Tag Archives: Small Times Magazine

January 20, 2012 — Purdue University researchers have created microtweezers for the manufacture of tiny structures in micro electro mechanical systems (MEMS), printing coatings on advanced sensors, and live stem cell sphere manipulation.

The variety of miniature structures in MEMS could be expanded using this microtweezer manufacturing technology, which assembles components like microscopic Lego pieces moved individually into place, said Cagri Savran, an associate professor of mechanical engineering at Purdue University. The microtweezers are compact and user-friendly, he added, and the team has demonstrated them by assembling 40um-diameter polystyrene spheres into three-dimensional shapes (at left below). It can also place tiny particles on the tip of a microcantilever (at right below).

Figure 1. Microtweezers constructing tiny structures at Purdue University. SOURCE: Birck Nanotechnology Center.

The new tool comprises a thimble knob from a standard micrometer, a two-pronged tweezer made from silicon, and a graphite interface that converts the turning motion of the thimble knob into a pulling-and-pushing action to open and close the tweezer prongs. No electrical power sources are needed. The new microtweezers are designed to be attached easily to translation stages and can be easily detached from a platform and brought to another lab while still holding a micro-size object for study, Savran said.

The two-pronged tweezer is micromachined in a cleanroom with the same techniques used to create semiconductors. The design’s one-piece "compliant structure," which is springy like a bobby pin or a paperclip, replaces the more complex hinges and other components of common microtweezers.

Figure 2. Purdue researchers’  microtweezers. SOURCE: Birck Nanotechnology Center.

"We currently are working to weigh single micro particles, individually selected among many others, which is important because precise measurements of an object’s mass reveal key traits, making it possible to identify composition and other characteristics," Savran said. That work is a collaboration with the research group of Timothy Ratliff, the Robert Wallace Miller Director of Purdue’s Center for Cancer Research.

The microtweezers also could facilitate the precision printing of chemical or protein dots onto microcantilevers to functionalize them for specific purposes. Microprinting a sequence of precisely placed dots of different chemicals on each cantilever, rather than coating it in one chemical, could functionalize a device to detect several substances at once with a smaller sample size.

The research was based at the Birck Nanotechnology Center in Purdue’s Discovery Park. Purdue has filed for a provisional patent on the design.

The research is described in the Journal of Microelectromechanical Systems (JMEMS) by Savran, mechanical engineering graduate students Bin-Da Chan and Farrukh Mateen, electrical and computer engineering graduate student Chun-Li Chang, and biomedical engineering doctoral student Kutay Icoz. Access the journal here: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=84

Courtesy of Emil Venere at Purdue University.

Research contact: Cagri A. Savran, 765 494-8601, [email protected].

Recently, National Institute of Standards and Technology (NIST) and the University of Virginia (UVA) have demonstrated that electron microscope beams can be used to move around nanoscale objects, raising the possibility of positioning and assembling nanoelectronics. Learn more: Electron beam could assemble nanoscale objects

View recent issues of the MEMS Direct newsletter

January 19, 2012 — Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.

Highlights of the 2012 event include a tablet PC teardown, with accompanying mobile-device sensor discussion; a panel on micro electro mechanical system (MEMS) future design trends and applications; and sessions on sensor integraion for smart grids and wireless cloud sensor networks.

Confirmed speakers include:
Steve Nasiri, Founder, President & CEO, InvenSense
Stephen Whalley, Director, Sensors, Intel
Steven Arms, President & CEO, Microstrain
Jamshid Avloni, President & CEO, Eeonyx
Brian Maccleery, Principal Product Manager for Clean Air Technology, National Instruments
Jamie Wiczer, Founder & President, Sensor Synergy
Thurston Brooks, VP Product Marketing. 3eTi
Mark Buccini. Director, Texas Instruments
Bob Scanell, Business Development Manager, Analog Devices, Inc.

View full sessions and register at www.sensorsindesign.com.

View recent issues of the MEMS Direct newsletter

January 18, 2012 — In 2011, Apple Inc. became the world’s largest purchaser of micro electro mechanical system (MEMS) microphones, passing Samsung Electronics Co. Ltd. Apple’s share of MEMS buying amounted to 27% for the year, compared to 20% for Samsung.

