Tag Archives: letter-wafer-business

By Jonathan Davis, global VP, Industry Advocacy, SEMI

The 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016), opened today (May 17) in Saratoga Springs, New York.  A record-setting 340-plus conference attendees joined this year’s event which focuses on key issues and trends in the manufacture of semiconductors.

Don O’Toole, IBM

Opening keynoter Don O’Toole of IBM’s Watson IoT Alliances & Ecosystem Business Development group highlighted the economic implications of the emerging Internet of Things and discussed how cognitive IoT is driving new business models.  He pointed to significant macroeconomic impacts as well as disruption and necessary change at the micro/strategic level within all enterprises.

In his talk on the “Economics of Things” he said that high-tech firms are challenged to continuously transform their business models and partner ecosystems to keep pace with the quickly evolving nature of business technology. Across industries, companies are turning their focus from traditional business equipment to a new generation of devices that will transform not just the electronics industry but many others.

O’Toole said that companies are moving beyond merely selling connected, intelligent products and services to using cognitive IoT to deliver greatly enhanced customer experiences over the life of their products. He described fundamental change or “liquidification” in the markets for physical goods.

Just as the internet created liquid markets with the digitization of music, news, maps, weather and traffic, the Internet of Things will eliminate physical constraints, structure information and create liquid markets in real estate, manufacturing, agriculture, retail and transportation. A radical repricing of credit and risk will improve financing and reduce “moral hazard,” which, in economic terms, is an information asymmetry that influences risk-taking to leverage lack of transparency.

The primary vectors of IoT to produce both opportunity and disruption will be the creation of new asset marketplaces, improved risk management and greater efficiency.  Fuller visibility and predictability will change market analysis and decision making with significant economic impact.  This characteristic will be apparent in widely varied industries including two that O’Toole profiled as examples: agriculture and real estate.

U.S. commercial real estate is a highly inefficient market in which lack of information transparency and predictability constrains utilization.  O’Toole said there is 12 billion square feet of commercial office space, however, only 67 percent is utilized.  IoT solutions that include sensor technology and user analytics potentially shift profit pools (as some actors benefit from the lack of information transparency), but can produce a $128 billion net economic benefit due to price efficiency and the elimination of shadow markets.

Similarly, agriculture faces high degrees of variability.  Despite significant scientific advancements, crop yields can fluctuate 39% between years, lending the moniker of “legalized gambling” to the farming industry. Employing IoT technologies that leverage sensors, monitoring, drones, cloud-based information systems and data analytics will reduce uncertainties, improve decision making and lead to better deployment of capital assets.  O’Toole estimates that this will produce a 6% decline in farm prices and raise GPD 2%. He cited California wine-maker E.J. Gallo’s ability to decrease water use by 20% as an example of the beneficial impact of cognitive IoT technologies.

While the economic benefits will accrue to multiple industries, high tech and electronics are to be among the greatest beneficiaries of the application of cognitive IoT functions in manufacturing. New ecosystems of customers and partners will develop.  Design and development will necessisarily change to be more agile, with faster prototyping and shorter product lifecycles.  O’Toole sees new value creation with machine-learned cognitive capabilities and natural language interfaces.

O’Toole expects to see far more information sharing between industries. He said that the permutations of ecosystems and industries that devices have to support are making interoperability the biggest challenge in the Internet of Things.

To win in the cognitive IoT era, O’Toole says companies must focus on experience. He offered the following advice:

·         Move from discrete, fixed engineering to continuous engineering

·         Future-proof designs with software-driven feature updates

·         Consider higher value business models that can shift capital expenses to operating expenses

·         Lead product development teams to use design thinking to better understand end-user personas

·         Build stronger relationships with end users by applying cognitive learning technologies to improve product services and experiences.

Other ASMC opening day sessions include contamination free manufacturing, advanced metrology, defect inspection, factory optimization, as well as 37 poster sessions on critical technological topics from representatives from global IC makers, equipment companies and materials providers.

POET Technologies Inc., a developer of opto-electronics fabrication processes for the semiconductor industry, today announced that it has signed a definitive agreement to acquire all the shares of BB Photonics Inc., a private designer of Integrated Photonic solutions for the Data Communications market.   Upon completion of this transaction which is subject to applicable regulatory reviews and approvals, including approval of the TSX Venture Exchange, POET will own 100% of BB Photonics and its assets, including intellectual property and technologies, and there will be no liabilities assumed on Closing.

BB Photonics, a pre-revenue, New Jersey-based privately held photonics company currently develops Photonic Integrated Components for the Datacenter market utilizing a Platform Technology approach using Embedded Dielectric Technology, that is intended to enable on-chip athermal wavelength control and lower the total solution cost of datacenter photonic integrated circuits.

