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By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp.

Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges
– both economic and technical. On the economic side is the need to cost-effectively manufacture up to a trillion sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment industry to provide very different types of manufacturing solutions to support the IoT.

In order to fulfill the promise of the IoT, sensor technology will need to become nearly ubiquitous in our businesses, homes, electronic products, cars, and even our clothing. Per-unit costs for sensors will need to be kept very low to ensure the technology is economically viable. To support this need, trailing-edge semiconductor manufacturing capabilities provide a viable option since fully depreciated wafer processing equipment can produce chips cost efficiently. For semiconductor equipment suppliers, this translates into additional sales of refurbished and productivity-focused equipment and upgrades that improve yield, throughput, and running costs. In addition to being produced inexpensively, sensors intended for use in the IoT will need to meet several criteria. First, they need to operate on very low amounts of power. In fact, some may even be self-powered via MEMS (microelectromechanical systems)-based oscillators or the collection of environmental radio frequency energy, also known as energy harvesting/scavenging. Second, they will involve specialized functions, for example, the ability to monitor pH or humidity. Third, to enable the transmission of data collected to the supporting infrastructure, good wireless communications capabilities will be important. Finally, sensors will need to be small, easily integrated into other structures – such as a pane of glass, and available in new form factors – like flexible substrates for clothing. Together, these new requirements will drive innovation in chip technology across the semiconductor industry’s ecosystem.

The infrastructure needed to support the IoT, in contrast, will require semiconductor performance to continue its historical advancement of doubling every 18-24 months. Here, the challenges are a result of the need for vast amounts of networking, storage in the Cloud, and big data analysis. Additionally, many uses for the IoT will involve risks far greater than those that exist in today’s internet. With potential medical and transportation applications, for example, the results of data analysis performed in real time can literally be a matter of life or death. Likewise, managing the security and privacy of the data being generated will be paramount. The real-world nature of things also adds an enormous level of complexity in terms of predictive analysis.

Implementing these capabilities and infrastructure on the scale imagined in the IoT will require far more powerful memory and logic devices than are currently available. This need will drive the continued extension of Moore’s Law and demand for advanced semiconductor manufacturing capability, such as atomic-scale wafer processing. Controlling manufacturing process variability will also become increasingly important to ensure that every device in the new, interconnected world operates as expected.

With development of the IoT, semiconductor equipment companies can look forward to opportunities beyond communications and computing, though the timing of its emergence is uncertain. For wafer processing equipment suppliers in particular, new markets for leading-edge systems used in the IoT infrastructure and productivity-focused upgrades for sensor manufacturing are expected to develop.

North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November 2013 order level of $1.24 billion.

The three-month average of worldwide billings in November 2014 was $1.19 billion. The billings figure is 0.5 percent higher than the final October 2014 level of $1.18 billion, and is 6.8 percent higher than the November 2013 billings level of $1.11 billion.

“”With the rise in bookings, the book-to-bill ratio climbed above parity in November,”” said SEMI president and CEO Denny McGuirk. “”2014 has been a solid growth year for the semiconductor equipment market, and we expect the foundry and memory sector to continue leading investments in 2015.””

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

June 2014 

$1,327.5

$1,455.0

1.10

July 2014 

$1,319.1

$1,417.1

1.07

August 2014 

$1,293.4

$1,346.1

1.04

September 2014 

$1,256.5

$1,186.2

0.94

October 2014 (final)

$1,184.2

$1,102.3

0.93

November 2014 (prelim)

$1,189.8

$1,217.1

1.02

Source: SEMI, December 2014

Synopsys, Inc. today announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond. The agreement enables Synopsys to deliver accurate, process-calibrated models for its Sentaurus TCAD (technology computer aided design) tools to semiconductor manufacturers for use during 5nm technology node research and development. This latest agreement between imec and Synopsys follows successfully completed collaborations on FinFET and 3D-IC technologies for the 10nm and 7nm technology nodes.

“At imec, we focus on bringing the semiconductor industry leaders together to deliver future technologies,” said An Steegen, senior vice president of process technologies at imec. “We are excited to expand our cooperation with Synopsys, the primary TCAD provider, to explore next-generation device and process technologies for 5 nanometer. This continued tight collaboration with Synopsys will enable us to tackle the physics and engineering of advanced devices and introduce a new device design infrastructure for the industry.”

