Tag Archives: Small Times Magazine

October 21, 2011 — Imec engineers fabricated <1 picoliter sealed cavities directly on 200mm silicon wafers, using freestanding thin membranes of nanoporous anodic alumina (PAA). The thin-film vacuum wafer processing technology can package micro electro mechanical systems (MEMS) at the wafer level with strong, hermetic results.

Traditional thin-film wafer-level MEMS packaging techniques use lithography-defined release holes to remove the sacrificial layer and form the microcavity between the MEMS and the capping layer, potentially enabling sealing material to leak inside the cavity, onto the MEMS structures.

In Imec’s MEMS packaging method, nanopores serve as release etch holes. The cap layer with nanopores is a freestanding PAA membrane around 2-3µm thick. The cylindrical nanopores boast a 15-20nm diameter, creating an aspect ratio of >100. The high aspect ratio lets these holes close very rapidly during the first stage of sealing.

Figure. Scanning electron microscopy (SEM) images of empty PAA-based thin-film packages, together with cross-section schematics (a-e) showing the process steps.

First, a 3µm chemical vapor deposition (CVD) oxide sacrificial layer is deposited, patterned to obtain anchors and supporting pillars for the package. Next, a 1-1.5µm aluminium layer is sputtered. This layer is anodized, using a mask to define the microcavity areas. PAA membranes are typically 50% thicker than the original aluminium layer. Next, the sacrificial oxide layer under the membranes is etched away by exposing the wafer to HF vapour. Finally, the packages are sealed using a 4µm plasma-enhanced CVD (PECVD) silicon nitride layer.

Imec aimed to perform thin-film wafer-level MEMS packaging with reduced complexity. The wafer-level packaging (WLP) process takes place at low temperatures. It is reportedly simple, non-organic, and RF-compatible (the packages have a negligible impact on RF transmission for signal frequencies up to 67GHz). The dielectric caps are optically transparent, suiting optical MEMS applications.

Imec performs world-leading research in nanoelectronics. Further information on imec can be found at www.imec.be. Also read: Imec: First poly-SiGe MEMS on Cu-backend CMOS

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October 21, 2011 – BUSINESS WIRE — Thin Film Electronics ASA (Thinfilm) and PARC, a Xerox company, created a working prototype printed non-volatile memory (NVM) device with complementary organic circuits.

Thinfilm Addressable Memory comprises printed polymer-based memory from Thinfilm and transistors from PARC that use complementary pairs of n- and p-type transistors like traditional CMOS chips.The addition of the integrated circuits makes the roll-to-roll (R2R) printed Thinfilm Memory addressable by printable logic. The prototype is a step toward mass-produced, low-cost, low-power ubiquitous printed electronic devices, the companies state.

The working prototype demonstrates rewritable memory and supports integration with sensors and other electronic components. The manufacturing process, using high-volume R2R printing, is reportedly environmentally friendly.

Thinfilm "can deliver a scalable, commercially viable version" of printed memory, noted Ross Bringans, VP, PARC Electronic Materials and Devices Laboratory. PARC specializes in designing full-featured systems for clients’ applications. Systems incorporating Thinfilm’s unique non-volatile ferroelectric polymer memory technology will see negligible power consumption by the devices, which do not require connection to external power to retain information.

"Addressable memory can be combined with sensors, power sources and antennas to power smart applications," said Davor Sutija, Thinfilm CEO. The target markets for Thinfilm Addressable Memory system products include NFC (Near Field Communications) tags, now available in Android phones, which enable device to device communication and have been predicted to, one day, be on all new objects. Thinfilm also targets sensor tags and disposable price labels. The addressable memory can be integrated with other printed components, such as antennas and sensors, to create fully printed systems for interaction with everyday objects and the “Internet of things” where the temperature of food and drugs are monitored or retail items are tracked individually rather than by pallet, container or truckload with a simple tap of a NFC enabled phone.

The development of the Thinfilm Addressable Memory was partially funded by an industrial development grant from Innovation Norway.

Thin Film Electronics ASA provides fully-printed non-volatile, rewritable memory for applications in toys & games, logistics, sensor, and ID systems. Learn more at http://www.thinfilm.se.

