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October 28, 2011 — BUSINESS WIRE — Orbit International Corp. (NASDAQ:ORBT) Power Group, through its Behlman Electronics Inc. subsidiary, received 3 new orders for its COTS Division, valued in excess of $1.5 million. The orders are for commercial off the shelf (COTS) power supplies to an electro-optical sensing system, a computer system, and an all-weather airborne reconnaissance aircraft.

$470,000 order: power supply used on a U.S. Naval electro optical sensing system. Deliveries will take place Q1 through Q3 2012. Option quantities have been quoted through 2015, which could bring the total value to over $1.5 million.

$657,000 order: power supply for a computer system used on a major missile defense system, as part of a system upgrade for an ongoing program for which Behlman received a $458,000 order in August 2011. Deliveries will take place from Q2 to Q4 2012. Additional follow-on orders are expected.

$455,000 order: power supply for the RC-135, a U.S. Air Force (USAF) all-weather airborne reconnaissance aircraft. Behlman has been supplying units for this program since 2008, totalling over $1,900,000 in orders. This order will be delivered from Q2 to Q4 2012, with additional orders expected in the future.

Orbit International Corp. is involved in the manufacture of customized electronic components and subsystems for military and nonmilitary government applications through its production facilities in Hauppauge, New York, and Quakertown, Pennsylvania; and designs and manufactures combat systems and gun weapons systems, provides system integration and integrated logistics support and documentation control at its facilities in Louisville, Kentucky. Its Behlman Electronics, Inc. subsidiary manufactures and sells high quality commercial power units, AC power sources, frequency converters, uninterruptible power supplies and associated analytical equipment. The Behlman military division designs, manufactures and sells power units and electronic products for measurement and display.

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October 27, 2011 — Micro electro mechanical system (MEMS) pressure sensors have relatively high average selling prices (ASP) and a range of applications, making them to leading MEMS device by 2014, according to IHS iSuppli MEMS & Sensors Market Tracker.

Pressure sensors are climbing the MEMS device ranks thanks to "steady market expansion," said Richard Dixon, Ph.D., senior analyst for MEMS and sensors at IHS. Currently, accelerometers and gyroscopes are the most popular MEMS devices.

The strong automotive resurgence post-recession kicked pressure sensor revenue to $1.22 billion in 2010, a 26% increase from 2009. 2011 growth will hit 6.6%, followed by a double-digit expansion in 2012. By 2014, revenue for MEMS pressure sensors will amount to $1.85 billion.

Figure. MEMS pressure sensor revenues. SOURCE: IHS iSuppli October 2011.

MEMS pressure sensor prices vary depending on the level of compensation and calibration of the die, as well as the MEMS packaging. MEMS pressure sensor designs use either a Wheatstone bridge arrangement (piezoresistive-type sensing) or capacitive sensing to detect deflation within the package. Both styles are popular, IHS reports. Medical and industrial MEMS pressure sensors sell between several dollars and tens of dollars. Highly specialized components for harsh environments, such as aircraft hydraulics, can sell in the hundreds, Dixon noted.

72% of MEMS pressure sensors (by revenue) are used in automotive applications in 2011; 11% go into medical electronics; and 10% serve the industrial segment. The remaining 6% is split between consumer electronics and military-aerospace devices.

Automotive pressure sensors are most popular for engine management (manifold air pressure sensors in petrol engines, common fuel rail pressure sensors for diesel cars). The sensors could also be used to improve combustion by measuring the exact stoichiometry within the engine cylinders. Tire pressure monitoring systems are also a major auto sensor application. One new automotive application is used in automatic transmissions, new double-clutch transmission systems, and manuals. Bosch recently entered this market with a MEMS solution in which the oil acts directly on the back of the silicon sensor (a so-called backside-entry design) with pressures of up to 70 bar.

In the medical market, pressure sensors are used mostly as low-cost disposable devices for catheters in surgical operations. More expensive versions suit pressure and differential flow monitoring in continuous positive airway pressure (CPAC) machines for treating sleep apnea. There is significant potential for implantable sensors from about 2015 onward.

