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Jan. 2, 2007 — Researchers at Purdue University have used a new technique to rapidly detect and precisely identify bacteria, including dangerous E. coli, without time-consuming treatments usually required.

The technique, called desorption electrospray ionization, or DESI, could be used to create a new class of fast, accurate detectors for applications ranging from food safety to homeland security, said R. Graham Cooks, the Henry Bohn Hass Distinguished Professor of Chemistry in Purdue’s College of Science.

Using a mass spectrometer to analyze bacteria and other microorganisms ordinarily takes several hours and requires that samples be specially treated and prepared in a lengthy series of steps. DESI eliminates the pretreatment steps, enabling researchers to take “fingerprints” of bacteria in less than a minute using a mass spectrometer.

“This is the first time we’ve been able to chemically analyze and accurately identify the type of bacteria using a mass spectrometer without any prior pretreatment within a matter of seconds,” Cooks said.

New findings show how the Purdue researchers used the method to detect living, untreated bacteria, including E. coli and Salmonella typhimurium, both of which cause potentially fatal infections in humans.

“There is always an advantage to the analysis of living systems because the bacteria retain their original properties,” Cooks said.

The findings are detailed in a paper appearing Jan. 7 in the journal Chemical Communications. The paper was written by chemistry graduate students Yishu Song, Nari Talaty and Zhengzheng Pan; Andy W. Tao, an assistant professor of biochemistry; and Cooks.

Mass spectrometry works by turning molecules into ions, or electrically charged versions of themselves, inside the instrument’s vacuum chamber. Once ionized, the molecules can be more easily manipulated, detected and analyzed based on their masses. The key DESI innovation is performing the ionization step in the air or directly on surfaces outside of the mass spectrometer’s vacuum chamber. When combined with portable mass spectrometers also under development at Purdue, DESI promises to provide a new class of compact detectors.

Purdue researchers are focusing on three potential applications for detecting and identifying pathogens: food safety, medical analysis and homeland security. Such a detector could quickly analyze foods, medical cultures and the air in hospitals, subway stations and airports, Cooks said.


This illustration depicts the use of a technique developed at Purdue to identify bacteria in its ambient environment using mass spectrometry. The technique, called desorption electrospray ionization, or DESI, could be used to create a new class of fast, accurate detectors for applications ranging from food safety to homeland security. (Purdue University, Department of Chemistry)

The researchers are able to detect one nanogram, or a billionth of a gram, of a particular bacterium. More importantly, the method enables researchers to identify a particular bacterium down to its subspecies, a level of accuracy needed to detect and track infectious pathogens. The identifications are based on specific chemical compounds, called lipids and fatty acids, in the bacteria.

“We can determine the subspecies and glean other information by looking at the pattern of chemicals making up the pathogen, a sort of fingerprint revealed by mass spectrometry,” Cooks said. “Conventional wisdom says quick methods such as ours will not be highly chemically or biologically specific, but we have proven that this technique is extremely accurate.”

The procedure involves spraying water in the presence of an electric field, causing water molecules to become positively charged “hydronium ions,” which contain an extra proton. When the positively charged droplets come into contact with the sample being tested, the hydronium ions transfer their extra proton to molecules in the sample, turning them into ions. The ionized molecules are then vacuumed from the surface into the mass spectrometer, where the masses of the ions are measured and the material analyzed.

Such a system could alert employees in the food and health-care industries to the presence of pathogens and could provide security personnel with a new tool for screening suspicious suitcases or packages.

Song will further the research, conducting experiments to look for bacterial contaminants in foods. Ongoing work by Talaty with international E. coli expert Barry Wanner, a professor in Purdue’s Department of Biological Sciences, will apply the method to living bacteria in so-called biofilms.

DESI has been commercialized by Indianapolis-based Prosolia Inc.

“This method could be applied very soon because the hardware is already available,” Cooks said.

The DESI instrument and mass spectrometer used in the research are housed at the Bindley Bioscience Center at Purdue’s Discovery Park.

Cooks also is leading work to build miniature versions of the normally bulky mass spectrometer, creating shoebox-size instruments that weigh about 10 kilograms (22 pounds), compared to about 30 times that weight for a conventional mass spectrometer.

Much of the research funding was provided by the National Science Foundation, the Office of Naval Research and by Prosolia through the Indiana 21st Century Research and Technology Fund.

– Emil Venere

MEMS components have been in projectors since 1996 and in TVs since 2002, but the cell phone market is the latest, greatest frontier

By Sarah Fister Gale

MEMS chips are finally small enough, cheap enough, and rugged enough to take their place in the world of consumer electronics. Motion sensors, microphones, gyroscopes and accelerometers are currently flourishing in consumers’ cell phones, digital cameras, gaming devices, laptops and other devices.

What’s more, experts say, the trend is just getting started. MEMS manufacturers – both the large, fully-integrated behemoths and the small, fabless outfits – are gearing up for a breakout year in 2007.

“The main reason that MEMS components are popular now for consumer electronics is that they offer sizes and functions not previously available,” said Jean Christophe Eloy, general manager of Yole Développement, a MEMS market research company in Lyon, France. “The components are also smaller and can be soldered directly onto the circuit boards. That offers a real technology and price advantage.”


Small companies like Knowles Acoustics, Akustica and MEMSTech were first out of the gate with MEMS microphones – and Knowles leads the pack in volume – but now big players like Infineon are edging in. The German juggernaut announced its silicon microphone, shown here, in November. Image courtesy of Infineon
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The latest forecasts from Yole indicate that the MEMS market will grow from $5.1 billion in 2006 to $9.7 billion by 2010, thanks in large part to consumer electronics applications.

“In response to this transition to consumer markets, many MEMS manufacturing companies are changing their business strategies to accommodate the low-cost, high-volume demand,” Eloy said.

Can you hear me now?

The acceleration of MEMS sales in consumer product categories in 2007 and beyond will involve both continuous growth in existing markets – such as inkjet print heads, pressure sensors and microphones – as well as huge growth in new applications for any device that might offer a better man-machine interface. (Think tilt navigation, for instance.)

Since 2004, the industry has seen increasing sales of MEMS devices across multiple consumer applications, with MEMS microphones for cell phones leading the pack. The market for MEMS microphones in cell phones alone is forecast to grow from 60 million units in 2005 to more than 350 million units in 2008; and overall MEMS microphone volumes will top 432 million units in 2008, according to a September 2005 Yole report. A similar growth rate in the speaker sector is expected to propel the MEMS microspeaker market.

Knowles Acoustics in Itasca, Ill., which shipped its first MEMS microphone in 2003, has emerged as the top provider of MEMS acoustic components, and recently announced shipment of its 300 millionth SiSonic surface mount MEMS microphone, according to Jeff Niew, Knowles vice president and general manager.


Established applications like inkjet heads won’t grow as fast as some of the new applications for MEMS in consumer electronics. Source: Yole Développement
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The company expects to have shipped its 500 millionth microphone by the middle of 2007 with continuous rapid growth in this market over the coming years, thanks in large part to the proliferation of cell phones. “The cell phone market is larger than all the other markets for MEMS components combined,” Niew said. “This year alone 970 million cell phones will be purchased…The volume is staggering.”

Investment in high volume production fabs has supported the increased popularity of these components and allowed for lower costs and smaller dimension units than previously possible, Niew says. To further stabilize costs and allow for ongoing rapid innovation, Knowles builds every new generation microphone using its original platform. “The lifespan of our products is 8-to-20 months,” he said. “We can’t waste time reinventing platforms every time we release a new model.”

