitrogen or other inert gases, packaged in cylinders and used by electronics customers to remove particles and unwanted deposits from the interior surfaces of manufacturing tools.

Local partner. Global expertise.

“By investing locally in material processing, we are significantly reducing the supply chain risk and increasing material availability for our customers,” notes Alex Tong, President of Linde LienHwa. “These new facilities represent the latest phases in our commitment to expand ESG production in both Taiwan and China.”

Linde LienHwa maintains an extensive network of on-site gas production, bulk gases for electronics customers, ESGs, ultra-pure wet chemicals, chemical production and stocking facilities. Linde LienHwa offers a widest number of electronics materials. Its products enable leading-edge manufacturing in the semiconductor, solar, display and solid state lighting/LED industries.

Linde Electronics, its global partner, is the electronics materials and service business of The Linde Group, an industry leader in the industrial gas sector. Linde Gas operates in more than 100 countries, with world-class R&D centers, including its newest Electronics R&D Center in Taichung Harbor, Taiwan.

SEMICON China and the Global Semiconductor Forum

Linde LienHwa will be exhibiting at the SEMICON China tradeshow in Shanghai 14-16 March 2018. Its focus will be on the quality, expertise, service and technical leadership that Linde LienHwa and its global partner Linde Electronics bring to the semiconductor industry through such offerings as electronic specialty gases, bulk gases for electronics customers and on-site solutions like SPECTRA-N nitrogen plants.

Anshul Sarda, Vice President of Electronics Special Gases for the Linde Group, will be speaking at the SEMICON China Win-Win: Build China’s IC Ecosystem forum, for which LLH is a sponsor, on 15 March in the Pudong Ballroom of the Kerry Hotel. His talk entitled “Integrating domestic and international electronic material solutions” given at 16:00 will explain the challenges of materials supply in a dynamic landscape of established and newly-launched customers and material producers.

Dr. Anish Tolia, Vice President of Global Marketing for Linde Electronics, will be speaking at the Global Semiconductor Forum on 9 March at the Grand Kempinski Hotel in Shanghai. His workshop entitled “Supplying China: Combining local partnerships with global expertise by electronic material providers” will instruct on how material providers can adapt global experience in supply chains to the burgeoning opportunities and requirements of the China electronics market.

Applied Materials, Inc. has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award. The PQS award recognizes companies like Applied that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.

“The dynamic nature of our business necessitates continuous improvement and an unrelenting focus on quality,” said Jacklyn Sturm, Vice President of Technology and Manufacturing Group and General Manager of Global Supply Management at Intel. “As Intel transitions to become a more data centric company, our award winning suppliers are embracing the most difficult challenges with rapid innovation and bold strategies.”

To qualify for PQS status, suppliers must exceed high expectations and uncompromising performance goals while scoring at least 80 percent on an integrated report card that assesses performance throughout the year. Suppliers must also achieve 80 percent or greater on a challenging continuous improvement plan and demonstrate solid quality and business systems.

Historically, the DRAM market has been the most volatile of the major IC product segments.  A good example of this was displayed over the past two years when the DRAM market declined 8% in 2016 only to surge by 77% in 2017! The March Update to the 2018 McClean Report (to be released later this month) will fully detail IC Insights’ latest forecast for the 2018 DRAM and total IC markets.

In the 34-year period from 1978-2012, the DRAM price-per-bit declined by an average annual rate of 33%. However, from 2012 through 2017, the average DRAM price-per-bit decline was only 3% per year! Moreover, the 47% full-year 2017 jump in the price-per-bit of DRAM was the largest annual increase since 1978, surpassing the previous high of 45% registered 30 years ago in 1988!

In 2017, DRAM bit volume growth was 20%, half the 40% rate of increase registered in 2016.  For 2018, each of the three major DRAM producers (e.g., Samsung, SK Hynix, and Micron) have stated that they expect DRAM bit volume growth to once again be about 20%.  However, as shown in Figure 1, monthly year-over-year DRAM bit volume growth averaged only 13% over the nine-month period of May 2017 through January 2018.