Within the industrial sector, big segments for MEMS pressure sensors include the heating, ventilation and air conditioning (HVAC) sector, level measurements, and various industrial process and control applications. Aircraft, for instance, use the sensors to monitor engines, flaps and other functions, in addition to precision altitude air pressure measurement.

MEMS pressure sensors to date have not been used as much in the consumer electronics and mobile space, where their revenue is under $50 million today. For the mobile segment in particular, no major application has emerged so far. Among their diverse applications, however, are weather stations, sport watches, bike computers, diving equipment and pedometers, along with white goods — such as water-level sensors employed for energy-efficient washing machines.

See the IHS iSuppli MEMS & Sensors Market Tracker – Bring It On: MEMS Maintains Double-Digit Growth Through 2014 at http://www.isuppli.com/MEMS-and-Sensors/Pages/Bring-It-On-MEMS-Maintains-Double-Digit-Growth-Through-2014.aspx?PRX

IHS (NYSE: IHS) provides market analysis on energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost.

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Researchers at the Georgia Institute of Technology have developed a prototype wireless sensor capable of detecting trace amounts of a key ingredient found in many explosives.

The device, which employs carbon nanotubes and is printed on paper or paper-like material using standard inkjet technology, could be deployed in large numbers to alert authorities to the presence of explosives, such as improvised explosive devices (IEDs).

Xiaojuan (Judy) Song, left, and Krishna Naishadham display two types of wireless ammonia-sensing prototype devices. (Georgia Tech Photo: Gary Meek)

“This prototype represents a significant step toward producing an integrated wireless system for explosives detection,” said Krishna Naishadham, a principal research scientist who is leading the work at the Georgia Tech Research Institute (GTRI). “It incorporates a sensor and a communications device in a small, low-cost package that could operate almost anywhere.”

Other types of hazardous gas sensors are based on expensive semiconductor fabrication and gas chromatography, Naishadham said, and they consume more power, require human intervention, and typically do not operate at ambient temperatures. Furthermore, those sensors have not been integrated with communication devices such as antennas.

The wireless component for communicating the sensor information — a resonant lightweight antenna – was printed on photographic paper using inkjet techniques devised by Professor Manos Tentzeris of Georgia Tech’s School of Electrical and computer engineering.  Tentzeris is collaborating with Naishadham on development of the sensing device.  

The sensing component, based on functionalized carbon nanotubes (CNTs), has been fabricated and tested for detection sensitivity by Xiaojuan (Judy) Song, a GTRI research scientist. The device relies on carbon-nanotube materials optimized by Song.

Pictured here are three wireless devices that use carbon nanotubes (CNTs) to achieve high sensitivity to ammonia. At left is a patch antenna, inkjet-printed on photographic paper, with the CNTs shown in black. At top center is an omni-directional segmented loop antenna on a soft substrate, designed for potential 5.8 GHz RFID integration. At bottom right is an inter-digitated capacitor on silicon substrate with CNT loading across the electrodes, being tested for its DC resistance. (Georgia Tech Photo: Gary Meek)

A presentation on this sensing technology was given in July at the IEEE Antennas and Propagation Symposium (IEEE APS) in Spokane, Wash., by Hoseon Lee, a Ph.D. student in ECE co-advised by Tentzeris and Naishadham.  The paper received the Honorable Mention Award in the Best Student Paper competition at the symposium.

This is not the first inkjet-printed ammonia sensor that has been integrated with an antenna on paper, said Tentzeris.  His group produced a similar integrated sensor last year in collaboration with the research group of C.P. Wong, who is Regents professor and Smithgall Institute Endowed Chair in the School of Materials Science and Engineering at Georgia Tech.

“The fundamental difference is that this newest CNT sensor possesses dramatically improved sensitivity to miniscule ammonia concentrations,” Tentzeris said. “That should enable the first practical applications to detect trace amounts of hazardous gases in challenging operational environments using inkjet-printed devices.”

Tentzeris explained that the key to printing components, circuits and antennas lies in novel “inks” that contain silver nanoparticles in an emulsion that can be deposited by the printer at low temperatures – around 100 degrees Celsius.  A process called sonication helps to achieve optimal ink viscosity and homogeneity, enabling uniform material deposition and permitting maximum operating effectiveness for paper-based components.