Top 4 brand purchasers of MEMS microphones in 2011 (Ranking by Unit Shipments in Millions of Units). SOURCE: IHS iSuppli.

2011 Rank Brand 2010 Unit Shipments 2010
Market Share
2011 Unit Shipments 2011
Market Share
2010-2011 Growth
1 Apple 127.8 18% 348.8 27% 173%
2 Samsung 132.2 19% 250.8 20% 90%
3 LG 90.4 13% 88.3 7% -2%
4 Motorola 44.0 6% 61.9 5% 41%
  Others 309.3 44% 533.9 42% 73%
  Grand Total 703.7 100% 1283.6 100% 82%

Overall global shipments of MEMS microphones rose to 1.3 billion units in 2011, up 82% from 704 million in 2010. MEMS microphone revenue in 2012 is projected to reach $493.5 million, up 32% from $373.2 million in 2011, shows an IHS iSuppli MEMS Market Brief. This year’s revenue expansion continues last year’s remarkable 64% increase. By 2015, MEMS microphone revenue will hit approximately $667.0 million, equivalent to a five-year compound annual growth rate of 24% starting from 2010. Shipments in 2015 will amount to some 2.9 billion units.

Apple primarily purchases MEMS microphones for its iPhones, headsets, and most notably iPads. Apple bought 173% more MEMS microphones year-over-year, or 349 million units, IHS reports.
 
MEMS microphones use a pressure-sensitive diaphragm etched on a semiconductor, replacing conventional electret condenser microphones (ECM) with a smaller form factor and better sound quality, among other benefits. Learn more in MEMS microphones make noise in 2012 from IHS director and principal analyst, MEMS and sensors, Jérémie Bouchaud.

Apple began its MEMS microphone buying spree with its iPhone 4, said Bouchaud. The iPad 2’s success pushed Apple into the #1 spot, with help from handsets and iPhones. Apple uses two analog MEMS microphones in its iPhone 4 and 4S phones, one analog MEMS microphone in the headset sold with the iPhone, and one digital MEMS microphone for Pad 2 tablets. "There has been a rapid adoption of multiple microphones in smartphone devices for noise compression, particularly important for voice commands such as those used in the Siri speech-recognition feature of the iPhone 4S," Bouchard notes.

Also read: Apple shares list of suppliers

Samsung uses dual MEMS microphones for its smartphones, and the microphones are also in the Galaxy 10.1 tablet. Samsung’s share in 2011 was roughly the same as it was in 2010.

Other notable MEMS microphones buyers include LG Electronics for its phones and G-Slate tablet; as well as Motorola Inc., an early adopter via its Razr phones as early as 2003.

Learn more about this topic with the forthcoming IHS iSuppli report, MEMS Microphones Go Digital in 2012: http://www.isuppli.com/MEMS-and-Sensors/Pages/MEMS-Microphones-Go-Digital-in-2012.aspx?PRX

View recent issues of the MEMS Direct newsletter

 

January 17, 2012 — IBM (NYSE: IBM) scientists have developed a flexible, non-contact, silicon microfluidic probe to accurately stain tissue sections at the micrometer scale for drug discovery and disease diagnostics research.

Tissue staining is widely used in pathology to detect disease markers in a patient’s sample. Traditional staining involves multiple chemical steps and precise exposure times. Mistakes at tissue staining can lead to false diagnoses. Biopsy samples are typically a few millimeters long. Staining is performed on many thin slices of the sample to identify and sub-type diseases.

The probe developed by IBM will "ensure a high diagnostic capability while minimizing patient discomfort," said Prof. Dr. Ali Khademhosseini, Associate Professor at Harvard Medical School and Brigham and Women’s Hospital. The probe stains a very small section of tissue with virtually any biomarker. Multiple stains can be used on the same sample.

The 8mm-wide, diamond-shaped probe comprises a silicon microfluidic head with 2 microchannels at each tip (See Figure 1). The head injects the liquid on the surface, then continuously aspirates the liquid to prevent spreading and accumulation on the surface, which can lead to overexposure.

Figure 1. The probe is similar to an inkjet head; however, unlike an inkjet printer cartridge, the head re-aspirates the liquid that it injects on a surface.