Figure 1 also plots the monthly price-per-Gb of DRAM from January of 2017 through January of 2018.  As shown, the DRAM price-per-Gb has been on a steep rise, with prices being 47% higher in January 2018 as compared to one year earlier in January 2017.  There is little doubt that electronic system manufacturers are currently scrambling to adjust and adapt to the skyrocketing cost of memory.

DRAM is usually considered a commodity like oil.  Like most commodities, there is elasticity of demand associated with the product.  For example, when oil prices are low, many consumers purchase big SUVs, with little concern for the vehicle’s miles-per-gallon efficiency.  However, when oil prices are high, consumers typically look toward smaller or alternative energy (e.g., hybrid or fully electric) options.

Figure 1

Figure 1

While difficult to precisely measure, it is IC Insights’ opinion that DRAM bit volume usage is also affected by elasticity, whereby increased costs inhibit demand and lower costs expand usage and open up new applications.  As shown in Figure 1, the correlation coefficient between the DRAM price-per-bit and the year-over-year bit volume increase from January 2017 through January 2018 was a strong -0.88 (a perfect correlation between two factors moving in the opposite direction would be -1.0).  Thus, while system manufacturers are not scaling back DRAM usage in systems currently shipping, there have been numerous rumors of some smartphone producers scaling back DRAM in next-generation models (i.e., incorporating 4GB of DRAM per smartphone instead of 5GB).

In 2018, IC Insights believes that the major DRAM suppliers will be walking a fine line between making their shareholders even happier than they are right now and further alienating their customer base.  If, and it is a BIG if, the startup Chinese DRAM producers can field a competitive product over the next couple of years, DRAM users could flock to these new suppliers in an attempt to get out from under the crushing price increases now being thrust upon them—with the “payback” to the current major DRAM suppliers being severe.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $37.6 billion for the month of January 2018, an increase of 22.7 percent compared to the January 2017 total of $30.6 billion. Global sales in January were 1.0 percent lower than the December 2017 total of $38.0 billion, reflecting normal seasonal market trends. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“After notching its highest-ever annual sales in 2017, the global semiconductor industry is off to a strong and promising start to 2018, posting its highest-ever January sales and 18th consecutive month of year-to-year sales increases,” said John Neuffer, president and CEO, Semiconductor Industry Association. “All major regional markets saw double-digit growth compared to last year, with the Americas leading the away with year-to-year growth of more than 40 percent. With year-to-year sales also up across all major semiconductor product categories, the global market is well-positioned for a strong start to 2018.”

Year-to-year sales increased substantially across all regions: the Americas (40.6 percent), Europe (19.9 percent), Asia Pacific/All Other (18.6 percent), China, (18.3 percent), and Japan (15.1 percent). Month-to-month sales increased slightly in Europe (0.9 percent), held flat in China, but fell somewhat in Asia Pacific/All Other (-0.6 percent), Japan (-1.0 percent), and the Americas (-3.6 percent).

To find out how to purchase the WSTS Subscription Package, which includes comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, please visit http://www.semiconductors.org/industry_statistics/wsts_subscription_package/. For detailed data on the global and U.S. semiconductor industry and market, consider purchasing the 2017 SIA Databook: https://www.semiconductors.org/forms/sia_databook/.

