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Sales of analog ICs are expected to show the strongest growth rate among major integrated circuit market categories during the next five years, according to IC Insights’ new 2018 McClean Report, which becomes available this month.  The McClean Report forecasts that revenues for analog products—including both general purpose and application-specific devices—will increase by a compound annual growth rate (CAGR) of 6.6% to $74.8 billion in 2022 from $54.5 billion in 2017.

The 2018 McClean Report separates the total IC market into four major product categories: analog, logic, memory, and microcomponents.  Figure 1 shows the forecasted 2017-2022 CAGRs of these product categories compared to the projected total IC market annual growth rate of 5.1% during the five-year period.

Figure 1

Figure 1

Analog ICs, the fastest growing major product category in the forecast, are a necessity within both very advanced systems and low-budget applications.  Components like power management analog devices help regulate power usage to keep devices running cooler and ultimately to help extend battery life in cellphones and other mobile/battery operated systems. The power management market is forecast to grow 8% in 2018 after increasing 12% in 2017.

In 2018, the automotive—application-specific analog market is forecast to increase 15% to be the fastest growing analog IC category, and the third-fastest growing of 33 IC product categories classified by WSTS. The growth of autonomous and electric vehicles and more electronic systems on board all new cars are expected to keep demand robust for automotive analog devices.

Communications and consumer applications continue to represent the biggest end-use applications for signal conversion analog ICs.  Signal conversion components (data converters, mixed-signal devices, etc.) are forecast to continue on fast-track growth with double-digit sales gains expected in three of the next five years.

After an extraordinary 58% sales spike in 2017, the memory market is forecast to return to more “normal” growth through the forecast.  The memory market is forecast to increase by a CAGR of 5.2% through 2022. New capacity for flash memory and, to a lesser extent for DRAM, should bring some relief from fast-rising ASPs and result in better supply-demand balance for these devices to support newer applications such as enterprise solid-state drives (SSDs), augmented and virtual reality, graphics, artificial intelligence, and other complex, real-time workload functions.

Meanwhile, growth in the microcomponent market (forecast CAGR of 3.9%) has cooled significantly due to weak shipments of standard PCs (desktops and notebooks).  Tablet sales have also slowed and weighed down total microcomponent sales. With the exception of the 32-bit MCU market, annual sales gains in most microcomponent segments are forecast to remain in the low- to mid single digit range through 2022.

IC Insights forecasts the total IC market will increase by a CAGR of 5.1% from 2017-2022.  Following the 22% increase in 2017, the total IC market is forecast to grow 8% in 2018 to $393.9 billion and then continue on an upward trend to reach $466.8 billion in 2022, the final year of the forecast.

Luc Van den Hove, president and CEO of imec

Luc Van den Hove, president and CEO of imec

SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Van den hove will receive the 21st SEMI Sales and Marketing Excellence Award for his contributions and leadership in consortia that made the imec model of collaborative research using pooled infrastructure self-sustaining. The model enables companies of all sizes and position in the value chain to participate in collaborative research that advances industry technology.

Inspired by the power of technology to improve lives, Van den hove transformed research from its focus on participation cost to an emphasis on collaboration to produce greater value. Under his leadership, imec brings together brilliant minds from established companies, startups and academia worldwide to work in a creative and stimulating environment with imec serving as their trusted partner. imec’s international research and development drives innovations in nanoelectronics and digital technologies by leveraging its world-class infrastructure and local and global ecosystem of diverse partners to accelerate progress towards a connected, sustainable future. Van den hove joined imec in 1984 and has led the technology innovation hub since 2009.

“Luc Van den hove is recognized both for his innovative marketing leadership and his resolve to deepen industry collaboration for the common good. Today, SEMI and its membership honor Van den hove for his contributions to the success of the semiconductor manufacturing industry,” said Ajit Manocha, president and CEO of SEMI.

The SEMI Sales and Marketing Excellence Award was inspired by the late Bob Graham, the distinguished semiconductor industry leader, who was a member of the founding team of Intel. Graham also helped establish industry-leading companies such as Applied Materials and Novellus Systems. The Award was established to honor individuals for the creation and/or implementation of marketing programs that enhance customer satisfaction and further the growth of the semiconductor equipment and materials industry.

