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Digital Specialty Chemicals Limited (DSC), a dual bottom line corporation and leading provider of advanced materials to the semiconductor, pharmaceutical, and specialty chemical markets, announced that it has received an equity investment from Intel Capital, Intel Corporation’s global investment organization. The investment will enhance the company’s research and development capabilities and will accelerate manufacturing capacity expansion.

DSC specializes in the manufacture of organophosphorus and organometallic chemistries used in both memory and logic thin film atomic layer deposition (ALD) manufacturing processes at leading semiconductor integrated circuit (IC) fabrication sites worldwide. The company is a leader in the manufacturing and handling of both novel specialty chemicals in large volume, high purity air- sensitive chemicals that require nitrogen and vacuum-operated vessels, using high pressure reactors and multiple distillation techniques.

“Since 1987, we have provided custom and high volume high purity chemicals to the semiconductor, pharmaceutical and specialty chemical markets worldwide. Our people, processes and facilities combine to offer the agility of a small, fine- chemical operation with the capacity of a large supplier,” said Dr. Ravi R. Gukathasan, CEO. “We believe that the continuation of Moore’s Law for semiconductor processing will depend greatly on continued innovation of advanced precursors which provides a growth opportunity for DSC. The funding from Intel Capital will help enable us to construct R&D and manufacturing facilities to meet growing demand for thin film technologies.”

“Materials innovation is critical to enabling new capabilities in semiconductor device design and manufacturing,” said Robert Bruck, corporate vice president and general manager of Global Supply Management at Intel. “We look forward to supporting DSC’s growth including development of new materials technologies for advanced semiconductor manufacturing process technology nodes.”

North America-based manufacturers of semiconductor equipment posted $1.57 billion in orders worldwide in April 2015 (three-month average basis) and a book-to-bill ratio of 1.04, according to the April EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in April 2015 was $1.57 billion. The bookings figure is 12.9 percent higher than the final March 2015 level of $1.39 billion, and is 9.0 percent higher than the April 2014 order level of $1.44 billion.

The three-month average of worldwide billings in April 2015 was $1.51 billion. The billings figure is 19.3 percent higher than the final March 2015 level of $1.27 billion, and is 7.6 percent higher than the April 2014 billings level of $1.40 billion.

“Both bookings and billings trends have improved, with the ratio remaining above parity over the past four months,” said Denny McGuirk, president and CEO of SEMI.  “Orders are higher than last year’s numbers, and current spending is on target with 2015 capex plans.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
November 2014 

$1,189.4

$1,216.8

1.02
December 2014 

$1,395.9

$1,381.5

0.99
January 2015 

$1,279.1

$1,325.6

1.04
February 2015 

$1,280.1

$1,313.7

1.03
March 2015 (final)

$1,265.6

$1,392.7

1.10
April 2015 (prelim)

$1,510.3

$1,572.2

1.04

Source: SEMI (www.semi.org), May 2015

As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ plasma processing Nanofab equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area. Multiple orders have recently been received from prestigious research centres in Europe and the USA, including the United States Naval Research Laboratory (NRL) and University College, London.

Chemical Vapour Deposition (CVD) has been one of the most successful techniques for the fabrication of nanostructured materials such as graphene, carbon nanotubes and other 1D and 2D nanomaterials. The Nanofab is ideal for this field of research as it combines several essential features for high performance growth such as a high temperature heater capable of processing up to 200mm wafers, shower head technology, automatic load lock for wafer handling as well as flexible options for liquid/solid precursor delivery.

Prof Zheng-Xiao Guo, of University College London said, “We recently placed an order for a Nanofab, chosen for its operating capability, process control, and great flexibility for further modification and upgrades. We also like the fact that we will be provided with dedicated after-sales support, not only in running the system, but also in enhancing the scope of our applications.”

Dr. David Haynes, sales and marketing director at Oxford instruments Plasma Technology commented, “In recent years there has been a great increase in graphene R&D worldwide, due to the impact that this area of research is expected to exert on tomorrow’s technologies and world economy. Several national research projects as well as industrial companies are now active in graphene production and applications, and more are set to follow, and we are extremely pleased that UCL, UK and NRL, USA amongst others have chosen our Nanofab systems.”

Samtec, Inc., a supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec, headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialize optical communications solutions using silicon photonics technology for addressing data centers and high-performance computing applications.

Officials from all parties expressed their enthusiasm. “We are thrilled with the opportunity to join the Silicon Photonics Program of the IRT Consortium,” said Marc Verdiell, CTO of the Samtec Optical Group. “Samtec brings its vast experience in optical transceiver technology, and advanced optical packaging and support to this program. This technology will strengthen Samtec’s expertise in high data rate applications from 28 Gbps, to 56 Gbps, and beyond, as well as allow further photonics integration for higher density, higher bandwidth, and lower cost per Gb optical interconnects.”