This strategic acquisition of BB Photonics will provide POET with additional differentiated intellectual property and know how for future product development at its facilities in Singapore recently acquired through the DenseLight transaction. Collectively this will enable POET to better service the end to end Data Communications market and additionally augment its sensing roadmap.

“The acquisition of BB Photonics helps bolster our Intellectual Property and know how in Integrated Photonic solutions and enables broad applications through its unique performance and cost capabilities. It is anticipated that these factors will allow us to expand, accelerate and complement our current roadmap”, said Dr. Suresh Venkatesan, POET’s Chief Executive Officer. “This is another synergistic and timely acquisition for us as we focus on providing our existing and future customers a broader range of differentiated photonics technologies.”

“BB Photonics is excited to be part of POET Technologies and to enable athermal multi-wavelength photonic integration in high speed Indium Phosphide devices”, said Bill Ring, Chief Executive Officer of BB Photonics.  “We look forward to working closely with POET and DenseLight to bring our differentiated IP to market and deliver meaningful shareholder value”.

POET will acquire 100% of the shares of BB Photonics from its shareholders in consideration of the issuance of approximately 2,000,000 common shares from POET’s treasury in this stock only transaction, subject to adjustment based on the increase or decrease in the US-CDN dollar exchange rate before Closing which is expected to take place no later than 30 days following the date of the agreement.

The issuance of the POET Shares is subject to compliance with all United States and Canada Federal and State or Provincial securities laws and regulations, and the rules of the TSX Venture Exchange. The POET Shares will be restricted and subject to resale restrictions as established by the TSX Venture Exchange and U.S. securities laws. The management shareholders of BB Photonics have agreed not to sell, transfer, pledge or otherwise dispose of the POET Shares for a period of six months, at which time such shareholders may each sell up to 25% of the POET Shares received by them. The management shareholders may sell an additional 25% of the POET Shares received by them after twelve months.  Thereafter, the management shareholders shall be able to sell the remaining shares after 24 months from Closing.  The non-management shareholders of BB may sell POET shares at various times and in various amounts at four, six and twelve month periods following issuance.

Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments were 2,538 million square inches during the most recent quarter, a 1.3 percent increase from the 2,504 million square inches shipped during the previous quarter. However, new quarterly total area shipments are 3.8 percent lower than first quarter 2015 shipments.

“After two quarters of negative silicon shipment volume growth, the increase in silicon volume shipments in the most recent quarter is encouraging,” said Dr. Volker Braetsch, chairman SEMI SMG and senior vice president of Siltronic AG. “It remains to be seen if silicon shipment volumes will exceed the record amount shipped last year.”

Quarterly Silicon* Area Shipment Trends

Millions of Square Inches

1Q-2015

4Q-2015

1Q-2016

Total

2,637

2,504

2,538

Shipments are for semiconductor applications only and do not include solar applications

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or “chips” are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

SEMI reports that the worldwide semiconductor photomask market was $3.3 billion in 2015 and is forecasted to reach $3.4 billion in 2017. After increasing 3 percent in 2014, the photomask market increased 1 percent in 2015. The mask market is expected to grow 2 and 3 percent in 2016 and 2017, respectively. Key drivers in this market continue to be advanced technology feature sizes (less than 45nm) and increased manufacturing in Asia-Pacific. Taiwan remains the largest photomask regional market for the fifth year in a row and is expected to be the largest market for the duration of the forecast.

Revenues of $3.3 billion place photomasks at 13 percent of the total wafer fabrication materials market, behind silicon and semiconductor gases. By comparison, SEMI reports that photomasks represented 18 percent of the total wafer fabrication materials market in 2003. Another trend highlighted in the report is the increasing importance of captive mask shops. Captive mask shops, aided by intense capital expenditures in 2011 and 2012 and the weakening Yen in recent years, which dampened Japan headquartered supplier’s revenues when reported in US dollars, gained market share at merchant suppliers’ expense. Captive mask suppliers accounted for 56 percent of the total photomask market last year, up from 53 percent in 2014. Captive mask shops represented 31 percent of the photomask market in 2003.

A recent published SEMI report, 2015 Photomask Characterization Summary, provides details on the 2015 Photomask Market for seven regions of world including North America, Japan, Europe, Taiwan, Korea, China, and Rest of World. The report also includes data for each of these regions from 2003 to 2017 and summarizes lithography developments over the past year.