The Holy Grail is in your hand

Microphones are not the only MEMS components benefiting from the cell phone market. In fact, cell phone manufacturers promise to be among the largest users of multiple MEMS devices, as they pack more and more features into thinner and smaller phones.

Gyroscopes, RF switches, and oscillators to replace quartz all offer compelling uses for cell phones, Eloy says. These components will be used to eliminate blurred photos, protect data against trauma, lengthen battery life, enhance GPS tracking, create more robust motion sensing menu interfaces, and more.


The development of MEMS for consumer electronics is one of many industry drivers that are generating increased demand for MEMS foundry services. Source: Yole Développement
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A case in point is InvenSense, which is tapping into the cell phone market for MEMS devices with its dual axis gyroscopes originally intended for image stabilization for digital cameras and camcorders. But today that market has exploded because of cell phones, 40 percent of which feature digital cameras. The gyros can also be used to enhance location-based services and navigation tools with better GPS accuracy, and enable smarter user-interfaces using hand motions and gestures as commands for more natural interaction.

The Santa Clara, Calif.-based company entered the MEMS market three years ago with a focus on consumer applications right from the start. “Historically, MEMS companies take years to develop a product and begin with industrial applications, but we bucked the trend,” said CEO Steve Nasiri. He credits the massive influx of capital into MEMS research in 2000 for the technology advances and ability to ramp up with a high volume, low cost approach. “MEMS went from a secret formula to a widely accepted semiconductor model in a very short amount of time.”

At the same time, demand for image stabilization has increased with the proliferation of camcorders and digital still cameras. “As the technology improved zoom and pixel rates, stabilization became critical,” he said. “They needed the gyroscope to cancel out the hand jitters that caused image blurring.”


Mobile device form factors draw on MEMS for everything from microphones to image stabilization to micro fuel cells for power. Source: Yole Développement
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Today, 35 percent of point-and-shoot cameras on the market use MEMS-based image stabilization technology, he said, and Nasiri predicts that by 2009 this will be a standard feature in all still and moving cameras. Industry projections also forecast that camera phones offering three megapixels and more are expected to reach 300 million units by 2008, creating another booming market for MEMS technology. “Cell phones are the holy grail of the MEMS world,” Nasiri said.

Nasiri says InvenSense is shipping dual axis integrated gyroscopes for less than $3 per unit and can produce thousands of gyroscopes on a single 6-inch wafer with integrated electronics. “We are already producing at maximum capacity and expect to have shipped several million units by early 2007,” he said.

The new game in town

Outside of the cell phone market, a more recent and highly publicized application of motion sensing MEMS components is in the latest generation of gaming controllers. The much anticipated Nintendo Wii features a wireless motion control device that promises to transform game play from a passive stationary experience to an interactive one, with gamers swinging virtual tennis rackets, wielding invisible swords and strumming interactive air guitars all thanks to accelerometers from STMicroelectronics and Analog Devices.

The sensors in the controller detect the motion and tilt of a player’s hand in three dimensions and respond to changes in direction, speed, and acceleration, converting those movements into immediate game action.

“These sensors will change the way people play,” said Benedetto Vigna, MEMS business unit director for STMicroelectronics in Milan, Italy. “It makes them feel like they are really in the game itself.”

Nintendo sold 600,000 of the new Wii consoles in its first eight days on the market and expected to sell four million in the United States and Canada alone in the six weeks leading up to the end of 2006.

Vigna attributes the popular innovation to three recent changes in MEMS sensor manufacturing – the dimensions are smaller, they require less power and they cost substantially less than they did just a few years ago.

“We’ve broken the prejudice that MEMS components are inaccessible,” he said. “We’ve done the innovation and brought down the cost structure to allow for large volume production at lower costs.”

The company recently announced it has inaugurated a new 200mm wafer fabrication line dedicated to MEMS devices at its manufacturing site in Agrate, near Milan. The new line will manufacture accelerometers, gyroscopes, microphones and pressure sensors. “Using the 200mm wafers will further reduce unit costs and accelerate both the expansion of current applications and the development of new MEMS markets,” Vigna said.

The future

As the technology behind MEMS continues to improve, new and better devices will continue to transform the way consumers use and interact with their electronics. Infineon Technologies in Munich, Germany, recently entered the market with a MEMS microphone that can withstand temperatures of up to 260 degrees Celsius and is intended to be more resistant to vibration and shock than conventional microphones. Due to the high temperature-resistance, the microphone can be soldered without difficulty onto any standard PCB and is intended for use on fully automated production lines common to mass market consumer products.

Looking beyond 2007, the possible applications for MEMS devices in consumer electronics is limited only by imagination and consumers’ hunger for information and entertainment at their fingertips, Eloy says.

Nasiri predicts that by 2008 the industry will have perfected a six-axis inertial measurement unit that can fit in the same space as a dual axis model and deliver a more complete range of motion sensing capabilities for the same cost. “It will be a much more realistic interface between man and machine,” he said.

By Lee Richmond, Makino

In an endless pursuit of the capabilities of micromachining, we often run across test cuts that are of interest. Recently, a medical staple mold demonstrated what is possible with current technologies.

A customer challenged a Makino user with a medical staple mold that would require cutting tools down to 0.20mm radius. The user was very capable and experienced in mold building, and was comfortable at 0.30mm, but anything smaller was uncharted territory.

This mold is a good example of a lot of current micromachining work. Innovative products need innovative molds that often have difficult feature details, which can be nearly impossible without the proper machinery and techniques. This is especially true when it comes to the medical market, where cost of production is typically secondary to protecting intellectual property, following stringent government guidelines, and making a superior product.

The mold steel is 420 stainless, hardened to 52 – 54 HRc (Rockwell hardness C scale). It has eight cavities and inside corner radii had to be held to 0.20mm. The part is so small that hand-polishing to finish any details or to clean up a rough finish is impossible, so the mold must be accurate and polish-free straight off the machine.

The original process was to CNC (computer numerical control) mill an electrode, EDM (electrical discharge machine) the cavity detail, finish mill and grind the rest of the details. This took a total of 67 hours. It’s an efficient method when direct milling is not possible, but there’s a lot of time tied up in prep work, and not actual production of the mold.

The new process was to hard mill the mold on a Makino V22 vertical machining center, skipping the EDM process. This alone saved the user a substantial amount of time. However, to challenge the production capabilities even further, the customer requested a unique test cut be preformed, cutting the corner radii in half to 0.10mm.


Micromachining bears great resemblance to its macroscale counterpart. Photo courtesy of Makino
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The part required five tools with nine different programs to keep the cuts in different areas of the mold to match specifications. Tools from 2mm down to 0.10mm radius were used. Tool-to-tool blending is critical, so we used Makino’s hybrid Automatic Tool Length Measurement (ATLM) system, installed on the V22. This system ensures that tool growth and wear is controlled, since the margin of error is so minute and surface finish requirements are so critical.

The final result allowed us to complete the core in 21 hours and the cavity in 13 hours. The majority of the 21 hours on the cavity was to pick out the tiny corners. The total time to produce the mold was reduced from 67 to 34 hours, or approximately 50 percent.

After the success of the new hard milling process, we decided that it might be interesting to push the boundaries of this process even further, just to see what was possible.

We decided to tweak the part design a bit – shrinking the overall size of the part and tightening up the corner radiuses, now down to 0.076mm. To do this, we had to use a 0.05mm radius tool, as no standard tool in between 0.10mm and 0.05mm radius is available.