Verdiell adds, “This technology can be used to enhance Samtec’s active optical products such as FireFly. FireFly Micro Flyover System gives designers a choice of using either micro footprint high-performance active optical engines or lower-cost copper interconnects. This allows the designer to upgrade from electrical to optical using the same interconnect system. With a 28 Gbps system in development, the currently released optical FireFly is a x12, 14 Gbps per channel, unidirectional or bidirectional transceiver system. It has the highest 14 Gbps bandwidth density available with an aggregate 168 Gbps.”

The IRT Nanoelec Silicon Photonics Program was launched in 2012. It brings together, under one roof, the expertise, tools and equipment needed for the development of silicon photonics technology and associated solutions for optical communications. Mentor Graphics, STMicroelectronics, CNRS and CEA-Leti were the core members of the consortium.

“The participation of the new partner Samtec within the Silicon Photonics Program is highly valuable, as Samtec will bring strong and complementary skills in optical and high-speed electrical packaging to our current consortium,” said Sylvie Menezo, director of the program. “The consortium is now gathering research institutes counted among the pioneers in silicon photonics and major industrial players over the complete value chain (silicon foundry, EDA, packaging). This is a key factor for success in developing innovative and cost-effective solutions.”

IC Insights will release its May Update to the 2015 McClean Report later this month.  This Update includes a discussion of the history and evolution of IC industry cycles, an update of the capital spending forecast by company, and a look at the top 25 1Q15 semiconductor suppliers (the top 20 1Q15 semiconductor suppliers are covered in this research bulletin).

The top 20 worldwide semiconductor (IC and O S D—optoelectronic, sensor, and discrete) sales ranking for 1Q15 is shown in Figure 1.  It includes seven suppliers headquartered in the U.S., four in Japan, three in Taiwan, three in Europe, two in South Korea, and one in Singapore, a relatively broad representation of geographic regions.

The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and four fabless companies.  It is interesting to note that the top four semiconductor suppliers all have different business models. Intel is essentially a pure-play IDM, Samsung a vertically integrated IC supplier, TSMC a pure-play foundry, and Qualcomm a fabless company.

IC Insights includes foundries in the top 20 semiconductor supplier ranking since it has always viewed the ranking as a top supplier list, not a marketshare ranking, and realizes that in some cases the semiconductor sales are double counted.  With many of our clients being vendors to the semiconductor industry (supplying equipment, chemicals, gases, etc.), excluding large IC manufacturers like the foundries would leave significant “holes” in the list of top semiconductor suppliers.  As shown in the listing, the foundries and fabless companies are identified.  In the April Update to The McClean Report, marketshare rankings of IC suppliers by product type were presented and foundries were excluded from these listings.

It should be noted that not all foundry sales should be excluded when attempting to create marketshare data. For example, although Samsung had a large amount of foundry sales in 1Q15, some of its foundry sales were to Apple.  Since Apple does not resell these devices, counting these foundry sales as Samsung IC sales does not introduce double counting.

Figure 1

Figure 1

Overall, the top-20 list shown in Figure 1 is provided as a guideline to identify which companies are the leading semiconductor suppliers, whether they are IDMs, fabless companies, or foundries.

In total, the top 20 semiconductor companies’ sales increased by 9 percent in 1Q15/1Q14 (6 percent excluding the foundries), three points greater than the total worldwide semiconductor industry growth rate.  Although, in total, the top-20 1Q15 semiconductor companies registered a 9 percent increase, there were six companies that displayed >20 percent 1Q15/1Q14 growth.  Nine companies had sales of at least $2.0 billion in 1Q15.  As shown, it took just over $1.1 billion in quarterly sales just to make it into the 1Q15 top-20 semiconductor supplier ranking.

There were two new entrants into the top 20 ranking in 1Q15—Japan-based Sharp and Taiwan-based pure-play foundry UMC, which replaced U.S.-based AMD and Nvidia.  AMD had a particularly rough 1Q15 and saw its sales drop 26 percent year-over-year.  It currently appears that AMD’s 2013 restructuring and new strategy programs to focus on non-PC end-use segments have yet to pay off for the company (in addition to its sales decline, AMD lost $180 million in 1Q15 after losing $403 million in 2014).

Although Intel’s sales were flat in 1Q15, and it believes its 2015 sales will be flat with 2014, it remained firmly in control of the number one spot.  There were, however, some significant changes in the remainder of the top 10 ranking.