For tissue section analysis, the probe can deliver an antibody very locally in a selected area of a tissue section with pinpoint accuracy. Since analysis can be done on spots and lines instead of on the entire tissue section, the tissue is better preserved for additional tests, if required. In addition, only a few picoliters (one trillionth of a liter) of liquid containing antibodies are needed for each analysis spot.

The microfluidic probe fits to standard workflows in conventional pathology. In addition, it is compatible with current biochemical staining systems and is resistant to a broad range of chemicals. The small size of the probe also enables easy viewing of the sample from above and below by an inverted microscope commonly used in research and clinical laboratories. Pathology can be put on a "modern roadmap," thanks to "the latest developments in silicon-based microfluidics," said Govind Kaigala, a scientist at IBM Research – Zurich. Also read: Microfluidics: $4B in 2016, thanks to life sciences

Figure 2. Marios Georgiadis, currently a PhD student at ETH Zurich, Institute for Biomechanics, takes a closer look at a silicon wafer containing dozens of microfluidic probes.

Prof. Dr. Khademhosseini said, "The developed system may have great potential in applications where sample size and the need for testing various types of biological analysis are required. I am confident that one day such approach will enable us to take small tissue biopsies and be able to obtain significantly more information."

IBM scientists will continue to test and improve the probe and potentially begin using it in laboratory environments in the next several months. The team plans to explore specific clinical applications, possibly with partners in the field of pathology.

IBM’s work is reported in the peer-reviewed journal Lab on a Chip. The scientific paper entitled "Micro-immunohistochemistry using a microfluidic probe" by Robert D. Lovchik, Govind V. Kaigala, Marios Georgiadis and Emmanuel Delamarche, appears at http://pubs.rsc.org/en/content/articlelanding/2012/lc/c2lc21016a.

Figure 3. A concept and workflow of micro-immunohistochemistry (μIHC) using a vertical microfluidic probe (vMFP). Dewaxing and rehydration of the tissue are performed according to conventional IHC (1). Using injection and aspiration apertures at the apex of a vMFP head, a solution of primary antibody is hydrodynamically confined (in the presence of an immersion liquid) to selected areas of a tissue section (2). Post-processing for visualization of the antigens on the tissue section continues as in standard IHC: the tissue section is incubated with secondary antibodies, and enzymatic precipitation of 3,3′-diaminobenzidine (DAB) chromogen leads to a visual signal, indicating the expression level of specific antigens in the tissue section semi-quantitatively. Typical parameters for the vMFP scans are indicated. Source: Lab on a Chip, DOI:10.1039/C2LC21016A

See all the photos from the microfluidic probe development on Flickr

Learn more about IBM at http://www.ibm.com/us/en/

Recent IBM news: IBM discovers magnetic storage limit at 12 atoms

View recent issues of the MEMS Direct newsletter

January 17, 2012 — Micro electro mechanical system (MEMS) microphones are set to enjoy another blockbuster year in 2012 as the devices continue to find strong adoption in portable electronics, including the wildly popular iPhone and iPad from Apple Inc., according to a new report from IHS iSuppli.

Revenue this year for MEMS microphones is projected to reach $493.5 million, up a solid 32% from $373.2 million in 2011. This year’s expansion continues the mighty growth path seen by MEMS mics following last year’s remarkable 64% increase, and the next few years also will see healthy prospects for the space.

By 2015, MEMS microphone revenue will hit approximately $667.0 million, equivalent to a five-year compound annual growth rate (CAGR) of 24% starting from 2010. Shipments in 2015 will hit 2.9 billion units.

  2010 2011 2012 2013 2014 2015
Billions of US Dollars  227.7 373.2 493.5 576.2 628.6 667.0

MEMS microphones are miniature devices that employ a pressure-sensitive diaphragm etched on a semiconductor. The microphones are commonly designed into cellphones, headsets, notebook PCs, and video cameras, replacing conventional electret condenser microphones (ECM) while providing greater clarity and sound reception for spoken commands from device users.

The rapid growth is due to a combination of factors. First, MEMS penetration in handsets continues unabated, deepening to 50% in 2011 from 38% the year before. Handsets, in fact, make up the top application device. Second, there has been a rapid adoption of multiple microphones in smartphone devices for noise compression — particularly important for voice commands such as those used in the Siri speech-recognition feature of Apple’s iPhone 4S. Finally, MEMS microphones are becoming more broadly used, in laptops, tablets, gaming consoles and cameras.

