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August 23, 2011 — Rice University researchers created a solid-state, nanotube-based supercapacitors for energy storage, combining aspects of high-energy batteries and fast-charging capacitors with harsh-environment ruggedness.

SEM images. CNT bundles coated with alumina and aluminum-doped zinc oxide in Rice U’s solid-state supercapacitor for energy storage. Credit: Hauge Lab/Rice University.

The supercapacitor uses a solid nanocoating of oxide dielectric material rather than liquid or gel electrolytes. The solid material better withstands extreme heat and cold while performing discharge/recharge functions.

Nanocapacitors. CNT bundles at the center of Rice’s supercapacitors. The electron microscope images at right show the three-layer construction of one of the supercapacitors, which are about 100nm wide. Credit: Hauge Lab/Rice University.

Rice used 15-20nm bundles of single-walled carbon nanotubes (SWCNT) up to 50µm long. Carbon nanotubes were used to give the electrons high surface area, increasing capacitance. Each bundle of nanotubes is a self-contained super capacitor that is 500 times longer than it is wide. A chip could contain hundreds of thousands of bundles.

Transfer scheme. Bundles of vertically aligned SWCNTs to be transferred intact to a conductive substrate. Metallic layers added via atomic layer deposition create a solid-state supercapacitor that can withstand extreme environments. Credit: Hauge Lab/Rice University.

The array was transferred to a copper electrode with thin layers of gold and titanium for adhesion and electrical stability. The nanotube bundles (the primary electrodes) were doped with sulfuric acid to enhance their conductive properties; then they were covered with thin coats of aluminum oxide (the dielectric layer) and aluminum-doped zinc oxide (the counterelectrode) via atomic layer deposition (ALD). A top electrode of silver paint completed the circuit. It creates a metal/insulator/metal structure. Rice asserts that the project is the first of its kind with such a high-aspect-ratio material and ALD fabrication.

Chemist and team leader Robert Hauge devised the energy storage system with an eye on integration into devices from on-chip nanocircuitry to power plant equipment, flexible displays, electric cars, bio-implants, sensors, and other applications, including medical injections.

Results are published in the journal Carbon. Access the article at http://www.sciencedirect.com/science/article/pii/S0008622311005549

Team members included former Rice graduate students Cary Pint, first author of the paper and now a researcher at Intel, and Nolan Nicholas, now a researcher at Matric. Co-authors of the Carbon paper include graduate student Zhengzong Sun; James Tour, the T.T. and W.F. Chao Chair in Chemistry as well as a professor of mechanical engineering and materials science and of computer science, and Howard Schmidt, adjunct assistant professor of chemical and biomolecular engineering, all of Rice; Sheng Xu, a former graduate student at Harvard; and Roy Gordon, the Thomas Dudley Cabot Professor of Chemistry at Harvard University, who developed ALD.

The research was supported by T.J. Wainerdi and Quantum Wired, in coordination with the Houston Area Research Council; the Office of Naval Research MURI program; the Wright Patterson Air Force Laboratory and the National Science Foundation.

More Rice U research:

August 22, 2011 — Imec and Holst Centre have developed an ultra-low-power readout ASIC for capacitive micro and nano electro mechanical system (MEMS/NEMS) sensors. While most available readout chips are customized to particular sensors, this architecture can interface with various MEMS/NEMS devices without draining power.

The system reads accelerometers and strain sensors in a half-bridge configuration, with gain controlled by integrating pulses from the excitation voltage, controlling the signal-to-noise (SNR) ratio. The system has also been designed to cancel residual motion artifacts.

The readout architecture has the lowest reported equivalent acceleration noise level and the highest bandwidth, Imec states, offering SNR, bandwidth, and power tradeoffs. The team achieved a figure-of-merit of 4.41×10-20 F√(W/Hz) for a sensor range of ±2.0g and ±20,000με over a 100Hz bandwidth. The readout chip handles sensors with different sensitivities, offsets and mismatch via modifications to timing and duty cycle of the excitation pulses.

"Innovative, flexible and power-efficient readout architectures," which read signals from a wide range of capacitive devices (such as accelerometers and strain sensors with different actuation voltages, sensitivities and resolutions), enable MEMS use in building-monitoring networks for seismic-active areas, among other uses where various sensors operate on restricted power sources, Imec reports. Resolution requirements can be 1mg and 10με for the accelerometer and strain sensor respectively, and a range of ±2.0g and ±20,000με over a 100Hz bandwidth.

The ASIC was fabricated on TSMC 0.25μm CMOS with metal-insulator-metal capacitors. Total power consumption of the 3 channels is 15μW. The clock and excitation voltages for the sensors are external.

