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SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit and loss (P&L) responsibility for SEMI Japan and leadership of SEMICON Japan along with all regional programs, events, and initiatives including SEMI Standards and industry advocacy. With more than 325 members, SEMI Japan plays a critical role in SEMI’s global industry association, representing more than 2,000 companies worldwide in the electronics manufacturing supply chain.

With all-time records expected in 2017 for global semiconductor revenue at $400 billion (USD), semiconductor equipment revenue at $56 billion (USD), and semiconductor materials revenue at $48 billion (USD), Japan is an essential global player and has seen very strong recent growth.  Japan supplies nearly one-third of the world’s semiconductor equipment and more than half all wafer fab materials. As semiconductor manufacturing continues its strong global growth, SEMI Japan role in connecting SEMI member companies in Japan with opportunities to collaborate and innovate with companies worldwide will take on increasing importance in enabling members’ growth and prosperity.

“With his long leadership experience at TEL, the largest semiconductor equipment company in Japan (and in the top-five globally), Jim understands the challenges and opportunities facing Japan as the global electronics manufacturing supply chain expands and evolves,” said Ajit Manocha, president and CEO of SEMI.  “Jim’s solid track record in heading ambitious business transformations makes him the ideal choice to lead SEMI Japan in SEMI’s 2.0 initiative. Jim will drive critical initiatives such as workforce development, greater environmental health and safety (EH&S) intensity, and new vertical application collaborations – like Smart Data and Smart Transportation that sharpen the industry’s focus on Artificial Intelligence (AI) and Machine Learning.”

Hamajima brings more than 30 years’ experience in the semiconductor equipment industry in Japan and the U.S. and a comprehensive understanding of the global industry.  Starting at Tokyo Electron Ltd. (TEL) in diffusion, Hamajima later held vice president positions overseeing multiple product lines at Tokyo Electron America and later for Cleaning Systems in Japan. Hamajima’s experience includes leading complex integrations as senior vice president at Timbre Technologies and as vice president and general manager at TEL-FSI. Prior to joining SEMI, Hamajima served as vice president and general manager of Corporate Strategy at TEL. Hamajima holds a Bachelor of Science degree in Metallurgy from the Nagoya Institute of Technology.

“I would also like to thank Osamu Nakamura for his important contributions, first as a SEMI Japan Regional Advisory Board member, later as a SEMI International BOD member and most recently as president of SEMI Japan, culminating in the very successful SEMICON Japan 2017 in mid-December,” commented Manocha. “I appreciate Osamu remaining as an advisor through the next several months to ensure a smooth transition and wish him a very happy retirement.”

 

By Natalie Shim, SEMI Korea

As dynamic back-end related technologies such as TSV (Through-Silicon Vias), InFO (Integrated Fan Out), etc., enable electronic devices to downsize with higher performance, the importance of back-end processing is greater than ever. Due to this, more and more customers are requesting “quality control” by tracing raw materials to assembly and packaging companies and the need for a standard is clear.

The Korea Advanced Back-end Factory Integration Task Force, in response to the industry’s demand, has decided to revise SEMI E142-0211 (Reapproved 1016), Specification for Substrate Mapping by adding an assembly and packaging raw materials traceability method.

Standards Chart

The first ballot is open for voting in Cycle 9-2017 (Nov 29 to Dec 29, 2017), and the TF will review the feedback at the next Information and Control Korea Technical Committee Chapter meeting scheduled for February 1, 2018, in conjunction with SEMICON Korea in Seoul, Korea.

Get Involved

SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.

For more information regarding Korea Advanced Back-end Factory Integration Task Force activities, please contact Natalie Shim at [email protected].

JEDEC Solid State Technology Association, a leader in standards development for the microelectronics industry, announces the successful launch of its newest committee: JC-70 Wide Bandgap Power Electronic Conversion Semiconductors. JC-70 held its first meeting in late October with twenty-three member companies, led by committee and subcommittee chairs from Infineon Technologies, Texas Instruments, Transphorm, and Wolfspeed, a Cree Company. Committee members include industry leaders in power GaN and SiC semiconductors as well as prospective users of WBG power semiconductors and T&M equipment manufacturers. Global multinational corporations and technology startups from the US, Europe, and Asia are working together to bring to the industry a set of standards for reliability, testing, and parametrics of WBG power semiconductors.

JC-70 has two subcommittees, which are focusing on Silicon Carbide (SiC) and Gallium Nitride (GaN) as the most mature wide bandgap (WBG) power semiconductor materials. Both SiC and GaN offer immense potential for enabling higher performance, more compact, and energy efficient power systems. Industry interest in JC-70 has been high with several new members joining the committee after the first meeting, underscoring the importance of creating universal standards to help advance the adoption of WBG power technologies.

