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Silicon carbide is one of the most interesting semiconductor materials in electrical power components for energy savings. Components are already in use today in hybrid cars and solar power inverters. The high efficiency of these components minimizes energy loss and makes green power economically feasible.

A new company, Epiluvac AB, has entered the scene with the ambition to supply the needed deposition equipment.

Much of the pioneering research around silicon carbide was done at Linköping University in Sweden, where the highly successful hot-wall CVD reactor type was developed. This reactor type has been successfully used all over the world by the most prestigious labs, and is well known for its supreme qualities.

The new company, Epiluvac AB, will continue the development of this reactor type. The complete team at Epiluvac has many years of experience developing hot-wall systems.

Today, Sweden has a unique cluster of companies and universities in the forefront of silicon carbide technology. The hot-wall CVD reactor has been the workhorse in R&D labs all over the world, and a large number of scientific papers have been published around material grown in them.

“We are convinced that Epiluvac AB will be able to supply the best possible CVD tools to R&D labs around the world,” says Bo Hammarlund, managing director of Epiluvac AB. “The system design during three decades has proven to meet the high expectations of the best researchers around the world.”

“It is also our ambition to stay in close contact with our customers in order to customize the tools for the specific needs. We have a lot of experience in doing this. With the unique cluster of silicon carbide companies we have in Sweden, we are also able to pick up new demands at an early stage for not only SiC but also GaN, AlN, and graphene.”

The hot-wall reactors have already proven to be successful tools for producing graphene. Epiluvac is one partner in the Strategic Innovation graphene program led by Chalmers University, Gothenburg.

Epiluvac AB offices and manufacturing facilities are located in the Ideon Science Park, Lund, Sweden, close to Lund University and the multi-disciplinary research centers ESS and Max IV in one of the most exciting research regions in Europe.

SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’’s chip makers, today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014. The billings figure is 5 percent lower than the first quarter of 2014 and 28 percent higher than the same quarter a year ago. The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 100 global equipment companies that provide data on a monthly basis.

Worldwide semiconductor equipment bookings were $9.96 billion in the second quarter of 2014. The figure is 9 percent higher than the same quarter a year ago and 1 percent higher than the bookings figure for the first quarter of 2014.

The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:


Region


2Q2014


1Q2014


2Q2013

2Q14/1Q14
(Qtr-over-Qtr)

2Q14/2Q13
(Year-over-Year)
Taiwan

2.48

2.59

2.73

-5%

-9%
North America

2.32

1.85

1.16

25%

101%
Korea

1.73

2.03

1.22

-15%

42%
China

1.03

1.71

0.84

-40%

23%
Japan

1.00

0.96

0.74

4%

35%
Europe

0.57

0.58

0.36

-3%

58%
ROW

0.50

0.42

0.51

18%

-2%
Total

9.62

10.15

7.54

-5%

28%

Source: SEMI/SEAJ September 2014

Note: Figures may not add due to rounding.

Spending on microwave RF power semiconductors continues to tick upward as the availability of new gallium nitride (GaN) devices for 4 to 18GHz becomes more pervasive. Point-to-point communications, SATCOM, radars of all types, and new industrial/medical applications will all benefit by the introduction of these high-power GaN devices.

“While gallium arsenide (GaAs) devices are presently the backbone of microwave RF power it is gallium nitride that will drive growth going forward,” notes ABI Research director Lance Wilson. “GaN can operate at much higher voltages and at power levels that were difficult or impossible to reach using GaAs.”

In addition to the above mentioned application segments, microwave GaN is finally reaching the performance points that can start to seriously challenge travelling wave tube applications for new designs that have historically used the latter.

“Microwave RF Power Semiconductors” examines Microwave RF power semiconductor devices with power outputs of greater than 3 watts and those that operate at frequencies of 4 to 18 GHz. This study is part of ABI Research’s ongoing effort to track the major changes in the RF power industry.

This release contains analysis of the six main vertical segments (C-Band GaAs, C-Band GaN, X-Band GaAs, X-Band GaN, Ku-Band GaAs, and Ku-Band GaN) and is further expanded to 28 application sub-segments.

These findings are part of ABI Research’s High-Power RF Active Devices Market Research.

ABI Research provides in-depth analysis and quantitative forecasting of trends in global connectivity and other emerging technologies.

RF Micro Devices, Inc. today announced the preliminary results of its special meeting of shareholders held earlier this morning to approve its agreement and plan of merger and reorganization with TriQuint Semiconductor, Inc.

RFMD shareholders voted to approve the merger agreement and to approve, by non-binding advisory vote, the compensation arrangements for RFMD’s named executive officers in connection with the transaction. TriQuint’s stockholders are scheduled to vote on the merger agreement and other matters at a special meeting to be held later today.