October 20, 2011 — Boosted by key design wins in Apple Inc. products like the iPad and iPhone, Asahi Kasei Microsystems (AKM) in 2010 retained its position as the world’s largest supplier of silicon magnetic sensors, according to an IHS iSuppli Magnetic Sensors Special Report from information and analysis provider IHS (NYSE: IHS).

IHS estimates that Japan’s AKM in 2010 accrued revenue of $300 million for magnetic sensors, up 58% from $190 million in 2009. This allowed it to reprise its No. 1 rank from 2009, as presented in the figure.

AKM led the market because of huge strides in supplying Hall electronic magnetic compasses, which are used in products like cellphones, tablets, digital still cameras, portable navigation devices and MP3 players.

Also read: Electronic compasses: Strong revenues from nav, gaming, military…

“An important segment of the magnetic sensor market is the digital compass, which has become a standard feature in GPS enabled smartphones and tablets,” said Richard Dixon, senior analyst for MEMS and sensors at IHS. “AKM has scored design wins for its 3-axis electronic compasses in the iPad, iPad 2, iPhone 3GS and iPhone 4, among other notable smartphone and tablet products. Because of this strong adoption, more than one-third of Asahi Kasei’s overall magnetic sensor revenue in 2010 came from 3-axis electronic compasses.”

The remaining two-thirds came from low-cost switches and sensors for consumer electronics and appliances, in which AKM also has undisputed worldwide dominance.

Top 5 magnetic silicon suppliers by revenue. SOURCE: IHS iSuppli October 2011.

“AKM enjoys tremendous economies of scale in producing commodity Hall devices and integrated circuits that few other manufacturers can match,” Dixon said. “Meanwhile, the high prices for compasses have served to keep the company at the top rank.”

AKM and four other top players together accounted for more than 80 percent of the global market for silicon magnetic sensors, which in addition to compasses are used extensively in automotive applications.

Revenue in 2010 from the Top 5 magnetic silicon suppliers reached a combined $962.0 million, or 82 percent of the market’s $1.18 billion value. The Top 5 consisted of AKM, Massachusetts-based Allegro Microsystems Inc., Infineon Technologies of Germany, Micronas of Switzerland, and Melexis N.V. of Belgium, as shown in the table below.

Second-ranked Allegro Microsystems, which had $264 million in revenue, was also the foremost supplier of automotive magnetic sensors. Magnetic sensors are found in more than 70 automotive applications, including anti-lock brake systems, electronic steering and throttle control, battery management and automatic transmission systems.

Allegro is putting increasing emphasis on higher-value automotive products, such as camshaft position sensors. Allegro is strong in supplying current sensors for battery management in automotive applications. Its revenue growth was strongest among the Top 5, up 75 percent from $151 million in 2009.

The No. 3 company, Infineon, was the leading supplier of automotive wheel-speed sensors. Revenue in 2010 for Infineon amounted to $148 million, up 40 percent from $106 million in 2009. Although most of its revenue comes from Hall magnetic ICs, Infineon is also pioneering an integrated giant magnetoresistive sensor element and application-specific integrated circuit (ASIC) that has higher spatial resolution than Hall sensors, suitable for precision applications like steering-wheel angle measurement. The company has no consumer electronics focus.

Fourth-ranked Micronas, with magnetic sensor revenue of $143 million, was also the top supplier of linear Hall sensors. It has a wide-ranging portfolio—a majority of it in automotive—but also benefits from a growing focus on industrial sensors. Micronas has been developing 3D Hall technology, but lags behind Melexis, a company that already has an established market presence for this new technology. The 3D Hall devices extend the spatial revolution of existing Hall sensors, allowing them to continue to compete against higher-performance magnetoresistive magnetic sensors. Micronas revenue in 2010 was up 36 percent from $105 million.

Melexis, the No. 5 company, concentrates on automotive applications and recently has gained significant presence in the emerging Chinese car markets. With revenue of $107 million, Melexis also supplies commodity Hall switches for cellphone display management applications. The company is unchallenged as the top supplier of acceleration pedal sensors, where its Hall sensors and 3D Hall sensors are deployed in electronic throttle control systems widely used on many cars today. Revenue in 2010 was up 43 percent, the third highest in the group, from $75 million in 2009.