The Global Semiconductor Alliance (GSA) is pleased to announce the appointment of Dr. Leo Li as the chairman of the GSA Board of Directors for 2016 and 2017.  Dr. Li serves as chairman, chief executive officer of Spreadtrum Communications, leading the Company’s mission to achieve industry leadership through continuous innovation and service.

The GSA Board chairman is a coveted position throughout the industry reserved for the most innovative leaders who represent the semiconductor industry’s most active global regions. Dr. Li will be the first chairman to serve from mainland China.  As a global Alliance, this is a key step for GSA to ensure the commitment to all important regions of the ecosystem.  It is vital to GSA that Chinese companies are being serviced and global members have access to all of the opportunities in China.

Dr. Li has served as a regional member of the GSA Board of Directors, representing the Asia-Pacific region since 2012. He has also served as a member of GSA’s Asia-Pacific Leadership Council since 2011.  The Asia-Pacific Leadership Council serves as advisors to the GSA Board on global and regional issues.

“I am honored that the GSA Board of Directors has appointed me as their Chairman,” commented Dr. Li. “The industry is constantly evolving and GSA has been instrumental in solving a variety of challenges and promoting collaboration between its member companies and partners. I am looking forward to serving as the Chairman to help advance GSA’s commitment to support globalization and continue to be the most prominent advocate to expand cooperation and innovation in our dynamic global semiconductor industry.”

Dr. Li has more than 30 years experience in wireless communications industry, joining Spreadtrum Communications in May 2008. From 2005 to 2007, he served as the chief executive officer of Magicomm Technology Inc., a cell phone product development company. From 2002 to 2005, he was senior business development director at Broadcom and was responsible for a line of GSM/GPRS/EDGE/WCDMA baseband business. From 1998 to 2002, Dr. Li was appointed as general manager of Mobile Phone Product and Vice President of Mobilink Telecom, a GSM baseband start-up company that was sold to Broadcom in 2002. Prior to 1998, he held various senior engineering and program management positions at Rockwell Semiconductors and Ericsson. Dr. Li holds 10 patents in wireless communication systems, RF IC system and circuit designs, and RFID applications.

Dr. Li received a BS degree from the University of Science and Technology of China in Hefei, China; a MS degree from the Institute of Electronics, Chinese Academy of Sciences in Beijing, China; a Ph.D. degree in Electrical Engineering from the University of Maryland in College ParkMaryland, USA; and an MBA degree from the National University in La Jolla, California, USA.

“It is a great honor to have Dr. Li serve as the Chairman of the GSA Board of Directors,” said Jodi Shelton, president of the GSA.  “Dr. Li is one of the most influential leaders in the semiconductor industry in China and his involvement will be critical to our future success. GSA will greatly benefit from his global perspective and technical expertise, enabling GSA to expand its collaboration between China and the worldwide semiconductor industry.”

Steve Mollenkopf, the Chairman of the GSA Board of Directors from 2014 to present, will continue to serve as a regional leadership director for the Board.

Revenue associated with the wireless competitive landscape continued to serve as a bright spot in the larger semiconductor market in 2015, growing almost 4 percent to over $56 billion, year over year, while total semiconductor revenue fell 2 percent to $347 billion during the same period. The wireless competitive landscape includes logic and analog semiconductors used in connectivity, mobile phones, media tablets, mobile infrastructure and other applications. However, due to slowing sales of smartphones and other wireless devices, the wireless competitive landscape faces a set of challenges that could result in similar or slower growth in 2016, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

wireless semiconductors

“Apple recently reported its fiscal second quarter results, and for the first time iPhone unit sales fell year over year, indicating the potential magnitude of the softness in the premium smartphone market,” said Brad Shaffer, senior analyst, mobile devices and networks, IHS Technology. “If the iPhone and other premium smartphones fail to gain enough traction to support growth in that market segment, it may be reflected in the underlying semiconductor market in 2016.”

According to the IHS Wireless Semiconductor Competitive Intelligence Service, the mobile handset integrated-circuit (IC) market is the largest segment in the wireless competitive landscape, comprising 62 percent of revenue in 2015 as the smartphone market continued to grow. “If unit shipments from Apple and other smartphone original equipment manufacturers continue to decline, the wireless competitive landscape could have a dragging effect on the larger semiconductor market in 2016. However, though currently too early in their lifecycles to make a material difference in the short term, emerging technologies like LTE-Advanced Pro or 4.5G could provide upside potential in the next 12 to 18 months,” Shaffer said.

Along with maturing growth rates in the smartphone market, Samsung, Apple, Huawei and other OEMs that are vertically integrated have varying degrees of internal semiconductor capabilities at their disposal — with the potential to supply their own smartphones and other OEMs as well. These internal design decisions tend to be cyclical in nature and can change from one product iteration to another, switching from internally-supplied components to third-party solutions.