Eligible candidates are nominated by their industry peers and selected after due diligence by an award committee. Previous recipients of this SEMI award include: Toshio Maruyama (2017), Jim Bowen (2016), Terry (Tetsuro) Higashi (2015), Winfried Kaiser (2014), Joung Cho (JC) Kim (2013), G. Dan Hutcheson (2012), Franz Janker (2011), Martin van den Brink (2010), Peter Hanley (2009), Richard Hong (2008), Richard E. Dyck (2007), Aubrey (Bill) C. Tobey (2006), Archie Hwang (2005), Edward Braun (2004), Shigeru (Steve) Nakayama (2003), Jerry Hutcheson and Ed Segal (2002), Jim Healy and Barry Rapozo (2001), and Art Zafiropoulo (2000).

By Emir Demircan, Senior Manager Advocacy and Public Policy, SEMI Europe

Electronic manufacturing is becoming cool to today’s youth. STEM skills are hot in the global job market – though the number of females pursuing a STEM education continues to lag. Work-based learning is key to mastering new technologies. And the electronics industry needs a global talent pipeline more than ever.

These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider. Here are the takeaways:

1) Electronics is much more than manufacturing

For many years, working in the manufacturing industry was not an appealing prospect for millennials. This picture is certainly changing. The pivotal role of electronics manufacturing in helping solve grand societal challenges in areas such as the environment, healthcare and urban mobility is reaffirmed by countries around the world. Electronics is the lifeblood of game-changing technologies such as autonomous driving, AI, IoT, and VR/AR, enticing more young employees into careers in research, design, technology development, production, cyber security and international business, and in disciplines ranging from engineering and data analytics to software development and cyber security.

What’s more, the drudgery of many factory jobs is disappearing thanks to automation, digitization and robotization. According to CEDEFOP, the European Centre for the Development of Vocational Training, low-skilled jobs in electro-engineering and machine operations/assembly in the European Union (EU) is projected to decrease 6.98 percent and 2.03 percent, respectively, between 2015 and 2025.

In parallel, the industry will need more high-skilled workers. For instance, within the same period, CEDEFOP forecasts a 12.51 percent increase in jobs for EU researchers and engineers. Soft skills will see high demand too. As the electronics industry continues to globalize and drive the integration of vertical technologies, workers proficient in communicating in an international environment, leading multicultural teams, developing tailor-made solutions and making data-driven decisions will see higher demand.

2) STEM skills will remain under the spotlight

Continuous innovation is the oxygen of the electronics manufacturing industry, powering the development of highly customized solutions by workers with technical expertise in chemistry, materials, design, mechanics, production and many other fields. In addition, capabilities such as smart manufacturing require workers with growing technical sophistication in areas such as software, information and communications technology (ICT) and data analytics, stiffening the challenge the electronics industry faces in finding skilled workers. Little wonder that employers in Europe struggle to build a workforce with the right technical expertise. The findings of the study “Encouraging STEM Studies for the Labour Market” conducted by the European Parliament underscores the difficulty of hiring enough workers with adequate STEM skills:

  • The proportion of STEM students is not rising at the European level and the underrepresentation of women persists.
  • Businesses are expected to produce about 7 million new STEM jobs, an uptick of 8 percent, between 2013 and 2025 in Europe.

3) The women-in-tech gap is becoming more persistent 

The global manufacturing industry suffers from strikingly low female participation in STEM education and careers. According to UNSECO, in Europe and North America, the number of female graduates in STEM is generally low. For instance, women make up just 19 percent of engineers in Germany and the U.S. The European Parliament study confirms that STEM employment remains stubbornly male-dominated, with women filling just 24 percent of science and engineering jobs and 15 percent of science and engineering associate positions in Europe. According to an article by Guardian, a mere 16 percent of computer science undergraduates in the United Kingdom and the U.S. are female. This yawning gender gap is a deep concern for electronics manufacturing companies in Europe, hampering innovation in a sector that relies heavily on diversity and inclusion and shrinks the talent pipeline critical to remaining competitive.

4) Coping with new technologies: work-based learning is the key

The evolution of the electronics industry since the 1980s has been swift. PCs emerged largely as islands of communication, then became networked. Networking bred the proliferation of social platforms and mobile devices and, today, is giving rise to IoT. Education curricula in Europe, however, have not matured at the same pace, opening a gap between the worlds of industry and education and imposing a formidable school-to-work transition for many young graduates. Work-based learning, which helps students develop the knowledge and practical job skills needed by business, is one solution. The industry reports that work-based learning is vital to remaining competitive in the long run. Innovative dual-learning programmes, apprenticeships and industrial master’s and doctorates are shining examples that are already paying off in some parts of Europe. Such work-based learning models can be extended as a common pillar of education in Europe.