“Ink-jet printing is low-cost and convenient compared to other technologies such as wet etching,” Tentzeris said.  “Using the proper inks, a printer can be used almost anywhere to produce custom circuits and components, replacing traditional clean-room approaches.”

Low-cost materials – such as heavy photographic paper or plastics like polyethylene terephthalate — can be made water resistant to ensure greater reliability, he added. Inkjet component printing can also use flexible organic materials, such as liquid crystal polymer (LCP), which are known for their robustness and weather resistance.  The resulting components are similar in size to conventional components but can conform and adhere to almost any surface.

Naishadham explained that the same inkjet techniques used to produce RF components, circuits and antennas can also be used to deposit the functionalized carbon nanotubes used for sensing.  These nanoscale cylindrical structures — about one-billionth of a meter in diameter, or 1/50,000th the width of a human hair — are functionalized by coating them with a conductive polymer that attracts ammonia, a major ingredient found in many IEDs.

Sonication of the functionalized carbon nanotubes produces a uniform water-based ink that can be printed side-by-side with RF components and antennas to produce a compact wireless sensor node.  

"The optimized carbon nanotubes are applied as a sensing film, with specific functionalization designed for a particular gas or analyte,” Song said. “The GTRI sensor detects trace amounts of ammonia usually found near explosive devices, and it can also be designed to detect similar gases in household, healthcare and industrial environments at very low concentration levels."

The sensor has been designed to detect ammonia in trace amounts – as low as five parts per million, Naishadham said.  

The resulting integrated sensing package can potentially detect the presence of trace explosive materials at a distance, without endangering human lives. This approach, called standoff detection, involves the use of RF technology to identify explosive materials at a relatively safe distance. The GTRI team has designed the device to send an alert to nearby personnel when it detects ammonia.  
The wireless sensor nodes require relatively low power, which could come from a number of technologies including thin-film batteries, solar cells or power-scavenging and energy-harvesting techniques.  In collaboration with Tentzeris’s and Wong’s groups, GTRI is investigating ways to make the sensor operate passively, without any power consumption.    

“We are focusing on providing standoff detection for those engaged in military or humanitarian missions and other hazardous situations,” Naishadham said.  “We believe that it will be possible, and cost-effective, to deploy large numbers of these detectors on vehicles or robots throughout a military engagement zone.”

October 27, 2011 — China will buy about 10% more micro electro mechanical systems (MEMS) in 2011 year-over-year, which is slower expansion than the 33% leap from 2009 to 2010. China’s efforts to dampen inflation are having an effect, shows data from the IHS iSuppli China Research report, which suggests that the market is "expanding at a healthy rate."

China MEMS revenue will reach $1.6 billion in 2011, growing to $2.6 billion in 2015, a 5-year compound annual growth rate (CAGR) of 12.1%.

Figure. China MEMS consumption (revenues). SOURCE: IHS iSuppli October 2011.

The 33% growth seen in 2010 was driven by an expansion of China’s manufacturing capacity for MEMS-integrating products: mobile phones, automotive electronics, and consumer electronic devices. This, combined with financial incentives from a lending-inclined Chinese government, created an expansion that is unlikely to be repeated, IHS reports.

2011 and future revenue growth will come from 3 major trends: new consumer experiences, falling MEMS production costs, and rising demand for MEMS-heavy mobile electronics (smartphones and tablets). The decrease in production costs, IHS asserts, will result from an increase in suppliers and improvements to MEMS technology and production processes. Production costs will decrease quickly, IHS forecasts.

MEMS microphones, accelerometers and gyroscopes — integrated into mobile/consumer products — will grow the fastest in China’s MEMS market. IHS expects these MEMS to bring $1.3 billion in 2015 revenues, with a CAGR of 21% from 2011 to 2015. Automotive MEMS in China will see a 14% CAGR; industrial MEMS will hit 12% CAGR over the same period.