“While this vertical integration has been especially evident in the premium smartphone tier, it helps to create a fiercely competitive environment in all market tiers, as it can limit the available market for third-party suppliers,” Shaffer said. “The increased competition resulting from a smaller market could impact core handset integrated-circuit prices in the entry-level and mid-range segments, with MediaTek, Spreadtrum and other suppliers vying for revenue share with market leader Qualcomm.”

Nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law theory and co-founder of Intel, is the recipient of its lifetime of innovation award. Imec’s annual award recognizes Dr. Moore’s visionary view, unrivalled innovation, and his profound impact on the global electronics industry.

In 1965, Dr. Moore predicted that the number of components on an integrated circuit (IC) would double every year for the coming 10 years, thereby making ICs and computer processing simultaneously faster, cheaper, and more powerful. In 1975, Dr. Moore revised the forecast rate to approximately every two years. Moore’s law turned out to be incredibly accurate, growing beyond its predictive character to become an industry driver that holds true today, 50 years later. Keeping up with Moore law’s progression has required a tremendous amount of engineering and commitment from the global semiconductor industry. While its meaning has evolved over generations, it has had a profound impact in many areas of technological change and progress.

“It is truly an honor to present imec’s lifetime innovation award to Dr. Moore, on behalf of all our global partners and our researchers,” stated Luc Van den hove, president and CEO of imec. “Dr. Moore’s name is synonymous with progress, and his vision has inspired and given direction to the entire semiconductor industry, which has revolutionized the way we compute, communicate, and interact. As the industry upholds this prediction and brings forth new innovations in chip technology, the future of Moore’s law will impact such things as healthcare, a sustainable climate, and safer transport all for the better.”

Dr. Moore began his career at Johns Hopkins University. He cofounded Fairchild Semiconductor in 1957 and launched Intel in 1968 together with Robert Noyce and Andy Grove. Today, Intel is a world leader in the design and manufacturing of integrated circuits and is the largest semiconductor company. Dr. Moore served as Intel CEO from 1975-1987, and then became its chairman of the board until his retirement in 1997.

“Although Moore’s law was created more than 50 years ago, it remains extremely valid and serves as a guide to what we innovate at imec,” continued Van den hove. “Throughout our organizations’ 32-year existence, we’ve worked at enabling Moore’s law and helping our partners innovate and develop the modern technology that society has embraced and demands. Dr. Moore’s legacy continues to be our mission and we are privileged to honor him.” 

Imec’s Lifetime of Innovation award is awarded to Dr. Moore on May 24, 2016 at its annual ITF Brussels, the flagship of imec’s worldwide ITF events.

By Dieter Ernst, East-West Center, Honolulu, HI
How will China’s new role transform the global semiconductor industry?

China has become the largest and fastest growing semiconductor market in the world, absorbing 40% of the worldwide semiconductor shipments. For US semiconductor firms, nothing compares to the China market.

China however faces a fundamental dilemma. As the world’s leading exporter of electronic products, it remains heavily dependent on imports of semiconductors and technology, primarily from the US, but also from Japan, Korea, Taiwan and Europe. At least 80 percent of the semiconductors used in China’s electronics manufacturing are imported and virtually all leading-edge devices like multi-component semiconductors (MCOs). For instance, 43% of the inputs for handsets and networking equipment of China’s second largest telecom company, ZTE, are supplied by US companies (Avnet, Qualcomm, Broadcom, Jabil, Intel, Microsoft, Micron, Xilinx, Nvidia and Finisar) [1].

As a result, China’s trade deficit in semiconductors has more than doubled since 2005 and now exceeds the huge amount it spends on crude oil imports. To correct this unsustainable imbalance, China’s new strategy to upgrade its semiconductor industry seeks to move from catching up to forging ahead in semiconductors through progressive import substitution. The “National Semiconductor Industry Development Guidelines (Guidelines)” and the “Made in China 2025” (MIC 2025, 中国制造2025) plan were published by China’s State Council in June 2014 and May 2015, respectively [2]. Both policies seek to strengthen simultaneously advanced manufacturing and innovation capabilities in China’s integrated circuit (IC) design industry and its domestic IC fabrication, primarily through foundry services.