More MEMS news from imec:

IEDM: IMEC, Panasonic tip record MEMS resonator

IC MEMS design partnership

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August 22, 2011 — Nanowires tend to grow in unruly tangles, but a new structured substrate from the Weizmann Institute of Science is producing long, straight, aligned semiconductor nanowires for semiconductors like LEDs and transistors, photovoltaics, lasers, storage media, and other applications.

Figure 1. Nanowires growing along nanogrooves.

Prof. Ernesto Joselevich, Ph.D., of the Weizmann Institute’s Chemistry Faculty, Ph.D. student David Tsivion and postdoctoral fellow Mark Schvartzman of the Materials and Interfaces Department grew nanowires made of gallium nitride (GaN), using a sapphire base. Instead of growing nanowires vertically (which become tangled when manipulated into arrays), the researchers cut the sapphire along different planes of the crystal, creating a nanoscale step pattern with accordion-like, V-shaped grooves in which nanowires grew horizontally. The team therefore combined synthesis and assembly of the nanowires.

Figure 2.Top view of the nanowires, scanning electron microscopy (SEM).

The surface steps and grooves guide mm-long nanowire arrays to grow along their edges and within the depressions of the grooves. Optical and electronic properties were as good or better than those of vertically grown nanowires, without the defects that Joselevich expected horizontal growth to induce. The team credits its vertical-growth process, tuned to produce horizontal growth, for this high quality, though more research is needed to better understand what’s happening.

The results are published in Science at http://www.sciencemag.org/content/333/6045/1003.short

Learn more at the Weizmann Institute of Science, http://wis-wander.weizmann.ac.il/ (English)

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August 18, 2011 — Sporian Microsystems received a US Department of Energy (DOE) contract to evaluate advanced materials, sensor designs and packaging for Generation IV nuclear reactor use.

Recycled reactor fuels could be used to power Gen IV reactors. The technology is still in development, with proliferation and physical protection (from terrorist attacks, for example) as major design elements, as well as improved nuclear safety and reliability.

Sporian will develop materials and sensor technology that withstand harsh environments like high temperatures and high pressures, exposure to liquid sodium, fast helium flow, gamma and neutron radiation. The company will develop micro electro mechanical systems (MEMS), polymer derived ceramic materials (PDCs), and electronics packaging technologies to acheive this.

Sporian originally developed harsh-environment sensors for coal and natural gas-based generating turbines and for propulsion turbines. It also makes sensors for other applications, like drinking water control. It will leverage the same technology for Gen IV reactors, reports Sporian principal investigator Dr. Yiping Liu.

Sporian will provide a subcontract to Pacific Northwest National Laboratory (PNNL) in Richland, WA to assist with the evaluation of this technology.

Sporian Microsystems Inc. develops, markets, manufactures and sells a family of novel sensors, multiple sensor-suites, sensor-subsystems and sensor data-loggers. For more information, visit www.sporian.com

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August 19, 2011 — IBM (NYSE:IBM) researchers have build experimental chips that emulate the perception, action and cognition of brains. The chips aim to drastically lower power consumption and form factors in future "cognitive computers."

The first 2 prototype chips — which contain no biological elements — have been fabbed at IBM’s Fishkill, NY fab and are undergoing tests at IBM’s Yorktown Heights, NY and San Jose, CA research labs. Both prototype cores were fabricated in 45nm silicon on insulator-complementary metal oxide semiconductor (SOI-CMOS) and contain 256 neurons. The digital silicon circuits inspired by neurobiology create a "neurosynaptic core" with integrated memory (replicated synapses), computation (replicated neurons) and communication (replicated axons). One core contains 262,144 programmable synapses; one contains 65,536 learning synapses. They perform simple applications like navigation, machine vision, associative memory, pattern recognition, classification, etc.

IBM’s "neurosynaptic computing chips" recreate the phenomena between spiking neurons and synapses in biological systems through advanced algorithms and silicon circuitry. Cognitive computers will be programmed by experiences, finding correlations, creating hypotheses, and remembering the outcomes. The cognitive system will analyze complex information from multiple sensory modalities simultaneously, dynamically rewiring itself as it interacts with its environment. IBM’s cognitive computing architecture of on-chip lightweight cores create a single integrated system of hardware and software.

Under the Systems of Neuromorphic Adaptive Plastic Scalable Electronics (SyNAPSE) multi-year project, IBM combined nanoscience, neuroscience and supercomputing expertise in a cognitive computing initiative with university collaborators. The US Department of Defense’s Defense Advanced Research Projects Agency (DARPA) awarded the team about $21 million in new funding for Phase 2 of SyNAPSE. The IBM team successfully completed Phases 0 and 1.