Jan 2018

Billions

Month-to-Month Sales                              

Market

Last Month

Current Month

% Change

Americas

8.95

8.63

-3.6%

Europe

3.37

3.40

0.9%

Japan

3.24

3.21

-1.0%

China

12.01

12.01

0.0%

Asia Pacific/All Other

10.41

10.35

-0.6%

Total

37.99

37.59

-1.0%

Year-to-Year Sales                         

Market

Last Year

Current Month

% Change

Americas

6.14

8.63

40.6%

Europe

2.84

3.40

19.9%

Japan

2.79

3.21

15.1%

China

10.16

12.01

18.3%

Asia Pacific/All Other

8.73

10.35

18.6%

Total

30.64

37.59

22.7%

Three-Month-Moving Average Sales

Market

Aug/Sep/Oct

Nov/Dec/Jan

% Change

Americas

8.54

8.63

1.1%

Europe

3.36

3.40

1.1%

Japan

3.20

3.21

0.3%

China

11.65

12.01

3.1%

Asia Pacific/All Other

10.33

10.35

0.1%

Total

37.09

37.59

1.4%

Silvaco today announced that it has acquired NanGate, a developer of Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.

NanGate’s Library Creation Platform has been deployed by a large number of semiconductor companies creating standard cell libraries used in hundreds of SoC designs and have shipped in billions of units. NanGate’s technology is available and proven in a broad range of standard logic CMOS processes from 250nm down to 14nm nodes, available from multiple foundries. The acquisition extends Silvaco’s tools portfolio, complements Silvaco’s IC design flow and strengthens the methodology to achieve high performance, high yield standard cell libraries that meet today’s high-sigma requirements.

“We are happy for the NanGate team with their ability to deliver excellent solutions for library creation to top-tier Semiconductor companies,” said Dave Dutton, CEO of Silvaco. “Together with our leadership in variation aware design methodology with VarMan, SmartSpice, and our complete custom design flow including extraction, we are now able to deliver a complete solution for high performance standard cell libraries creation.”

“The synergy between Silvaco’s growth strategy and NanGates technology plus the combination of our talented teams will accelerate the delivery of tools and methodologies for a highly productive standard cell library and characterization flow,” said Ole Christian Andersen, President and CEO of NanGate. “We are excited to join Silvaco to further our original vision.”

Silvaco’s aggressive growth plan is designed to grow revenue by adding strategic technologies to offer the best solutions to our customers. This acquisition was led by Ron Sorisho and is the sixth acquisition for Silvaco’s business development team.

BY AJIT MANOCHA, President and CEO of SEMI

2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth. The equipment industry surpassed revenue levels last reached in the year 2000. Semicon- ductor equipment posted sales of nearly $56B and semiconductor materials $48B in 2017. For semiconductor equipment, this was a giant 36 percent year-over-year growth. Samsung, alone, invested $26B in semiconductor CapEx in 2017 – an incredible single year spend in an incredible year.

MEMS and Sensors gained new growth in telecom and medical markets, adding to existing demand from automotive, industrial and consumer segments. MEMS is forecast to be a $19B industry in 2018. Flexible hybrid electronics (FHE) is also experiencing significant product design and functionality growth with increasing gains in widespread adoption.

No longer isa single monolithic demand driver propelling the electronics manufacturing supply chain. The rapidly expanding digital economy continues to foster innovation with new demand from the IoT, virtual and augmented reality (VR/AR), automobile infotainment and driver assistance, artificial intelligence (AI) and Big Data, among others. With the explosion in data usage, memory demand is nearly insatiable, holding memory device ASPs high and prompting continued heavy investment in new capacity.

2018 is forecast to be another terrific year. IC revenues are expected to increase another 8 percent and semiconductor equipment will grow 11 percent. With diverse digital economy demand continuing, additional manufacturing capacity is being added in China as fab projects come on line to develop and increase the indigenous semiconductor supply chain.

So, why worry?

The cracks starting to show are in the areas of talent, data management, and Environment, Health, and Safety (EH&S).

Can the industry sustain this growth? The electronics manufacturing supply chain has demonstrated it can generally scale and expedite production to meet the massive new investment projects. The cracks starting to show are in the areas of talent, data management, and Environment, Health, and Safety (EH&S).