Top MEMS mic buyers and suppliers
Not surprisingly, Apple was the top purchaser of MEMS microphones in 2011. Apple uses two analog MEMS microphones in its iPhone 4 and 4S phones, one analog MEMS microphone in the headset sold with the iPhone, and one digital MEMS microphone for the iPad 2 tablet.

Samsung Electronics Co. Ltd. is an important buyer of MEMS microphones, the top purchaser until Apple overtook the company last year. Samsung uses dual MEMS microphones for its handsets, and microphones are also utilized in the company’s Galaxy 10.1 tablet.

Other notable MEMS microphones buyers include LG Electronics for its phones and G-Slate tablet and Motorola Inc., an early adopter via its Razr phones as early as 2003.

Among suppliers, Knowles Electronics continues to dominate the market, though its share of MEMS microphone shipments has fallen from 88% in 2010 to 75% last year. Knowles supplies Apple, Samsung, LG, and Motorola.

ECM suppliers have begun to expand their portfolios by including MEMS microphones. Within this group, AAC Inc. is the most successful to date with 11% market share in 2011, functioning also as a second source to Knowles for the iPhone 4 and 4S. AAC, together with other Chinese-based ECM makers GoerTek Inc., Hosiden and BSE Co. Ltd, shipped more than 200 million MEMS microphones in 2011, with each buying MEMS dies from German outfit Infineon Technologies AG.

The No. 3 supplier in 2011 was Analog Devices Inc., thanks to its design win with the digital MEMS microphone in the Apple iPad 2. The company also sells into some niche applications, including teleconference equipment.

Other important MEMS microphone suppliers are Akustica (part of Bosch), which in 2011 sold tens of millions of digital MEMS microphones for use in laptops, up from less than 4 million in 2010; and STMicroelectronics, a top supplier also of digital MEMS microphones.  

Digital MEMS microphones sound out the right path
While MEMS microphones can be analog and are often used for the acoustic function in handsets, digital microphones yield several advantages. For instance, changes in design are easy to implement in the device for which the microphones are intended, and time to market is also shorter. Digital microphones are less sensitive to electromagnetic interference, and an increased Power Supply Rejection Ratio (PSRR) simplifies architecture and improves audio quality. In the case of noise suppression with three or more microphones, the signal from digital microphones is easier to process than from analog.

Aside from their use in handsets, digital microphones also provide better immunity to electromagnetic interference when used in laptops, especially in Voice over IP (VoIP) applications.

Though currently more expensive than comparable surface-mountable (SMD) digital ECMs, digital MEMS microphones will become more competitive, IHS believes, leading to their rapid adoption for the foreseeable future. Nokia Corp. started to increase the share of digital MEMS microphones in its handsets during the second half of 2011 — a trend that will continue with other handset manufacturers in the next two years.

Apple also has started implementing digital MEMS microphones on its iPad 2, and the next iPhone version is expected to use multiple digital MEMS microphones.
 
Learn more about this topic with the forthcoming IHS iSuppli report "MEMS Microphones Go Digital in 2012." For more information, visit http://goo.gl/IWykx.

Jérémie Bouchaud is an analyst at IHS.
Recent IHS research:

View recent issues of the MEMS Direct newsletter

January 17, 2012 – PRLEAP.com — Norcada launched 2 microporous silicon nitride transmission electron microscopy (TEM) sample holders, suiting atomic layer deposition (ALD) analysis, thin film growth, and other applications under TEM, SEM, or STXM tools.

The windows have a mesh structure with 2µm-diameter holes and 3µm distance, and their uniform high-quality silicon nitride film is available in 50nm and 200nm thicknesses.

Norcada micro-porous TEM membrane films a supportive platform for overhanging samples across the 2um holes. A string-shaped material or a micron-sized sample can be placed or grown across the holes, allowing for a no thin film background for the microscopy image.

"The microporous TEM membranes easily withstand manipulation of small particles with a single-hair paintbrush," said Dr. Anna Butterworth from the Space Sciences Laboratory at the University of California, where they have been using the membrane for thin-film measurements in a project involving ALD samples studied with transmission x-ray spectroscopy. "The holey membrane is ideal for nm-resolution work in TEM and STXM."

