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North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.07 means that $107 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in July 2014 was $1.41 billion. The bookings figure is 2.8  percent lower than the final June 2014 level of $1.46 billion, and is 17.1 percent higher than the July 2013 order level of $1.21 billion.

The three-month average of worldwide billings in July 2014 was $1.32 billion. The billings figure is 0.7 percent lower than the final June 2014 level of $1.33 billion, and is 9.4 percent higher than the July 2013 billings level of $1.20 billion.

“Order activity for semiconductor equipment has held at a steady level so far for 2014,” said Denny McGuirk, president and CEO of SEMI. “This trend, along with improvements in semiconductor device sales and unit shipments, is consistent with our outlook for strong equipment sales growth this year.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

February 2014

1,288.3

1,295.4

1.01

March 2014

1,225.5

1,297.7

1.06

April 2014

1,403.2

1,443.0

1.03

May 2014

1,407.8

1,407.0

1.00

June 2014 (final)

1,327.5

1,455.0

1.10

July 2014 (prelim)

1,317.6

1,413.7

1.07

Source: SEMI, August 2014

Intel Corporation and Unity Technologies today announced a strategic collaboration to advance the development of Android-based applications on Intel architecture. The agreement accelerates Intel’s mobility push as millions of developers using the Unity development platform can now bring native Android games and other apps to Intel-based mobile devices. Unity adds support for Android across all of Intel’s current and future processors including both the Intel Core and Intel Atom processor families.

Unity will ensure Intel product enhancements, including both graphics and CPU performance improvements and features, will be seamlessly integrated into future releases of the Unity 4 and Unity 5 product lines. As Intel architecture continues to gain market segment share on mobile devices, these improvements will help ensure that the Unity developers’ games run natively as well as look great and perform beautifully on Intel platforms.

In addition, developers using Unity can now easily add support for Intel architecture in their applications or produce native applications for Intel architecture only with minimal extra effort.

“We’ve set a goal to ship 40 million Intel-based tablets this year and expect more than 100 Android tablet designs on Intel in the market by the end of this year,” said Doug Fisher, Intel corporate vice president and general manager of the Software and Services Group. “Our collaboration with Unity will give its nearly 3 million developers the necessary software tools and support to build amazing Android experiences on Intel architecture.”

“Unity is used by half of all mobile game developers, and many of them have been asking for increased support for Intel-based devices running Android,” said David Helgason, CEO, Unity Technologies. “We are proud to be working with Intel to ensure that Unity provides the smoothest and highest performing experience possible on Intel platforms.”

“As a mobile gaming company, Kabam relies on the Unity game engine and the compelling performance and efficiency it provides us to publish our mobile games for players around the world,” said Kent Wakeford, COO of Kabam. “We are very excited to bring Unity-authored content, such as our upcoming title, ‘Marvel Contest of Champions,’ to the rapidly growing installed base of Intel-powered Android devices.”

SmartPlay Inc., a design services company with expertise in digital, analog, wireless software and system design, announced that it is ready to offer design services to customers of Intel Custom Foundry that require expertise, know-how and unique IP in critical embedded applications. SmartPlay will provide support in SoC implementations and will offer turnkey services ranging from RTL/Netlist to GDSII.  This also establishes SmartPlay as a key player in the Intel Custom Foundry ecosystem committed to delivering world class SoC design services.

SmartPlay shares a three-year relationship with Intel Custom Foundry, and has efficiently delivered numerous projects for them such as test chip development platform (Architecture to GDSII), DDR3/4 PHY verification and layout of Analog IPs along with the participation in various customer tape-outs on Intel Custom Foundry’s 22nm and 14nm platforms. Design services offered by SmartPlay have been extremely useful in reducing time-to-market for customers of Intel Custom Foundry.