“Today’s shareholder vote is a significant endorsement of our vision to create the new leader in RF solutions,” Bob Bruggeworth, president and CEO of RFMD, said. “With the closing of this transaction, we will bring under one roof the industry’s broadest portfolio of critical enabling technologies, with expertise in mobile devices and complex infrastructure and global aerospace/defense applications.”

RFMD and TriQuint anticipate the closing of the transaction will occur in the second half of calendar 2014 subject to the receipt of regulatory approval and other customary closing conditions.

RFMD is a designer and manufacturer of high-performance radio frequency solutions.

Fujitsu Semiconductor America (FSA) today announced that Shinichi “James” Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

Machida, who has more than 25 years’ experience in semiconductor marketing and overseas sales support, has held a wide range of management positions at Fujitsu Microelectronics Limited (FML) and its affiliates, serving as president of Fujitsu Microelectronics Asia Pte. Ltd. (FMAL) headquartered in Singapore and Fujitsu Microelectronics Pacific Asia Ltd. (FMP) headquartered in Hong Kong from October 2006 until his appointment as Fujitsu Semiconductor America’s President and CEO from June 2008 to April 2011.  From July 1990 through June 1995, he was assigned to Fujitsu Microelectronics, Inc. (FMI), a predecessor of Fujitsu Microelectronics America (FMA) and FSA. During that time, he worked in FMA’s operations group, managing special projects with FMA’s strategic customers.

“Fujitsu Semiconductor America has developed a long history of world-class research, advanced product development, and strong sales throughout the Americas,” said Machida.  “I am pleased and excited to return to the US and look forward to my new tenure at FSA, and to continuing and strengthening the excellent product development and customer service that have been a hallmark of the company for many years.”

Fujitsu Semiconductor America, Inc. (FSA) is a designer and developer of semiconductor products and solutions for new generations of consumer, communications, automotive and industrial products. Founded in 1979 and headquartered in Sunnyvale, California, Fujitsu Semiconductor America is a wholly owned subsidiary of Fujitsu Semiconductor Limited (FSL), Japan.

Although operators will continue to face strong international competition, new opportunities in next-generation semiconductors and electronic inputs will encourage operators to invest in product development. For these reasons, industry research firm IBISWorld has updated a report on the Semiconductor and Circuit Manufacturing industry in its growing industry report collection.

Semiconductors are a core component of electronic devices and form a vital part of products ranging from devices and systems (e.g. computers, cell phones and televisions) to solutions and services (e.g. internet providers, telecommunications and broadcasting services). The Semiconductor and Circuit Manufacturing industry is one of the top export industries in the United States and, according to the Semiconductor Industry Association (SIA), indirectly provides jobs to 250,000 Americans. Valued at $79.5 billion, the industry has grown at an average annual rate of 4.8% in the five years to 2014.

“However, a portion of this growth represents a recovery from the industry’s dismal performance in 2009,” according to IBISWorld Industry Analyst Darryle Ulama.

Revenue is expected to contract by 1.7% in 2014, as demand for US-made semiconductors is offset by international competition and aggressive import penetration. Emerging countries, particularly in East Asia, have siphoned semiconductor manufacturing away from the United States through industrial policy, tax incentives and high-tech corridors with low-cost labor. Even as global demand for semiconductors rises, industry manufacturers are operating in a highly competitive global industry. “Combined with price reductions, production outsourcing and international competition have prevented the industry from achieving higher revenue growth in the past five years,” says Ulama These factors have also contributed to the industry’s high revenue volatility, as industry performance becomes more closely embedded into the globalized electronics value chain.

In the five years to 2019, greater research and development efforts will sustain the industry. Although operators will continue to face strong international competition, new opportunities in next-generation semiconductors and electronic inputs will encourage operators to invest in product development. For example, manufacturers will focus on producing wide bandgap semiconductors that are smaller, faster and more efficient than their silicon counterparts. Additionally, greater demand for industry products in smart grid technology and smart vehicles will spur revenue growth.

SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’’s growing role in the global semiconductor industry. The executive event held at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City, brings together key decision-makers shaping the future of the industry in Vietnam, and international participants from major companies in the semiconductor manufacturing supply chain.  Keynote presentations include Sherry Boger, Vietnam general manager, Intel Corporation, and Pham B Tuan, CNS, who will both provide their perspectives on current and future industry development in Vietnam.

