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The new, higher-speed DDR4 DRAM generation gained significant marketshare in 2016, representing 45% of total DRAM sales. Previously, DDR3 DRAM, including low-power versions used in tablets, smartphones, and notebook PCs, accounted for 84% of total DRAM sales in 2014 and 76% in 2015, but in 2016, DDR4 price premiums evaporated and prices fell to nearly the same ASP as DDR3 DRAMs. A growing number of microprocessors, like Intel’s newest 14nm x86 Core processors, now contain DDR4 controllers and interfaces.  As a result, IC Insights expects DDR4 to become the dominant DRAM generation in 2017 with 58% marketshare versus 39% for DDR3 (Figure 1).

Figure 1

Figure 1

The Joint Electron Devices Engineering Council (JEDEC) officially launched the fourth generation of DDR in 2012.  In 2014, DDR4 memories first began appearing on the market in DRAM modules for powerful servers and a small number of high-end desktop computers, which had souped-up motherboards or the “extreme” versions of Intel’s 22nm Haswell-E processors for high-performance gaming software and PC enthusiasts, but volume sales remained low until 2015, when data centers and Internet companies began loading up servers with the new-generation memories to increase performance and lower power consumption. In 2016, DDR4 memories quickly spread into more data center servers, mainframes, and high-end PCs, accounting for about 45% of total DRAM sales versus 20% in 2015.  In 2017, DDR4 will move into more notebook PCs, high-end tablets, and smartphones and is expected to hold a 58% share of DRAM sales.

The DDR4 standard contains a number of features that are expected to speed up memory operations and increase SDRAM storage in servers, notebook and desktop PCs, tablet computers, and a wide range of consumer electronics.  The DDR4 standard supports stacked memory chips with up to eight devices presenting a single signal load to memory controllers.  Compared to DDR3, DDR4 can potentially double the module density, double the speed, and lower power consumption up to 20%, thereby extending battery life in future 64-bit tablets and smartphones.

Meanwhile, the DRAM average selling price has been increasing very rapidly since mid-2016.  Figure 2 shows that the DRAM ASP increased 54% from $2.41 in April 2016 to $3.70 in February 2017.  As a result of this big increase, IC Insights raised its 2017 DRAM market forecast to $57.3 billion, which is a 39% increase over 2016.  IC Insights believes that DRAM ASPs will continue to trend upward through most of the first half of 2017, though probably not as rapidly as they did between the period from April 2016 to February 2017.

Figure 2

Figure 2

In its latest quarterly financial conference call, Micron indicated its DRAM outlook through the balance of its fiscal year 2017 (ending August 31) was very encouraging, with solid demand coming from PC, server, communication, automotive, and several other applications.

However, the bigger question for Micron and other top DRAM suppliers is available supply and whether (more accurately, when will) prices plateau and begin trending downward.  One indication that DRAM prices could soften in the second half of the year is the fact that Samsung and SK Hynix are bringing additional DRAM capacity online that features smaller process geometries. Samsung is slated to begin operations at its new Fab 18, in Pyeongtaek, South Korea in 2Q17.  Fab 18, with capacity of 300,000 300mm wafer starts per month, features five production lines that are dedicated primarily to making DRAM.  The company plans to begin DRAM operations at the fab using an 18nm process technology.

SK Hynix has transitioned most of its South Korean-based DRAM output from Fab M10 to Fab M14. With Fab M14 and its dedicated DRAM fab in Wuxi, China, SK Hynix has DRAM capacity of about 280,000 300mm wafer starts per month.  SK Hynix is manufacturing most of its DRAM at the 21nm node, but expects to begin using sub 20nm process technology later this year, thereby helping to reduce costs and increase the number of chips on a wafer.

Following a year of extraordinary gains in pricing, a boost to DRAM supply in the second half of 2017 could lead to reduced ASPs and the inevitable start of a cyclical slowdown in the DRAM market.