Working closely together, the joint Synopsys-imec team is investigating, among other topics, a vertical nanowire-nanosheet hybrid SRAM cell to target 5nm technology. Early studies show the benefits of nanowire-nanosheet technology in density and performance compared to conventional FinFETs and lateral nanowires. Synopsys’ Sentaurus TCAD tools that support this collaboration are used by technology development teams at foundries and integrated device manufacturers (IDMs) for device architecture selection, design and process optimization. Using early versions of Synopsys’ TCAD models allows the imec project team to explore a range of topics including fundamental device physics (material science, quantum transport and strain engineering), middle-of-line (MOL) local interconnects and the optimization of parasitics. A significant part of the analysis involves full-3D process and electrical simulations to identify device and interconnect reliability solutions for these highly scaled circuits.

“This is the first time a process-calibrated TCAD simulation flow has been used to comprehensively study the process, device and circuit architectures so early in the technology path-finding process,” said Anda Mocuta, logic device manager at imec.

The Synopsys TCAD tools used in this collaboration include the industry-standard simulators Sentaurus Process, Sentaurus Device, Sentaurus Interconnect and Raphael. 3D process structures are read into Raphael for extracting the resistance and capacitance of MOL structures and are combined with Sentaurus-derived compact models for circuit simulation with Synopsys’ HSPICE tool. This simulation flow enables technologists to evaluate the speed and power consumption of ring oscillators and other test circuits in the early stage of technology development, thereby closely linking technology development and selection with circuit-level targets.

“This expanded collaboration with imec builds on the success of previous collaborations to address key challenges at the 5 nanometer technology node,” said Howard Ko, senior vice president and general manager of the Silicon Engineering Group at Synopsys. “Imec’s advanced technology prototyping and characterization capabilities make it an ideal partner for our development and calibration of advanced Sentaurus TCAD models to address the significant technical and business challenges that our customers face in the development of 5nm node technologies.”

What’s next for MEMS?


December 16, 2014

By Paula Doe, SEMI

The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

While the IoT may be all about sensors, it is not necessarily a bonanza for most traditional MEMS sensor makers. “The surprising winner turns to be optical MEMS for optical cross connect for the data center, where big growth is coming,” said Jérémie Bouchaud, IHS Director and Sr. Principal Analyst, MEMS & Sensors, at the recent MEMS Industry Group (MIG) “MEMS Executive Congress” held in Scottsdale, Arizona from November 5-7.

The market for wearables will also see fast growth for the next five years, largely for smart watches, driving demand for motion sensors, health sensors, sensor hubs and software –but even in 2019 the market for sensors in wearables will remain <5% the size of the phone/tablet market, IHS predicts.  The greater IoT market may reach billions of other connected devices in the next decade, but sensor demand will be very fragmented and very commoditized. Smart homes may use 20 million sensors in 2018, but many other industrial applications will probably each use only 100,000 to 2-3 million sensors a year, Bouchaud noted.

And most of this sensor market will be non-MEMS sensors, some mature and some emerging, including light sensors, fingerprint sensors, pulse sensors, gas sensors, and thermal sensors, all requiring different and varied manufacturing technologies.  Much of the new sensor demand from automotive will be also be for non-MEMS radar and cameras, though they will also add MEMS for higher performance gyros, lidar and microbolometers, according to IHS. Expect major MEMS makers to diversify into more of these other types of sensors.

MEMS Exec Bouchaud - IHS - MIG US 2014_Page_22_Resized

Yole Développement CEO Jean Christophe Eloy looked at how the value in the IoT would develop.  While the emerging IoT market is initially primarily a hardware market, with hardware sales climbing healthily for the next five years or so, it will quickly become primarily a software and services market.  In five to six years hardware sales will level off, and the majority of the value will shift to data processing and value added services.  This information service market will continue to soar, to account for 75% of the $400 Billion IoT market by 2024.

MEMS Exec JC Eloy_Market Panel_MIG 2014 V1_Page_28_Resized

Re-thinking the business models?

The IoT will bring big changes to the electronics industry, from new technologies to new business models, and new leaders, suggested George Liu, TSMC Director of Corporate Development.  He of course also argued that the high volume and low costs required for connected objects would drive sensor production to high volume foundries, and drive more integration with CMOS for smart distributed processing at CMOS makers.