In total for 2014 and 2015, SEMI estimates a spending of almost $4 billion on front-end and back-end equipment in the Southeast Asia region, and another $13 billion in spending on materials including $3 billion on fab related materials. In addition, according to the SEMI World Fab Forecast, Southeast Asia is home to over 35 production fabs covering Foundry, Compound Semiconductors, MEMS, Power, LED, and other devices. Specific to backend manufacturing, Gartner reports that the Southeast Asia microelectronics manufacturing market accounts for 27 percent of the world’s assembly, packaging, and test production square footage.

At this year’s summit, executives from leading microelectronics companies —and semiconductor equipment and materials companies — will meet with delegates representing Vietnamese government, academia, research, and industry to explore and discuss the key strategies and opportunities in the growing Vietnam semiconductor industry. The event includes:

  • Market Overviews: Presentations by Bettina Weiss, SEMI Headquarters and Clark Tseng, SEMI Taiwan
  • Semiconductor Manufacturing in Vietnam: Presentations by: Sherry Boger, Intel; Pham B Tuan, CNS; Solomon Ng, STMicroelectronics; Todd Curtis, Fab-Finder; and Cor Claeys, imec
  • Two Panel Discussions: Investor Perspectives (moderated by Eduard Hoeberichts, FabMax) and Education and Workforce Development (moderated by Bettina Weiss, SEMI)
  • Tabletop exhibition and discussions

“Vietnam is committed to the global microelectronics world and moving beyond backend,” said Kai Fai Ng, president SEMI Southeast Asia. As the first major new fab project in Vietnam, many challenges still remain, from infrastructure and process technology to device design and IP creation and protection. The SEMI Vietnam event provides a key platform to advance important discussions and decision-making in this promising and growing market.”

The connections and relationships forged during the Summit are expected to drive further growth over the next decade and beyond. Global stakeholders with an interest in Vietnam’’s semiconductor market, including those from the equipment, materials, and device and R&D communities, are invited to share their vision, insights and outlook with Vietnam’s local business, technology and educational communities.

The 2nd SEMI Vietnam Semiconductor Strategy Summit is organized by SEMI and co-organized by Saigon Hi-Tech Park (SHTP) and Ho Chi Minh City Semiconductor Industry Association (HSIA).  The premier sponsor is FabMax. Individual registration costs US$750 for SEMI members and US$950 for non-members. Registration and additional information is available online at www.semi.org/vietnam.

The business model and structure of the manufacturing industry has grown well beyond the scope of a single enterprise and location, making radio frequency identification (RFID) solutions indispensable to its functioning. With increasing adoption of lean manufacturing strategies prompting most industry players to focus on and outsource niche operations within global supply chains, RFID solutions will help sustain high levels of performance.

New analysis from Frost & Sullivan, Analysis of the Global RFID in Manufacturing Market, finds that the market earned revenues of $1.29 billion in 2013 and estimates this to nearly quadruple to $4.99 billion in 2020. The study covers passive, active and battery-assisted passive RFID. Over the forecast period, demand for active RFID will increase to fulfill business needs more efficiently.

Use of RFID technologies enhances supply chain visibility and total control of inventory, operations and logistics across diverse manufacturing points. As RFID solutions facilitate real-time tracking of assets in different locations, it increases productivity enabling cost-effective allocation of resources. These benefits, along with reduced labor requirements, information accuracy, improved sales and customer service boost RFID adoption among manufacturing participants looking to realize higher return on investment.

“Opportunities for RFID solution providers exist across all application segments within the manufacturing industry,” said Frost & Sullivan Measurement & Instrumentation Senior Research Analyst Nandini Bhattacharya. “Growth prospects in the automotive and aerospace manufacturing sectors are especially promising owing to supportive industry regulations.”

However, as long as the economic situation remains uncertain, customers – particularly small and medium enterprises – will be reluctant to invest in RFID solutions unless they see a direct correlation between implementation of these technologies and cost-saving advantages. Cost is, therefore, a discerning factor for consumers’ RFID purchasing decisions. Scalability of solutions and technology support will be important criteria influencing uptake.

“Partnerships and acquisitions are rampant and necessary for this market to continue to expand,” noted Bhattacharya. “Without such collaborations, the breadth of knowledge and expertise needed for success is typically too wide even for the largest of companies.”

Analysis of the Global RFID in Manufacturing Market is part of the  Growth Partnership Service program. Frost & Sullivan’s related studies include: Analysis of the Global 2D-Barcode Scanners Market, Analysis of the Global RFID Tags Market, Analysis of the Global RFID and Bar Code Printers Market, and Emerging Opportunities in Global Biometrics Market. All studies included in subscriptions provide detailed market opportunities and industry trends evaluated following extensive interviews with market participants.

The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October. PE2014 is an ideal forum to meet technology leaders and professionals from industry, academia, and research organizations focused on developing the next-generation of plastic and organic electronics.