The smaller cuts increased the cut time from 13 hours to 32 hours, a 244 percent cycle time increase in the cavity. The core proved too long to continue the cut. Step-over in the core got down to 2.5 microns and step-down to 4 microns. Tool failures started to pile up.

In conclusion, we were able to get great results cutting corner radii to 0.20mm, then even better when we went down to a 0.10mm. We hit a wall when we attempted a 0.076mm corner radius with a 0.05mm radius cutter. Cycle times spiked dramatically and the tooling wore out quickly.

Without a tool between 0.10mm and 0.05mm radius, a 0.076mm corner radius is impractical in hardened 420 stainless steel.

Why does this matter? Because we learn what’s possible from our failures as much as we learn from our successes. Since we were able to hold 0.10mm corner radii while improving cycle times in a hardened steel mold, it shows that we’re going down the right path. All the ingredients aren’t there to go even smaller, but we’re getting very close.

The test cuts will continue, and we are confident we’ll get a 0.076mm corner radius, and even tighter, with some more tweaking. In the meantime, we need to examine our processes, tooling, and machine to make sure we’re doing everything we can to increase accuracies even further.

To get tolerances like these, there are a few essential components that must be considered. Typical machining applications allow for several microns or more of variation. When you’re dealing with micro-molds, a single micron of inaccuracy will often ruin your work piece.

First, the machine you choose must be stable, both thermally and for vibration. Any growth in the tool that isn’t addressed properly can devastate your accuracy, just as chatter can when milling hardened steel with a tiny tool.

The way Makino accomplishes thermal stability is with a core-cooled spindle and insulation of the work envelope. These advancements permit us to accurately control and predict how much the tool will grow, which allows the machine’s software to compensate, and therefore maintain our accuracies. Vibration is kept to an absolute minimum with heavy castings, a spindle designed to be utterly rigid, and software which compensates for the properties of metal being cut at high speeds.


Makino engineers found that they could get great results cutting corner radii to 0.20mm, then even better down to a 0.10mm radius, but that tooling wore out quickly when attempting a 0.076mm corner radius with a .05mm radius cutter. Image courtesy of Makino
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Another aspect of the machine tool that must be considered is the servo control technology. Makino has implemented high resolution scale feedback that is able to recognize and achieve sub-micron movements, and therefore hold the tolerances of micro applications.

The second thing you’ll need to accomplish cuts this accurate and small is a programmer with a creative streak. Most programmers aren’t accustomed to working with step-overs and step-downs of only a few microns or less, or with tooling that will break if it rubs too long or hits a corner incorrectly, so it’s important to consult someone who’s done it before to program the cuts correctly.

To program a mold in hardened steel is hard enough, but when you factor in the accuracies needed and the unique tooling, it’s simply not something that just anybody can do. And that programmer needs the right tools – programming software that gives him the ability to run the tricks, like trichoidal roughing and arc fitting corners, needed to successfully mill hardened micro molds.

Finally, you need the right tooling. Everyone has their vendor preference, but without tools with predictable life and performance, that cut as they’re designed to, you’ll never hold the tolerances needed for micro work.

Most of the tooling needed in submicron work is so small you literally can’t touch it without breaking it – most machinists aren’t used to using it, much less buying it. And keep in mind that tooling is usually not an area where cutting corners saves you money. You’ll just end up paying on the back end with re-work, delayed deliveries, or even worse, outsourcing the part when you can’t produce it.

Nearly every micromachining process is a trial-and-error situation, especially when it comes to sub-micron cuts. This process can be shortened greatly with the aid of engineers experienced in micromachining, along with some fundamental ingredients like a capable machine tool, tooling, and programming tailored specifically for micromachining.

Lee Richmond is micro market manager at Makino (www.makino.com) in Auburn Heights, Mich. He can be reached at [email protected].

By Roger Allan

A recent spate of spectacular MEMS product developments aimed at large mainstream applications has kindled debate about MEMS’ suitability for high-volume CMOS manufacturing. Has MEMS’ moment arrived? Most experts express optimism that the time is coming closer, but they believe it will be challenging to monolithically integrate a MEMS structure and a CMOS circuit – for, say, signal conditioning – on the same wafer.

At the MEMS Industry Group’s Executive Congress in November in Scottsdale, Ariz., a common theme was that it is very challenging to establish a common manufacturing process that can be implemented by foundries like TSMC or Chartered Semiconductor – and that’s a major reason why nearly all MEMS manufacturers use their own processes. At the same time, many say there’s a trend for MEMS companies to go fabless.

The trouble is, said Kevin Shaw, director of business development at Sensor Platforms, “MEMS processes do not integrate well with CMOS. A MEMS element is not optimally designed for electrical properties but for mechanical properties. Stability issues can arise in trying to integrate MEMS onto a CMOS wafer.” Sensor Platforms specializes in ASICs for MEMS sensors or actuators.

Indeed, many MEMS manufacturers prefer to use a hybrid approach to make cost-effective devices rather than a pure monolithic method. Often, the MEMS element is on one chip while the signal-conditioning circuitry is on another, usually an ASIC. Interconnecting the two requires a very careful approach to ensure that acceptable yield and reliability levels are achieved.


SiTime makes use of a process called “MEMS First” that buries the MEMS element within a wafer. Source: SiTime
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“It is not sufficient to have only a sensor or actuator to act on data,” said longtime MEMS consultant Roger Grace. “You also need signal conditioning to provide analog-to-digital conversion, temperature compensation, filtering and a myriad of other functions that is deliverable to the rest of the system’s computer for analysis and decision making. And the hybrid approach is what a majority of MEMS IC volume producers have chosen.”

He tempers his remarks with the observation that there’s room for both monolithic and hybrid approaches in MEMS, depending on the application of the MEMS IC and the cost-effectiveness of the manufacturing process.

InvenSense Inc., for example, has made dual-axis CMOS MEMS gyroscopes using a proprietary, patented, wafer-level packaging that allows the company to fully test the IC at the wafer level. The bonding process provides electrical connections between both wafers and creates a hermetic seal between them.

In the company’s view, this approach avoids many pitfalls associated with trying to integrate the MEMS and CMOS processes, as done with a surface micromachining process like that used by Analog Devices for its MEMS accelerometers.


Akustica’s design for its MEMS microphone combines both CMOS electronics and MEMS sensing elements on a single wafer. Source: Akustica
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Akustica has shown that a monolithic MEMS IC can be made on a CMOS process. In the Akustica microphone, being manufactured by X-FAB Semiconductor Foundries AG, the metallization layer serves as the MEMS element. Specifications released so far show impressive performance. The company is bullish on its chips, and is predicting large shipments of its MEMS ICs, not only as microphones, but also for CMOS sensors of all types.

It should be noted that Analog Devices has successfully manufactured MEMS ICs like accelerometers, gyroscopes, and more for a long time using its iMEMS process, whereby the MEMS element sits next to the signal-conditioning CMOS on the wafer. So has Texas Instruments, with its digital micro-mirror device (DMD) for projectors and televisions. It sits on the same CMOS wafer holding the electronics. Both companies have been very successful in the market with their products.


Analog Devices’ design for its sensors puts the MEMS elements on a wafer next to signal conditioning CMOS circuitry. Source: Analog Devices
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Analog Devices and TI, however, use their own in-house-developed fabrication processes. And there’s a general consensus in the MEMS community that for a fabless IC design house to be successful in MEMS manufacturing, it must have the volumes and thus the lower costs to use an outside CMOS foundry.

In the case of the SiTime MEMS resonator, the company makes use of a two-chip proprietary process called “MEMS First” that uses an Epi Seal packaging process licensed from Bosch. The Silicon Valley Technology Center (SVTC) helped SiTime develop a manufacturing process for the timing chip.