Speaking on the strategic value of the relationship, Pradeep Vajram, President & CEO, SmartPlay, said “The increasing complexity, interface, and functionality of SoCs have brought about many challenges in building highly-integrated systems. SmartPlay’s design services are aimed at enabling companies to reduce time-to-market, increase efficiency and perform better and faster. Being chosen by Intel Custom Foundry to collaborate on design services for its customers is a reflection of SmartPlay’s ability to handle complex designs. SmartPlay has been working successfully with Intel Custom Foundry for over three years and the announcement of this collaboration is a further step towards a long and fruitful association.”

 “We have enjoyed a strong collaborative relationship with SmartPlay for the past 3 years, allowing us to rapidly ramp and optimize our development platforms on our 22nm and 14nm technologies,” said Ali Farhang, Vice President, Technology and Manufacturing Group, Director of Design and Enablement Services, Intel Custom Foundry. “SmartPlay has become a key design service provider in our ecosystem, and we look forward to continuing this collaboration to accelerate our customers’ time to market using Intel’s leading-edge silicon manufacturing technologies.”

The semiconductor industry in India is estimated to grow from $10.02 billion in 2013 to $52.58 billion in 2020 at CAGR of 26.72%, according to Research and Markets new report the “Semiconductor Market in India 2014 – 2020.”

India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors. As of now India doesn’t have any operational wafer fabrication plants and depends extensively on the imports. Currently, the semiconductor industry is 100% import based with India importing semiconductors worth $10 billion in 2013. Since In 2013, India spent $169 billion on oil imports, $54 billion on gold imports and $31.5 billion on electronic imports.

Semiconductors are used extensively in various applications, which offer immense potential for the growth of this industry in India. Semiconductors are used majorly in Mobile Devices, Telecommunications, Information Technology & Office Automation (IT & OA), Industrial, Automotive and other industries (Aerospace, Defense and Medical industries).

Mobile devices are expected to grow at CAGR of 33.4% from 2013 to 2020, according to this research report,. The contribution to semiconductor revenue is expected to grow from 35.4% in 2013 to 50.7% in 2020.

Telecommunication segment is expected to grow at CAGR of 26.8% from 2013 to 2020 and its contribution to total revenue will remain the same at 19.7% in 2020.

IT&OA contribution to the total semiconductor revenue will come down from 28.3% in 2013 to 17.4% in 2020 due to consolidation in this sector. This segment will grow at CAGR of 18.2% over the next seven years.

The consumer electronics segment is expected to grow at CAGR of 18.8% and the contribution to the total semiconductor revenue will come down from the current level of 5.6% in 2013 to 3.5% in 2020. Industrial electronics segment is expected to grow at CAGR of 19.6% and the contribution to the total semiconductor revenue will come down from current level of 4% to 2.7%.

Automotive electronics segment is expected to grow faster at CAGR of 30.5% from 2013 to 2020; its revenue contribution will increase from 3.2% in 2013 to 3.9% in 2020.

This study looks at the current state of the semiconductor industry in terms of products and service offerings and their growth over the last few years. The growth drivers and inhibitors of the industry are also examined in detail. The value chain of the industry in India has also been identified and mapped out. Based on all these factors, the report makes projections for the market size in 2020 in terms of products, services, application domains and overall market potential.

In addition to this, the report contains profiles of and inputs from several key companies operational in this sector. 24 companies have been extensively profiled in this report, to cover the entirety of the value chain.

Read more: Global semiconductor industry on pace for record sales through first half of 2014

GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, announced today the addition of William “Bill” Davidson, Jr. as senior vice president and chief administrative officer (CAO), strengthening the company’s leadership team. As the company’s first CAO, Davidson takes over global leadership of critical corporate functions supporting the company’s worldwide operations including Human Resources, IT, Corporate Marketing and Communications, Government Relations, and Risk Management, Sustainability and Real Estate.

“Bill is an accomplished industry executive who brings to GLOBALFOUNDRIES a strong track record of managerial success,” said Sanjay Jha, CEO, GLOBALFOUNDRIES. “His ability to develop and lead global teams across complex organizations will help drive our next phase of growth.”