See the IHS iSuppli report "Digital Compasses Pick Up Reins of Magnetic Sensor Market" at http://www.isuppli.com/MEMS-and-Sensors/Pages/Digital-Compasses-Pick-up-Reins-of-Magnetic-Sensors-Market.aspx?PRX

IHS (NYSE: IHS) provides market analysis on energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost. Learn more at www.ihs.com.

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October 20, 2011 — At the MEMS Executive Congress 2011, November 2-3, in Monterey, CA, a demo event will showcase MEMS-enabled applications from medical devices to entertainment and computing systems.

MEMS Executive Congress is hosted by the MEMS Industry Group (MIG). This year marks the first MEMS Technology Showcase at the event. Each finalist will get five minutes to wow the audience, who will text-message votes for their favorite demo. Panel moderator Sam Guilaumé, CEO, Movea, will crown the winner at the end of the day.

MEMS Technology Showcase finalists include:

“Red Ridge” from Intel
A new tablet form-factor reference design enabling OEM customers and developers to design and manufacture products using the “Medfield” platform. “Medfield,” Intel’s next-generation, 32nm SoC processor, will support the development of devices with even lower power, smaller footprints, more integration of features and stunning performance. “Medfield” is compatible with the Intel® Wireless Display technology, which eases the sharing of high-definition content wirelessly among a tablet, PC and TV.
ShowWX+ HDMI from MicroVision
A high-brightness, handheld pico projector that lets users project images, presentations and video as large as 100 inches across from an Apple iPhone or iPad or a laptop onto any available surface. With the addition of an HDMI input, the ShowWX+HDMI supports the connection to a broad array of new host devices that have HDMI as their output standard.
The Raisin System from Proteus Biomedical
Combines pharmaceuticals, medical devices, telecommunications and social networking in a seamless solution. The Raisin System delivers a fully integrated wellness experience, combining daily medications with the information, education and motivation consumers and their families need to maximize individual health outcomes. The core enabling innovations of this system are the Proteus Ingestible Event Marker (IEM), the Raisin Personal Monitor and the HealthTiles application environment.
MOD Live from Recon Instruments
An interactive display for the world’s first GPS-enabled goggles. New this fall, MOD Live snap-fits into Recon-ready goggles, delivering sleek graphics and smart optics that are completely non-obtrusive for front and peripheral vision. MOD Live offers real-time feedback, including speed, jump analytics, latitude/longitude, altitude, vertical distance travelled, total distance travelled, chrono/stopwatch mode, a run-counter, temperature and time. MOD Live also integrates with Android smartphones for additional apps and live connectivity, giving access to navigation, resort points of interest, caller ID, text messaging, MP3 playlists, buddy tracking, wireless camera sync, and much more.
MEMS-Based Heart Rate Monitor from R0R3 Devices
A MEMS-based heart-rate monitor which provides advantages over chest strap electrocardiograms (ECG), offering accurate heart-rate measurement for wearers engaging in periodic motion such as running, doing push-ups or jumping jacks. It is also ideally suited for medical applications. The monitor offers an innovative wireless ANT+ communications and conforms to the basic profile for heart-rate monitor for GPS watches, such as Garmin and others. Other models communicate directly with Droid and iPad for remote patient monitoring.
The Air Mini Keyboard from Sunrex
An in-air remote control with integrated keyboard used by the PayTV industry for interactive TV applications and media control. The Air Mini Keyboard is also ideal for PC-connected home theater applications. The new keyboard is currently in production for large OEM customers.
Sys-Evo from Syride
A light (110 g) and compact (12.5 x 10.5 x 2 cm) electronic module for surfboards. Sys-Evo monitors wave height, wave direction, distance traveled, and the duration of the wave. It also monitors the surfer’s actions (waiting time, paddling, riding), providing information on a surfer’s strengths and weaknesses and benchmarking performance relative to the athlete’s own goals and to the competition.