Liu projected these changes would mean a new set of companies would come out on top. Few leading system makers managed to successfully transition from the PC era to the mobile handset era, or from the mobile handset era to the smart phone era, as both the key technologies and the winning business models changed, and chip makers faced disruption as well. “For one thing, the business model changed from making everything in house to making nothing,” he noted. “The challenge is to focus on where one is most efficient.”

“The odds of Apple or Google being the dominant players in the next paradigm is zero,” concurred Chris Wasden, Executive Director, Sorenson Center for Discovery and Innovation at the University of Utah.

Lots of other things will have to change to enable the IoT as well. Liu projected that devices will need to operate at near threshold or even sub-threshold voltages, with “thinner” processing overhead, while the integration of more different functions will redefine the system-in-a-chip. Smaller and lower cost devices will require new materials and new architectures, new types of heterogenous integration and wafer-level packaging, and an ecosystem of standard open platforms to ease development. TSMC’s own MEMS development kit has layout rules, but not yet behaviorial rules, always the more challenging issue for these mechanical structures. “That’s the next big thing for us,” he asserted. “These huge gaps mean huge opportunities.”

IDMs and systems companies still likely to dominate                     

Still, the wide variety, and sometimes tricky mechanics and low volumes, of many MEMS devices have been a challenge for the volume foundries.  The fabless MEMS model has seen only limited success so far and is unlikely to see much in the next decade either, countered Jean Christophe Eloy, CEO of Yole Développement, who pointed out that some 75% of the MEMS business is dominated by the four big IDMs who can drive costs down with volumes and diversified product lines. To date, only two fabless companies—InvenSense and Knowles—are among the top 30 MEMS suppliers.

Most of the rest of the top 30 are system makers with their own fabs, making their own MEMS devices to enable higher value system products of their own, which is likely to continue to remain a successful approach, as the opportunities for adding value increasingly come from software, processers, and systems.  “MEMS value has always been at the system level,” noted Eloy.

GE’s recent introduction of an improved MEMS RF switch to significantly reduce the size and cost of its MRI systems is one compelling example, with the potential of the little MEMS component to greatly extend the use of this high-contrast soft-tissue imaging technology.  Though the company sold off its general advanced sensors unit last year to connector maker Amphenol Corp., it is still making its unique RF switch using a special alloy in house in small volumes as a key enabler of its high value MRI systems. These imagers work by aligning the spin of hydrogen nuclei with a strong magnet, tipping them off axis with a strong RF pulse from an antenna, then measuring how they snap back into alignment with lots of localized antennas with low power RF switches close to the body.  “We’re now launching a new receive chain using MEMS RF switches,” reported Tim Nustad, GM and CTO, Global Magnetic Resonance, GE Healthcare. “Later we can see a flexible, light weight MRI blanket.”

Opportunity for smaller, lower power, lower cost technologies

So far, MEMS makers have driven down the cost of devices by continually shrinking the size of the die.  But that may be about to change, as the mechanical moving structures have about reached the limit of how much smaller they can get and still produce the needed quality signal.  That’s opening the door for a new generation of devices using different sensing structures and different manufacturing processes.  For inertial sensors, options include bulk acoustic wave sensing from Qualtre, piezoresistive nanowires from Tronics and CEA/Leti, and even extrapolating gyroscope-like data with software from accelerometers and magnetometers. MCube’s virtual gyro with this approach, now in production with some design wins, claims to save 80% of the power and 50% of the cost of a conventional MEMS gyro.

Piezoelectric sensing, often with PZT films, is also drawing attention, with products in development  for timing devices and microphones. Sand9 claims lower noise and lower power for its piezoelectric MEMS timing, now starting volume manufacturing for Intel and others for shipments in 1Q15.  It has also recently received a patent for piezo microphone, while startup Vesper (formerly known as Baker-Calling and then Sonify) also reports working with a major customer for its piezoelectric MEMS microphone.