Davidson joins GLOBALFOUNDRIES with more than 25 years of experience in leading technical sales, marketing and general management roles in the telecommunications and semiconductor industries. He most recently served in a dual role as senior vice president, strategy and operations and senior vice president, investor relations at Qualcomm Inc. In these roles, Davidson oversaw reporting and operations, executed on strategic global business initiatives, and served as the primary liaison with the investment community and Qualcomm shareholders. During his time at Qualcomm, Davidson also led global marketing and communications for more than six years.

Davidson also spent 13 years at Bell Atlantic where he gained substantial experience in the wireline business at New Jersey Bell, as well as serving as vice president of wireless data sales and marketing for Bell Atlantic Mobile. Davidson’s background also includes serving as vice president of commercial sales operations for GE Capital’s telecommunications financial services division.

The Facilities 450mm Consortium (F450C), a partnership of leading nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced it has again increased in size, naming Pfeiffer Vacuum as the twelfth member company to join the consortium.

“Two of the main objectives of the F450C include improved Airborne Molecular Contamination (AMC) detection and response and increased green mode systems usage,” stated Adrian Maynes, F450C program manager. “Bringing Pfeiffer Vacuum on board adds valuable expertise to help us address the goalsof our key focus groups.”

Pfeiffer Vacuum’s advanced AMC solutions have already been tested and are ready for implementation into the next technology node. The company’s expertise regarding the contaminants associated with pod systems and their direct environments will help ensure high quality and increased yield in the production of the larger and more advanced 450mm wafer. In addition, Pfeiffer Vacuum’s high-efficiency pumps have been designed and engineered specifically for the 450mm infrastructure — complete with advanced leak detection — further enabling the environmental sustainability of 450mm facilities.

“All of our vacuum pumps, systems and leak detectors are developed with sustainability in mind,” said Oliver Mayfarth, market manager semiconductor at Pfeiffer Vacuum. “We are excited to be aligned with the F450C to ensure that 450mm technology leaves little footprint and is developed in the most cost-effective manner.”

Read more: 450mm transition toward sustainability: Facility and infrastructure requirements

Cavium, Inc., a provider of semiconductor products, announced an agreement to acquire Xpliant, Inc., a privately held company headquartered in San Jose, California. Xpliant is a provider of high performance, high density switch silicon targeting a broad range of switching applications for the data center, cloud, service provider and enterprise markets.

The total acquisition cost is projected to be approximately $90 million, which includes payments to stockholders, note holders and other liabilities and costs. Cavium was an investor in Xpliant having provided $15 million of funding to Xpliant through June 2014, which is included in that total cost estimate.  The remaining $75 million will be comprised of approximately $40 million in cash and $35 million in stock.

Xpliant technology and products address the need for increased capacity in both networking infrastructure and data centers driven by the steep growth of mobile applications and social networking. Global mobile data traffic will increase nearly 11-fold between 2013 and 2018 growing at a CAGR of 61 percent, while cloud data center IP traffic will more than double between 2014 and 2017 growing at a CAGR of 30% according to Cisco’s Visual Networking Index and Global Cloud Index.

This expected growth will require increased intelligence and bandwidth within the network switching solution offerings to deliver enormous amounts of data in an efficient manner while controlling power consumption and costs. Furthermore, software-defined networking (SDN) continues to emerge as the architectural implementation of choice for building these networks.

Ethernet Switches are used to connect components within a system as well to connect various systems such as servers, server racks and networking appliances in the data center, enterprises and service provider networks. Switches are also used to connect servers, wireless access points, desktops and various network appliances throughout an enterprise.  The Total Addressable Market for Ethernet switch silicon is currently valued in excess of $1B per year.  The continued rise of SDN is expected to accelerate a refresh cycle further accelerating the deployment of new switch platforms.

Current switch solutions are built on a legacy fixed function architecture that will not be able to address the new market trends and requirements in data center, service provider and enterprise segments. Current networking silicon is hardwired to only offer a limited set of fixed function capabilities. Any new features that need to be added require a new revision to the silicon which can significantly delay deployments. Furthermore, these fixed function capabilities do not currently enable the software flexibility required to deploy true software defined networking resulting in extremely inefficient networks. Another disadvantage of the current legacy fixed function architecture is that system vendors cannot differentiate and optimize their product features and capabilities for a range of target market applications.