Register for MEMS Executive Congress, a business gathering of MEMS companies and OEMS hosted by MEMS Industry Group, here: http://www.memsindustrygroup.org

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October 19, 2011 — MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost and in a reproducible, simple manner.

A small, voltage-activated glass stamp etches nanoscale patterns onto metallic surfaces in the lab of Nicholas Fang, associate professor of mechanical engineering. Fang’s engravings act as optical antennae that can identify a single molecule by picking up on its specific wavelength. Controlling the optical antenna dimensions tunes the signals the device reports, Fang says.

The glass stamp technique is an alternative to electron-beam (e-beam) lithography for lab-on-chip fabrication. Fabricating a 6mm2 pattern using e-beam litho typically takes half a day and would price them at $600 each, Fang estimates. Nanoimprint lithography, a low-cost technique where polymer forms a pattern, is imprecise, with bumps and dents in the mold. Makers must use more polymer material to fabricate more copies, as the polymer is washed away during processing.

Fang’s team adopted the nanoimprint lithography approach using glass as a molding material instead of polymer. Molten glass is "very malleable and soft," Fang said, noting that the research was inspired by glassblowers. Fang found that glass easily takes a precise shape at the small-scale. Superionic glass, composed partly of ions, can be electrochemically activated.

The researchers filled a small syringe with glass particles and heated the needle to melt the glass inside. They then pressed the molten glass onto a master pattern, forming a mold that hardened when cooled. The team then pressed the glass mold onto a flat silver substrate, and applied 90 millivolts above the silver layer. The voltage stimulated ions in both surfaces, and triggered the glass mold to essentially etch into the metal substrate.

Figure. MIT’s glass stamp reproduces precise, nanometer-scale etchings in silver. The original engraving is 10um wide. Image courtesy of Kyle Jacobs, MIT.

The group was able to produce patterns of tiny dots, 30nm wide, in various patterns (see the figure) at a resolution more precise than nanoimprint lithography, and that can be reused many times.

While the glass-mold etch process is lower cost, it still requires a master metallic pattern that is formed via expensive lithography. Only one master pattern, and one glass stamp, can be used to mass-produce an entire line of the same sensor.

“With this stamp, I can reproduce maybe tens of hundreds of these sensors, and each of them will be almost identical,” Fang says. “So this is a fascinating advancement to us, and allows us to print more efficient antennae.”

The researchers reported the new fabrication process in the Sept. 21 online edition of the journal Nanotechnology. Access it here: http://iopscience.iop.org/0957-4484/22/42/425301

Learn more at http://web.mit.edu.

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October 17, 2011 — In its iPhone 4S teardown, IHS (NYSE:IHS) found "key changes" in the iPhone components. Jim Morrison, product manager at Chipworks, called the iPhone 4S "something of a hybrid" of the iPhone 4 and iPad 2, in his teardown analysis.

Notably, the iPhone 4S uses a 5-lens camera module, which is a first encountered in a smartphone during a IHS iSuppli Teardown Analysis. The 4S camera module is an autofocus device with an 8-megapixel (MP) resolution, compared to 5MP in the iPhone 4 models. Like the iPhone 4, the 4S employs backside illumination (BSI) technology.

Attend the free, on-demand webcast: Lens Tilt in Small Auto-Focus Cameras from DigitalOptics Corporation, a wholly owned subsidiary of Tessera Technologies.

The apps processor is the same dual-core A5 seen in the iPad 2, says IHS, likely along with the same SDRAM memory configuration at 4 Gigabits (Gb). Low memory density is evidence of Apple’s software + hardware efficiency approach to device design, IHS points out. Chipworks is investigating if the A5 is still made by Samsung, or if it has moved to TSMC for 40nm low-power production.

Chipworks is posting de-capsulated die-level images of the iPhone 4S components at http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns.

A cellular radio makes the iPhone 4S a "true world phone," said Wayne Lam, senior analyst at IHS. iPhone 4S merges the HSPA and CDMA radio capabilities found separately in the two previous iPhone 4 models into a single product that can address global wireless networks. No other handset OEM produces a single device for multiple operators and for multiple geographies on this scale, making the phone operational with AT&T, Verizon, and Sprint carriers. Changes to the radio design include the use of an updated Qualcomm baseband processor, the MDM6610.