Bert Bruggeman, SVTC’s managing director, believes the SiTime approach is a good example of making MEMS devices with a CMOS process. “The MEMS element is transparent to the CMOS process,” he said. He also praised the Akustica design.

He cautions, however, that MEMS devices need to be developed for 8-inch wafers to be manufactured cost-effectively in volume. “It may take two to three years before we go from a MEMS design to large-scale production,” he said. “In five years, we may see an entirely new way of making MEMS. As the market starts growing, many of the present MEMS manufacturing problems will be worked out.”

Making light of the small


January 1, 2007

Photonics and nanotechnology have a synergy rarely seen. But nano-optical devices are not prevalent in the marketplace, even though the academic labs churn out one breakthrough after another. So where’s the light?

By Richard Gaughan

Photonics and nanotechnology seem the perfect match. In fact, photons are inherently nanoscale entities, generally interacting with a single electron of a single atom.

But even though there seems a natural marriage between photons and nanomaterials, nano-optical devices are not yet prevalent. But the delay is not due to any fundamental scientific misunderstanding or technological failure, but is rather a reflection of the nature of technological development. In fact, a look at some of the nano-optical devices that are at or near commercial reality shows a predictable pattern of needs: tight integration, an existing market, a clear cost benefit and a scaleable solution.

Some examples of innovative photonic technology on the cusp of market acceptance are quantum dots, membrane deformable mirrors, and photonic bandgap fibers. Each of these technologies has distinct engineering challenges, and each has a distinct market, but together they provide insight into the types of challenges faced by most nano-optical technologies.

Quantum dots shine

The unique absorption and emission characteristics of quantum dots (QDs) were first demonstrated in the 1980s. A quantum dot is a semiconductor particle just a handful of nanometers in diameter. The QD creates a potential well that constrains the electrons within the semiconductor to specific energy levels dependent upon the material and the particle size.

The specific energy band structure determines the wavelength of photons that can be absorbed or emitted by the QD. In general, the absorption band is relatively broad, but the emission wavelength of a specific QD is narrow. In practice, this means different diameter quantum dots can be excited by the same illumination source, but each will emit at its unique wavelength.


By layering the proper blend of quantum dot diameters on top, these UV LEDs emit visible light with high conversion efficiency. Here Lauren Rowher of Sandia National Laboratory showcases a couple of different laboratory devices designed to pave the way to commercial development. Photo courtesy of Sandia National Lab
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For example, QD labels treated with binding molecules will attach to specific molecular targets, so when a solution is illuminated with a single source the different labels emit light of a different color. The fluorescing quantum dots serve to make the otherwise invisible target molecules visible.

According to Steve Talbot, chief marketing officer at Evident Technologies, a Troy, N.Y., company that makes a variety of products based on quantum dots, QDs have rapidly infiltrated life science applications at least partly “because they are easily integrated with the existing technologies” – such as the surface binding methods and fluorescence readers prevalent in the marketplace.

The next target application for Evident Technologies is solid state lighting. Light emitting diodes (LEDs) are expected to be efficient replacements for current lighting technologies, for applications from decorative accent lighting to aircraft and automobile lighting – and eventually the general illumination marketplace. Different colors can be realized by designing devices of unique materials and customized semiconductor structures. But a more efficient solution may be to use bright UV LEDs to excite a phosphor layer which will absorb the UV and emit in its characteristic color.

Sounds like a perfect match for quantum dots, which absorb in a broad range in the UV and emit at a precise wavelength. QDs of different diameters can be integrated into a single phosphor layer, with the emitted light being a summation of all the different colors – including blends that can create white emission.


To produce LEDs with this range of color would usually require different semiconductor materials and different structures. But by coating a UV LED with quantum dots of different sizes, identical components emit different visible spectra. Photo courtesy of Evident Technologies
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Conceptually that’s easy to understand, but to implement the LED QD nanophosphor requires success over a number of steps. Mike Locascio, Evident’s chief technical officer, identified a host of issues for LEDs. “For an LED to be successful,” he said, “it needs not only an exact color match and good color uniformity, but also a high color rendering index [a measure of white light quality], longevity, and high brightness, all at a competitive price point.”

Although the fundamentals of QD manufacturing are understood, to make them application-specific requires more than just a grasp of how large to make a QD core. The surface layer of the QD modifies the color, then an encapsulant provides both an interface between the LED and QDs and a matrix for deposition of the nanophosphor. And the entire assembly must survive a high temperature cure that will not degrade its environmental or performance capabilities. The application initiates a cascade of development steps. Complex, yes, but the challenges can be overcome: Evident is now shipping sample LEDs with integrated QD nanophosphors.

Adaptive optics for the masses

Adaptive optics refers to the capability to measure and control the shape of a propagating wavefront. Sensors provide input into a control system that generates signals to change the optical path length of a small part of the cross-section of an optical beam. A deformable mirror introduces wavefront changes by tilting and positioning small areas of the mirror surface.

One problem with traditional deformable mirrors is that they’re expensive. In the mid-1990s a MEMS deformable mirror was first demonstrated, constructed by assembling an electrode pattern surface parallel to a very thin reflective and conductive membrane. With a voltage pattern introduced on the electrodes, electrostatic attraction pulls the membrane into a desired shape, changing the wavefront of a beam reflected off its surface. Because of the advantages of scale offered by MEMS manufacturing, membrane deformable mirrors are much less expensive than traditionally-manufactured deformable mirrors, which brings the cost into range for mainstream projects.

Although the cost of continuous-membrane MEMS deformable mirrors is attractive, they had an operational restriction that was a bit cumbersome. Under certain conditions the membrane gets so close to the electrode that the electric field strength rapidly rises, forcing the membrane to come in contact with the electrode, leading to electrical discharge through the membrane, and catastrophic membrane failure.

AgilOptics, of Albuquerque, N.M., avoided this “snapdown” problem by restricting the usable voltage range, but that also limited the utility of the deformable mirror. The solution was acceptable, but not ideal; so development continued, and AgilOptics’ commercially-available membrane mirrors now have an insulating coating that retains its flexibility, but eliminates snapdown entirely.

Guiding the unguidable

In 1998 Yoel Fink and others at MIT reported on a class of reflective coatings that offered characteristics no other reflective coatings could match: angle-independent reflectivity over a wide range of wavelengths. By depositing alternating layers, a photonic crystal structure was created, with a bandgap that prohibited propagation for a range of wavelengths determined by the index of refraction of the two materials and their layer thickness.

Fink realized this principle could be applied to reflective surfaces along a waveguide of arbitrary shape to control the propagation of wavelengths that traditionally are difficult to guide. For example, a hollow core surrounded by alternating layers of materials of high index of refraction would be able to guide the 10.6 μm wavelength of CO2 lasers. Fink and his colleagues created a company called OmniGuide, in Cambridge, Mass., to commercialize applications of the photonic bandgap (PBG) fiber.


MEMS deformable mirrors are affordable enough to bring wavefront control to a variety of new applications. For example, this membrane mirror system stores up to 100 frames that can be played back continuously to simulate changes in atmospheric conditions. Photo courtesy of AgilOptics
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But fabricating a laboratory scale device for academic research is quite different from manufacturing commercially significant quantities, and Fink was presented with the challenge of scaling the manufacturing. He needed a method that would control the thickness of each of the layers surrounding the core, yet still be able to produce large quantities of the PBG fiber. He was drawn to the drawdown process traditionally used to produce optical fiber: a macroscopic preform is fabricated, then heated and pulled into a long, thin strand. “Conceptually,” said Fink, “the difficult and tedious process of reducing feature size becomes straightforward with fiber drawdown, and the length can be kilometers.” But several challenges stood in the way of translating that concept into reality.