As part of the Guidelines, a CNY120 billion (US$19 billion) national industry investment fund has been set up to help local foundries finance the build-up of advanced manufacturing processes, and also to assist local IC firms to form mergers and/or make acquisitions internationally. With the MIC 2025 plan, China is aiming to improve the self-sufficiency rate for ICs in the nation to 40% in 2020, and boost the rate further to 70% in 2025. MIC 2025 specifically defines the following priorities: i) Catch up with world best practice in IC design cores and design tools; ii) move to the frontier of multicomponent semiconductors (MCOs); iii) win design-in contracts from China-based electronic equipment manufacturers (both large global MNCs and Chinese firms like Lenovo or Huawei); and iv) strengthen China’s capacity to design and produce high- density chip packages and 3D micro-package technology.

Both policies have already led to a major push in the development of the local IC industry, with investments in semiconductor memories, designs, foundries, OSATS, and equipment and materials. In addition, strategic partnerships, joint ventures and mergers and acquisitions have proliferated across China’s semiconductor industry, both among domestic firms (to increase economies of scale and scope), and with leading global semiconductor firms (to access cutting-edge technology and best-practice management techniques).

Based on a review of policy documents and interviews with China-based industry experts, this paper explores how realistic these objectives are, and how this might affect international firms and the global semiconductor industry.

How realistic are the objectives of China’s new policies?

Over the last 60 or so years, China’s semiconductor industry has come a long way from being a completely government-owned part of the defense technology production system, with state-owned enterprises (SOEs) as the only players, toward a gradually more market-led development model. The role of SOEs has dramatically declined, and a deep integration into international trade and global networks of production and innovation has transformed decisions on pricing and investment allocation, with private firms as the main drivers. Major achievements include the rapid growth of China’s IC design industry from practically zero at the turn of the century to $17.05 billion in 2014, with an almost 37% compound annual growth rate since 2003. Other achievements include the successful diversification into optical devices (especially LED-related), sensors and discrete devices; first steps to move from silicon to wide band-gap semiconductor materials; and the surge of China’s semiconductor assembly, packaging, and testing (APT) industry, which has become the global market leader.

However, China’s achievements are overshadowed by persistent weaknesses, despite massive government support. Buying decisions for advanced ICs consumed in China are mostly made in Taiwan, Korea, US (for mobile devices), Japan, and Singapore. Of particular concern is the large and growing gap between semiconductor consumption and production, which has ballooned to a record $ 120 billion in 2013, and is forecast to reach $ 151.5 billion in 2017.[3] Equally important, China continues to play second fiddle in wafer fabrication – China’s 2015 share of total worldwide semiconductor wafer fab capacity is 11.7%,but advanced technology nodes (28nm and below) account for only 5% of worldwide wafer fab capacity. Foreign IDMs dominate (Intel, Samsung, Hynix), and Chinese foundries have a long way to go to catch up in process technology and wafer size. Most importantly, China lags behind in innovation, especially for advanced semiconductors, despite all the government’s previous plans and efforts.

Will China’s policy on semiconductors this time around work better than before? Our research finds that China’s new semiconductor policy does not represent a radical break with its deeply embedded statist tradition [4]. However, there are some important changes toward a more bottom-up, market- led approach to industrial policy. If sustained, these changes may considerably improve China’s chances to succeed in its new push in semiconductors.

China’s new semiconductor policy (as defined in the Guide- lines) relies on private equity investment rather than subsidy as the tool of industrial policy. The government participates in equity investment but claims it will do so without intervening in management decisions. This is expected to reduce the cost of investment for a selected group of firms comprising a “national team” in the semiconductor industry. The underlying financial networks are complex and difficult to disentangle. Take Hua Capital Management Co., Ltd (HCM), a Chinese investment management company, which was chosen to manage the chip design and testing fund under the Beijing government’s 30-billion-yuan (HK$37.8 billion) Semiconductor Industry Development Fund.

According to industry observers, the real driving force behind HCM is Chen Datong, who is HCM’s chairman as well as co-founder and managing partner of WestSummit Capital, a leading China-based global equity firm focused on helping high-growth technology companies access the China market. Dr. Chen has more than 20 years of investment and operations experience in the technology and semiconductor industries, and he owns 34 US and European patents. [5] Another major player is Liu Yue, the deputy chairwoman of HCM, who also has a wealth of experience in China’s IC industry. Of particular interest is her role as an early investor in China’s leading foundry SMIC through Walden Capital, and her continuous involvement with SMIC. HCM’s president, Xisheng (Steven) Zhang, started out in 1994 as a post-doctorate researcher at University of California, Berkeley, worked his way into senior management positions at Agilent Technologies and Silicon Valley start-up IC design companies, and joined Beijing- based private equity investment company WestSummit Capital in 2013. Zhang has over 20 years industry experience in semiconductors, and in managing start-up companies in Silicon Valley and in Beijing.