The baseband processor is now discrete, no longer integrated with the RF transceiver (which is a dual-mode Qualcomm RTR8605). The IHS iSuppli Teardown Analysis Service has seen this RF set-up in other handset designs, such as the Hewlett-Packard Veer and HTC Thunderbolt.

The 4S also likely makes use of three different power amplifier module (PAM) module suppliers: Avago, Skyworks and TriQuint, a jump from the iPhone 4 CDMA version where only Avago appeared. Both Skyworks and TriQuint were featured in the HSPA/GSM version of the iPhone.

See IHS’s table of iPhone 4S components here.

IHS iSuppli soon will reveal the results of its full physical teardown that will provide actual data on iPhone 4S components and features. IHS (NYSE: IHS) provides research and analysis on energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost. Learn more at www.ihs.com.

Chipworks provides reverse engineering and patent infringement analysis of semiconductors and electronic systems. Learn more at www.chipworks.com, or read Chipworks Real Chips by blogger Dick James.

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October 14, 2011 – BUSINESS WIRE — NeoPhotonics Corporation (NYSE:NPTN), photonic integrated circuit (PIC) modules and subsystems maker, completed the acquisition of privately held Santur Corporation, a designer and manufacturer of Indium Phosphide (InP) PIC products.

NeoPhotonics agreed to pay an estimated $39.2 million in cash for Santur, after deductions for closing costs and other adjustments, plus up to $7.5 million additional cash contingent on the financial performance of Santur products subsequent to closing of the transaction through the end of 2012.

“By combining active InP PICs from Santur with our hybrid PICs, we can provide our customers with new products for 100G coherent systems that feature higher levels of integration, higher performance and greater functionality,” said Tim Jenks, Chairman and CEO of NeoPhotonics.

Santur is located in Fremont, CA, and is focused on commercializing PIC-based laser array and packaging technologies for communications. It was founded in 2000. Santur’s technology includes established telecom designs offering elegant approaches to wide tunability as well as high speed transceivers. Santur products are designed to provide reduced size, power consumption and cost for a wide range of DWDM, Coherent and Client Side networking applications in 10G, 40G and 100G networks.

NeoPhotonics also announced that, in connection with the acquisition of Santur Corporation, the company granted special inducement grants under the NeoPhotonics 2011 Inducement Award Plan to retain certain Santur employees (118 in total) as employees of the NeoPhotonics group. The company granted an aggregate of 466,450 stock options, each of which vests 25% on the first anniversary of the closing of the Santur acquisition and the remainder in thirty-six substantially equal monthly installments thereafter, subject to such employees being employed by the NeoPhotonics group on the vesting dates. The stock options were granted effective upon the acquisition closing date, have a ten year term and an exercise price equal to $5.97 per share, which was the closing price of NeoPhotonics common stock on the New York Stock Exchange on the date of grant. The stock options were approved by the Compensation Committee of NeoPhotonics board of directors and were granted as a material inducement to employment with the NeoPhotonics group.

The NeoPhotonics Board of Directors approved the 2011 Inducement Award Plan based on the employment inducement exemption provided under the NYSE listing standards. As a result, the 2011 Inducement Award Plan did not require shareholder approval, and this press release is being issued pursuant to applicable NYSE guidance.

NeoPhotonics designs and manufactures PIC-based modules and subsystems for bandwidth-intensive, high-speed communications networks. Learn more at www.neophotonics.com/

October 14, 2011 — Panorama Synergy Ltd (ASX:PSY) has formed an exclusive worldwide licensing agreement with the University of Western Australia (UWA) for optical technologies related to highly sensitive measurements by multiple, simultaneous micro-cantilever micro-electro-mechanical system (MEMS) sensors.

The MEMS under UWA development could be manufactured in more compact, portable sizes, said John Athans, Panorama Synergy chairman. The low-cost chips can be built with multi-system, multi-analyte sensors.