More open platforms ease development of new applications of established devices

The maturing ecosystem of open development platforms across the value chain is helping to ease commercialization of new applications. The two latest developments in this infrastructure are a standard interface to connect all kinds of different sensors to the controller, and an open library of basic sensor processing software. The MIPI Alliance brought together major users and suppliers—ranging across STMicroelectronics and InvenSense, to AMD and Intel, to Broadcom and Qualcomm, to Cadence and Mentor Graphics—to agree on an interface specification to make it easier for system designers to connect and manage a wide range of sensors from multiple suppliers while minimizing power consumption of the microcontroller.  Meanwhile, sensor makers and researchers are making a selection of baseline algorithms available for open use to ease development of new products.  Offerings include Freescale’s inertial sensor fusion and PNI Sensors’ heart rate monitoring algorithms, along with other contributions from Analog Devices, Kionix, NIST, UC Berkeley and Carnegie Mellon to start. The material will be available through the MIG website.

Plenty of companies have also introduced their own individual platforms to ease customer development tasks as well, ranging from MEMS foundries’ inertial sensor manufacturing platforms to processor makers’ development boards and kits. Recently STMicroelectronics also adding its sensor fusion and other software blocks to its development platform.

KegData is one example of a company making use of these platforms to enable development of a solution for a niche problem – an automated system for telling pub owners how much beer is left in their kegs, using a Freescale pressure sensor and development tools. Currently the only way to know when a beer keg is empty is to go lift and weigh or shake it, a problem for efficiently managing expensive refrigerated inventory.  Adding a pressure sensor in the coupler on top of the keg allows the height of the beer to be measured by the differential pressure between the liquid and the gas above it. The sensor then sends the information to a hub controller that communicates with the internet, letting the pub manager know to order more, or even automatically placing the order directly with the distributor.  The startup’s business model is to give the system to distributors for free, but sell them the service of automating inventory management for their customers, saving them the significant expense of sending drivers around to shake the kegs and take pre-orders.

More broadly, MEMS microphones are poised to continue to find a wide range of new applications. IHS’ Bouchaud  pointed out that cars will soon each be using 12-14 MEMS microphone units, to listen for changes in different conditions, while home security applications will use them to detect  security breaches from unusual patterns of sounds, from people in the house to dogs barking. Startup MoboSens says it converts its chemical water quality data into audio signals to feed it into the phone’s mic port for better quality.

Opportunities still for new types of MEMS devices

Growth will also continue to come from new MEMS devices that find additional ways to replace conventional mechanical parts with silicon. Eloy noted that MEMS autofocus units may finally be the next breakout device, as they have started shipping in the last few weeks, and aim at shipping for products in 2015.  MEMS microspeakers are also making progress and could come soon. But ramping new devices to the high volumes demanded by consumer markets is particularly challenging. “The only way to enter the market is with new technology, but high volume consumer markets make entry very hard for new devices,” he said. “The market is saturated, wins depend on production costs, and not everyone can keep up…. The last significant new device was the MEMS microphone, and that was ten years ago.”

But innovative new MEMS technologies also continue to be developed for initial applications in higher margin industrial and biomedical fields. One interesting platform is the MEMS spectrometer from VTT Technical Research Center of Finland.  This robust tunable interferometer essentially consists of an adjustable air gap between two mirrors, made of alternating ALD or LPCVD bands of materials with different defraction indexes, explained Anna Rissanen, VTT research team leader for MOEMS and bioMEMS instruments. The structure can be tuned by different voltages to filter particular bands of light, while a single-point detector, instead of the usual array, enables very small and low cost spectrometers or hyper spectral cameras. VTT spinout Spectral Engines is commercializing near-IR and mid-IR sensors aimed at detecting moisture, hydrocarbons and gases in industrial applications.  Other programs have developed sensors for environmental analysis by flyover by nano satellites and UAVs, sensors for monitoring fuel quality to optimize energy use and prevent engine damage, and sensors that can diagnose melanoma from a scan of the skin.

Keep up with these changing manufacturing technology demands at upcoming MEMS events at SEMICON China 2015SEMICON Russia 2015SEMICON West 2015, and at the new European MEMS Summit planned for Milan in September.

Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine. The cash transaction paid the holders of Peregrine common shares $12.50 per share.