“I am delighted by the initial response to the JC-70 committee, and look forward to welcoming additional companies to participate in developing standards for wide bandgap power technology,” said John Kelly, JEDEC President. “Broad industry participation will help ensure the resulting documents meet the needs of product designers as they create systems to enable a more energy efficient future.”

Four committee meetings are planned for 2018, including a webconference on January 25 and a meeting co-located with the APEC Conference on March 5. Interested companies worldwide are welcome to join JEDEC to participate in this important standardization effort.Contact Emily Desjardins ([email protected]) for more information or visit www.jedec.org.

Renesas Electronics Corporation (TSE:6723, “Renesas”), a supplier of advanced semiconductor solutions, today announced the integration of Intersil Corporation as a legal entity and a new branding policy following the acquisition of Intersil on February 24, 2017. Effective January 1, 2018, Intersil Corporation is expected to operate in the market under the name of Renesas Electronics America Inc. The completion of Renesas’ U.S. entity integration marks a major milestone in the integration process, which remains well on track. As well, the integration process in Japan and Korea is expected to be completed on or about January 1, 2018. The remaining Intersil entities are expected to be integrated in the near future.

“With the integration of the Intersil business, we have taken another significant step towards maximizing the full potential of the combined business, providing scale, stability and a comprehensive product mix,” said Bunsei Kure, Representative Director, President and CEO of Renesas Electronics Corporation. “With the enhanced global strength, Renesas is in the best position to further strengthen its leadership in the global semiconductor market.”

“The promise of the Renesas and Intersil integration has already begun to materialize as we’ve started operating as one company,” said Necip Sayiner, Executive Vice President of Renesas, President of Renesas Electronics America and President, CEO and Director of Intersil. “We are fully combining our portfolios, technologies and talent to maximize the potential of the acquisition synergies. As a result, we are positioned to expand our business in the broad-based market, providing complete system solutions that enable customers to get to market faster.”

As of January 1, 2018, Intersil Corporation is expected to complete an absorption-type merger with Renesas Electronics America Inc., the U.S. subsidiary of Renesas, leaving Intersil Corporation as the surviving company. Intersil Corporation will then change its name to Renesas Electronics America Inc.

Prior to this entity integration, Renesas implemented a transition to a new organizational structure in July 2017 to accelerate the integration of the Intersil business. The aim of this transition is to move beyond its Japan-centric business management and to achieve a truly global company that acts as “One Global Renesas,” a company that operates as a global entity.

Nova (Nasdaq: NVMI), a provider of metrology solutions for advanced process control used in semiconductor manufacturing, today announced that Ronnie (Miron) Kenneth, former Chief Executive Officer of Voltaire Technologies Ltd. (Nasdaq: VOLT) and former Chief Executive Officer of Pontis Ltd., has been appointed to the company’s Board of Directors.

Mr. Kenneth is a veteran high-tech leader who served for ten years as Chairman and Chief Executive Officer at Voltaire, leading it to an initial public offering on Nasdaq in 2007. Following the company’s merger with Mellanox Technologies Ltd. (Nasdaq: MLNX) in 2011, Mr. Kenneth became the Chief Executive Officer of Pontis Ltd., a privately-held company, until 2013. Mr. Kenneth currently serves as the Chairman of Teridion Technologies Ltd. and Varada Ltd., and he is a director of Allot Communications Ltd. (Nasdaq: ALLT) and Orbotech Ltd. (Nasdaq: ORBK).

“Ronnie brings a broad experience in leading technology companies. I am looking forward to adding his extensive experience in the high-tech industry to our board as Nova continues to expand. I have no doubt that Ronnie will be an important addition to our Board of Directors and will contribute to Nova’s success,” commented Dr. Micha Brunstein, Nova’s Chairman of the Board.

“I am excited to join Nova and have the opportunity to contribute to its continued growth,” added Mr. Kenneth. “Nova has already established a strong position in a rapidly expanding market, and I believe that this talented board will continue to chart a course of success for the company.”

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its industry-leading process equipment. The building, part of an investment of more than 20 million Euros that was announced earlier this year, allows for a significant expansion of warehouse space and provides more than 50 percent additional test room space for the final assembly of EVG’s high-precision systems, as well as technical source inspection of the systems by its customers.