UWA was awarded an ARC grant to develop this technology. Under the licensing agreement, Panorama Synergy has rights up to 75% share on products and 50% share on sublicences.

Two complete patent applications covering this technology have been lodged in the USA and Australia. In addition PSY has lodged in Australia a provisional patent application for a variant technology that offers additional capabilities.

Optical cantilever technology in miniaturized biological and chemical sensing can be used for medical, security, gas detection, and other applications. Athans said the licensing agreement with UWA could bring "significant commercial opportunities for Panorama Synergy."

Panorama Synergy Limited (ASX:PSY) develops and commercializes photonics breakthroughs for multiple applications. For additional information, visit the Panorama Synergy website www.panoramasynergy.com.au

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October 14, 2011 – Marketwire — mPhase Technologies Inc. (OTCBB:XDSL) was granted access to the technical facilities at the Center for Nanoscale Materials (CNM), Argonne National Labs for user-initiated nanoscience & nanotechnology research. mPhase will optimize its micro electro mechanical system (MEMS) Smart silicon membrane, a key component of the mPhase Smart NanoBattery and other potential smart surface applications.

mPhase Smart NanoBattery design uses electrowetting and microfluidic techniques to selectively activate and control the power generated by the cells in the reserve battery. mPhase’s goal is to design batteries with long shelf life, high availability and other programmable factors, said mPhase CEO, Ron Durando.

mPhase will conduct technical analysis and refinement of its smart surfaces technology using Argonne’s sophisticated laboratory tools, which are not readily available to small businesses The CNM nanoscience & nanotechnology research program provides access to capabilities for design, synthesis, characterization, and theory & modeling of nanoscale phenomena, enabling development of functional nanoscale systems.

Also read: mPhase touts progress for nanobattery polymer coating

mPhase Technologies Smart Surface technology combines nanotechnology, MEMS processing and micro fluidics for applications in drug delivery systems, lab-on-a-chip analytic systems, self-cleaning systems, liquid and chemical sensor systems, and filtration systems. More information about the company can be found at http://www.mPhaseTech.com.

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October 14, 2011 — The COWIN project is a European Commission (EC) initiative under FP6 and FP7 European research projects for smart nano and micro technologies benefiting diagnostic and medical applications. The 3-year project has a January 2012 closing for micro and nano bioconvergence systems’ research projects.

Smart technology and sensors interact with environments and act on the data collected. Diagnostic and life science applications for smart systems saw an estimated 14% growth in 2009, and became a $1.5 billion market in 2010, according to Yole Développement. The European Commission expects smart sensors to grow in the life sciences field like they have taken off in smartphone applications. Uses include earlier in vivo and in vitro diagnosis of diseases, better medical devices, quality control in the agro-food industry, and environment safety.

Figure. Microsystem devices for healthcare applications, 2009-2015 (US$ million). SOURCE: Yole, September 2011.

In this context, part of the current FP7 European Call closing in January 2012 is especially dedicated to micro and nano bioconvergence systems’ research projects driven by applications’ requirements. Results of such R&D projects are expected to bring key differentiation to support the market penetration of smart systems in the Life Science field. A budget of 39 M€ is dedicated to this topic.

Also read: European competitiveness in miniaturized smart systems

The European Commission is also facilitating the access to advanced smart systems technologies through the COWIN action that extracts and promotes the best of the European FP6 and FP7 R&D projects’ results. It includes in particular for biological applications:

  • Fully integrated detection platform
  • Chemical and gas smart sensors with higher specificity and sensitivity
  • Innovation process for cartridge production
  • Newly solution for reagents integration
  • Data transmission monitoring
  • Innovation in sensors for Body Area Network (BAN)
  • Innovative sensors for medical imaging
  • Innovative robotics and surgical tools.

Large companies, but especially SMEs and start-up companies, are strongly encouraged to take benefit of the European Commission’s support to optimize their access to this promising innovation, reduce their time to market and strengthen their leadership in their targeted markets.

COWIN is a support action launched under the 7th framework Program for 3 years to strengthen the European competitiveness in miniaturized smart systems. Learn more at www.cowin4u.eu.

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