First, the feature sizes of the PBG fiber are one or two orders of magnitude smaller than those in traditional fiber – layers 100 nm thick instead of tens of microns. Second, rather than using the homogeneous glasses of traditional fiber, high-index semiconductors were needed. Finally, each of the multiple layers of the waveguide must be precisely controlled at a level well beyond that required for traditional fiber manufacturing. Those three challenges changed the project into a two-year, market-driven research effort.

The ideal market

Identifying the ideal market is like a “cutest baby” competition: it all depends on your perspective. Different technologies for different applications also have different criteria for what constitutes the ideal market opportunity. For the application of quantum dots for LED wavelength conversion, the ideal market has the potential for extremely high volume. Other technical solutions exist for generating a desired spectrum from solid state devices, but none is firmly entrenched. QD manufacturing technology is efficient enough to allow market entry at a competitive price point, and improvements in process control promise future cost reductions.

And, although the market for solid-state lighting is fair-sized already, the general illumination market holds huge potential. Evident Technologies’ Locascio noted that “market areas and subsegments within each area have their own set of challenges. We look at the price, performance, and packaging requirements to determine if quantum dots can provide an effective solution.”

For MEMS deformable mirror applications, the ideal application is either one in which a conventional optical instrument provides acceptable, but not optimum performance, or an application where wavefront control is being performed in much more expensive ways.

Dennis Mansell, president of AgilOptics, described the new Aeri atmospheric simulator the company has developed that can loop 100 frames to emulate rapid changes in optical transmission. “The system is highly capable, and several large customers are interested. But it’s a bit frustrating waiting for them to see the value.”

The ideal customer for Omniguide’s PBG fiber is one that has an important problem the technology can solve, and they’re willing to pay a premium for the solution. Whether the market is a relatively small number of customers willing to pay top dollar, a huge opportunity with smaller margins, or somewhere in between, each of these companies emphasizes the need to understand the customer’s requirements. The fundamental technology is already understood and the issue becomes one of tailoring the characteristics and the manufacturing process to meet the customer’s performance and price requirements.

New array suggests throughput could eventually meet commercial needs

By Charles Q. Choi

Dip-pen nanolithography can literally draw structures only nanometers in scale, but was always limited in throughput by how many pens it could write with at the same time. Now the technique’s inventor has devised an array with hundreds of times more pens than before.

Dip-pen nanolithography (DPN) uses atomic force microscope (AFM) tips as pens and dips them into inks containing anything from DNA to semiconductors. The new array from Chad Mirkin’s group at Northwestern University in Evanston, Ill., has 55,000 pens – far more than the previous largest array, which had 250 pens.

The new array can draw 55,000 likenesses of Thomas Jefferson in a space the size of a nickel – images consisting in total of some 470 million 80-nanometer-wide dots – in less than 30 minutes.

“The throughput barrier is a grand challenge for the nanotechnology field, as lithography is the foundation for all that we do. And in this paper Mirkin and coworkers drive a truck through this challenging barrier,” said Joseph DeSimone, a chemist at the University of North Carolina at Chapel Hill and director of the new UNC Institute for Advanced Materials, Nanoscience and Technology. The researchers reported their new DPN array in the November 6 issue of Angewandte Chemie.

“One of the gating aspects of the technology is that, with a single-pen tool, you’re extremely limited in throughput. Seeing they’re able to take their research to a 55,000-tip array instrument would definitely address the issue of throughput,” said Vahe Mamikunian, an analyst with Lux Research.

NanoInk, the Chicago company Mirkin founded in 2002 which is commercializing dip-pen lithography, has licensed the new array and has exclusive rights. “It will be on the research market early next year,” Mirkin said.


The schematic shows the fabrication process for 2D cantilever arrays developed by the Mirkin group at Northwestern University and licensed by NanoInk. Image courtesy of Chad Mirkin
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The array was made by modifying a microfabrication process developed for single AFM probes. Oxidized silicon wafers had 10-micron square openings lithographically patterned into them, and pyramidal pits were etched in those openings. These pits served as molds for pyramidal probes when films of silicon nitride were deposited. The silicon nitride on the front side of the wafers was then lithographically patterned to form arrays of cantilevers.

The probes are roughly 7.6 microns high, with tips about 60 nanometers across. “The tall tips keep the arm holding the tips from running into the surface,” Mirkin said.

The researchers also bend the cantilevers by coating them with gold and then annealing them. The resulting curvature is due to how gold and silicon nitride layers expand differently in heat, and how the different layers in the cantilever restructure due to annealing.

“The bent cantilevers give us more play in the vertical direction to get any misaligned tips in contact with the substrate. In other words, the tips in the array do not have to be perfectly in one plane to bring them all in contact with the surface to be patterned,” Mirkin explained.

The result is an array that can bring all the pens in contact with their substrate using merely gravity, as opposed to a complex set of feedback systems. “This makes the approach innovative, straightforward, inexpensive and extremely useful and versatile,” Mirkin said. Once all the tips of the array are in position, the array is locked in place by a rapidly curing epoxy resin on the tip holder.

“What is most surprising to me is the degree of fidelity achieved,” said Jim De Yoreo, a member of the scientific staff at Lawrence Livermore National Laboratory who conducts research into scanned probe nanolithography techniques. “Highly multiplexed cantilever arrays have been fabricated by a number of groups. But overcoming the challenges of adequately uniform inking of all the tips and obtaining registry between the substrate and all tips has never been achieved. I would have expected these to be daunting tasks, but Professor Mirkin’s group has dealt with both quite handily.

The most important implication of having overcome these two challenges is that high-throughput constructive patterning of a nearly unlimited set of functional chemistries at sub-100-nanometer length scales is now possible. This puts commercial use of constructive scanned probe lithography within our grasp.”

In initial experiments, Mirkin and his colleagues could generate 88 million dot features with their new array, each pen generating 1,600 dots in a 40 by 40 array, where the distance between each 80-to-120-nanometer-wide dot was 400 nanometers. In other experiments, they generated protein nanoarrays. “I was really excited to see 55,000 cantilevers working in unison – really impressive work,” said Thomas Thundat at Oak Ridge National Laboratory in Tennessee, an expert on nanomechanical devices who leads a nanoscale science and devices group at the lab.

The massively parallel DPN approach heralded by the new array “really opens the technique up for many applications, especially in the life sciences,” Mirkin said, “and perhaps some in other areas like integrated electronics and photonics.”

Nanoarrays that DPN can build can “allow us to study cells and the factors that control their behavior – adhesion, growth, motility, differentiation and apoptosis – in a way one could never achieve with conventional technologies. It will allow us to study how viruses work at the single particle level – how they bind and infect cells.”

Moreover, “they will provide important insight into many areas of cancer research – the factors that lead to metastasis events,” Mirkin added. The nanoarrays DPN can build “will lead to many new screening procedures for new therapeutics for a variety of diseases, including many forms of cancer.”

“I suspect the market opportunities for high-resolution, massively parallel DPN will be as diverse as semiconductors, large-area displays, pharmaceutical/packaging tagging for anti-counterfeiting and research tools,” DeSimone said.