SK Hynix continued its ascent up the semiconductor company rankings that started a few years ago and moved into 5th place in 1Q15, displacing Micron.  With Qualcomm’s sales hitting a soft patch and SK Hynix continuing to gain share in the memory market, IC Insights believes that the company could move past Qualcomm into the fourth spot when the full-year sales totals for this year are tallied.

While MediaTek’s growth has slowed somewhat from its torrid pace over the past few years, the company posted a year-over-year sales increase of 12 percent to move into the top 10.  IC Insights believes that MediaTek will remain in this position in the full-year 2015 ranking.

Although Sharp as a whole is having a difficult time, its semiconductor group, which represents only about 14 percent of the company’s corporate sales, posted a whopping 62 percent growth rate (an 88 percent increase in yen), the best 1Q15 sales increase of any top-20 semiconductor supplier.  This sales surge was almost entirely due to the company’s success in the CMOS image sensor market.

As would be expected, given the possible acquisitions and mergers that could occur this year (e.g., NXP/Freescale, GlobalFoundries/IBM’s IC group, etc.), as well as any new ones that may develop, the top 20 semiconductor ranking is likely to undergo a tremendous amount of upheaval over the next couple of years as the semiconductor industry continues along its path to maturity.

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its NILPhotonics Competence Center—established to assist customers in enabling new and enhanced products and applications in the field of photonics—has generated strong interest from customers and resulted in multiple system orders since its launch in December 2014. New system orders have included the company’s EVG700/7000 Series UV-NIL (UV nanoimprint lithography) systems with SmartNIL technology to support high-volume manufacturing applications, including displays, light emitting diodes (LEDs) and wafer-level optics.

EV Group wafer

Since its initial launch, the NILPhotonics Competence Center has also expanded the products and applications it is supporting. These include photonic and microfluidic devices for bio-medical applications that pave the way for faster and more accurate diagnosis of diseases, as well as plasmonic structures that simultaneously carry optical and electrical signals and can be scaled to the smallest dimensions to enable new chip designs as well as better-performing devices, such as waveguides and sensors.

“The prevailing perception has been that despite the potential benefits of NIL technology, the barrier to entry for integrating it into high-volume manufacturing (HVM) is high. That simply isn’t the case. EV Group has invested significant resources over many years in developing NIL technology as an HVM-capable solution for a number of applications,” stated Markus Wimplinger, corporate technology development and IP director at EV Group. “Today, we have the world’s largest installed base ofmore than 200 systems at customer facilities around the globe supporting volume-manufacturing of LEDs, MEMS, optics, photovoltaics and other devices. Our NILPhotonics Competence Center allows us to more easily bring all of our process and product capabilities and expertise to bear in helping our customers enable new photonic products and applications.”

EVG’s NILPhotonics Competence Center leverages EVG’s process and equipment know-how in NIL and other process areas such as wafer bonding to support emerging photonic applications and significantly shorten time to market through fast process implementation and optimization, as well as through customized equipment design. In addition, EVG has a global partner network to draw from to support its customers’ process integration and optimization efforts across the NIL infrastructure, including template manufacturing, resist materials and supporting equipment. As a result, EVG is able to provide consultation and support across all phases of the product lifecycle—from design for manufacturing and prototyping through process development, qualification runs, pilot manufacturing and process transfer.

“More than a decade ago, EV Group launched the NILCom Consortium with support from companies representing key aspects of the NIL supply chain in order to speed commercialization of NIL technology. Through the dedicated efforts of all of our members, we are pleased to announce that the NILCom Consortium has successfully completed its charter and will end formal operations. That said, we will continue to collaborate with companies across the NIL supply chain including our former members as needed to ensure that NIL technology continues to address future customer roadmap requirements,” added Wimplinger.

Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments were 2,637 million square inches during the most recent quarter, a 3.4 percent increase from the 2,550 million square inches shipped during the previous quarter, resulting in a new quarterly volume shipment record. New quarterly total area shipments are 11.6 percent higher than first quarter 2014 shipments.

“Total silicon shipment volumes for the first quarter of this year surpassed the record high reached in the third quarter of last year,” said Ginji Yada, chairman of SEMI SMG and general manager, International Sales & Marketing Department of SUMCO Corporation. “Silicon shipments for the most recent quarter benefited from the strong market momentum the semiconductor market enjoyed last year.”

Quarterly Silicon Area Shipment Trends

Millions of Square Inches

Q1 2014

Q3 2014

Q4 2014

Q1 2015
Total

2,363

2,597

2,550

2,637

*Shipments are for semiconductor applications only and do not include solar applications

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or “chips” are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers, epitaxial silicon wafers, as well as non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturers Group acts as an independent special interest group within the SEMI structure and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.   For more information, visit www.semi.org.

SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing. In addition to the exposition with over 650 exhibitors planned, SEMICON West will feature over 180 total hours of programs —  including free technical, applications and business programs as well as an extensive lineup of exclusive programs. Discounted registration for SEMICON West ends June 5.

Exclusive programs include the three-day Semiconductor Technology Symposium (STS) conference, a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. STS is offered as an intensive professional conference, with paid guaranteed classroom-style seating, lunch, and networking breaks. Aligned with the latest inputs from technology roadmaps, sessions at the STS will focus on the significant trends shaping near-term semiconductor technology and market developments in key areas including:

  • Semiconductor Manufacturing: Current Challenges and Future Opportunities for the Supply Chain
  • Adjacent Spaces: Strategies for Executing Expansion into Adjacent Markets
  • Packaging: The Very Big Picture 
  • Packaging: Digital Health and Semiconductor Technology
    • Test Vision 2020 (Automated Test Equipment)
    • Interconnect Technology for High-Performance Computing
    • Making Sense of the Lithography Landscape: Cost and Productivity Issues below 14nm and Path(s) to 5nm
    • Scaling Transistors: HVM Solutions Below 14nm; Getting to 5nm
    • Flexible Hybrid Electronics for Wearable Applications – Challenges/Solutions
    • Interconnect Technology for High-Performance Computing

In addition to the STS conference, SEMICON West continues to feature a full set of complimentary programs, including keynote addresses, executive panels, technical and business sessions.

The Tuesday Keynote Panel includes Jo De Boeck, senior VP and CTO of imec; Mike Campbell, senior VP of Engineering at Qualcomm; and Subashish Mitra, associate professor at Stanford University who will tackle the issue of “Scaling the Walls of sub-14nm Manufacturing.” Doug Davis, senior VP and GM, IoT Group at Intel, will present the Wednesday Keynote.

SEMICON West TechXPOT conference sessions on the exhibition floor are also provided free to exposition attendees. Sessions at the TechXPOTs are developed for engineers, technologists, and business leaders seeking solutions to key technology challenges, exploring cutting-edge and future technology developments and assessing their impact on the semiconductor supply chain. Developed in conjunction with SEMI technical committees, partner organizations, and technologists, the TechXPOT agenda will provide a deeper view of key technology developments and their business impact:

  • What’s Next for MEMS?
  • Automating Semiconductor Test Productivity
  • Emerging Generation Memory Technology: Update on 3D NAND, MRAM and RRAM
  • Materials Session: Contamination Control in the Sub-20nm Era
  • Subsystem and Component Suppliers at Critical Cross Roads to Deliver on Yield and Productivity
  • Equipment and Materials Opportunities for Flexible Hybrid Electronics
  • Packaging Session: Auto Utopia — Gearing up Semiconductor to Turn Dreams to Reality
  • The Evolution of the New 200mm Fab for the Internet of Everything
  • Monetizing the IoT: Opportunities and Challenges for the Semiconductor Sector
  • CMP Technical and Market Trends
  • Factory of the (Near) Future: Using Industrial IoT in Semiconductor Manufacturing Sector
  • Update on Industry Status of 450mm

Other key programs include:

  • Silicon Innovation Forum Conference is a two-day innovation conference that includes a one-day startup/investor forum and a one-day research forum.
  • Sustainable Manufacturing Forum is a three-day event starting on July 13; it delves into issues of Regulatory Compliance, Sustainable Technologies, and Sustainable Supply Chains.
  • “Bulls and Bears,” a session where a panel of technical and financial thought leaders address provocative questions on the state of the microelectronics industry and the outlook for the future.

Discounted registration for SEMICON West 2015 (www.semiconwest.org) through June 5.  Early-bird pricing for the Semiconductor Technology Symposium (STS), Test Vision 2020, and Sustainable Manufacturing Forum (SMF) applies through June 5. Premier sponsors of SEMICON West 2015 include Applied Materials, KLA-Tencor, and Lam Research.

Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

Hansen’s professional experience includes serving as Vice President and Chief Technology Officer (CTO) at Freescale Semiconductor since 2009. Hansen replaces retiring SRC President and CEO Larry Sumney who guided the organization for more than 30 years since its inception in 1982. SRC’s many accolades over the years include being the recipient of the National Medal of Technology in 2007.