5) A global industry needs a global talent pipeline

The electronics value chain workforce needs an international and multicultural talent pipeline, chiefly spanning the U.S., Europe and Asia. However, many European manufacturers, in particular small and medium enterprises (SMEs), report that building an international workforce remains a challenge due to employment and immigration law barriers as well as cultural and linguistic differences. The EU’s Blue Card initiative, designed to facilitate hiring beyond Europe, is a step in the right direction. Nevertheless, with the exception of Germany, EU member states have made little or no use of the EU Blue Card scheme.

SEMI drives sector-wide initiatives on workforce development

Understanding the urgency, SEMI is accelerating its workforce development activities at global level. Contributing to this initiative, the SEMI talent pipeline Forum in Dresden served as an effective platform for the industry to share its challenges and opportunities with students at various education levels. Led by industry representatives, the sessions enabled the exchange of workforce-development best practices and paved the way for further collaboration among industry, academia and government in Europe. For example, in the Career Café session, students networked with hiring managers. Other workforce development initiatives include:

To help position the skills challenges faced by SEMI members high on the public policy agenda, SEMI in 2017 joined several policy groups including Digital Skills and Jobs Coalition and Expert Group on High-Tech Skills. Last year SEMI also launched Women in Tech, an initiative that convenes industry leaders to help increase female representation in the sector. SEMI also educates its members about key EU resources such as the Blue Card and Digital Opportunity Internship programmes aimed at hiring international talent. In 2018, SEMI will reach out to even more young people through its High Tech U programme to raise awareness of careers in electronics. SEMICON Europa 2018 will host dedicated talent pipeline sessions to help the industry tackle its skills challenges. ISS Europe 2018 sessions on Gaining, Training and Retaining World Class Talent will disseminate best practices to the wider industry. Also this year, SEMI Europe plans to start a new advisory group, “Workforce 4.0,” dedicated to bringing together human resources leaders in the sector to give the electronics manufacturing industry a stronger voice on workforce development.

 

With consumer television prices falling, global shipments of organic light-emitting diode (OLED) TVs grew 133 percent year over year, reaching a new monthly record of 270,000 units in November 2017, during the lead-up to the holiday shopping season. This growth comes as falling prices placed 55-inch 4K OLED into the budget range of a greater number of high-end holiday shoppers, according to IHS Markit (Nasdaq: INFO).

Overall global liquid crystal display (LCD) TV shipments in November slightly declined by 1.6 percent month over month, falling to 24.4 million units, as Black Friday demand in the United States declined in 2017 compared to the prior year. Total OLED TV shipments from January through November 2017 surpassed 1.3 million units. Together with December estimates, overall OLED TV shipments are likely to exceed 1.4 million units shipped in 2017.

“In 2017, the landscape for OLED TV brands changed as Sony, Toshiba and other major brands began selling OLED TVs,” said Ken Park, associate director, IHS Markit. “The growing number of available OLED TV choices, especially high-profile Japanese and European brands, has resulted in more competition and pricing promotion activity in the OLED TV market.”

LGE dominated the OLED TV market in 2016, accounting for around 92 percent of all units shipped, while several Chinese brands accounted for most of the remaining shipments. During the weeks surrounding Black Friday 2017, LGE dropped the price of its entry-level B7 series 55-inch and 65-inch 4K OLED TVs by $200, pricing its lowest tier 55B7 model at $1,499.

LGE led overall OLED TV shipment volume in November, with a 31 percent month-over-month increase in shipments. Total year-over-year 55-inch OLED TV shipments rose 123 percent in November, while 65-inch shipments grew 157 percent.

IHSM_Monthly_OLED_TV_Shipments_2017_R

Micron and Intel today announced an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.

The announcement involves the companies’ mutual agreement to work independently on future generations of 3D NAND. The companies have agreed to complete development of their third generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019. Beyond that technology node, both companies will develop 3D NAND independently in order to better optimize the technology and products for their individual business needs.

Micron and Intel expect no change in the cadence of their respective 3D NAND technology development of future nodes. The two companies are currently ramping products based on their second generation of 3D NAND (64 layer) technology.

Both companies will also continue to jointly develop and manufacture 3D XPoint™ at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah, which is now entirely focused on 3D XPoint memory production.