The new 55,000-pen DPN array was used to draw 55,000 likenesses of Thomas Jefferson in a space the size of a nickel in less than half an hour. Image courtesy of Chad Mirkin
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Still, it seems this array “is looking at some of the applications that nano-imprint lithography is targeting, and I’m not sure that’s a good place to be targeting,” Mamikunian said. “The reason for that is, with dip-pen nanolithography, you effectively have one supplier right now in the form of NanoInk. So there’s a limited supply base. With nano-imprint, five or six companies are really pushing the technology, from Molecular Imprints to Obducat to Nanonex.”

Mamikunian noted that some of the applications NanoInk is targeting for DPN are different from those of nano-imprint, such as pharmaceutical anti-counterfeiting and photomask and circuit line repair. And, in their paper, Mirkin and his colleagues noted that the advantages their massively parallel DPN approach has over nano-stamping include the distortion effects that plague nano-stamping and nano-stamping’s need to fabricate a mask each time a new design is required.

Another question Mamikunian had with the new array was how manufacturable these were on a large scale.

“If you were ordered to produce 50 or 60 a quarter, what would your ability be to produce such large array instruments predictably and reliably?” Mamikunian said. “It’s really great work, and there will be some applications coming out of it, but until they show how to make such a large array tool on a mass scale, (there are) more questions than answers.”

“These are made by conventional microfabrication processes,” Mirkin responded, adding that mass production was not a big hurdle. Integration is the real issue, he contended, including getting different inks to different tips on the fly. “Maintaining registration with the underlying substrate during the entire process needs to be worked out as well,” he added. “All doable, but it will take some time.”

First-ever UMass Lowell-Small Times analysis explores nanotech industry priorities

Although nanotechnology is generally considered a long-term research priority for the United States and other nations, most U.S. nanotechnology industry executives said that high volume manufacturing of nano materials and products is the most important activity required for the United States to strengthen its nanotech capabilities. The focus on high volume manufacturing outpaced long-term research by a factor of more than two to one.

The results were part of a survey of nanomanufacturing executives conducted by the University Of Massachusetts Lowell and Small Times. Of the 407 executives interviewed, 39 percent said that if the U.S. were to strengthen its R&D capability, high volume manufacture of nano materials and products would be most important. Only 15 percent chose “basic long term research.” A majority of executives (63 percent) said they see the U.S. as leading the world in nanotechnology research and development, with only 7 percent seeing the U.S. as lagging behind other countries.

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Moreover, the respondents don’t expect industry to go it alone. In fact, the vast majority of nanotech executives think government should play a role – either take the lead in R&D and commercialization incentives or at least participate in a limited fashion. But they are split between the two approaches, 45 percent wanting government to take the lead and 43 percent saying government’s role should be limited. Eleven percent said government should “stay out of it.”

More executives said their companies are integrating nanotech materials (88 percent) rather than currently manufacturing those materials (47 percent) themselves. (The overlap is companies that are involved in both manufacturing and integrating.) Nanocrystals, followed by nanotubes and nanoparticles, are seen as the most important nanomaterials to develop, manufacture and purchase over the next three years, and most companies currently manufacture or use those materials in that order.

The survey also clearly showed that nanotech industry executives think the role of government is not only to foster technical innovation, but to monitor its social and environmental side effects. In fact, there was near-unanimous consensus on the issue: 97 percent of executives think that government has an important role in addressing potential health effects and environmental risks of nanotechnology.

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This likely follows from the observation by 64 percent of the respondents that the risk to the public, environment and workforce of exposure to nanoparticles is currently unknown.

Despite the perceived environmental uncertainty, many of the respondents were also bullish on their own firms’ potential sales in nanotechnology. Twenty-five percent said they expect sales of $10 million or greater next year and a full 56 percent expect those sales levels in three years.

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In order to build those products, most executives (58 percent) said their firms plan to share facilities with universities in developing nanotechnology materials. Yet, an overwhelming percentage of respondents (77 percent) said their firms are currently developing nanotech products and processes using their own internal R&D, rather than through collaboration with universities (7 percent), suppliers (5 percent) or others.

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A majority of respondents (58 percent) utilize or plan to utilize shared use facilities at local universities; with science and engineering labs (25 percent), electronics labs (24 percent) and biotech labs (17 percent) topping the list; followed by specific diagnostic equipment (14 percent) and microfabrication labs (12 percent). Training and workforce development were not perceived as huge barriers. Seventy-six percent of executives said the lack of a knowledgeable workforce was not a significant impediment to capitalizing on the opportunities of nanotechnology. In fact, most executives rated their companies as having an excellent or very good supply of labor (61 percent), capital (58 percent), and infrastructure (58 percent) for commercializing nanotech products and processes.

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Rather, the most significant barriers to growth that were cited included lack of financing (45 percent), intellectual property issues (46 percent) and lack of available prototype facilities (43 percent).

The UMass Lowell survey team included Barry Hock, Dane Netherton, Edward March and David Kassel.


Methodology

The data summarize findings of a national telephone survey conducted from August 23, 2006 through September 19, 2006. Interviews were conducted under the supervision of a university-trained field supervisor.

A total of 407 respondents identified as business leaders in the nanotechnology industry were interviewed by telephone. The respondents’ companies were taken from a listing of Small Times Magazine nanotechnology-identified subscribers. The cooperation rate for this survey was 33 percent of the companies contacted.

Results from the total sample can be interpreted as accurate to within ±5 percent with a 95 percent level of confidence. Sub-samples have a greater margin of error.

Survey respondents were located in roughly equal proportions in each of the nation’s regional U.S. Census divisions. These regional proportions are consistent with those found in a National Science Foundation funded survey of nanotechnology leaders conducted in 2005 by the National Center for Manufacturing Sciences (NCMS) in Ann Arbor, Mich. The NCMS survey determined its geographic distribution “generally correlated well with the U.S. regions receiving the highest infusion of NNI funds and other private investments”.

Percentages may not total to 100 due to missing responses or rounding.

By John Carroll

When research scientist Bruce E. Torbett is isolating stem cells from blood in his laboratory at The Scripps Research Institute’s Department of Molecular and Experimental Medicine, he relies on a hefty device that costs about $30,000. An antibody is used to identify the cells and attach them to magnetic beads, which then pass by a magnetic column that demagnetizes them and allows the cells to be harvested.

It’s a time-consuming and expensive process, taking hours of lab time. It’s also an absolute necessity for anyone studying the therapeutic qualities of stem cells.

For companies developing stem cell therapies for widespread use against disease, though, that kind of painstaking procedure looms like a technological roadblock. To remove the barrier, Durham, N.C.-based Aldagen has hooked up with specialty MEMS manufacturer Innovative Micro Technology to begin beta testing a new machine – the Aldesorter – that’s designed to make the technology cheaper, faster and a lot easier to use.

“Current technology was built really for the research market,” said Ed Field, the president and COO of Aldagen, which is researching the use of adult stem cells for the purpose of repairing human tissue, a field that includes rebuilding blood vessels in cardiac patients.

With several stem cell therapies in the pipeline, Field can easily look beyond the research stage to a period when these treatments will become available to large populations of patients. At that point, he says, slow speeds and large machines simply won’t cut it anymore.

“What we were looking for was a very simple desk-top solution where we could provide much faster isolation of these stem cells populations and also have a sterile sorting path so you can throw it away and put in a new disposable for the next patient,” said Field.


Within the Aldesorter, shown here, microfluidic devices isolate the stem cells needed for a treatment. Image courtesy Innovative Micro Technology
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The collaboration marries IMT’s expertise with microfluidics with Aldagen’s chemical reagents that are required to mark and isolate pure stem cell populations from cord blood and bone marrow. Together, they plan to turn out a new version of IMT’s cell sorter specifically to isolate adult stem cells for treatments aimed at a range of diseases that includes chronic heart failure, peripheral vascular disease, leukemias and genetic enzyme deficiencies.