Read more in China is Ripe for Expected MEMS Market Growth in 2011 and Beyond at http://www.isuppli.com/China-Electronics-Supply-Chain/Pages/China-is-Ripe-for-Expected-MEMS-Market-Growth-in-2011-and-Beyond.aspx?MWX

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Helsinki-based ScanNano,a private Finnish R&D firm that specializes in MEMS technology at the nanoscale, has partnered with STMicroelectronics with the goal of combining RF MEMS and CMOS.

According to Dr. Andrei Pavlov, president and founder of ScanNano Tek, the program is intended to design, prototype and evaluate, MEMS devices, using ScanNano’s Deep Vacuum Gap (DVG) manufacturing technology. In the first-stage, the devices will be directed mainly towards Radio Frequency (RF) applications (e.g. RF switches, variable capacitors and integrated circuits) in the telecommunications market. The program will also evaluate the design and cost benefits expected from using DVG Technology at the commercial production stage.

Pavlov explained that, "Proving out our DVG technology is a critical step in our strategy to grow Scannano into a major designer of advanced Nano-MEMS devices for a wide range of new applications in many different markets."

Pavlov describes deep vacuum gap technology as a unique method of producing highly accurate vacuum gaps within MEMS and NANO devices without the need for multiple fabrication and encapsulation steps. DVG permits the fabrication of structures having nano-gaps which can be as small as a few nanometers in size, or even less than 1nm (e.g., 0.5nm). There can be several nanogaps in one device and the device may have multi-gap or multi-nano-gap structures.

Present technology requires the use of a sacrificial layer and an etching process which limits the minimum size of the gap because it is more difficult to etch thinner sacrificial layer materials underneath the top structure. Accordingly, the sensitivity of the MEMS structure is lower for larger gaps and higher power is needed to control the devices. Furthermore, most traditional MEMS devices require a vacuum in the gap and therefore, require special protection from ambient atmosphere, such as sealing and encapsulation. Because ScanNano’s DVG devices can be produced accurately at the NANO scale, many more devices can be accommodated in the same space, offer lower power consumption and encapsulation is not necessary. Furthermore, the demanding requirements associated with current MEMS/NANO technologies limits the range of qualified manufacturing facilities. On the other hand, ScanNano’s DVG technology permits its implementation in conventional CMOS manufacturing facilities. And because encapsulation is not required, material and manufacturing costs are significantly reduced, explained Pavlov.

October 26, 2011 – Marketwire — Display companies Pixtronix Inc. and Chimei Innolux Corp. (CMI) collaborated on the development of 5"-diagonal micro electro mechanical system (MEMS) display prototypes. The displays use Pixtronix’s proprietary MEMS technology and were built by CMI.

The 5" display boasts over 135% NTSC color gamut, greater than 170 degree view angles, more than 3,000:1 contrast ratio and 24-bit color depth, all at a 75% average power reduction versus LCD displays.

Also read: Qualcomm’s approach to displays

The companies will demonstrate the prototypes at FPD International 2011, October 26-28 in Yokohama, Japan (Pixtronix booth 3502 and CMI booth 3602). At last year’s FPD International, the partners announced a 2.5"-diagonal display. The new MEMS display is four times that prototype’s resolution, and twice the size.

The 5" display suits "the smart phone and tablet markets," said Tony Zona, CEO of Pixtronix. Zona added that the partners will continue to collaborate on performance and commercialization.

The PerfectLight display is an innovative low-power multimedia display for portable devices, achieving over 135% NTSC color gamut, 24-bit color depth, and 100 microsecond shutter response times; all with a 75% power reduction versus LCD displays. In addition, this new class of display offers Application Agility to dynamically optimize image quality and power consumption for all applications, ranging from full speed video to e-reader operation in a single device. The PerfectLight display is based upon Pixtronix’s Digital Micro Shutter MEMS technology, which is built within standard LCD infrastructure and eliminates liquid crystals, polarizers and color filters to enable a highly efficient, programmable display with proven MEMS reliability.

CMI is one of the leading worldwide manufacturers of TFT-LCD display products, including TFT-LCD panels, and total solutions for LCD TV and monitor systems. Its one-stop shopping business model vertically integrates TFT-LCD panel manufacturing expertise with systems assembly capabilities. More information about CMI is available at www.chimei-innolux.com.