“Micron’s partnership with Intel has been a long-standing collaboration, and we look forward to continuing to work with Intel on other projects as we each forge our own paths in future NAND development,” said Scott DeBoer, executive vice president of Technology Development, Micron. “Our roadmap for 3D NAND technology development is strong, and we intend to bring highly competitive products to market based on our industry-leading 3D NAND technology.”

“Intel and Micron have had a long-term successful partnership that has benefited both companies, and we’ve reached a point in the NAND development partnership where it is the right time for the companies to pursue the markets we’re focused on,” said Rob Crooke, senior vice president and general manager of Non-Volatile Memory Solutions Group, Intel Corporation. “Our roadmap of 3D NAND and Optane™ technology provides our customers with powerful solutions for many of today’s computing and storage needs.”

Xilinx, Inc. (NASDAQ: XLNX) today announced that its board of directors has appointed Victor Peng as president and chief executive officer, effective January 29, 2018.  Peng will become the fourth CEO in Xilinx’s history and takes the helm of the global market leader of programmable semiconductor products at a time of increasing momentum and opportunity.

“Victor is unique in his ability to translate vision and strategy into world-class execution and has an incredible ability to inspire and lead transformation.  He has been the architect of Xilinx’s innovations for the past decade and will move the company forward with the speed required to capitalize on the opportunities in front of us,” said Dennis Segers, chairman of the board of Xilinx. “Victor is a proven leader with exceptional business acumen and a deep, unwavering dedication to customers. The BOD is thrilled to appoint Victor CEO as the company enters its next chapter of expanded innovation and growth.”

“I’m honored to have been chosen to lead Xilinx at such a dynamic time in our industry,” said Peng. “The world of technology is changing rapidly, and I plan to architect Xilinx to take advantage of where I see the greatest opportunities for transformational growth.  Xilinx is in a rare position of strength and is poised to capitalize on the next shift in computing.  By focusing on delivering unique value to new areas as well as our traditional markets, I plan to accelerate the company’s growth and create the next wave of shareholder value.”

Since joining the company in 2008, Peng has spearheaded industry-leading strategy and technical shifts across the company’s portfolio of products and services, resulting in three consecutive generations of core product leadership and significant technology breakthroughs in integration and programming.  Most recently, he served as Chief Operating Officer and was appointed as a member of the board of directors in October 2017.

Before joining Xilinx, Peng served as corporate vice president of the graphics products group (GPG) silicon engineering at AMD, where he also served as a key leader in AMD’s central silicon engineering team supporting graphics, console game products, CPU chipset and consumer business units. Peng earned a bachelor’s in electrical engineering from Rensselaer Polytechnic Institute, and a master’s in electrical engineering from Cornell University.

Peng, 57, succeeds Moshe Gavrielov, 63, who will step down as CEO and from the board of directors on January 28, as part of a previously announced CEO succession plan.

The latest market research report by Technavio on the global radio-frequency (RF) power semiconductor devices market predicts a CAGR of close to 12% during the period 2017-2021.

The report segments the global RF power semiconductor devices market by application (telecom segment, military segment, and industrial segment), by material (gallium nitride, gallium arsenide, and laterally diffused metal oxide semiconductor), and by geography (the Americas, EMEA, and APAC). It provides a detailed illustration of the major factors influencing the market, including drivers, opportunities, trends, and industry-specific challenges.

 

Increased proliferation of smartphones and tablets: a major market driver

Increased proliferation of smartphones and tablets is one of the major factors driving global RF power semiconductor devices market. The network traffic is growing at an exponential rate because of the increased popularity of mobile computing devices. As a result, there is the continued deployment of the next-generation wireless standards such as 4G and 5G across the globe. The integration of progressive wireless technologies such as long-term evolution (LTE) and Wi-Fi in smartphones and tablets has generated an increased need for new RF features in these devices. The proliferation of mobile computing devices such as smartphones and tablets are expected to encourage RF device manufacturers to develop high-performance RF filters that meet the requirements of smartphones and tablet OEMs.

APAC: largest RF power semiconductor devices market

The RF power semiconductor devices market in APAC will grow rapidly during the forecast period. There is a high demand for improved cellular networks from developing countries such as China, India, South Korea, Taiwan, and Malaysia. Most of these nations are almost at their saturation of 3G services and have started offering 4G as well as LTE services. The high population density of nations such as India and China, along with the economic growth has increased demand for power applications in network infrastructure to offer better services.