Based on this information, one might conclude that HCM qualifies as a professional fund manager with considerable knowledge of key aspects of the semiconductor industry value chain, especially related to IC design. In the view of the United States Information Technology Office (USITO), the use of professional investment fund managers, as opposed to government subsidies or investment, “suggest a new approach to industrial policy that focuses on building a strong and sustainable investment environment in China.”[6] It remains unclear, however, how private equity fund managers, who are supposed to maximize the return to capital, can nevertheless serve as proxies for the government and support its policy to strengthen indigenous innovation. A final assessment thus has to wait until more information is available on how funds will ultimately be deployed.

MIC 2025, on the other hand, seeks to provide a new framework for coordinating industrial support policies, in order to overcome a persistent gap in technological, management and innovation capabilities. Improved policy coordination is considered to be essential for overcoming deeply entrenched disconnects between industry, academia and government. Over two and a half years, 50 experts from the China Academy of Engineering and the Chinese Academy of Sciences worked together with around 100 experts from industry and research institutes to design the MIC 2025 plan. An equally important objective is to reduce the fragmentation of decision-making across government agencies and between the Central government and local governments. As an important step in this direction, 14 state-run associations from different sectors worked together and created a voluntary quality management standard for automated and intelligent manufacturing.

In short, China’s government seems more open to experimentation with new approaches to policy formulation, investment finance and flexible, bottom-up policy implementation. Among Chinese technology planners, there seems to be a growing consensus that the closer China moves to the technology frontier, the less scope there is for imitation and low-level incremental innovation. Chinese firms now are encouraged to develop and protect their own intellectual property rights and accelerate the commercialization of new ideas, discoveries and inventions.

China’s leadership is very conscious that the United States is far ahead in advanced semiconductors and that China has a long way to go to close the gap. But at the same time, Beijing’s new semiconductor policies also convey a new sense of optimism. Global transformations in semiconductor markets and technology, including a new interest in strategic partnerships and mergers, are no longer perceived exclusively as threats. In fact, China’s technology planners now seek to identify pathways to innovation- led development that could benefit from new technologies, such as the technology convergence in mobile devices, the Internet of Things in industrial manufacturing, and “green development”, focusing on a reduction of energy consumption, water usage and pollution. Forging ahead in semiconductors is considered essential for realizing this potential.

Above all, the role of the government appears to be gradually shifting away from the selection of priority sectors and technologies toward the facilitation of an interactive learning process led by the private sector. In this new model of industrial policy, which is slowly taking hold in China’s semiconductor industry, the government role is to provide incentives and remove regulatory constraints to empower the private companies that are most capable of realizing China’s domestic innovation potential.

It is however an open question whether China’s transition to innovation-led growth in semiconductors could be derailed, for instance, by the threat of overcapacity or by the Leader- ship’s (cyber-) security objectives. As is typical for China, the implementation of the semiconductor policy is left to the local governments who have become masters in producing overcapacity due to misaligned incentives that are focused exclusively on the region’s GDP growth.

China’s policy on cyber security seeks to protect China-based information systems against perceived threats to national and public security. [7] In response to Edward Snowden’s disclosure of US National Security Agency (NSA) global surveillance practices in China and elsewhere, China’s concern with cyber- security receives prominent attention in the Guidelines. It is unclear at this stage whether the drumbeat on security is used primarily as a tactic to mobilize support for aggressive investment funding? [8] Or is this focus on security an overriding concern for China’s leadership that will cast aside many of the aforementioned economic considerations?

In the end, there is reason for cautious optimism that pragmatism will continue to shape China’s policy for semiconductors [9]. Learning from global industry leaders will play a critical role, based on a quite realistic set of expectations: “In the next ten years, there will be a large amount of M&A cases in China, but many of them will fail…But it is better than nothing. China’s enterprises will gain experience.”[10] More than before, such pragmatism will be shaped by economic constraints, such as the country’s rising debt and dwindling foreign exchange reserves due to the collapse in Chinese exports [11].

Implications for international firms and the global semiconductor industry

As U.S. and other foreign semiconductor companies heavily depend on the China market, they seem to have little choice but to adjust their strategies to China’s new semiconductor policy. Intel, for instance, now depends on China for one-fifth of its revenues, while Qualcomm relies on the China market for nearly half of its income. In fact, U.S. and other foreign firms are quite explicit that they would be willing to accede to Chinese demands to transfer technology and form joint ventures with its firms, if only they could expand or at least sustain their share of the China market.