Xpliant is a semiconductor provider that has assembled a team of switching industry veterans who have previously delivered several generations of industry leading switching solutions to market at a range of leading switching system and silicon vendors. Xpliant has developed a family of switching silicon solutions with world class10G/40G/100G port speeds and port densities supporting throughput ranging from multi-hundred gigabit to multi-terabit. In addition, the products have been designed from the ground up to specifically address the challenges of throughput and flexibility driven by the needs of next generation networking infrastructure and software defined networking.  Xpliant’s innovations in switching architecture will enable increased intelligence and flexibility beyond what is available today in commodity Ethernet switch silicon while delivering market leading bandwidth, throughput and scalability along with unprecedented flexibility/programmability. All of these characteristics are required to efficiently enable virtualized data center and software defined networking without compromise. Xpliant’s flexible and programmable architectural solutions are designed to enable OEM customers to bring to market customized and highly differentiated products optimized for their target markets.

Cavium has a rich history of identifying emerging market trends and delivering disruptive industry leading products to the wired and wireless infrastructure market. The addition of Xpliant’s family of switching solutions, which are critical building components for next generation infrastructure, will be highly synergistic with Cavium’s existing infrastructure product offerings such as ThunderX, OCTEON and LiquidIO families. This family of switching solutions will enable Cavium to significantly increase its share of BOM in the data center, service provider and enterprise markets. Additionally, these products will allow Cavium to offer complete end to end solutions for compute, networking and storage, optimized for best performance, cost and power for next generation virtualized software defined infrastructure.

“Xpliant has developed a disruptive family of switching silicon solutions for next generation software defined networks,” said Syed Ali, President and CEO, Cavium. “This product line significantly expands our addressable TAM and will be an exciting addition to our portfolio of solutions for the data center, service provider and enterprise markets. The Xpliant line of products is highly synergistic with Cavium’s existing infrastructure products and will enable Cavium to deliver highly optimized end to end solutions to our customers. We are extremely pleased with the strong customer engagements and traction which are an excellent validation of Xpliant’s technology and products”.

BY BYRON EXARCOS, President, CLASSONE TECHNOLOGY

Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones. The last decade’s round of consolidations in the manufacturing and equipment sectors has only exacerbated this trend. This approach may make good business sense for the large equipment companies, but it’s created a serious challenge for smaller IC manufacturers. Even worse, it now threatens to stifle the continuing innovation on which the high tech industry depends.

It’s hard to fault the big equipment players for their business model. It’s much more cost-effective and profitable to dedicate the bulk of your resources to those customers who want to buy multiple process tools featuring “bleeding edge” technology on highly automated, volume production platforms. In many cases, it’s simply not as profitable to engage with smaller customers.

So what choice do the manufacturers have for populating their fabs if they’re running 200mm or smaller wafers? One alternative is to buy refurbished tools, assuming they can find a tool that meets their needs, which is not always easy. Another is to buy a bigger tool with more performance capabilities than they need, which busts their equipment budget. There aren’t many other options.

Now, one could dismiss this issue by simply saying, that’s the way this market works. Continued growth in our industry has always depended on a certain path of continual innovation. “Smaller, faster, cheaper” — producing smaller, more powerful chips in ever greater volume on larger wafers was a highly successful means of turning computers and subsequent mobile computing and communication devices into household items. It’s hard to fault a business/technology model that has been successful for so many years.

On the other hand, every emerging market eventually matures. We’ve all experi- enced the boom-and-bust cycles that roil our industry and what happens when the “last big thing” plateaus or dries up. Today, the capital equipment market is at a cusp. We need to examine whether the traditional smaller-design-rules/bigger-wafers/faster-throughput approach is helping or hindering the introduction of new technologies.