“It is,” said IMT CEO John Foster, “a race car tuned for Aldagen’s application.”

IMT has been working with stem cell isolation technology for the past four years, says Foster, when it was originally funded by the Defense Advanced Research Projects Agency.

In the Aldesorter, IMT’s chips work with an external laser that excites a fluorescent light from cells tagged by a universal stem cell marker, along with a high-speed actuator valve and microfluidics to isolate the stem cells needed for a treatment. And it’s being developed so that the chips can be replaced for every new patient, providing a sterile process for each new patient.

If they’re successful, they can help change the way the stem cell isolation works.

“The Aldagen group and IMT are proposing a different way” to isolate stem cells, said Torbett, “using a proprietary dye that stains the same stem cell population, but with no beads and no antibodies, going through a microfluidic chip at a fast rate which is much quicker to isolate the cells.

“Conventional sorting would be slower than the chip type of technology,” he added. “MEMS is quite rapid. The argument is for another modality and a more rapid method for isolation. What had taken five hours to separate might now take an hour.”


The IMT cell sorter chip showing input, sort/keep, and waste tubing. All microfluidics are contained within the chip for sterility and disposability. Image courtesy Innovative Micro Technology
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That would be an exciting advance that would not only help provide the therapy to patients, says Torbett, but also speed research in the field as well. It’s not a technological revolution, he adds, and it’s likely to take several years to fully prove itself. But it is an important incremental step, and one that a number of technology companies in the field are also exploring.

“I think that these kinds of devices would be useful, cheaper than current devices,” Torbett said. “There are things that have to be worked out, but it would be an enabling technology.”

For Aldagen, the work is critical to developing stem cell therapies, where stem cells are collected from a patient and then reinfused, readily available to treat diseases.

“We’re looking at heart failure ischemia, where there are hundreds of thousands of patients,” said Field. “The current machine could do one person a day. The Aldesorter can handle five to six patients a day per machine.”

“You can sort stem cells today and use the reagents that Aldagen is using to come up and get a great supply of stem cells,” said Foster. “The problem is the speed and sterility of the path which we are solving to make it a clinical tool.”

Drawing stem cells from bone marrow, for example, requires the ability to isolate one percent of all the cells in the bone marrow, says Foster. “That’s not a needle in the haystack, but it isn’t easy.”

Having a fast method to sort a patient’s stem cells on the spot will be particularly critical in an acute therapy.


Stem cells, above, flow through an IMT cell sorter microfluidic channel. Image courtesy Innovative Micro Technology
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“You may want to take the Aldesorter, draw marrow, isolate the stem cells and put them right back into the heart,” said Field. “It makes it easier to get into these chronic populations and in acute settings for trauma or heart attack and stroke. Because the Aldesorter is quick, we can begin to explore the use of stem cells in those markets.”

The final business model hasn’t been crafted yet, says Field, but it may be that the best way to commercialize technology like the Aldesorter will be to give the machine away and sell the disposable chips to users. And Foster isn’t ruling out broader applications as the stem cell field develops.

“Aldagen is our partner for the clinical use of these stem cells,” said Foster. “There may be other applications for cell sorting.”

Aldegan was recently preparing to unveil Phase I data on the Aldesorter. From there, says Field, they can go to the FDA and start a countdown on a follow-up study that can be used to seek FDA approval in 2008. And Field is confidently predicting that Aldagen will be in the forefront of the developers working in the adult stem cell field.

“We believe that the first commercialization of stem cells will be in the adult setting,” said Field. “Embryonic stem cells will take a long time to develop, with some tough ethical and political issues. In the adult space, there’s a faster path to commercialization.”

Legal experts say decision more about EPA policy revamp than nanotechnology

By Richard Acello

The headline in the Washington Post read: “EPA to Regulate Form of Nanotechnology.” But the Environmental Protection Agency’s action may have more to do with whether a washing machine can be considered a pesticide.

On Nov. 21, the EPA said it had determined that the Samsung silver ion generating washing machine, which releases nano silver ions into wash water, is subject to registration requirements under the Federal Insecticide, Fungicide and Rodentcide Act, or FIFRA.

This was a reversal of an earlier determination that said that the Samsung washer was a device, rather than a pesticide, and therefore not subject to regulation. Under the registration requirement, manufacturers must provide evidence that the use of nanosilver won’t cause harm to public health.

The agency now says that if a product “incorporates a substance intended to prevent, destroy or mitigate pests,” it is considered a pesticide and is required to be registered.

However, the EPA also said it had not come to any conclusions about whether a washing machine that releases silver ions or any other product is using “nanomaterials.” Nano silver is used as a germicide in food-storage containers, air fresheners, and shoe liners, among other products.


Samsung’s washing machine that uses silver ions to clean clothes must be registered with EPA because it acts like a pesticide, the agency said. Image courtesy of Samsung
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“I think this is about the delineation between a device – a washing machine – and a pesticide, or a washing machine that disperses an anti-microbial into the wash and into the waste treatment system, and not necessarily nano silver,” said Sean Murdock, executive director of the NanoBusiness Alliance. “The washing machine application is very different than the use in food containers or wound care, which is regulated by Food and Drug Administration. As such, I suspect the new ruling will primarily affect dispersive uses of nano silver, which are not nearly as common.”

Dick Stoll, a lawyer at Foley & Lardner in Washington who specializes in EPA issues, said the next day press coverage was “pretty misleading.”

“They made it sound as if some earthshaking event has occurred and it hasn’t,” Stoll said.

Stoll says the agency has already been involved in regulation of nanotechnology under the Clean Air Act, and FIFRA. The larger issue, which has already been joined in salvos between industry and environmental groups, is whether EPA should move to consider any nanotechnology product a “new substance” under the Toxic Substances Control Act (TSCA or “Tosca”).

“If EPA said yes to that, it would be a very big deal,” Stoll said.

The effect of a move to regulate nanotech products under TSCA could result in a delay of months or years, Stoll says, in bringing a product to market.

Lynn Bergeson, an attorney with Bergeson & Campbell in Washington, and chair of the American Bar Association’s Section of Environment, Energy and Resources, said the washing machine decision is “far more about EPA revisiting its device policy than being driven by a determination to regulate things made at the nanoscale level.”

The EPA recently formed a nanotechnology task force working within its Office of Pesticide Programs, and Bergeson said the agency “has been clear that it’s at the very early stages of review.”

Bergeson says the agency has more authority to regulate under FIFRA than under TSCA. “EPA has enormous authority under pesticides versus TCSA,” she explained. “Under TSCA, once a substance is on the approved inventory list, any use is legitimate, but FIFRA is use-specific. The EPA always has the authority to assess the risk of pesticides, regardless of the use.”

Environmentalists seized on the EPA’s washing machine decision to urge the agency to regulate a wider group of products containing nano silver.

In a Nov. 22 letter to the director of the EPA’s Office of Pesticide Programs, environmental action organization Natural Resources Defense Council (NRDC) said “….there are currently more than 40 consumer products in the marketplace that contain nano silver, some of which either expressly make pesticidal claims or imply pesticidal effectiveness and none of which are currently registered with EPA.” The NRDC says the agency is “obligated to examine these products and require registration for any product that uses nano silver as a biocide.”

The NRDC said Sharper Image has removed statements of pesticidal claims from its products treated with nano silver, including slippers, socks and food containers, an action that “denies the public’s right to know the active ingredient of these products.”