Participating in the DRAM market has always been a big challenge for suppliers.  Hot or cold, boom or bust—the DRAM market is rarely moving along in a steady, predictable manner.  For at least the first half of 2017, it appears that DRAM market will be very favorable for these top three suppliers.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $30.4 billion for the month of February 2017, an increase of 16.5 percent compared to the February 2016 total of $26.1 billion. Global sales in February were 0.8 percent lower than the January 2017 total of $30.6 billion, exceeding normal seasonal market performance. February marked the global market’s largest year-to-year growth since October 2010. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor industry has posted strong sales early in 2017, with memory products like DRAM and NAND flash leading the way,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth. Global market trends are favorable for continuing sales growth in the months ahead.”

Year-to-year sales increased across all regions: China (25.0 percent), the Americas (19.1 percent), Japan (11.9 percent), Asia Pacific/All Other (11.2 percent), and Europe (5.9 percent). Month-to-month sales increased modestly in Asia Pacific/All Other (0.5 percent) but decreased slightly across all others: Europe (-0.6 percent), Japan (-0.9 percent), China (-1.0 percent), and the Americas (-2.3 percent).

Neuffer also noted the recent growth of foreign semiconductor markets is a reminder of the importance of expanding U.S. semiconductor companies’ access to global markets, which is one of SIA’s policy priorities for 2017. The U.S. industry accounts for nearly half of the world’s total semiconductor sales, and more than 80 percent of U.S. semiconductor company sales are to overseas markets, helping make semiconductors one of America’s top exports.

February 2017

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

6.13

5.99

-2.3%

Europe

2.84

2.82

-0.6%

Japan

2.79

2.77

-0.9%

China

10.15

10.05

-1.0%

Asia Pacific/All Other

8.72

8.76

0.5%

Total

30.64

30.39

-0.8%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.03

5.99

19.1%

Europe

2.66

2.82

5.9%

Japan

2.47

2.77

11.9%

China

8.04

10.05

25.0%

Asia Pacific/All Other

7.88

8.76

11.2%

Total

26.08

30.39

16.5%

Three-Month-Moving Average Sales

Market

Sept/Oct/Nov

Dec/Jan/Feb

% Change

Americas

6.25

5.99

-4.2%

Europe

2.88

2.82

-2.3%

Japan

2.90

2.77

-4.6%

China

10.04

10.05

0.1%

Asia Pacific/All Other

8.94

8.76

-2.0%

Total

31.02

30.39

-2.0%

 

IEEE, the world’s largest technical professional organization dedicated to advancing technology for humanity, this week announced the next milestone phase in the development of the International Roadmap for Devices and Systems (IRDS)—an IEEE Standards Association (IEEE-SA) Industry Connections (IC) Program sponsored by the IEEE Rebooting Computing (IEEE RC) Initiative—with the launch of a series of nine white papers that reinforce the initiative’s core mission and vision for the future of the computing industry. The white papers also identify industry challenges and solutions that guide and support future roadmaps created by IRDS.

IEEE is taking a lead role in building a comprehensive, end-to-end view of the computing ecosystem, including devices, components, systems, architecture, and software. In May 2016, IEEE announced the formation of the IRDS under the sponsorship of IEEE RC. The historical integration of IEEE RC and the International Technology Roadmap for Semiconductors (ITRS) 2.0 addresses mapping the ecosystem of the new reborn electronics industry. The new beginning of the evolved roadmap—with the migration from ITRS to IRDS—is proceeding seamlessly as all the reports produced by the ITRS 2.0 represent the starting point of IRDS.

While engaging other segments of IEEE in complementary activities to assure alignment and consensus across a range of stakeholders, the IRDS team is developing a 15-year roadmap with a vision to identify key trends related to devices, systems, and other related technologies.

“Representing the foundational development stage in IRDS is the publishing of nine white papers that outline the vital and technical components required to create a roadmap,” said Paolo A. Gargini, IEEE Fellow and Chairman of IRDS. “As a team, we are laying the foundation to identify challenges and recommendations on possible solutions to the industry’s current limitations defined by Moore’s Law. With the launch of the nine white papers on our new website, the IRDS roadmap sets the path for the industry benefiting from all fresh levels of processing power, energy efficiency, and technologies yet to be discovered.”