Headquartered in Andover, Massachusetts and led by experts in the fields of displays, optics and MEMS, the Pixtronix mission is to develop, license and market the perfect display for today’s multimedia lifestyle. The company’s PerfectLight displays combine the best image quality at the lowest power consumption for all applications and are designed to scale from mobile devices to desktop displays through HD televisions. Pixtronix’s investors include Atlas Venture, Kleiner Perkins Caulfield & Byers, and Samsung Venture Investment Corporation. For more information, visit www.pixtronix.com.

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October 25, 2011 — Photonic switch maker CALIENT Technologies Inc. raised a $19.4 million round of venture financing, bringing in new and existing investors, to expand into data center and cloud computing markets and ramp its new portfolio of 3D micro electro mechanical system (MEMS) photonic switching systems and modules for OEMs and system integration partners.

CALIENT is using these funds to respond to market demand for high bandwidth communications in new markets, said Atiq Raza, chairman and CEO of CALIENT, calling out data centers and cloud computing networks as "exciting new opportunities" with "unprecedented growth in server deployments." The new family of modular photonic switching systems and subsystems target enterprise and cloud data centers, as well as subsea cable and government networks.

Also read: Is telecom ready to embrace MEMS-based solutions?

CALIENT is pursuing the new applications sectors with better power efficiency, more modularity in a smaller form factor, and lower cost switches based on its 3D optical MEMS technology. The MEMS mirrors are fabricated using proprietary deep-silicon plasma etch. CALIENT designs and fabricates its systems using the state of art optical MEMS equipment at its corporate headquarters in Santa Barbara, CA. The scalable capacity helps networks grow in speed from 10Gbps to 40Gbps and 100Gbps.

Photonics switches reconfigure high-bandwidth connectivity within and between data center sites to support time-of-day or instantaneous demand variations, or disaster recovery scenarios.

CALIENT Technologies provides 3D MEMS adaptive photonic switches for content networks. For more information, visit at www.calient.net.

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October 24, 2011 — Researchers from the National Institute of Standards and Technology (NIST) and University of Colorado Boulder (CU) developed a low-power microchip combining microfluidics and magnetic switches to trap and transport magnetic beads.

The magnetic particle microfluidics approach has traditionally required continuous power, and heat can be an issue. The demo chip features two adjacent lines of 12 thin-film magnet switches called spin valves, commonly used as magnetic sensors in read heads of high-density computer disk drives. These spin valves have been optimized for magnetic trapping. Pulses of electric current are used to switch individual spin valve magnets “on” to trap a bead, or “off” to release it, moving the bead down a ladder formed by the two lines. The beads start out suspended in salt water above the valves before being trapped in the array.

Figure. Micrograph of magnetic microfluidic chip developed by the NIST and CU. Brief pulses of electrical current in the two orange lines generate a magnetic field to turn individual spin valves (blue bars) on and off, moving a magnetic bead up or down the “ladder.” SOURCE: W. Altman/CU and NIST.

This design creates a "switchable permanent magnet" that requires power only to switch on (for less than a microsecond), said NIST physicist John Moreland.

NIST researchers previously demonstrated that spin valves could be used to trap and rotate particles and recently were awarded two patents related to the idea of a magnetic chip. (U.S. Patent 7,981,696 B2, awarded July 19, 2011, and U.S. Patent 7,985,599 B2, awarded July 26, 2011. Inventors John Moreland, Elizabeth Mirowski, and Stephen Russek. Microfluidic platform of arrayed switchable spin-valve elements for high-throughput sorting and manipulation of magnetic particles and biomolecules.)

Biotechnology and medical diagnostics applications could use the chip in bioassay magnetic tags. The chip demonstration provides a conceptual foundation for a more complex magnetic random access memory (MRAM) for molecular and cellular manipulation. For example, programmable microfluidic MRAM chips might simultaneously control a large number of beads, and the attached molecules or cells, to assemble “smart” tags with specified properties, such as an affinity for a given protein at a specific position in the array. NIST is also interested in developing cellular and molecular tags for magnetic resonance imaging (MRI) studies in which individual cells, such as cancer cells or stem cells, would be tagged with a smart magnetic biomarker that can be tracked remotely in an MRI scanner, Moreland says. Automated spin valve chips might also be used in portable instruments for rapid medical diagnosis or DNA sequencing.