Talent has become a pinch point. In Silicon Valley alone, SEMI member companies have thousands of open positions. Globally, there are more than 10,000 open jobs. Attracting new candidates and developing a global workforce are critical to sustaining the pace of innovation and growth.
Data management and effective data sharing are keys to solving problems faster and making practical novel but immature processes at the leading edge. It is ironic that other industries are ahead of semiconductor manufac- turing in harnessing manufacturing data and leveraging AI across their supply chains. Without collaborative Smart Data approaches, there is jeopardy of decreasing the cadence of Moore’s Law below the 10 nm node.

EH&S is critical for an industry that now uses the majority of the elements of the periodic table to make chips – at rates of more than 50,000 wafer starts per month (wspm) for a single fab. The industry came together strongly in the 1990s to develop SEMI Safety Standards and compliance methodologies. Since then, the number of EH&S profes- sionals engaged in our industry has declined while the number of new materials has exploded, new processing techniques have been developed, and manufacturing is expanding across China in areas with no prior semicon- ductor manufacturing experience.

HTU has been a very effective program with over 218 sessions run to date, over 7,000 students engaged, and over 70 percent of respondents pursuing careers in the STEM field.

To ensure we don’t slow growth, the industry will need to work together in 2018 in these three key areas:

Talent development needs to rapidly accelerate by expanding currently working programs and adding additional means to fill the talent funnel. The SEMI Foundation’s High Tech University (HTU) works globally with member companies to increase the number of high school students selecting Science, Technology, Engineering, and Math (STEM) fields – and provides orientation to the semiconductor manufacturing industry. HTU has been a very effective program with over 218 sessions run to date, over 7,000 students engaged, and over 70 percent of respondents pursuing careers in the STEM field. SEMI will increase the number of HTU sessions in 2018.

Plans have already been approved by SEMI’s Board of Directors to work together with SEMI’s membership to leverage existing, and pioneer new, workforce development programs to attract and develop qualified candidates from across the age and experience spectrum (high school through university, diversity, etc.). Additionally, an industry awareness campaign will be developed and launched to make more potential candidates attracted to our member companies as a great career choice. I’ll be providing you with updates on this initiative – and asking for your involvement
– throughout 2018.

Data management is a broad term. Big Data, machine learning, AI are terms that today mean different things to different people in our supply chain. What is clear is that to act together and take advantage of the unimaginable amounts of data being generating to produce materials and make semiconductor devices with the diverse equipment sets across our fabs, we need a common understanding of the data and potential use of the data.

In 2018, SEMI will launch a Smart Data vertical application platform to engage stakeholders along the supply chain to produce a common language, develop Standards, and align expectations for sharing data for mutual benefit. Bench- marking of other industries and pre-competitive pilot programs are being proposed to learn and, here too, we need the support and engagement of thought leaders throughout SEMI’s membership.

EH&S activity must intensify to maintain safe operations and to eliminate business interruptions from supply chain disruptions. There is potential for disruptions from material bans such as the Stockholm Convention action on PFOA and arising from the much wider range of chemicals and materials being used in advanced manufacturing. Being able to reliably identify these in time to guide and coordinate industry action will take a reinvigorated SEMI EH&S stewardship and membership engagement.

As China rapidly develops new fabs in many provinces – some with only limited prior experience and infrastructure – SEMI EH&S Standards orientation and training will accelerate the safe and sustainable operation of fabs, enabling them to keep pace with the ambitious growth trajectory our industry is delivering. In 2018, we’ll be looking for a renewed commitment to EH&S and sustainability for the budding challenges of new materials, methods, and emerging regions.

Remarkable results from a remarkable membership

Thank you all for a terrific 2017 and let’s work together on the key initiatives to ensure that our industry’s growth and prosperity will continue in 2018 and beyond.

In a quick review of 2017, I would like to thank SEMI’s members for their incredible results and new revenue records. Foundational to that, SEMI’s members have worked together with SEMI to connect, collaborate, and innovate to increase growth and prosperity for the industry. These founda- tional contributions have been in expositions, programs, Standards, market data, messaging (communications), and workforce development (with HTU).