According to analysts, the plastics electronics market is growing rapidly and is expected to reach $13 billion by 2020 driven by increasing applications in the semiconductor and electronics market. Applications like large area displays, solar panels and printed electronics are now responsible for a substantial portion of the PE market, and emerging applications like OLED, thin-film batteries, and sensors are emerging growth opportunities.

Manufacturability of Plastic Electronics has made major steps in the last year, moving from research level to industrial relevance.  Still, numerous barriers to commercialization must be overcome — from material development to integration, manufacturing, processing, and assembly issues. PE2014 covers these issues currently driving development and impeding progress.

Plastic electronics’ imminent transition from the R&D phase to the industrialization stage is highlighted by several keynote presentations at the PE2014 (www.plastic-electronics.org).  Fiddian Warman, founder and managing director, SODA, will present on, “How design type approaches can be effective in facilitating innovative technological development and open up new markets and opportunities,” and John Heitzinger, president, Soligie, Inc., will delve into “Advances in Additive Manufacturing of Electronics.”

The exposition and conference cover the entire span of Plastic Electronics —Hybrid and Heterogeneous Integration; Organic Electronics; OLEDs, Displays, and Lighting; and Flexible Photovoltaics — offering the latest developments for engineers, material experts, manufacturing professionals and industry strategists. Highlights are:

  • Business Case session —  speakers from imec, ISORG, Nokia, Philips Research, Plastic Logic, SODA, STMicroelectronics, Valeo, and Yole Developpement.
  • Manufacturing Panel Discussion on “Building a Leadership Position in PE” — panelists from Bosch, Cambridge, CEA, Joanneum Research, and Ynvisible.
  • Manufacturing Session — presenters from Applied Materials, Beneque, CEA Tech, Dupont Teijin Films UK Ltd, Joanneum Research, NovaCentrix, Roth and Rau B.V.,  Soligie, Universal Laser Systems, Ynvisible — as well as Cambridge University, the European Commission, and VTT (Finland).
  • Technologies/Materials Session — features speakers from Arkema, Arizona State University, CEA-LITEN, Corning, Fraunhofer, imec, and Sunchon National University.

The Plastic Electronics Exhibition & Conference 2014 is hosted by SEMI and representatives of leading industry companies, research centers and institutes. SEMI focuses its activities on roadmaps, standardization, research and statistics, conferences, exhibitions and public policy worldwide.  For more information on the conference, presenters, topics, events and exhibitors, visit www.plastic-electronics.org.

During the three days of SEMICON Europa 2014 (www.semiconeuropa.org), more than 8,000 visitors from all over the world are expected at the trade fair. The combination of SEMICON Europa with Plastic Electronics offers visitors and exhibitors excellent synergies and opportunities.

The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.

Manocha, a strategic advisor to GLOBALFOUNDRIES following his retirement from CEO, will serve as keynote speaker during TECHCON’s Sept. 8 banquet, while Nido Qubein, President of High Point University, will open the conference the morning of Sept. 8. Additionally, David Berz, Global Learning Leader at LinkedIn, will address the conference at a Sept. 7 evening session.

Hosted in Austin, Texas, SRC’s annual TECHCON conference features next-generation research progress among hundreds of university students, faculty and industry experts.

“TECHCON brings together the brightest minds in microelectronics research to exchange news about the progress of new materials and processes created by SRC’s network of more than 100 of the top engineering universities,” said SRC President Larry Sumney. “Students and industry leaders discuss basic research at TECHCON that is intended to accelerate advancements for both private and public entities.”

Manocha is a veteran semiconductor industry executive with more than 30 years of global expertise in manufacturing operations, general management and semiconductor technology. His keynote will discuss the technical and economic challenges facing the semiconductor industry, and how the industry has an opportunity to evolve its foundry model to enable innovation required to drive technology forward and also offer a practical framework for controlling manufacturing costs.

Qubein, chairman of Great Harvest Bread Company with 220 stores in 43 states, is president of High Point University in North Carolina that educates 4,300 undergraduate and graduate students from 40 countries. His address will cover communicating and connecting in a technical environment, helping SRC support its members in building the overall effectiveness through human capital and cultivating SRC students.

Berz leads a team of learning instructional designers at LinkedIn whose key focus is to create web and e-learning experiences for the global LinkedIn enterprise. His session will help attendees define the elements of building their professional LinkedIn profile and using LinkedIn effectively for a technical career.

More than 11,000 students have been prepared by SRC programs, professors and mentors for entry into the semiconductor business. These students provide a path for technology transfer and a source of relevantly educated technical talent for the industry.