Today’s emerging technologies include devices such as smart sensors, power and RF wireless devices. The fact is, many of these chips can be made quite well and quite profitably using larger design rules on 200mm or even smaller substrates. However, many of the companies developing these devices are not huge enterprises, and they’re hampered by the unavailability of tools delivering the appropriate levels of process technology, automation and throughput — at a price they can afford. Ironically, our industry is in a phase where the equipment companies that once drove significant innovations, such as the introduction of copper deposition and low-k dielectrics, have become so large and narrowly focused that they’re impeding the development of many other emerging technologies.

I have some understanding of the needs of smaller device manufacturers because one of our companies, ClassOne Equipment, has been selling refurbished equipment to them for over a decade. That is why we’ve now created a whole new company, ClassOne Technology, to provide new equipment at substantially lower prices specifically for 200mm and smaller substrates. We are introducing new electroplating systems, spin rinse dryers and spray solvent tools; and some of them are literally half the cost of high-end competitive units. We’re particularly interested in serving all those small- to mid-sized companies who are making MEMS, power devices, RF, LEDs, photonics, sensors, microfluidics and other emerging-technology devices.

However, no single company can solve the entire problem. There is a glaring need for equipment manufacturers to bring the price/performance ratio of their tools back in line with the needs of more of the equipment users, not just those at the bleeding edge. If the tool manufacturers persist in trying to only sell the equivalent of sports cars to customers who just need pickup trucks, America’s high tech industry may soon find itself trailing, rather than leading the innovation curve.

Harnessing big data


July 28, 2014

Addressing the analytics challenges in supply chain management. 

BY NORD SAMUELSON, CHRISTOPHER POCEK and CHRIS LANMAN, AlixPartners, San Francisco, CA 

A changing workforce and lack of convergence between information technology (IT) and business may be preventing many companies from joining the big-data revolution. Defined as very large sets of data but more commonly used in reference to the rapid increase in amounts of data in recent years, big data will divide companies into two groups in the next decade: those able to benefit from big data’s potential and those unable. Companies that create capabilities for capturing, processing, analyzing, and distributing data in order to make better decisions in real time will likely be able to outperform their competition and respond more quickly to their customers’ needs. The data avalanche is coming from a number of sources, such as enterprise resource planning, orders, shipments, Weblogs, GPS data, radio-frequency identification, mobile devices, and social channels; and there is value to be created in all areas of a business by adopting a data-driven culture.

However, in discussions about big data’s arrival, we sometimes forget to ask how effectively we’re converting the data into value. Too often, huge investments in IT infrastructure coupled with sophisticated analytical and reporting software have delivered little value. Why? We often find it’s because companies are understaffed, or they may lack the analytics talent who know how to build links between the data and the value drivers. There is also a gap between finding insights from data and then applying the insights to create value. That is where the levels of training and experience of a company’s analysts enter the equation.

One area of particular concern is supply chain management (SCM). A company’s SCM organization makes decisions about build plans, stocking locations, inventory levels, and so forth based on the conversion of raw data about demand, sales, and inventory on hand. And when there’s a shortage of analytics talent, SCM is typically one of the first areas affected. Traditionally, analytical innovation happens in two ways: either through an internal-pipeline process of developing junior analysts into senior analysts or by periodically bringing in external experts to seed knowledge. But big data is challenging both approaches.

The internal pipeline is challenged by a workforce marked by shorter tenures. Shorter tenures result
in more generalists in the workforce, often in place of the specialists needed for analytical innovation. For example, younger workers, such as millennials, are significantly less likely to settle into a long career at a company. According to a survey by Future Workplace, 91% of millennials (born in the 1980s and ’90s) expect to stay in a job for less than three years (Meister 2012), meaning that those in analytical roles are usually in the job only long enough to execute established analytics—and not long enough to develop a holistic understanding of how data can be applied to drive business value. As a result, those on the business side and those on the IT side don’t always learn to make the end-to-end connections between raw data and measurable value. The internal-pipeline approach is further challenged by companies themselves: frustrated by high turnover, companies are less likely to invest in developing their people— only to watch the people leave for higher-paying positions.