Peregrine will continue to market its high-performance, integrated RF solutions under the Peregrine brand, as a wholly owned subsidiary of Murata Electronics North America, Inc. Peregrine solutions leverage the UltraCMOS technology platform, a patented, advanced form of silicon-on-insulator (SOI) that delivers the monolithic integration and superior performance necessary to solve the world’s toughest RF challenges. Peregrine will continue to offer its integrated RF solutions to markets such as communications (mobile, wireless infrastructure, land mobile radio, broadband and wireless), industrial (test and measurement, automotive, Internet of Things) and aerospace. With the close of this acquisition, Murata gains Peregrine’s strong intellectual property portfolio, which contains over 180 filed and pending patents.

“Today, we deepen our existing partnership and officially welcome Peregrine Semiconductor to the Murata family,” said Norio Nakajima, Executive Vice President, Director of Communication Business Unit of Murata. “With this acquisition, we combine Murata’s world-leading mobile RF module capabilities with Peregrine’s best-in-class RF products. We’re eager to leverage Peregrine’s innovations, such as the industry’s first reconfigurable RF front-end system UltraCMOS Global 1, and expand the Murata business into all the markets that Peregrine currently offers RF solutions. This acquisition further defines our stance as an ‘Innovator in Electronics’.”

“After years of a successful partnership, we’re happy to become a part of the Murata team, the world’s leading RF module and filter provider,” said Jim Cable, PhD, President and CEO of Peregrine Semiconductor. “Murata already has deep relationships and trust built in all of our target markets. We believe we can offer their customer base exciting new RF capabilities.  With the reach of Murata products and the power of our UltraCMOS technology, we believe we will change the course of RF history. In the case of mobile, it will speed the industry’s transition to an integrated, all-CMOS RF front-end. Together, we’re looking forward to accomplishing great things.”

Founded in 1944 in Kyoto, Japan, Murata celebrated its 70th anniversary in October. Murata has grown into a global enterprise composed of 101 companies in 23 nations. As an “Innovator in Electronics,” Murata designs, manufactures and supplies advanced electronic materials, leading-edge electronic components and multi-functional, high-density modules. Murata innovations can be found in a wide range of applications from mobile phones to home appliances, and automotive applications to energy management systems and healthcare devices.

The Global Semiconductor Alliance (GSA) announced the recipients honored at the 2014 GSA Awards Dinner Celebration that took place in Santa Clara, California. The commemorative event celebrated GSA’s 20th year anniversary. Over the past 20 years, the awards program has recognized the achievements of semiconductor companies in several categories ranging from outstanding leadership to financial accomplishments, as well as overall respect within the industry.

This year, in recognition of GSA’s 20 years of global collaboration, there was a special presentation honoring past Dr. Morris Chang Exemplary Leadership Award recipients, GSA’s most prestigious award.

GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities. Winners include the “Most Respected Emerging Public Semiconductor Company Achieving $100 million to $250 million in annual sales Award” presented to Ambarella, Inc.; “Most Respected Public Semiconductor Company achieving $251 million to $1 billion in annual sales Award” awarded to InvenSense, Inc.; and “Most Respected Public Semiconductor Company achieving greater than $1 billion in annual sales Award” received by QUALCOMM Incorporated.

The “Most Respected Private Company Award” was voted on by GSA membership and presented to Spreadtrum Communications Inc. Other winners include “Best Financially Managed Company achieving up to $500 Million in annual sales Award” presented to Montage Technology and “Best Financially Managed Semiconductor Company achieving greater than $500 million in annual sales Award” earned by Skyworks Solutions, Inc. Both companies were recognized based on their continued demonstration of the best overall financial performance based on specific financial metrics.

GSA’s Private Awards Committee, made up of members of the Emerging Company CEO Council, venture capitalists and select industry entrepreneurs, chose the “Start-Up to Watch Award” winner by identifying a company that has demonstrated the potential to positively change its market or the industry through the innovative use of semiconductor technology or a new application for semiconductor technology. This year’s winner is Ineda Systems, Inc.

As a global organization, the GSA recognizes companies headquartered in the Europe/Middle East/Africa and Asia-Pacific regions. Award winners are chosen by the leadership council of each respective region and are semiconductor companies that demonstrate the most strength when measuring products, vision, leadership and success in the marketplace. The recipient of this year’s “Outstanding Asia-Pacific Semiconductor Company Award” is MediaTek Inc. and “Outstanding EMEA Semiconductor Company Award” is Infineon Technologies AG.