“SRC under Larry Sumney’s leadership has made an indelible impact on the advancement of technology during the past three decades, and we congratulate Larry on his retirement and salute him for his contributions to the semiconductor industry,” said Mike Mayberry, Intel Corporate Vice President and Director of Components Research who is SRC Board Chairman. “We also welcome Ken Hansen to his new role guiding SRC, and we look forward to Ken’s leadership helping SRC reach new heights in an era where basic research and development is as critical as ever.”

Prior to his CTO role at Freescale, Hansen led research and development teams for more than 30 years in multiple senior technology and management positions at Freescale and Motorola. Hansen holds Bachelor and Master of Science degrees in Electrical Engineering from the University of Illinois where he has been recognized as an ECE (Department of Electrical and Computer Engineering) Distinguished Alumni.

In his new role at SRC, Hansen intends to build on the consortium’s mission of driving focused industry research to both advance state-of-the-art technology and continue to create a pipeline of qualified professionals who will serve as next-generation leaders for the industry.

“SRC also has an opportunity to strengthen its core by recruiting new members to gain more leverage to fund industry wide solutions for some of the challenging technology roadblocks that are ahead of us,” said Hansen.

“The model that SRC has developed is unmatched in the industry and has proven to be extremely significant. The industry would not be where it is today without the contributions of SRC under the leadership and vision of Larry Sumney,” Hansen continued.

Meanwhile, Sumney’s decorated career began in 1962 at the Naval Research Laboratory. He later directed various other research programs at Naval Electronics Systems Command and the Office of the Undersecretary of Defense — including the Department of Defense’s major technology initiative, Very High Speed ICs (VHSIC) —before agreeing to lead SRC following its formation by the Semiconductor Industry Association.

Under his leadership, SRC has also formed wholly owned subsidiaries managing the Nanoelectronics Research Initiative (NRI), the Semiconductor Technology Advanced Research network (STARnet) and the SRC Education Alliance, among other programs. Sumney received a Bachelor of Physics from Washington and Jefferson (W&J) College, which recognized him with the 2012 Alumni Achievement Award, and a Master of Engineering Administration from George Washington University.

“I have enjoyed a front row seat in the development of today’s technology-based economy and advancement of humanity through the semiconductor industry,” said Sumney. “I am completely confident that SRC is well positioned and will continue to flourish, to seed breakthrough innovation and help provide the people and ideas to keep the U.S. semiconductor industry competitive and prosperous in years to come.”

Additional industry leaders with strong ties to SRC commended Sumney for his service over the years while supporting Hansen’s appointment.

“Over more than 30 years, Larry Sumney’s visionary leadership of SRC has steered one of the world’s most transformative industries through times of tremendous growth and innovation,” said John Kelly, Senior Vice President, Solutions Portfolio and Research for IBM.  “I’ll personally miss working with Larry, but also have tremendous respect for and confidence in Ken Hansen, and we look forward to collaborating with him to drive the next generation of research in this vital industry.”

“Larry’s leadership and vision are key reasons why SRC’s research has played a fundamental role behind many of the most significant semiconductor innovations of the last three decades,” said Lisa Su, AMD president and CEO and a former SRC student. “Ken’s broad industry experience makes him ideally suited to lead the next phase of the SRC, as the organization continues to expand its capabilities and provide the basic research and development foundation needed to further accelerate innovation across the industry.”

Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud.” The new parts will enable acceleration of up to two times that of a field programmable gate array (FPGA) for workloads like security and big data analytics while also speeding the time to market for custom application specific integrated circuit (ASIC) development by as much as 50 percent.

The tremendous growth of cloud computing has spurred greater demand for customized chips that make a particular application or workload run faster. To enable this, eASIC plans to integrate its eASIC platform technology with future Intel Xeon processors, providing cloud service providers a highly customized, integrated hardware solution for their particular workload.

eASIC’s technology can increase flexibility and fast-time-to-market when compared to traditional ASICs and increase performance and lower power consumption when compared to FPGAs. By integrating hardware accelerator solutions with the eASIC platform, Intel can deliver much faster and more flexible systems for cloud customers.

“Having the ability to highly customize our solutions for a given workload will not only make the specific application run faster, but also help accelerate the growth of exciting new applications like visual search,” said Diane Bryant, senior vice president and general manager of Intel’s Data Center Group. “This announcement helps broaden our portfolio of customized products to provide our customers with the flexibility and performance they need.”

This collaboration is part of Intel’s strategy to integrate reprogrammable technology with Intel Xeon processors to greatly improve performance, power and cost.

“We believe our eASIC technology has unique characteristics that will benefit cloud service providers to get the most from their applications,” said Ronnie Vasishta, president and chief executive office at eASIC. “The combination of eASIC and Intel technology will help bring break through cost and performance to our customers.”