Albany Nanotech put another notch in its belt when it qualified its 65nm semiconductor fabrication line in September. It is the first university to qualify a line of tools that matches the current state-of-the-art in the semiconductor industry.

The line is operated under the auspices of the Center for Semiconductor Research (CSR), an industrial partnership that includes participation from IBM, Advanced Micro Devices (AMD), Sony, Toshiba, Tokyo Electron and Applied Materials. The CSR is a long-term program to develop future chip technology beginning with the 32nm node. It is intended to provide full vertical integration of the design, modeling, fabrication, testing and pilot prototyping of devices.

“The line came up really well,” said James Ryan, professor of nanoscience and vice president of technology at Albany Nanotech. “It worked pretty much on the first shot.”

Ryan and others involved in the effort say the new line is a necessity in order for Albany Nanotech to take advantage of resources like an extreme ultraviolet (EUV) alpha demo tool it took delivery of from ASML this past summer. Moreover, they say, having a full product line is critical for both developing the new processes required and for providing feedback to the tool vendors.


From left, IBM Director of 300mm Operations William Rozich, Albany Nanotech Vice President and Chief Administrative Officer Alain Kaloyeros, and Albany Nanotech Vice President of Technology James Ryan display some of the wafers that came off Albany Nanotech’s new 65nm production line. Photo courtesy of Albany Nanotech
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“We intend to totally practice the craft of device integration,” said William Rozich, IBM’s director of 300mm operations. “Toolmaker participation becomes critical.” In short, having a full line lets tool innovation become part of the design process itself.

Ryan and Rozich said the effort was a case study in making industrial teams work. “People disagree, sure,” said Ryan, “but the guy who gets listened to in the meeting is the guy in the room who is smartest on that topic.”

Rozich said the effort constituted a unique blend of cultures that was a first for IBM in another way. “It was the first time for us doing this type of thing where we are not running the show,” he said.

Nevertheless, hiccups did occur. Working “pretty much on the first shot” actually meant the second: The first, said Ryan, was a mis-process.

And the teams encountered challenges they didn’t anticipate – such as how to collaborate in an open environment while still protecting corporate assets. That may sound easy, but it’s not necessarily so when you have to balance fab viewing corridors and camera phones, or open academic networks and corporate VPNs. New protocols had to be developed.

And procurement provided an almost comic stumbling block. “Let’s just say they weren’t used to ordering the quantities (of chemicals) that we need,” said Ryan of procurement staff who were more accustomed to ordering for classroom experiments than they were for a semiconductor fab.

Going forward, the group says the line will be both integrated and modular, supporting both industrial 32nm process development as well as academic projects like one Ryan is pursuing under a Navy contract to develop a new resistor material.

“It’s a unique model,” said Alain Kaloyeros, Albany Nanotech vice president and chief administrative officer, citing the close industry-academic collaboration. “It’s important to have partners willing to take short term risk in order to be strategic.”
– David Forman


IBM unveils MEMS-based chip cooling approach

IBM researchers presented an innovative MEMS-based approach for improving the cooling of computer chips at the Power and Cooling Summit in October. Big Blue says the technique, called “high thermal conductivity interface technology,” allows a twofold improvement in heat removal over current methods and could pave the way to reduce industry’s reliance on complex and costly systems to cool chips.

The approach addresses the connection point between the hot chip and the various cooling components used today to draw the heat away, including heat sinks. Special particle-filled viscous pastes are typically applied to this interface to guarantee that chips can expand and contract owing to the thermal cycling. This paste is kept as thin as possible in order to transport heat from the chip to the cooling components efficiently. Yet, squeezing these pastes too thin between the cooling components and chip would damage or even crack the chip using conventional techniques.


This image shows a cross-sectional schematic of the cooling architecture using the high thermal conductivity interface. A highly viscous paste is brought between the chip cap and the hot chip in order to reduce the thermal resistance. Thanks to its tree-like branched channels, the architecture allows the paste to spread very homogenously and attains a thickness of less than 10 micrometers. With this technique, two times less pressure is needed to apply the paste and a twofold increase in cooling performance can be achieved. Image courtesy of IBM
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Instead, the researchers used MEMS processing techniques to develop a chip cap with a network of tree-like branched channels on its surface. The pattern is designed such that when pressure is applied, the paste spreads much more evenly and the pressure remains uniform across the chip, allowing the right uniformity to be obtained with nearly two times less pressure, and a ten times better heat transport through the interface.


This image shows a cross-sectional schematic of the jet impingement cooling system that eliminates the thermal interface. Here, the hot chip is directly cooled by a multitude of small streams of water. The technique employs a distributed return architecture with alternating inlets and outlets to squirt small amounts of water onto the chip and suck them off again, The 50,000 channels are 30-50 micrometers wide and made with MEMS processing techniques. Image courtesy of IBM
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The technique is one of several being explored by scientists at the IBM Zurich Research Laboratory to address cooling. The researchers are also developing a novel and promising approach for water-cooling. Called direct jet impingement, it squirts water onto the back of the chip and sucks it off again in a closed system using an array of up to 50,000 tiny nozzles and a tree-like branched return architecture.

By using a closed system, there is no fear of coolant getting into the electronics. In addition, the team was able to enhance the cooling capabilities of the system by devising ways to apply it directly to the back of the chip, thereby avoiding the resistive thermal interfaces between the cooling system and the silicon.


IMEC demos feasibility of double patterning immersion litho for 32nm node

IMEC, the Leuven, Belgium, independent research center for micro and nanotech, showed in collaboration with ASML the potential of double patterning 193nm immersion lithography at 1.2NA for 32nm node Flash and logic.

The organizations said that the results prove that double patterning might be an intermediate solution before extreme ultraviolet (EUV) lithography and very high NA (beyond water) 193nm immersion lithography will be ready for production.

The results were obtained by splitting gate levels of 32nm half pitch Flash cells as well as logic cells in two complementary designs. The splitting was done automatically using software from EDA partners in IMEC’s lithography program. After splitting, both designs received optical proximity corrections (OPC) and a classical lithography approach “litho-etch-litho-etch” was performed. Exposures of both lithography steps have been carried out on an XT:1700i at ASML.

IMEC and ASML say the results show that the XT:1700i 193nm immersion tool, which has a maximum NA of 1.2, could be extended beyond the 45nm node.


Nantero announces routine use of nanotubes in production CMOS fabs

Nantero Inc., a Woburn, Mass., company using carbon nanotubes for the development of next-generation semiconductor devices, announced it has resolved the major obstacles that had been preventing carbon nanotubes from being used in mass production in semiconductor fabs.

Nanotubes are widely acknowledged to hold great promise for the future of semiconductors, but most experts had predicted it would take a decade or two before they would become a viable material. This was due to several historic obstacles that prevented their use, including a previous inability to position them reliably across entire silicon wafers and contamination previously mixed with the nanotubes that made the nanotube material incompatible with semiconductor fabs.

Nantero said it has developed a method for positioning carbon nanotubes reliably on a large scale by treating them as a fabric which can be deposited using methods such as spincoating, and then patterned using lithography and etching. The company said it has been issued patents on all the steps in the process, as well as on the article of the carbon nanotube fabric itself, U.S. Patent No. 6,706,402, “Nanotube Films and Articles,” by the U.S. Patent and Trademark Office.

The patent relates to the article of a carbon nanotube film comprised of a conductive fabric of carbon nanotubes deposited on a surface. Nantero has also developed a method for purifying carbon nanotubes to the standards required for use in a production semiconductor fab, which means consistently containing less than 25 parts per billion of any metal contamination.