Semiconductor financial analyst Rajvindra Gill from Needham & Company presented this year’s “Favorite Analyst Semiconductor Company Award.” The criteria used in selecting this year’s winner included historical as well as projected data such as per cent stock and revenue increase, net profit margin, revenue forecasts, and product performance. Needham & Company presented to Synaptics, Inc.

The Awards Dinner Celebration was made possible by title sponsor TSMC, VIP and networking reception sponsor Optimal+, as well as general sponsors Advantest, Alix Partners, Altera, AMD, Amkor, ARM, ASE Group, Bank of America Merrill Lynch, Broadcom, Cadence Design Systems, CSR, eSilicon, GLOBALFOUNDRIES, IBM, Jefferies Group LLC, J.P. Morgan, KPMG, Marvell, MediaTek, Mentor Graphics, Micron, Microsemi, Model N, Morgan Stanley, Needham & Co., NVIDIA, Open-Silicon, QUALCOMM, Qorvo (RFMD + TriQuint), QuickLogic, Rambus, Samsung, SanDisk, Silicon Labs, SMIC, Synopsys, UMC, VeriSilicon and Wells Fargo.

The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association. He will assume his new role in January, succeeding Brian Toohey, who has been president & CEO since 2010 and announced his plans to leave the association in 2013 to join New Hampshire-based DEKA Research & Development Corporation.

As Senior Vice President for Global Policy at the Information Technology Industry Council (ITI), Neuffer has been responsible for all aspects of ITI’s global government relations covering a wide range of policy areas, including trade, cyber security, standards, regulatory, and privacy. Before joining ITI, John served for over seven years at the Office of the U.S. Trade Representative (USTR) as Deputy Assistant USTR for Asia-Pacific Economic Cooperation and Deputy Assistant USTR for Japan.

“John Neuffer’s extensive trade and tech industry experience positions him well to build on the strong tradition of SIA’s leadership role for the U.S. semiconductor industry,” said Brian Krzanich, CEO of Intel and SIA Chairman. “John’s deep understanding of the importance of technological innovation to the U.S. economy and proven track record of success will serve him well as he takes the helm at SIA. On behalf of the Board of Directors, I would like to thank Brian Toohey for his outstanding leadership and service to the industry.”

“I am honored to assume the leadership of this outstanding organization that has made such an enduring impact to the semiconductor industry and the U.S. economy,” said Neuffer. “I am excited to advance the mission of SIA and its member companies at a time when the global landscape offers both great opportunities and great challenges.”

“I applaud the selection of John Neuffer as SIA’s next president & CEO,” said Brian Toohey. “I have had the opportunity to work closely with John on a number of key international initiatives during my time at SIA and know he will be a highly effective leader for the organization. It has been an honor to serve on behalf of an exceptional association and industry, and I wish John well in his new role.”

Neuffer is an executive committee member and former chairman of the U.S. Information Technology Office in Beijing and a member of the Industry Trade Advisory Committee on ICT, Services, and Electronic Commerce. Prior to his tenure with USTR, Neuffer lived and worked in Japan for 11 years, where he was an expert in Japanese politics and policy.

Lattice Semiconductor Corporation today announced that its Board of Directors has appointed Jeff Richardson to the company’s Board of Directors and Audit Committee. Mr. Richardson brings to the Board more than twenty-seven years’ experience in the semiconductor industry.

Mr. Richardson joined LSI Corporation in 2005 and most recently served as Executive Vice President and Chief Operating Officer until the company’s acquisition by Avago Technologies in May 2014. He earlier served as executive vice president of various LSI divisions, including the Semiconductor Solutions Group, Networking and Storage Products Group, Custom Solutions Group and Corporate Planning and Strategy. Before joining LSI, Mr. Richardson held various management positions at Intel Corporation, including Vice President and General Manager of Intel’s Server Platforms Group, and the company’s Enterprise Platforms and Services Division. Mr. Richardson’s career also includes serving in technical roles at Altera Corporation; Chips and Technologies; and Amdahl Corporation.

“Mr. Richardson is an excellent addition to our Board of Directors. He is a seasoned semiconductor industry executive with experience successfully building, acquiring, and transforming very complex and large businesses. We look forward to his informed perspective and contributions as Lattice Semiconductor continues to make impressive strides in the markets it serves,” stated Patrick Jones, Lattice’s Chairman of the Board.