Results were published by lead author Wendy Altman, who did the research at NIST as a CU graduate student working on her doctoral thesis. Another author, Bruce Han, was a CU student in NIST’s Summer Undergraduate Research Fellowship (SURF) program. See: W.R. Altman, J. Moreland, S.E. Russek, B.W. Han and V. M. Bright. 2011. Controlled transport of superparamagnetic beads with spin-valves. Applied Physics Letters, Vol. 99, Issue 14, Oct. 3.

The National Institute of Standards and Technology (NIST) is an agency of the U.S. Department of Commerce. Learn more at www.nist.gov.

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October 24, 2011 — A highly engineered lanthanum and strontium compound material could form the basis of spintronics devices, report Argonne National Laboratory (ANL) and the National Institute of Standards and Technology (NIST) researchers.

ANL team members engineered the highly ordered magnetic oxide compound of lanthanum and strontium. ANL used atomic layer deposition to organize the lattice in layers of just strontium and just lanthanum. In randomly created compounds, stronger magnetic properties are found where extra lanthanum atoms are added to the lattice. The researchers’ virtually perfect sample of the material allowed them to study fundamental characteristics, said Brian Kirby, a physicist at the NIST Center for Neutron Research (NCNR).

Figure. Manganite oxide lattices (blue) doped with lanthanum (red) and strontium (green) have potential for use in spintronic memory devices, but their usual disorderly arrangement (left) makes it difficult to explore their properties. The ANL/NIST team’s use of a novel orderly lattice (right) allowed them to measure some of the material’s fundamental characteristics. SOURCE: Argonne National Laboratory.

The NIST team members used the NCNR’s polarized neutron reflectometer to analyze the magnetic properties within this oxide lattice versus those of a random compound. The influence of electrons near the additional lanthanum layers was spread out across three magnetic layers in either direction, but fell off sharply further away than that. Tiffany Santos, lead scientist on the study from ANL, says that the measurement will be important for the emerging field of oxide spintronics, as it reveals a fundamental size unit for electronic and magnetic effects in memory devices made from the material.

Also read: Brookhaven studies FET’s superconductor transition

Referring to use for memory chips, Kirby says that electrons will need to be physically close enough to influence each other to share spin information. The precisely constructed compound showed the researchers "how big that range of influence is," Kirby explained.

Results were published in Physical Review Letters: T. S. Santos, B. J. Kirby, S. Kumar, S. J. May, J. A. Borchers, B. B. Maranville, J. Zarestky, S. G. E. te Velthuis, J. van den Brink and A. Bhattacharya. Delta doping of ferromagnetism in antiferromagnetic manganite superlattices. Physical Review Letters, Week ending Oct. 14, 2011, 107, 167202 (2011), DOI: 10.1103/PhysRevLett.107.167202.

The National Institute of Standards and Technology (NIST) is an agency of the U.S. Department of Commerce. Learn more at www.nist.gov.

October 21, 2011 – BUSINESS WIRE — Scientific & Biomedical Microsystems, LLC, a developer of scientific and medical sensors and systems based on micro electro mechanical systems (MEMS) and other microfabrication technologies, was awarded a 5-year Schedule 871 contract by the US General Services Administration (GSA).

The contract will streamline the ability of all United States Federal agencies and contractors to purchase SB Microsystems’ advanced design, fabrication and test services.

Scientific & Biomedical Microsystems also recently added 2 hires, with 2 additional openings available.

Company representatives will take part in Governor O’Malley’s Investment and Trade Mission to India (Nov. 28-Dec. 3)

The Schedule 871 contract takes effect September 27th 2011.

SB Microsystems’ core capabilities include MEMS, microfluidics, embedded systems, precision machining, biosensors and wireless sensor networks. It provides a full scope of early-stage product development services from concept development and detailed design all the way through to prototype fabrication, test, and manufacturing. For more information about Scientific & Biomedical Microsystems, please visit http://www.sbmicrosystems.us/index.html

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