Examples include Intel’s substantial investment in Spreadtrum, one of China’s leading IC design firms, and Qualcomm’s investment in China’s leading IC fabrication company, SMIC. As foreign firms seek to cooperate more closely with Chinese firms in exchange for continued market access, this raises the question to what degree this might amplify China’s policies. Might foreign firms in some cases actually provide more effective support than the Beijing government in expanding China’s semiconductor industry?

To conclude, both Chinese and U.S. semiconductor companies have much to gain by learning from each other as they each face their own upgrading imperatives. While they compete in global markets, they would both benefit from cooperation in advanced semiconductor manufacturing and technology to solve the challenges of economic growth, better and lower- cost health systems, and a greener environment. Given the importance of both countries in the global semiconductor industry, it is striking to see that such cooperation remains as yet quite limited.

There is however ample scope to extend such cooperation. While China is catching-up in semiconductors, the US is still way ahead in overall innovation capacity. China’s persistent innovation gap implies that Chinese firms continue to need access to American technology, whether in terms of equipment, core components, software or system integration. For America, this implies that China’s new policies for semiconductors creates new markets for American firms, provided they stay ahead on the innovation curve.

But implementing such cooperation faces many hurdles. While incumbent industry leaders seek to retain the status quo, newcomers like China seek to adjust the old rules to reflect their interests as latecomers. But progress towards greater cooperation should be possible, once China acknowledges that US semiconductor firms need safeguards against forced technology transfer through policies like compulsory licensing, information security standards and certification, and restrictive government procurement policies. The US, in turn, needs to acknowledge that Chinese firms feel disadvantaged by restrictions on Chinese foreign direct investment (through CFIUS), and by restrictions on the export of technology to China, like the recent decision of the Commerce Department to slap technology export restrictions on US suppliers of semiconductor to China’s ZTE. In the end, such policies may encourage China to shift to alternative suppliers in Korea, Taiwan, and to promote more aggressively domestic suppliers.

References

  1. China-based firms supply less than 17% of ZTE’ s most recent quarterly procurement value, see Bloomberg Supply Chain data, as reported in http://www.bloomberg.com/ gadfly/articles/2016-03-07/a-u-s-ban-on-sales-to-china-s-zte-could-backfire.
  2. See USITO, 2014, Guidelines to Promote National Integrated Circuit Industry Development (unauthorized translation of document published by the Ministry of Industry and Infor- mation Technology, the National Development and Reform Commission, the Ministry of Finance, and the Department of Science and Technology), United States Information Technology Office, Beijing, June 24. On MIC2025, see the official website http://english.cntv.cn/special/madeinchina/ index.shtml. For an unofficial translation of the MIC2025 plan, see http://www.usito.org/content/usito-made- china-2025- unofficial-translation-2015-5-29.
  3. PWC, 2016, China’s impact on the semiconductor industry: 2015 update March,http://www.pwc.com/gx/en/technology/ pdf/china-semicon-2015-report-1-5.pdf
  4. Ernst, D., 2015, From Catching Up to Forging Ahead: China’s Policies for Semiconductors, East-West Center Special Study, September, http://www.eastwestcenter. org/node/35320, http://papers.ssrn.com/sol3/papers. cfm?abstract_id=2744974
  5. Chen Datong got his BS, MS, and PhD from Tsinghua University and worked as a post-doctoral research fellow at Stanford University. He was a partner in the Northern Light Venture Capital fund where he led investments in the semiconductor industry. Dr. Chen was the co-founder and CTO of Spreadtrum Communications, and hence has deep insider knowledge of that company. Prior to Spreadtrum, Dr. Chen was the co-founder and senior VP for OmniVision, again providing him with insider knowledge about the acquisition of that company in 2015.
  6. USITO, China IC Industry Support Guidelines—Summary and Analysis, September 1, 2014: 6.
  7. The following draws on chapter 2 in D. Ernst, Indigenous Innovation and Globalization: The Challenge for China’s Standardization Strategy, 2011. See also D. Ernst and S. Martin, The Common Criteria for Information Technology Security Evaluation: Implications for China’s Policy on Information Security Standards, East-West Center Working Paper, Economics Series no. 108, January 2010.
  8. After all, security concerns as a tactic to mobilize support for public and private investment in R&D have been used in other countries before, the United States included.
  9. According to a leading China expert, “Pragmatism has been a hallmark of China’s reforms over the past 30 years, as Chinese leaders have not flinched from a realistic view of their challenges. They typically experiment with various approaches before deciding on the best ways to address major concerns.” K. Lieberthal, Managing the China Challenge: How to Achieve Corporate Success in the People’s Republic (Washington, DC: Brookings Institution Press, 2011): p.7.
  10. Chen Datong, chairman, Hua Capital Management Co., Ltd, one of China’s IC Industry Equity Development Funds, presentation at Global Leadership Summit, Global Semicon- ductor Alliance (GSA), Shanghai, http://www.gsaglobal.org/ events/2014/0320/speakers.aspx#Chen.
  11. According to Reuters, “China’s February 2016 trade perfor- mance was far worse than economists had expected, with exports tumbling the most in over six years, days after top leaders sought to reassure investors that the outlook for the world’s second-largest economy remains solid. Exports fell 25.4 percent from a year earlier, twice as much as markets had feared as demand skidded in all of China’s major markets, while imports slumped 13.8 percent, the 16th straight month of decline.” (China February exports post worst fall since May 2009, March 8, 2016, http:// www.reuters.com/article/us- china-economy-trade- idUSKCN0WA09C