Mr. Richardson, 49 years old, presently serves as a Director of Ambarella Corporation, a developer of low-power, high-definition and Ultra HD video compression and image processing solutions. From 2011 until 2013, Mr. Richardson served on the Board of Directors of Volterra Corporation. He received a Bachelor of Science Degree in Electrical Engineering from the University of Colorado, Boulder

The Linde AG Supervisory Board has appointed Dr. Christian Bruch and Bernd Eulitz as new members of its Executive Board with effect from January 1, 2015. Bruch and Eulitz will succeed Professor Dr. Aldo Belloni, who will step down from the Linde AG Executive Board and retire when his contract runs out on December 31, 2014. Belloni has worked in leading roles in Linde AG since 1980. He has been a member of the Executive Board since 2000 and has in recent years been responsible for the Engineering Division and also for the EMEA segment (Europe, Middle East, Africa) and the tonnage (on-site) Global Business Unit of the Gases Division.

“For more than three decades, Aldo Belloni has given exceptional service to The Linde Group and has made a significant contribution to the successful performance of the company,” said Dr Manfred Schneider, Chairman of the Linde AG Supervisory Board. “We would like to thank him for his great achievements and tireless commitment to Linde.”

Christian Bruch will assume Belloni’s responsibility on the Linde AG Executive Board for the Group’s Engineering Division. Bruch, who holds a doctorate in engineering, has worked in management roles in Linde’s Gases and Engineering Divisions since 2004. His most recent position was on the Management Board of Linde Engineering.

Bernd Eulitz will be the Executive Board member responsible for the EMEA segment of the Group’s gases business. Since he joined the company in 2004, Eulitz, a graduate engineer, has assumed various management functions in the Gases Division. Recently, he has been based in Singapore and has been responsible for the South & East Asia Regional Business Unit.

In the 2013 financial year, The Linde Group generated revenue of EUR 16.655 bn, making it the largest gases and engineering company in the world with approximately 63,500 employees working in more than 100 countries worldwide.

TSMC held its 14th annual Supply Chain Management forum on December 4, 2014 to show appreciation for the support and contributions of its suppliers in 2014, and to recognize nine outstanding equipment and materials suppliers. The theme of this year’s forum was “Collaborate and Win Together,” and over 600 suppliers around the world in the fields of equipment, materials, packaging, testing, facilities, IT systems and services, and environmental and waste management services participated in the forum.

“TSMC’s success comes from collaborating with our customers and suppliers through our Grand Alliance so that we magnify each others’ innovations and stand together as a most powerful competitive force in the semiconductor industry,” said TSMC Co-Chief Executive Officer Dr. Mark Liu. “Our supplier partners are a critical part of this alliance, and we look forward to reaping the rewards of many years of strong growth together.”

“We are very grateful for our supplier partners’ full support as we ramp our 20nm capacity at a record-breaking rate. This year’s award winners have provided exemplary service to TSMC,” said TSMC Senior Vice President and Chief Information Officer Dr. Steve Tso. “Our hard work together over the past year has laid strong foundation for the upcoming ramp in 16nm, which will generate even more opportunities for us all.”

In addition to recognizing suppliers’ excellent overall performance with the “Supplier Excellence Award,” TSMC also established the “Outstanding Contribution Award” this year to recognize a company that collaborated closely with TSMC in the spirit of the Grand Alliance to produce first-rate results.”

The winners are as follows:

Outstanding Contribution Award
Applied Materials, Inc. –Outstanding Contribution in EPI/PVD Equipment and Local Service

Excellent Performance Award [In alphabetical order]
EBARA Corporation- Excellent Performance in CMP Equipment
Fujifilm Electronic Materials- Excellent Performance in CMP Slurry
Hitachi High-Technologies Corporation – Excellent Performance in Etch Equipment
JX Nippon Mining & Metals Corporation- Excellent Performance in Metal Target
KLA-Tencor Corporation- Excellent Performance in Inspection Equipment
Shin-Etsu Chemical Co., Ltd- Excellent Performance in Lithography Material
SUMCO Corporation- Excellent Performance in Raw Wafer Material
Tokyo Electron Limited- Excellent Performance in Equipment Productivity Improvement