According to Rohan Joy Thomas, a lead analyst at Technavio for research on embedded systems, “Taiwanese manufacturers are developing RF devices for smartphones and wireless communications. Companies such as WIN Semiconductors and Visual Photonics Epitaxy are competing in the optic fiber telecommunication markets using their advanced technology to raise their product value and gross margins. WIN Semiconductors utilizes its production facilities at 90% of overall capacity. These positive developments are expected to push the overall market to gain traction in the forecast period.”

Competitive vendor landscape

Like most emerging compound semiconductor technologies, the theoretical benefits of wide bandgap (WBG) materials are well known. However, the practical realization of this technology in microelectronic devices remains at its nascent stage. The strong supply chain of RF devices can help push the use of this technology for RF infrastructure. In 2015, the RF power industry witnessed growth, driven by the large-scale adoption of LTE networks in China and increased demand for cellular infrastructure. Many device manufacturers are equipped with the requirements to make GaN commercially successful. Therefore, Technavio anticipates a speedy increase in the process and product development toward mass manufacturing.

By Junko Collins, Director of Standards, SEMI Japan

SEMI Standards are the very heartbeat of manufacturing efficiency, underpinning the state-of-the-art technologies and products showcased by over 750 exhibitors at SEMICON Japan last December. Through its Standards committees, SEMI is a key enabler of innovation, higher manufacturing efficiency and lower manufacturing costs for the global electronics industry.

At SEMICON Japan, 22 SEMI Standards meetings were held by committees including:

  • Japan Regional Standards Committee (JRSC)
  • Gases Committee
  • Facilities Committee
  • Liquid Chemical Committee
  • Physical Interface & Carriers Committee
  • Silicon Wafers Committee
  • Traceability Committee
  • Information & Control Committee
  • Environmental, Health & Safety Committee

At the SEMI Standards Friendship Party during SEMICON Japan, JRSC recognized the following nine committee members for outstanding contributions to the development of SEMI Standards.

SEMI Japan Standards Award honors enduring commitments and outstanding contributions to standards development.

  • Takayuki Nishimura, SCREEN Semiconductor Solutions Co, Ltd, for his long-term chairmanship of the Japan Information & Control Committee. He led the committee’s collaboration with other regions and spearheaded the development of the Generic Equipment Model (GEM) 300A standard for smarter semiconductor factories by the SEMI equipment suppliers special interest group (ESG).

SEMI Japan International Collaboration Award recognizes members who contributed to Japan’s collaboration with other regions.

The four Japan 3 Dimensional Structured IC (3DS-IC) Committee steering group leaders for their contribution to the integration of 3DS-IC Committee and Packaging Committee into the 3D Integration & Packaging Committee.

  • Masahiro Tsuriya, International Electronics Manufacturing Initiative
  • Eiji Yoshino, Hitachi High-Technologies Co.
  • Haruo Shimamoto, Advanced Industrial Science and Technology
  • Mamoru Takahashi, Asahi Glass Co., Ltd.

SEMI Japan Special Appreciation Award is awarded for special contributions to the SEMI Standards program.

  • Mitsune Sakamoto, Zama Consulting for his dedication to the full revision of the GEM 300 seminar text that explains the 300 mm automated communication standard.

SEMI Japan Honor Award recognizes long-term contributions to SEMI Standards.

  • Yoshitada Nogami, SK-Electronics Co., Ltd. for his contribution to the development of many flat panel display standards as a chairman of the FPD committee. He also contributed to the growth of the FPD industry through SEMI Japan Production Cost Saving activities.
  • Yoshihisa Takasaki, ASM Japan K.K., for his contribution to the Information & Control Committee. In particular, as co-leader of the GEM 300 TF he was instrumental in the development of the GEM300A standard for smarter manufacturing.
  • Toshio Murakami, Murakami Corporation, for his contribution to Metrics Committee as a chairman and for maintaining high committee productivity even in times of constrained resources.

The award ceremony was attended by international SEMI Standards members and SEMI global leadership including: Ajit Manocha, SEMI president and CEO; Michael Ciesinski, SEMI Vice President, Technology Communities; and Osamu Nakamura, president of SEMI Japan.

For more information on SEMI Standards program, visit www.semi.org/standards.

IC Insights is currently researching and writing its 21st edition of The McClean Report, which will be released later this month.  As part of the report, a listing of the 2017 top 50 fabless IC suppliers will be presented.