IC Insights’ April Update to the 2016 McClean Report, to be released later this week, includes IC Insights’ final 2015 top 50 company rankings for total semiconductor and IC sales as well as rankings of the leading suppliers of DRAM, flash memory, MPUs, IC foundry services, etc.

Figure 1 ranks the top 13 IC foundries (pure-play and IDM) by foundry sales in 2015.

Apple TSMC sales

TSMC, by far, was the leader with $26.4 billion in sales last year.  In fact, TSMC’s 2015 sales were over 5x that of second-ranked GlobalFoundries (even with the addition of IBM’s chip business in the second half of 2015) and almost 12x the sales of the fifth-ranked China-based foundry SMIC.  As shown, there are only two IDM foundries in the ranking—Samsung and Fujitsu—after IBM and Magnachip fell from the list in 2015.  Despite losing a significant amount of Apple’s business, Samsung easily remained the largest IDM foundry last year, with more than 3x the sales of Fujitsu, the second-largest IDM foundry.

Illustrating the dramatic effect of exchange rate fluctuations on the IC sales numbers, TSMC’s 2015 growth rate was about half (6%) of what it was in its local currency (11%).  Thus, while the company met its stated goal of 10% or better growth in 2015 in NT dollars (840.5 billion), its growth rate in U.S. dollars was only 6%.

Driving home just how important Apple’s foundry business is, TSMC’s foundry sales increased by $1,464 million last year while its sales to Apple jumped by $1,990 million, representing more than 100% of TSMC’s total foundry sales increase in 2015.  As a result, without Apple, TSMC’s foundry sales would have declined by 2% last year, eight points less than the 6% increase it logged when including Apple.

Second ranked GlobalFoundries took over IBM’s IC business in early July of 2015.  It should be noted that besides $515 million in IDM foundry sales IBM made in 2014, the company also had about $1.0 billion of internal transfer IC revenue that year.  As a result, GlobalFoundries’ quarterly sales in 4Q15 were about $1.4 billion, an annual run-rate of $5.6 billion, about 12% greater than the company’s 2015 sales of $5.0 billion. However, without the addition of IBM’s sales in the second half of last year, GlobalFoundries’ sales would have declined by 2% in 2015.

Sales from the top 13 foundries’ shown in Figure 1 were $46.7 billion and represented 93% of the $50.3 billion in total foundry sales in 2015.  This share was two points higher than the 91% share the top 13 represented two years earlier in 2013.  With the barriers to entry (e.g., fab costs, access to leading edge technology, etc.) into the foundry business being so high and rising, IC Insights expects this “top 13” marketshare figure to continue to slowly rise in the future.

ams AG (SIX: AMS), a provider of high performance sensors and analog ICs, announces that U.S. District Judge Richard A. Schell has entered an order on April 26, 2016, awarding one of its wholly-owned subsidiaries, ams-TAOS USA Inc. f/k/a Texas Advanced Optoelectronic Solutions, Inc., US $77,021,593 in damages from United States-based Intersil Corporation, including US $10,000,000 in exemplary damages.

The decision comes after a 2015 four-week trial in which jurors in the federal Eastern District of Texas found in favor of ams-TAOS on all claims against Intersil: misappropriation of ams-TAOS’ trade secrets, breach of a non-disclosure agreement between the parties, tortious interference with ams-TAOS’ prospective business relations, and willful infringement of U.S. Patent No. 6,596,981.

The final judgement which will be entered on a later date can, however, be appealed. ams AG is therefore not able to estimate a time frame for conclusion of the case or recovery of damages awarded.

ams AG’ General Counsel Jann H. Siefken stated,  “We are pleased with the court’s decision to enforce our company’s intellectual property rights against a competitor who would seek to misappropriate them for an unfair competitive advantage.”