“The IRDS has taken a significant step in creating the industry roadmap by publishing nine technical white papers,” said IEEE Fellow Elie Track, 2011-2014 President, IEEE Council on Superconductivity; Co-chair, IEEE RC; and CEO of nVizix. “Through the public availability of these white papers, we’re inviting computing professionals to participate in creating an innovative ecosystem that will set a new direction for the greater good of the industry. Today, I open an invitation to get involved with IEEE RC and the IRDS.”

The series of white papers delivers the starting framework of the IRDS roadmap—and through the sponsorship of IEEE RC—will inform the various roadmap teams in the broader task of mapping the devices’ and systems’ ecosystem:

“IEEE is the perfect place to foster the IRDS roadmap and fulfill what the computing industry has been searching for over the past decades,” said IEEE Fellow Thomas M. Conte, 2015 President, IEEE Computer Society; Co-chair, IEEE RC; and Professor, Schools of Computer Science, and Electrical and Computer Engineering, Georgia Institute of Technology. “In essence, we’re creating a new Moore’s Law. And we have so many next-generation computing solutions that could easily help us reach uncharted performance heights, including cryogenic computing, reversible computing, quantum computing, neuromorphic computing, superconducting computing, and others. And that’s why the IEEE RC Initiative exists: creating and maintaining a forum for the experts who will usher the industry beyond the Moore’s Law we know today.”

The IRDS leadership team hosted a winter workshop and kick-off meeting at the Georgia Institute of Technology on 1-2 December 2016. Key discoveries from the workshop included the international focus teams’ plans and focus topics for the 2017 roadmap, top-level needs and challenges, and linkages among the teams. Additionally, the IRDS leadership invited presentations from the European and Japanese roadmap initiatives. This resulted in the 2017 IRDS global membership expanding to include team members from the “NanoElectronics Roadmap for Europe: Identification and Dissemination” (NEREID) sponsored by the European Semiconductor Industry Association (ESIA), and the “Systems and Design Roadmap of Japan” (SDRJ) sponsored by the Japan Society of Applied Physics (JSAP).

The IRDS team and its supporters will convene 1-3 April 2017 in Monterey, California, for the Spring IRDS Workshop, which is part of the 2017 IEEE International Reliability Physics Symposium (IRPS). The team will meet again for the Fall IRDS Conference—in partnership with the 2017 IEEE International Conference on Rebooting Computing (ICRC)—scheduled for 6-7 November 2017 in Washington, D.C. More information on both events can be found here: http://irds.ieee.org/events.

IEEE RC is a program of IEEE Future Directions, designed to develop and share educational tools, events, and content for emerging technologies.

IEEE-SA’s IC Program helps incubate new standards and related products and services, by facilitating collaboration among organizations and individuals as they hone and refine their thinking on rapidly changing technologies.

Technavio market research analysts forecast the global MRAM market to grow at a CAGR of close to 94% during the forecast period, according to their latest report.

The market study covers the present scenario and growth prospects of the global MRAM market for 2017-2021. The report also lists STT-MRAM and Toggle MRAM as the two major product segments, of which STT-MRAM accounted for more than 63% of the market share in 2016. STT-MRAM devices are more efficient, faster, and easier to scale down as compared to toggle MRAM devices.

“MRAM is a type of nonvolatile memory that utilizes magnetic charges for storing data instead of electric charges as in the case of DRAM and SRAM technologies. MRAM offers the added advantage of higher density in terms of writing and reading speed. In addition, MRAM retains the data even when turned off and consumes less amount of electricity, unlike DRAM and SRAM,” says Navin Rajendra, an industry expert for embedded systems research at Technavio.

Technavio’s sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more.

Technavio hardware and semiconductor analysts highlight the following three market drivers that are contributing to the growth of the global MRAM market:

  • Increasing demand for data centers
  • Growing Internet of things (IoT) and big data operations
  • Enterprise adoption of cloud-based storage

Increasing demand for data centers

High amount of system memory has become crucial for the proper functioning of new types of enterprise and data center applications. DRAM cannot provide the required capacity and low energy required for these data centers. MRAM has advanced features like low-power consumption and higher memory capacity than DRAM. Thus, MRAM is expected to replace DRAM in data centers and enterprise storages during the forecast period.

