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Dec. 6, 2006 — SiTime Corp., a Sunnyvale, Calif., start-up commercializing silicon MEMS resonators, announced the appointment of Regina Rekhtman as vice president of operations.

Rekhtman previously served as senior director of operations and quality for Microsoft’s XBOX Silicon group, where she managed XBOX 360 custom silicon products through launch and high volume manufacturing.

Rekhtman brings more than 20 years of senior operations management experience in the semiconductor industry, where she was responsible for process technology, fabless manufacturing, supply chain management, product engineering, yield enhancement and quality/reliability control.

Subsequently, she held executive, management and engineering positions at fabless start-up companies (Sirific Wireless, SiRF Technology) and established IDM companies (IMP, National Semiconductor, Raytheon Semiconductor).

Dec. 6, 2006 — SmalTec International LLC, a Naperville, Ill., microtechnology solutions provider, announced the launch of its most advanced micro-EDM / nano-grinding equipment.

The company says its M2I7-n Micro-EDM / Nano-Grinding machine is capable of ultra-precise results, such as perfect round holes to within 0.20 micron diameter and positional tolerance, plus complex micro patterns to true 3-D contoured shapes are achievable.

The M2I7-n’s positional range of X, Y, and Z is 50 millimeters per axis, its step resolution is 10 nanometer, and its positional repeatability is 170 nanometers.

“Mechanical and electrical functions are getting more and more concentrated in a great part of industrial products,” said T. Masuzawa, Emeritus Professor of the University of Tokyo and founder of Masuzawa Micromachining Technology Consulting, in a prepared statement. “Micromachining is one of the important technologies which support this tendency.”

SmalTec has been offering micro-EDM and nano-grinding equipment, full-service prototyping, and micro manufacturing solutions and services for its high-tech customers since 2002. The company’s goal is to raise the bar on the industry’s precision, capabilities, and throughput.

Dec. 5, 2006 — Five Star Technologies of Cleveland has closed an investment round of $7.1 million dollars led by Morgenthaler Ventures. Other investors include CTTV Investments (ChevronTexaco), Early Stage Partners, Industrial Technology Ventures, and Reservoir Venture Partners.

Five Star Technologies is a supplier of high-performance inks and dispersions for use in electronics packaging and assembly operations. Using its patented Particle Management Technology, Five Star creates precision products that are intended to fill a missing link in the assembly of high-performance electronic components. Five Star dispersions of conductive, sub-micron and nanoscale particles offer stability and uniformity to help customers improve electrical and thermal performance.

Morgenthaler, CTTV Investments, Early Stage Partners, and Industrial Technology Ventures invested in the company in previous financings. Reservoir Venture Partners is a new investor.

Dec. 5, 2006 — Developers of MEMS and flat panel displays now have a powerful new development and productivity tool from GenISys GmbH, a leading-edge provider of software solutions for efficient processing optimization of microstructure fabrication.

GenISys introduced Layout LAB, a simulation platform for mask aligner lithography that lets users virtually model, redesign and optimize device layouts and processes in hours rather than weeks.

As with advanced IC manufacturing, where lithography simulation has enabled technologies such as Optical Process Correction (OPC) and Design for Manufacture (DfM), the “virtual lab” approach to MEMS is intended to not only save time but also help realize lower costs, higher manufacturing yield and faster time-to-market.

The company says the benefits extend to the development and production of micro devices, like high-resolution flat panel displays, in which proximity printing (mask aligner lithography) is a key part of the manufacturing process.

The program enables design and modeling of processes including mask layout, exposure tool, process parameters, accurate 3-D aerial image and resist contour calculation. Its VisualFLOW graphical user interface gives users a drag-and-drop tool for designing and optimizing complex hierarchical process flows. And, because of its database-driven architecture, Layout LAB lets developers store predefined functional modules and create, store and quickly retrieve their own custom process flows.

In addition to supporting modeling and optimization, Layout LAB simulation provides fast 3-D visualization and verification. When introducing a new device layout to the production line, the first step is to verify that the layout will print as desired using specific parameters. With Layout LAB, users can get the verification they need without having to produce masks or run the layout in the actual production line, further cutting both time and costs.

“In today’s MEMS industry, there is tremendous process variability, which, in conjunction with increasingly narrow process margins, requires a dedicated simulation environment. In contrast to IC manufacturing, where projection lithography is the standard, MEMS processes primarily use proximity lithography. Simulation software for MEMS applications needs to model mask aligners, larger layouts and also thick resist layers,” said Nezih Unal, vice president of marketing and sales of GenISys, in a prepared statement.