Figure 1 shows the top 10 ranking of fabless IC suppliers for 2017.  Two China-based fabless companies made the top 10 ranking last year—HiSilicon, which sells most of its devices as internal transfers to smartphone supplier Huawei, and Unigroup, which includes the IC sales of both Spreadtrum and RDA. Fabless company IC sales are estimated to have exceeded $100 billion in 2017, the first time this milestone has been reached.

Figure 1

Figure 1

Unlike the relatively close annual market growth relationship between fabless IC suppliers and foundries, fabless IC company sales growth versus IDM (integrated device manufacturers) IC supplier growth has typically been very different (Figure 2).  The first time IDM IC sales growth outpaced fabless IC company sales growth was in 2010 when IDM IC sales grew 35% and fabless IC company sales grew 29%.  Since very few fabless semiconductor suppliers participate in the memory market, the fabless suppliers did not receive much of a boost from the surging DRAM and NAND flash memory markets in 2010, which grew 75% and 44%, respectively.  However, the fabless IC suppliers once again began growing faster than the IDMs beginning in 2011 and this trend continued through 2014.

Figure 2

Figure 2

In 2015, for only the second time on record, IDM IC sales “growth” (-1%) outpaced fabless IC company sales “growth” (-3%).  The primary cause of the fabless companies’ 2015 sales decline was Qualcomm’s steep 17% drop in sales. Much of the sharp decline in Qualcomm’s sales that year was driven by Samsung’s increased use of its internally developed Exynos application processors in its smartphones instead of the application processors it had previously sourced from Qualcomm.  Although Qualcomm’s sales continued to decline in 2016, the fabless companies’ sales in total (5%) once again outpaced the growth from IDM’s (3%).

In 2017, the market behaved very similarly to 2010, when strong growth in the memory market propelled the IDM IC sales growth rate higher than the fabless IC supplier growth rate.  With the total memory market, a market in which the fabless IC companies have very little share, surging by 58% last year, IDM IC sales growth easily outpaced fabless company IC sales growth in 2017.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $37.7 billion for the month of November 2017, an increase of 21.5 percent compared to the November 2016 total of $31.0 billion and 1.6 percent more than the October 2017 total of $37.1 billion. All major regional markets posted both year-to-year and month-to-month sales increases in November, with the Americas market leading the way. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor industry reached another key milestone in November, notching its highest-ever monthly sales, and appears poised to reach $400 billion in annual sales for the first time,” said SIA President & CEO John Neuffer. “Global market growth continues to be led by sales of memory products, but sales of all other major semiconductor categories also increased both month-to-month and year-to-year in November. All regional markets also experienced growth in November, with the Americas continuing to post the strongest gains.”

Regionally, year-to-year sales increased in the Americas (40.2 percent), Europe (18.8 percent), China (18.5 percent), Asia Pacific/All Other (16.2 percent), and Japan (10.6 percent). Month-to-month sales increased in the Americas (2.6 percent), China (2.1 percent), Europe (1.8 percent), Asia Pacific/All Other (0.5 percent), and Japan (0.3 percent).

To find out how to purchase the WSTS Subscription Package, which includes comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, please visit http://www.semiconductors.org/industry_statistics/wsts_subscription_package/. For detailed data on the global and U.S. semiconductor industry and market, consider purchasing the 2017 SIA Databook: https://www.semiconductors.org/forms/sia_databook/.

Nov 2017

Billions

Month-to-Month Sales                              

Market

Last Month

Current Month

% Change

Americas

8.54

8.77

2.6%

Europe

3.37

3.43

1.8%

Japan

3.20

3.21

0.3%

China

11.65

11.90

2.1%

Asia Pacific/All Other

10.33

10.39

0.5%

Total

37.09

37.69

1.6%

Year-to-Year Sales                         

Market

Last Year

Current Month

% Change

Americas

6.25

8.77

40.2%

Europe

2.88

3.43

18.8%

Japan

2.90

3.21

10.6%

China

10.04

11.90

18.5%

Asia Pacific/All Other

8.94

10.39

16.2%

Total

31.02

37.69

21.5%

Three-Month-Moving Average Sales

Market

Jun/Jul/Aug

Sep/Oct/Nov

% Change

Americas

7.55

8.77

16.1%

Europe

3.22

3.43

6.4%

Japan

3.13

3.21

2.6%

China

11.08

11.90

7.4%

Asia Pacific/All Other

9.98

10.39

4.0%

Total

34.96

37.69

7.8%