The demand for data centers among CSPs, government agencies, and telecommunications organizations is growing. Thus, with an increase in the demand for data centers globally, the manufacturers will invest in new technologies that will be equipped with MRAMs, which will drive the global MRAM market.

Growing Internet of things (IoT) and big data operations

There will be around 30 billion Internet-connected devices worldwide by 2020, which will be a major revenue generator for data center storage market as growing connected devices will lead to the generation of high volumes of data. Terms such as a connected car, connected home, connected health, and smart cities are gaining popularity. Many industries such as manufacturing, utilities, retail, automotive, and social media use IoT.

IoT devices demand an energy-efficient network of smart nodes that need to be always powered on, always connected, and always aware, with low active duty cycles. The present IoT devices rely on both nonvolatile storage and volatile working memory simultaneously.

“Manufacturers have introduced a unified memory subsystem that is built on embedded STT-MRAM. This system offers faster processing and is cost and energy efficient as compared to the older technologies,” says Navin.

Enterprise adoption of cloud-based storage

Storing data on the cloud is proving to be an effective medium for enterprises worldwide. Many enterprises started moving their data to the cloud (storage-as-a-service) by selecting service providers such as Amazon Web Service, Microsoft Azure, and Google Cloud Platform. DRAM has been used in cloud computing applications. However, MRAM has better features like fast read-write and low error rate compared with DRAM, and thus, it is expected that DRAM will soon be replaced by MRAM in the future.

IC Insights has raised its worldwide IC market growth forecast for 2017 to 11%—more than twice its original 5% outlook—based on data shown in the March Update to the 20th anniversary 2017 edition of The McClean Report. The revision was necessary due to a substantial upgrade to the 2017 growth rates forecast for the DRAM and NAND flash memory markets.

IC Insights currently expects DRAM sales to grow 39% and NAND flash sales to increase 25% this year, with upside potential from those forecasts.  DRAM market growth is expected to be driven almost entirely by a huge 37% increase in the DRAM average selling price (ASP), as compared to 2016, when the DRAM ASP dropped by 12%. Moreover, NAND flash ASPs are forecast to rebound and jump 22% this year after falling by 1% last year.

The DRAM market started 2017 the way it ended 2016—with strong gains in DRAM ASP.  In April 2016, the DRAM ASP was $2.41 but rapidly increased to $3.60 in January 2017, a 49% jump.  A pickup in DRAM demand from PC suppliers during the second half of 2016 caused a significant spike in the ASP of PC DRAM.  Currently, strengthening ASPs are also evident in the mobile DRAM market segment.

With total DRAM bit volume demand expected to increase by 30% this year and DRAM bit volume production capacity forecast to increase by 20%, IC Insights believes that quarterly DRAM ASPs could still surprise on the upside in 2017. Furthermore, DRAM output is also being slowed, at least temporarily, by the ongoing transition of DRAM production to ≤20nm feature sizes by the major DRAM producers this year.

At $57.3 billion, the DRAM market is forecast to be by far the largest IC product category in 2017, exceeding the expected MPU market for standard PCs and servers ($47.1 billion) by $10.2 billion this year.  Figure 1 shows that the DRAM market has been both a significant tailwind (i.e., positive influence) and headwind (i.e., negative influence) on total worldwide IC market growth in three out of the past four years.

Figure 1

Figure 1

Spurred by a 12% decline in the DRAM ASP in 2016, the DRAM market slumped 8% last year.  The DRAM segment became a headwind to worldwide IC market growth in 2016 instead of the tailwind it had been in 2013 and 2014. As shown, the DRAM market shaved two percentage points off of total IC industry growth last year.  In contrast, the DRAM segment is forecast to have a positive impact of four percentage points on total IC market growth this year. It is interesting to note that the total IC market growth rate forecast for 2017, when excluding the DRAM and NAND flash markets, would be only 4%, about one-third of the current worldwide IC market growth rate forecast including these memory devices.