Norcada microporous TEM membranes are manufactured to fit any commercial TEM sample holder, and are inspected and packaged in a Class 100 (ISO-4-5) Cleanroom.

Norcada is a micro/nano device product development company, with extensive industrial experience and capabilities in MEMS design and fabrication for Silicon Optical Benches (SiOB), sensors, X-ray microscopy windows and TEM Analysis Windows, and other commercial devices. Norcada has a state-of-the-art MEMS design, prototyping, and test facility. Learn more at www.norcada.com.

View recent issues of the MEMS Direct newsletter

January 16, 2012 — The analysts at IDTechEx look at the year past (2011) and the year ahead (2012) for energy harvesting devices.

2011 held multiple scientific advances, technology breakthroughs, and new product developments in the energy harvesting field. This will continue in 2012, IDTechEx predicts, along with a stronger push for commercialization. Other trends include optimized power consumption in electronics devices, such as Intel’s Claremont processor that runs on solar power.

Piezoelectric energy harvesters have evolved in a few years from harvesting μW of power to miliwatts in 2008, and higher energy designs are being demonstrated today. At Energy Harvesting 2011 in Boston, research work from the US National Institute of Aerospace (NIA) showcased development of high energy efficiency piezoelectric energy harvesters. Focusing on basic scientific principles that demonstrated how the "33" (longitudinal) excitation mode on piezoelectric harvesters is characterized by 3x higher energy conversion efficiency than the "31" (transverse) excitation mode, the NIA researchers described the design and construction of a hybrid piezoelectric energy harvesting transducer that can harvest 4x more energy than a tradition "31" harvester. The NIA will now optimize these devices with numerical piezoelectric harvesters being developed that can harvest up to 1W of power in 2012.

Also read: IMEC improves piezoelectric energy harvesters to drive vehicle health monitoring and MicroGen hones piezoelectric MEMS energy harvester at Cornell

End user pull is increasing, leading to increased interest in the capabilities of energy harvesters and the bespoke performance they can provide in very specific operating environments. Thermoelectrics company Micropelt demonstrated a cooking sensor co-developed with MSX technology, in which Micropelt’s thermal energy harvesting technology allows for a fully embedded and sealed cooking sensor for the life time of the gear; and qNODE, developed with Schneider Electric, a wireless condition monitoring sensor for 24/7 production environments. The cooking sensor harvests power from the cooking heat; qNODE wireless temperature sensor generates its power from the resistive heat of the device it is monitoring.
 
These technologies and others will be the subject of IDTechEx’s upcoming Energy Harvesting & Storage and Wireless Sensor Networks & RTLS Europe 2012, for full details, visit www.IDTechEx.com/eh.

View recent issues of the MEMS Direct newsletter

Also visit the new Energy Storage Channel on ElectroIQ.com!

January 16, 2012 — Baolab Microsystems is launching evaluation kits of its 3D 3-axis CMOS MEMS NanoCompass technology at the end of February 2012. NanoCompass technology uses Baolab’s NanoEMS technology to create nanoscale micro electro mechanical systems (MEMS) within the standard metal structure of a high-volume-manufactured CMOS wafer.

NanoEMS sensors have moved to volume production on a standard CMOS fab line. The MEMS structure — inertial masses, suspension springs, capacitive sensing plates, cantilevers, switching contacts — is mask-defined within the standard CMOS metal interconnect layers and vias. The Inter Metal Dielectric (IMD) is then etched away through tiny openings in the passivation layer, freeing the MEMS structures. The holes are then sealed and the chip packaged.

"NanoEMS makes it much easier and more cost effective to integrate MEMS sensors with microcontrollers and associated electronics all on the same chip in the same CMOS production line," said Dave Doyle, Baolab’s CEO.

Possible areas that Baolab and its customers are investigating are:

Vibrating antennas. These overcome the limitations of classic (static) antennas such as compact superdirective/superesolution antennas/lenses that require phase shifters and gains with an accuracy not currently realistic. Vibrating antennas make these feasible along with spatial multiplexing communications for mobile telecoms and internet.