“EVG operates in highly dynamic markets, where we always strive to provide our customers with the latest technologies to realize their product ideas with the shortest possible time to market–true to EVG’s Triple-i philosophy of invent-innovate-implement,” stated Dr. Werner Thallner, executive operations and financial director at EV Group. “Our headquarters expansion helps ensure that we continue to deliver on this pledge to our customers. I’m pleased to say that we completed this expansion in record time too, and we already have plans for additional capacity expansion in preparation for future growth.”

The completed building at EV Group's headquarters is part of an investment of more than 20 million Euros to expand the company's production capacity.

The completed building at EV Group’s headquarters is part of an investment of more than 20 million Euros to expand the company’s production capacity.

The new test rooms, which are designed to house larger systems including high-volume manufacturing platforms and solutions for panel-sized substrates, are equipped with the latest air conditioning and cleanroom technology. The ambient conditions created through these measures are similar to those found in the semiconductor fabs or bio-medical labs of EVG’s global customers. The sophisticated security concept at EVG’s headquarters, which extends to the new building complex, enables customers to have controlled access to individual test rooms where the technical source inspection of their tools can take place together with EVG specialists.

Several EVG systems have already been moved to the new facility for final assembly, software installation and initial set-up in order to make more room available for fulfilling additional system orders.

More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate already strong industry growth. March 14-16, 2018, at the Shanghai New International Expo Centre (SNIEC), SEMICON China 2018 will bring together top executives and technologists in six exhibition halls, the most ever in the event’s 30-year history, to find opportunities in key focus areas including Smart Automotive and Smart Manufacturing, Green Tech, Advanced Technology, and Power and Compound Semiconductors.

Concurrent with FPD China, SEMICON China 2018, the largest and most influential gathering of the semiconductor supply chain in China, is now open for visitor registration.

SEMICON China technical forums will address the most pressing industry topics:

  • CSTIC 2018: Staged in conjunction with SEMICON China, this has ranked among the largest and most comprehensive annual semiconductor technology conferences in China since 2000. March 11-12, 2018, CSTIC 2018 will feature nine symposiums covering all aspects of semiconductor technology, with a focus on manufacturing and advanced technology.
  • SIIP: Tech Innovation and Investment Forum: SIIP is a key international platform for semiconductor industry investment in China. Informed by China’s IC policy to fund key semiconductor sectors, leaders of China’s National IC Fund and municipal IC funds will join leaders from global investment institutions to discuss hot opportunities in China semiconductor investment – and applications such as Artificial Intelligence (AI).
  • Win-Win: Build China’s IC Ecosystem: Spurred by a strong market outlook, policy and the national fund, fab construction in China will surge over the next five years, with OSAT (Outsourced Semiconductor Assembly and Test) making strategic investments. Industry leaders will explore how China’s semiconductor manufacturing industry will strengthen its core competency, prioritize resources, revisit its business model, and thrive in the electronics ecosystem.
  • Power and Compound Semiconductor International Forum: Among the largest power and compound semiconductor industry forums in Asia, this two-day event features four sessions: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology
  • Smart Automotive Forum – AI Inside: Top automotive, electronic, AI and technology executives will gather to discuss the future of the rapidly disrupting automotive industry.
  • China Memory Strategic Forum: Driven by market needs and policy support, three new Chinese Memory foundries are accelerating memory development. Industry leaders will explore ways multinationals can benefit more from China’s memory market, China can better leverage its technical strength, and Chinese companies can enhance research and development collaboration with global partners.
  • Green High-Tech Facility Forum: With more than 10 fabs now under construction in China,China’s semiconductor industry is entering a stage of rapid growth. Green Tech leaders will discuss how China can improve factory design and construction; optimize energy efficiency of semiconductor manufacturing equipment; enhance machine platform stability, chemicals and gas management, and wastewater treatment; and improve risk management.
  • Smart Manufacturing Forum: The semiconductor industry must be proactive in all aspects of smart manufacturing. This session will address automation, product tractability, cost and cycle time reduction, enhancements in productivity and yield, and efficiency improvements in front- and back-end factories.
  • Semiconductor New Technology Conference: The best way to promote new technology is through direct customer interaction and collaboration. Join this conference to discuss your new IC, new IOT solution, new machine or new material with more 200 customers from around the world.
  • 2018 China Display Conference-Emerging Display Forum: Join this forum, concurrent with FPD China 2018, to exchange ideas on emerging display technologies and future development.
  • MSIG International IOT Conference 2018: MEMS, sensors, IC, NB-IoT, 5G and smart application experts will share their insights on the IoT market and how to maximize the value of IoT applications.