The March Update to the 2017 edition of The McClean Report further describes IC Insights’ IC market forecast revision, updates its 2017-2021 semiconductor capital spending forecast, and shows the final 2016 top 10 OSAT company ranking.

Research information that will be posted in the March Update to the 20th anniversary 2017 edition of IC Insights’ McClean Report shows that fabless IC suppliers represented 30% of the world’s IC sales in 2016 (up from only 18% ten years earlier in 2006).  As the name implies, fabless IC companies do not have an IC fabrication facility of their own.

Figure 1 depicts the 2016 fabless company share of IC sales by company headquarters location.  As shown, at 53%, the U.S. companies held the dominant share of fabless IC sales last year, although this share was down from 69% in 2010 (due in part to the acquisition of U.S.-based Broadcom by Singapore-based Avago).  Although Avago, now called Broadcom Limited after its merger with fabless IC supplier Broadcom became official on February 1, 2016, has fabrication facilities that produce III-V discrete devices, it does not possess its own IC fabrication facilities and is considered by IC Insights to be a fabless IC supplier.

Figure 1

Figure 1

Figure 2 shows that in 2009, there was only one Chinese company in the top-50 fabless IC supplier ranking as compared to 11 in 2016.  Moreover, since 2010, the largest fabless IC marketshare increase has come from the Chinese suppliers, which held a 10% share last year as compared to only 5% in 2010. However, when excluding the internal transfers of HiSilicon (over 90% of its sales go to its parent company Huawei), ZTE, and Datang, the Chinese share of the fabless market drops to about 6%.

Figure 2

Figure 2

European companies held only 1% of the fabless IC company marketshare in 2016 as compared to 4% in 2010.  The reason for this loss of share was the acquisition of U.K.-based CSR, the second largest European fabless IC supplier, by U.S.-based Qualcomm in 1Q15 and the purchase of Germany-based Lantiq, the third largest European fabless IC supplier, by U.S.-based Intel in 2Q15.  These acquisitions left U.K.-based Dialog ($1.2 billion in sales in 2016) as the only Europe-headquartered fabless IC supplier in the fabless top 50-company ranking last year (Norway-based Nordic Semiconductor just missed making the top 50 ranking with 2016 sales of $198 million).

There is also only one major fabless Japanese firm—Megachips, which saw its sales increase by 20% in 2016 (8% using a constant 2015 exchange rate), one major South Korean fabless IC company (Silicon Works), and one major Singapore-based (Broadcom Ltd.) fabless supplier.

Annual total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march in the next five years and are now expected to top one trillion units for the first time in 2018, according to data presented in IC Insights’ soon to be released March Update to the 2017 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry, and the 2017 O-S-D Report—A Market Analysis and Forecast for the Optoelectronics, Sensors/Actuators, and Discretes.

Semiconductor shipments totaled 868.8 billion in 2016 and are forecast to top one trillion units in 2018. Figure 1 shows that semiconductor unit shipments are forecast to climb to 1,002.6 billion devices in 2018 from 32.6 billion in 1978, which amounts to average annual growth of 8.9% over the 40 year period and demonstrates how dependent on semiconductors the world has become.

semiconductor unit growth

Figure 1

The largest annual increase in semiconductor unit growth during the timespan shown was 34% in 1984, and the biggest decline was 19% in 2001 following the dot-com bust.  The global financial meltdown and ensuing recession caused semiconductor shipments to fall in both 2008 and 2009; the only time that the industry experienced consecutive years in which unit shipments declined. Semiconductor unit growth then surged 25% in 2010, the second-highest growth rate across the time span.

Despite advances in integrated circuit technology and the blending of functions to reduce chip count within systems, the percentage split of IC and O-S-D shipments within total semiconductor units remains heavily weighted toward O-S-D devices.  In 2016, O-S-D devices accounted for 72% of total semiconductor units compared to 28% for ICs. Thirty-six years ago in 1980, O-S-D devices accounted for 78% of semiconductor units and ICs represented 22% (Figure 2).