The infographic below captures these foundational accom- plishments altogether. SEMI strives to speed the time to better business results for its members across the global electronics manufacturing supply chain. To do so, SEMI is dependent upon, and grateful for, the support and volunteer efforts of its membership. Thank you for a terrific 2017 and let’s work together on the key initiatives to ensure that our industry’s growth and prosperity will continue in 2018 and beyond.

Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology has also led suppliers to eliminate inefficient wafer fabs. From 2009-2017, semiconductor manufacturers around the world have closed or repurposed 92 wafer fabs, according to data compiled, updated, and now available in IC Insights’ Global Wafer Capacity 2018-2022 report.

Figure 1 shows that since 2009, 41% of fab closures have been 150mm fabs and 26% have been 200mm wafer fabs. 300mm wafer fabs have accounted for only 10% of total fab closures since 2009. Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009.

Figure 1

Figure 1

More recently, ProMOS closed two 300mm memory fabs in 2013 and Renesas sold its 300mm logic fab to Sony in 2014.  Sony repurposed that fab to make image sensors.  In 2017, Samsung closed its 300mm Line 11 memory fab in Yongin, South Korea, also repurposing it to manufacture image sensors. Semiconductor suppliers in Japan have closed a total of 34 wafer fabs since 2009, more than any other country/region.   In the 2009-2017 timeframe, 30 fabs were closed in North America and 17 shuttered in Europe, and only 11 wafer fabs were closed throughout the Asia-Pacific region (Figure 2).

Figure 2

Figure 2

Worldwide fab closures surged in 2009 and 2010 partly as a result of the severe economic recession at the end of the previous decade.  A total of 25 fabs were closed in 2009, followed by 22 being shut down in 2010.  Ten fabs closed in 2012 and 2013.  Two fabs were closed in 2015, the fewest number of closures per year during the 2009-2017 time span.  In 2017, 3 wafer fabs were removed from service. IC Insights has identified three wafer fabs (two 150mm fabs, one 200mm fab) that are targeted for closure this year and next.

Given the flurry of merger and acquisition activity seen in the semiconductor industry recently, the skyrocketing cost of new wafer fabs and manufacturing equipment, and as more IC companies transition to a fab-lite or fabless business model, IC Insights expects more fab closures in the coming years—a prediction that will likely please IC foundry suppliers.

ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab. Semitool Batch Spray Solvent Tools and Tepla barrel etch processing equipment – all refurbished by ClassOne – will be installed at the customer facility in England.

“They selected ClassOne for two important reasons,” said ClassOne CEO, Byron Exarcos. “First, our refurbished tools are providing “better-than-new” performance because the equipment is completely refurbished from the frame up, replacing all older-technology elements with current state-of-the-art parts – such as the advanced Windows 7 control systems. And secondly, ClassOne is able to provide this customer with a very strong local service and support infrastructure in the UK, which is essential to their operation.”

“This is a milestone fab upgrade, and we’re proud to be playing an important role in it,” said Exarcos. “Because we’ve built a strong relationship with this particular customer for nearly a decade. Now we’re able to support their UK facility with a local team of senior product, process and field service engineers – and with the fast response times they’re looking for.”

Exarcos noted that ClassOne’s UK support group has over 100 years of combined experience specifically on Semitool equipment and single-wafer systems. He cited this as an example of ClassOne’s ongoing initiative to provide “an unbeatable level of quality products and support” across Europe for single-wafer electroplating, batch spray tools, and other process equipment.

In addition to the refurbished systems sold by ClassOne Equipment, ClassOne also sells its own brand of newprocessing systems through a sister company, ClassOne Technology. These include new Solstice electrochemical plating systems and Trident spray solvent tools (SSTs) as well as new spin rinse dryers (SRDs). The stated goal of both ClassOne companies is to provide advanced processing solutions for a broad range of budget-conscious users, many of whom are in emerging technologies.