“GenISys enables today’s MEMS researchers, process development and production engineers to get the print results they need in days, rather than weeks. Layout LAB’s unique database-driven, modular architecture combines performance, flexibility and ease of use. Most important, it gives MEMS developers a level of responsiveness that has previously been unattainable.”

Dec. 5, 2006 — Nanogen Inc., a San Diego developer of advanced diagnostic products, announced it has been awarded a $4.5 million contract from the U.S. Centers for Disease Control and Prevention (CDC) to develop a unique multi-analyte Point-Of-Care (POC) diagnostic assay for influenza in support of the U.S. Government’s efforts to strengthen its readiness for a potential influenza pandemic.

The goal of the development is to employ Nanogen technology in a low cost, high sensitivity POC immunoassay that simultaneously detects Influenza Type A, Type B, seasonal flu (H1N1 and H3N2) and avian flu (H5N1) in a simple to use assay format. This development program is partnered with HX Diagnostics, Inc., which will commercialize the product upon approval. The current award of $4.5 million funds the first two phases of a five-phase development project and, if all five phases are funded by the CDC, can total approximately $12.5 million over the next two to three years.

The Nanogen product under development is a third generation high sensitivity lateral flow test designed to be accurate, highly portable, and simple to use yet with a cost similar to current influenza POC tests sold today. The immunoassay technology underlying the design builds upon that employed in Nanogen’s current cardiac infarction products, which are capable of delivering results at the point of care in as little as 15 minutes.

ICF International of Fairfax, Va., released an analysis of the U.S. Federal Government’s efforts to research the human health and environmental consequences of nanotechnology.

The report, titled “Characterizing the Environmental, Health, and Safety Implications of Nanotechnology: Where Should the Federal Government Go From Here?” describes a need to chart a more aggressive course when it comes to answering such questions.

In the report, ICF says it takes an integrated view of the challenge and provides 14 specific policy recommendations built around three components.

The first entails identifying the “right” research that can inform priority risk management decisions. The second addresses research management and offers recommendations for the completion of timely and policy-relevant research. The third component focuses on how research results can be used to support sound risk management decisions. Principles of continuous improvement are then overlaid on the framework to allow ongoing feedback to enhance the national research effort.

“At first, the challenge appears to be only a scientific one, focused on traditional risk assessment topics like hazard, exposure, dose-response, and environmental impacts,” says Peter Linquiti, study co-author and ICF consultant, in a prepared statement. “But it’s also a management issue. Without a sound strategic research plan and the right underlying business processes, it will be difficult to ensure that federal research reliably yields answers to questions being asked by a wide variety of stakeholders.”

ICF International partners with government and commercial clients to deliver consulting services and technology solutions in the energy, environment, transportation, social programs, defense, and homeland security markets. The 1,800-person firm serves government, major corporations, and multilateral institutions.

Dec. 4, 2006 — XCOM Wireless Inc., a Signal Hill, Calif., developer of radio frequency (RF) products, announced it selected Innovative Micro Technology (IMT), a Santa Barbara, Calif., MEMS contract manufacturer, to manufacture die for its RF MEMS relay product.

XCOM and IMT said they have implemented an effective wafer manufacturing process to produce RF relay die with high performance, reliability, and environmental ruggedness. XCOM is sampling its RF MEMS relay product for size-constrained and performance-critical applications in automated test equipment (ATE), RF test equipment, civilian radios, and military radios.

“We are supplying qualified products to support the continued growth of ATE and RF test equipment,” said Dan Hyman, CEO of XCOM, in a prepared statement. These, he said, will lay a foundation for the company’s future products intended for high-end antenna applications and multi-mode, multi-standard consumer handsets.

Hyman said XCOM has been delivering samples that demonstrate excellent repeatability, high bandwidth, and strong performance, and that the company would use IMT as it moves into production.


Above, an array of XCOM RF MEMS die.

XCOM’s RF MEMS relays are intended for a diverse set of applications where low loss, high isolation, and high bandwidth are required. The company’s relay incorporates the benefits of a metal-to-metal contact, similar to conventional mechanical relays, while providing the miniature, surface-mount footprint of a solid-state relay. Applications include switching and signal routing in ATE and RF test equipment; and tunable filters, antennas, and matching networks for civilian and military radios and radar systems.

JPSA intros new rotary stage


December 4, 2006

Dec. 4, 2006 — Hollis, N.H.-based J. P. Sercel Associates (JPSA) announced a new integrated Z-theta motorized stage that it says offers high precision operation for wafer processing and positioning.