Figure 2

Figure 2

Surprisingly, shipments of commodity-filled discretes devices category (transistor products, diodes, rectifiers, and thyristors) accounted for 44% of all semiconductor unit shipments in 2016. The long-term resiliency of discretes is primarily due to their broad use in all types of electronic system applications. Consumer and communications applications remain the largest end-use segments for discretes, but increasing levels of electronics being packed into vehicles for greater safety and fuel efficiency have boosted shipments of discretes to the automotive market as well. Discretes are used for circuit protection, signal conditioning, power management, high current switching, and RF amplification. Small signal transistors are still used in and around ICs on board designs to fix bugs and tweak system performance.

Among ICs, analog products accounted for the largest number of shipments in 2016. Analog ICs represented 52% of IC unit shipments in 2016, but only 15% of total semiconductor units. Figure 3 shows the split of semiconductor unit shipments by product type in 2016.

2016 semiconductor unit shipments

For 2017, semiconductor products showing the strongest unit growth rates are those that are essential building-block components in smartphones, new automotive electronics systems, and within systems that are helping to build out of Internet of Things.  Some of the fast-growing IC unit categories for 2017 include Consumer—Special Purpose Logic, Signal Conversion (Analog), Auto—Application-Specific Analog, and flash memory.  Among O-S-D devices, CCDs and CMOS image sensors, laser transmitters, and every type of sensor product (magnetic, acceleration and yaw, pressure, and other sensors) are expected to enjoy strong double-digit unit growth this year. More coverage about these semiconductor products and end-use applications are included in the 2017 editions of IC Insights’ McClean Report and O-S-D Report.

Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017.  The record is expected to be broken again in 2018, nearing the $50 billion mark. These record-busting years are part of three consecutive years of growth (2016, 2017 and 2018), which has not occurred since the mid-1990s. The report has been the industry’s most trusted data source for 24 years, observing and analyzing spending, capacity, and technology changes for all front-end facilities worldwide. See Figure 1.

fab equipment spending

Figure 1: Fab Equipment Spending (Front End Facilities)

SEMI‘s World Fab Forecast report (end of February 2017) provides updates to 282 facilities and lines equipping in 2017, 11 of which are expected to spend over $1 billion each in 2017. In 2018, SEMI’s data reflect 270 fabs to equip, with 12 facilities spending over $1 billion each.  The spending is mainly directed towards memory (3D NAND and DRAM), Foundry and MPU.  Other strong product segments are Discretes (with LED and Power), Logic, MEMS (with MEMS/RF), and Analog/Mixed Signal.

SEMI (www.semi.org) forecasts that China will be third for regional spending in 2017, although China’s annual growth is minimal in 2017 (about 1 percent), as many of the new fab projects are in the construction phase.  China is busy constructing 14 new fabs in 2017 and these new fabs will be equipping in 2018. China’s annual spending growth rate in 2018 will be over 55 percent (more than $10 billion), and ranking in second place for worldwide spending in 2018.  In total for 2017, China is equipping 48 fabs, with equipment spending of $6.7 billion; looking ahead to 2018, SEMI predicts that 49 fabs to be equipped, with spending of about $10 billion.

Other regions also show solid growth rates.  The SEMI World Fab Forecast indicates that Europe/Mideast and Korea are expected to make the largest leaps in terms of growth rates this year with 47 percent growth and 45 percent growth, respectively, year-over-year (YoY).  Japan will increase spending by 28 percent, followed by the Americas with 21 percent YoY growth.

The SEMI Industry Research & Statistics team has made 195 changes on 184 facilities/lines in the last quarter, with eight new facilities added and three fab projects cancelled. SEMI’s World Fab Forecast provides detailed information about each of these fab projects, such as milestone dates, spending, technology node, products, and capacity information. The World Fab Forecast Report, in Excel format, tracks spending and capacities for over 1,100 facilities including future facilities across industry segments.  The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, in-house equipment, and spending on facilities for equipment. Also check out the Opto/LED Fab Forecast.