SEMICON China also features three theme pavilions:

  • IC Manufacturing: See products, technologies, and manufacturing solutions focused on serving China’s fabless IC community, from design to final manufacturing.
  • LED and Sapphire: Learn how China has become the world’s largest sapphire manufacturing center.
  • ICMTIA: See the local IC material industry demonstrate its capabilities to support semiconductor industry growth.

The global wafer mounter equipment market is expected to grow at a CAGR of more than 4% from 2017-2021, according to a new market research report by Technavio.

Global wafer mounter equipment market segmentation by application and product type

Technavio’s report on the global wafer mounter equipment market analyses the business dimensions and presents a comprehensive breakdown in terms of market segmentation by application, including 300 mm (12 inches), 200 mm (8 inches), and 150 mm (6 inches). In 2016, the global wafer mounter equipment market by application was dominated by the 300mm segment, which accounted for a revenue share of close to 64%.

Based on product type, the global wafer mounter equipment market has been segmented into manual wafer mounters, automatic wafer mounters, and semi-automatic wafer mounters. The manual wafer mounters segment dominated the market, accounting for a revenue share of more than 41% in 2016.

“Manual wafer mounters are the most preferred wafer mounters by semiconductor device manufacturers. Leading vendors such as Taiwan Semiconductor Manufacturing Company, GLOBALFOUNDRIES, United Microelectronics, and SMIC are undertaking capital investments to meet the rising requirements for chips as new applications such as the IoT, factory automation, and automobile automation are emerging. The market will slowly transition from manual wafer mounters to automatic wafer mounters as manufacturers look to automate various processes,” says Chetan Mohan, a lead analyst at Technavio for semiconductor equipment research.

 

Global wafer mounter equipment market: competitive vendor landscape

The semiconductor industry is witnessing significant technology transitions in the manufacturing process such as the shift to smaller nodes, the multi-patterning technology, and the growth of MEMS and NEMS devices. To address these requirements of the customers, some of the equipment manufacturers are expected to develop new fabrication equipment that is in line with these technological advances. The semiconductor market is predicted to be driven by the growth of the IoT market, which will increase the demand for sensors, controllers, and embedded non-volatile memory.

North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in November 2017 was $2.05 billion. The billings figure is 1.6 percent higher than the final October 2017 level of $2.02 billion, and is 27.2 percent higher than the November 2016 billings level of $1.61 billion.

“November billings for North American equipment manufacturers increased modestly for the first time in four months,” said Dan Tracy, Senior Director, Industry Research and Statistics, at SEMI. “Year-to-date equipment spending is well on track to set a historical high, and we expect that positive momentum to continue into next year as new fabs in China begin to equip.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)
Year-Over-Year
June 2017
$2,300.3
34.1%
July 2017
$2,269.7
32.9%
August 2017
$2,181.8
27.7%
September 2017
$2,054.8
37.6%
October 2017 (final)
$2,019.3
23.9%
November 2017 (prelim)
$2,052.2
27.2%

Source: SEMI (www.semi.org), December 2017

 

QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology. Specifically, Mentor’s Precision Synthesis software has been optimized to support the QuickLogic ArcticProTM architecture used in the company’s eFPGA IP.

QuickLogic will distribute this new version of Precision Synthesis as part of its Aurora development tool suite to provide high performance synthesis technology to eFPGA designers in their next SoC with embedded FPGA IP. The combination of the two tool sets will deliver a seamless development environment supporting a complete design flow, from RTL to programming bitstream, for the embedded FPGA portion of the design.

The tools from both companies have been tuned for implementation efficiency and design performance to enable the effective targeting of designs to the eFPGA IP. By embedding eFPGA technology, SoC developers gain post-manufacturing design flexibility to support design fixes, upgrades, market variants, and rapidly evolving standards or market requirements.

“We are pleased to collaborate with Mentor to give our customers complete design flow support for our eFPGA technology,” said Mao Wang, director of product marketing at QuickLogic Corporation. “Mentor has done an excellent job in enabling their Precision Synthesis software to generate an optimized synthesis netlist for the QuickLogic ArcticPro-based eFPGA architecture.”

“QuickLogic’s eFPGA IP has the potential to be a transformative technology for our SoC customers, and we are looking forward to delivering an outstanding synthesis solution for their Aurora development tools and a continued growth in our partnership,” said Ellie Burns, director of marketing, Calypto Systems Division at Mentor.

Mentor’s Precision Synthesis and QuickLogic Aurora development tools supporting QuickLogic’s eFPGA technology are both available now from QuickLogic Corporation.