JPSA says the non-contact operation — as opposed to typical worm and wheel rotary designs — reduces maintenance requirements, is less susceptible to wear, and is not affected by torque variations because there’s no gear interface. The new Z-theta stage provides 360 degrees of rotational capability, and its Z-axis capability makes it applicable to a wide range of applications, with the ability to accommodate wafers of varying thicknesses and diameters.

Advantages of the new rotary stage include continuous or limited travel, excellent accuracy and repeatability, a cog-free motor for smooth motion; zero gear backlash; low wobble and bearing run-out; and no accuracy changes over time due to gear wear.

The stage is intended for laser micromachining applications and wafer processing, among others. Resolution (microns/arc seconds) is 0.25µm in the Z axis, and 0.72 arc seconds in the Theta axis; Repeatability of ±2 µm in the Z axis, and ±1 arc second for Theta.

Agilent unveils new AFM/SPM


December 1, 2006

Dec. 1, 2006 — Agilent Technologies announced the introduction of the Agilent 5400 AFM/SPM system, a high-precision instrument offering atomic resolution for a variety of research, industry and teaching applications.

The system is designed to be easy to use and affordable in order to appeal to a broad audience.

The modular system is intended to be used for applications in materials science, polymers, general surface characterization and nanolithography. The system also can be easily upgraded to the premier Agilent 5500 AFM/SPM.

Several features of the Agilent 5400 are intended to simplify its use. The scanner has quick-install nose cones, resulting in convenient switching of imaging modes; a scanner that snaps into place; open access to the sample plates; and simple alignment of optics. The system’s software, PicoView, is a new design with streamlined GUIs for intuitive operation.

To increase its appeal as a teaching instrument, Agilent is including undergraduate curriculum materials with each system. Jayne C. Garno, assistant professor of chemistry at Louisiana State University in Baton Rouge, La., where the system underwent beta testing, said undergraduates were already operating the system. “It proved to be a serious scientific instrument with outstanding resolution, yet has an intuitive and user-friendly software interface,” she said in a prepared statement.

By Jo McIntyre
Small Times Contributing Editor

Dec. 1, 2006 — Philips Business Electronics is selling off its remaining 8,406,007 shares of FEI Company. The shares are being offered by Philips Business Electronics International B.V., a wholly owned subsidiary of Koninklijke Philips Electronics N.V.

“What that will do for us is reduce the concentration of ownership,” said FEI’s CEO Don Kania. “People view that (concentration) as a problem, because it reduced the float. We think that in a quarter or two it will benefit the stock price significantly.”

Analyst Mark Miller, senior vice-president of equity research at Brean Murray, Carret & Co. of New York, said he’s optimistic about the proposed sale. However, he does see a downside: the loss of a formal relationship with a big European company that has a great heritage in the electron microscopy field. There is value in that relationship, he maintained, which FEI will have to forego.

At the same time, that relationship comes with a cost, said Miller. Any time a single company has that number of shares in another established company operating in the same geographical area, managers may feel somewhat constrained. “My feeling is that (the divestment) lets FEI manage operations in Europe with more freedom and flexibility to make strategic decisions,” Miller said.

Miller said he likes the managment changes he has seen at FEI during the five years he has covered the company. He said Kania brings a lot of unique attributes to the company.

“The company has been under pressure to improve their margins. Veeco, where Don came from, has been able to bring up its margins, while FEI has struggled to do that, I’m optimistic we’re going to see some progress there.”

Philips has viewed FEI as a purely financial investment, Kania said, and now that Philips is changing its business model to a healthcare and lifestyle company, the company is selling its non-related investments.

As a new CEO for FEI, Kania said he is quite satisfied about FEI’s own direction. The company has a strong technology, growing revenue, income and profitability.

Their own restructuring is behind them and they’ve sharpened their focus by selling Knight Technology, which operates in San Jose, Calif., and India. Knight provides yield management and failure analysis software to the semiconductor industry. FEI sold Knight to Santa Clara, Calif.-based Magma Design Automation Inc.

Going into 2007, the company will be introducing new products and tools, and just announced that it will expand its Helios NanoLab family of DualBeams, when it introduces the Helios NanoLab 400 and 400S systems next week at SEMICON Japan.

The tools combine advanced FIB and SEM technologies in an integrated, platform with a wide range of advanced high-resolution solutions for analytical labs of their semiconductor manufacturer customers.

The new products represent the next-generation of technology following FEI’s Strata 400 and 400 STEM in the semiconductor market, the company said.