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $30.6 billion for the month of January 2017, an increase of 13.9 percent compared to the January 2016 total of $26.9 billion. Global sales in January were 1.2 percent lower than the December 2016 total of $31.0 billion, reflecting normal seasonal market trends. January marked the global market’s largest year-to-year growth since November 2010. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor industry is off to a strong and encouraging start to 2017, posting its highest-ever January sales and largest year-to-year sales increase in more than six years,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Sales into the China market increased by more than 20 percent year-to-year, and most other regional markets posted double-digit growth. Following the industry’s highest-ever revenue in 2016, the global market is well-positioned for a strong start to 2017.”

Year-to-year sales increased substantially across all regions: China (20.5 percent), the Americas (13.3 percent), Japan (12.3 percent), Asia Pacific/All Other (11.0 percent), and Europe (4.8 percent). Month-to-month sales increased in Europe (1.2 percent), but fell slightly in China (-0.2 percent), Japan (-1.6 percent), Asia Pacific/All Other (-1.6 percent), and the Americas (-3.1 percent).

January 2017

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

6.33

6.13

-3.1%

Europe

2.80

2.84

1.2%

Japan

2.84

2.79

-1.6%

China

10.17

10.15

-0.2%

Asia Pacific/All Other

8.86

8.72

-1.6%

Total

31.01

30.63

-1.2%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.41

6.13

13.3%

Europe

2.71

2.84

4.8%

Japan

2.49

2.79

12.3%

China

8.42

10.15

20.5%

Asia Pacific/All Other

7.86

8.72

11.0%

Total

26.89

30.63

13.9%

Three-Month-Moving Average Sales

Market

Aug/Sept/Oct

Nov/Dec/Jan

% Change

Americas

6.06

6.13

1.2%

Europe

2.82

2.84

0.7%

Japan

2.89

2.79

-3.2%

China

9.78

10.15

3.7%

Asia Pacific/All Other

8.88

8.72

-1.8%

Total

30.43

30.63

0.7%

 

Survey results that will be posted in the March Update to the 20th anniversary 2017 edition of IC Insights’ McClean Report show that eleven companies are forecast to have semiconductor capital expenditure budgets greater than $1.0 billion in 2017, and account for 78% of total worldwide semiconductor industry capital spending this year (Figure 1). By comparison, there were eight companies in 2013 with capital spending in excess of $1.0 billion. As shown in the figure, three of the top 11 major capital spenders (Intel, GlobalFoundries, and ST) are forecast to increase their semiconductor spending outlays by 25% or more in 2017.

The biggest percentage increase in spending by a major spender in 2016 came from the China-based pure-play foundry SMIC, which ran its fabrication facilities at ≥95% utilization rate for much of last year. SMIC initially set its 2016 capital expenditure budget at $2.1 billion. However, in November, the company raised its spending budget to $2.6 billion, which resulted in outlays that were 87% greater than in 2015.

In contrast to the surge of spending at SMIC last year, the weak DRAM market spurred both Samsung and SK Hynix to reduce their total 2016 capital spending by 13% and 14%, respectively. Although their total outlays declined, both companies increased their spending for 3D NAND flash in 2016. As shown, Micron is forecast to cut its spending by 13% in 2017, even after including Inotera, which was acquired by Micron in December of last year.

In 2016, GlobalFoundries had plenty of capacity available. As a result, the company cut its capital expenditures by a steep 62%. As shown, the company is forecast to increase its spending this year by 33%, the second-largest increase expected among the major spenders (though its 2017 spending total is still expected to be about half of what the company spent in 2015). It is assumed that almost all of the spending increase this year will be targeted at installing advanced processing technology (the company announced that it is focusing its efforts on developing 7nm technology and will skip the 10nm node).

Figure 1

Figure 1

After spending about $1.06 billion last year, Sony is expected to drop out of the major spender listing in 2017 as it winds down its outlays for capacity additions for its image sensor business and its spending drops below $1.0 billion. As shown in Figure 1, ST is expected to replace Sony in the major spender listing this year by increasing its spending by 73% to $1.05 billion.  It should be noted that ST has stated that this surge in outlays is expected to be a one year event, after which it will revert back to limiting its capital spending to ≤10% of its sales.