The second approach—that of periodically bringing in external experts to rebuild a process or implement the latest software package—is also starting to show wear. The evolution cycle of new analytical techniques is rapidly slowing down as big data brings opportunities to better integrate internal and external data sources. Traditionally, companies have been able to implement software solutions or bring in experts to install the latest offering and then profit from that investment for five or seven years. The initial cost was justified by the continued value for years to come. But now, the volume, variety, and velocity of the new data being generated are changing the business landscape by calling for a more rapid cycle of analytical-tool introduction. And that landscape itself usually changes every two or three years. So, as a result, the days of big-bang projects appear to be coming to an end.

What can be done? Companies should look across the entire supply chain—or across any function,
for that matter—and measure the amount of data being generated. Then they should weigh that measurement against the value actually realized. If data volumes are growing more rapidly than the corresponding increase in value, there may be an analytics talent challenge.

Three methods of creating value have proved effective in today’s rapidly changing market.

1. Outsourcing portions of analytic requirements

Companies can approach analytics outsourcing in a variety of ways, ranging from a data prep model—in which a company hires a third party to process raw data to the point where an analyst can consume it— all the way to a fully outsourced model, in which a third party processes and analyzes the data, poten- tially adds other proprietary data, and sends back fully actionable information. The data prep model enables a company to focus a limited pool of analysts on the critical knowledge-capture portion of the process and thereby free up time spent on non-value- added processes. The fully outsourced model enables companies to stay up-to-date on the latest technol- ogies and software without having to make up-front investments to purchase the latest software and technology.

2. Creating central analytics teams

Companies that rely heavily on converting data to knowledge can set up an analytic group focused solely on solving analytical issues across the company. Such companies have adopted analytics
as a core differentiator and encourage analysts to develop the holistic view that facilitates insight. Central analytics groups seem to perform better than embedded groups—and especially when they report through the business side. Of course, maintaining a group dedicated to analytics is an investment that some companies may hesitate to make, but there is tremendous value in having such in-house expertise.

3. Partnering with academic or not-for-profit institutions

Academic and nonprofit organizations are often-overlooked resources. For instance, the brand-new Center for Supply Chain Management at the University of Pittsburgh intends to provide student and faculty interactions with industry representatives who will promote experience-based learning activities within the university’s supply chain management courses. To improve the center’s effectiveness, the university plans to create a Supply Chain Management Industry Council composed of member companies dedicated to SCM. The council members, along with tenured faculty specializing in teaching SCM, will foster interest and excellence in SCM and analysis. Other institutions offer training, certifications, and conferences that encourage and enable analysts to further develop and share ideas. The Institute for Operations Research and the Management Sciences recently introduced the Certified Analytics Profes- sional certification to give companies an option for developing their people without having to make hefty investments in training organizations.

Big data is fundamentally transforming the way business operates. It is enabling management to track the previously untrackable, forecast the previ- ously unpredictable, and understand interactions between suppliers and customers—all of it with unprecedented clarity. And winning organizations will invest in the necessary infrastructure and people to harness the transformative power of data.

Peregrine Semiconductor Corporation, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, and RF Micro Devices, Inc., a designer and manufacturer of high-performance radio frequency solutions, today announced that they have settled all outstanding claims between the companies. The two parties have entered into patent cross licenses and have agreed to dismiss all related litigation. Specific financial terms of the agreement remain confidential.

“We are pleased that we have reached agreement with RF Micro Devices and resolved all of our outstanding litigation under terms that recognize Peregrine’s unique role in the invention and commercialization of RF SOI technology,” said Jim Cable, CEO of Peregrine Semiconductor. “This agreement provides validation for the many ways in which Peregrine continues to expand the industry’s technological frontiers through both our inventions and commercial products. We look forward to continuing to solve our customers’ and partners’ toughest RF challenges.”

Bob Bruggeworth, president and CEO of RFMD, said, “We are very pleased to reach an agreement with Peregrine that recognizes the value of their patents and their contribution to the development of RF SOI. The signing of this patent cross-license agreement allows RFMD to focus 100% on building the industry’s leading portfolio of RF solutions, making this agreement very positive for both our Company and our customers.”