Thermo-magnetic RF switches & antennas. By exploiting the low value of the Curie temperature of Nickel, it is possible to build RF switches, filters and reconfigurable antennas. This creates a novel category of reconfigurable RF MEMS components which are highly reliable, since there are no moving parts, achieving compelling RF specs, low power consumption and low cost thanks to CMOS processing.

Modal switches. This novel topology enables compelling specifications for RF switches with low-capacitance ratio and high isolation, using low cost, low resistivity CMOS substrates. The principle is based on transferring power from the different transmission modes in a transmission line, using reconfigurable MEMS loads to balance and unbalance the line.

Integrated passives: inductors, transformers, capacitors. Integrated inductors with a helicoidal shape typical of off-chip inductors, offer reduced losses (higher Q) and smaller parasitic capacitance (higher resonant frequency). It is also possible to create transformers with any winding ratio.

Integrated capacitors for low frequency applications, especially power, where the tangent capacitance is used instead of the traditional approach using secant capacitance. When capacitors are used in voltage regulators, only a small fraction of the charge stored in the capacitor is typically used to regulate the voltage. This kind of capacitor allows a higher percentage of the stored charge to be used to regulate the voltage, which makes it possible to implement smaller, integrated filters and regulators, with superior performance.

RF filters. The small feature size of CMOS processing makes it is possible to implement RF MEMS filters up to the GHz band required for cell phone communications and significantly increase the electromechanical coupling. Current MEMS RF mechanical filters have a problem with very low electromechanical coupling, which means low sensitivity, that they try to offset by means of using a very high voltage but with limited success.

Power converters. NanoEMS MEMS enable integrated charge pumps and power supplies, which are lower in cost, more compact and more efficient.

Baolab Microsystems’ technology enables MEMS to be created inside the CMOS wafer using standard manufacturing techniques. Internet: www.baolab.com.

View recent issues of the MEMS Direct newsletter

January 12, 2012 — Multitest, semiconductor test equipment maker, shipped the first Multitest MEMS equipment for the MT9510 pick-and-place test handler to an IDM in the US. The IDM will perform micro electro mechanical system (MEMS) gyroscope test on the newly installed tool.

This new combination is based on the MT MEMS and MT9510 platforms, combining expertise in MEMS test and device under test (DUT) handling. The MT9510 offers positioning accuracy and tri-temp performance for MEMS test.

Multitest has delivered MEMS test products integrated with tri-temp handlers and strip testers for various applications. The company has received additional orders for package conversion kits and other systems.

Multitest manufactures test equipment for semiconductors: test handlers, contactors, and ATE printed circuit boards. For more information, visit www.multitest.com/MEMS or www.multitest.com/MT9510XP.

January 11, 2012 – BUSINESS WIRE — WiSpry Inc., tunable radio frequency (RF) semiconductor maker, confirmed that its RF micro electro mechanical system (MEMS) technology is used in the first mass-produced RF-MEMS-enabled handset. WiSpry’s antenna tuner extends usable bandwidth for small form-factor antennas, dynamically compensates for user interference such as hand placement that touches the antenna, and lowers the energy required for a given radiated signal.

The design win was first reported in an IHS iSuppli teardown, detailed in RF MEMS tuned for growth, shows smartphone win. IHS expects this component to kick off a slew of RF MEMS integration, supplied from established companies (Sony) to start-ups (DelfMEMS).

WiSpry’s WS2017 tunable impedance match (TIM) circuit comprises a network of low-loss inductors combined with WiSpry’s digitally tunable, low-loss MEMS capacitors. In this application, the resulting impedance-transforming network can dynamically compensate for VSWR up to 20:1 or greater. The setting for the network is controlled via a serial bus and continuously updated in sync with the radio signal.

Jeffrey Hilbert, president and founder of WiSpry, sees RF-MEMS as "an indispensable component in the larger toolkit" for 4G devices.

WiSpry will demo the device all week as part of the MEMS Techzone at International CES 2012 in Las Vegas, Las Vegas Convention Center South Hall 2, booth #25218.

WiSpry is a fabless RF semiconductor company that designs and manufactures RF-CMOS integrated circuits and components for leading manufacturers of mobile phones, laptops and wireless data communications products. For more information, visit www.wispry.com.

View recent issues of the MEMS Direct newsletter