These brain-inspired chips move beyond "more than half a century" of von Neumann paradigm computer architectures, said Dharmendra Modha, project leader for IBM Research. The cognitive system has no set programming, integrates memory with processor, and mimics brains’ event-driven, distributed and parallel processing.

IBM plans to build a chip system with 10 billion neurons and 100 trillion synapses that uses 1 kilowatt of power, with a 2-liter volume form factor.

Potential applications include vast sensor networks feeding a world water monitoring system for agriculture to tsunamis, grocer shelves that detect bad or contaminated produce, traffic lights that know when driving conditions become dangerous, and endless consumer product uses, said Dr. Modha.

University partners include Columbia University; University of California, Merced; Cornell University; and University of Wisconsin, Madison.

IBM has performed cognitive computing research since 1956 and recently created "Watson" to demonstrate problem-solving functions of advanced computers. For more information about IBM Research, please visit www.ibm.com/research.

Throughout 2011, IBM is hosting the IBM Research Colloquia, convening thought leaders at its global labs to discuss technologies of the future and their potential impact on business and society. The first of these colloquia took place at IBM Research – Zurich, and featured a dialogue on Nanotechnology and the Future of Computing with IBM Fellows and Nobel Laureates, Drs. Gerd Binnig and Heinrich Rohrer, and talks by Prof. Dr. Achim Bachem of the Julich Research Center on 21st Century Supercomputing; Prof. Dr. Karlheinz Meier, Kirchhoff Institute for Physics at Heidelberg University on Brain Inspired Computing and Prof. Dr. Daniel Loss of the University of Basel on Quantum Computing.

Chips are also in development that incorporate brain neurons on silicon. Read IMEC’s Patterning neurons-on-chip devices using microcontact printing

August 18, 2011 — Laser micro-manufacturer Potomac Photonics added advanced quality control (QC) and inspection capabilities to its service offerings for micro-electronics, MEMS, and micro-fluidics, as well as medical, consumer, solar, and bio-photonics projects.

Potomac Photonics selected Media Cybernetics’ Image-Pro Plus Version 7.0 image processing and analysis software, which creates image informatics to automate QC processes.

Measurement standards are key at the micron scale in manufacturing, said Mike Davis, director of operations, Potomac Photonics, noting that the tool will give customers greater insight into process control on their projects. Potomac drills micro holes in polymers, metals, silicon, glass, and ceramics for both prototyping and production applications.

Potomac Photonics uses microfabrication to develop miniature products on a contract basis. Visit the website at www.Potomac-laser.com.

Also read:

Laser micromachining system eliminates lithography in MEMS prototyping

Newport laser microfabrication station optimized for MEMS research

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August 18, 2011 — Benedetto Vigna, group VP and GM of ST Microelectronics (STM, ST) MEMS, Sensors, and High-Performance Analog Division, will keynote the 4th International Microtech/MEMS Conference on August 24. Vigna will present "The Future of MEMS and Challenges to Success."

The International Microtech/MEMS Conference co-locates with MICROTech World 2011, August 24-26, at KINTEX in Korea.

Listen to Vigna speak on MEMS traps to avoid and the MEMS metamorphosis here

Vigna will address the challenges that new MEMS applications — context awareness, positioning and remote monitoring, etc. — pose to MEMS suppliers. He also will share STM’s approach to these new possibilities. ST MEMS sensors are used in consumer devices, as motion-based user interface components for smartphones, game consoles, and more. ST acceleration sensors are used for free-fall protection in laptop hard-disk drives. Automotive OEMs integrate ST’s MEMS into airbags and enhanced navigation systems.

STMicroelectronics will also showcase MEMS technologies for automotive, smart mobile devices, and healthcare applications at MICROTech World Booth D-21, Hall 5, KINTEX (Korea International Exhibition Center).

STMicroelectronics makes semiconductor products for multimedia convergence and power applications. Further information on ST can be found at http://www.st.com.

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August 18, 2011 – BUSINESS WIRE — The Defense Advanced Research Projects Agency (DARPA) of the US Department of Defense (DoD) awarded QD Vision Inc. $900,000 to advance their quantum dot (QD) based infrared (IR) materials and deliver two prototype devices. The R&D is expected to take 12 months.

QD Vision is tasked with creating a prototype device using quantum dots as an emissive layer in an electronic device (electroluminescent application) and another in a film that is activated by external light sources (photoluminescent application). The company has previously demonstrated a quantum-dot-based display, and proprietary printing method to fabricate QDs.

QD Vision has worked with DARPA before as a prime contractor. To learn more about QD Vision’s Government Business, visit www.qdvision.com/government-contracts.

Although this project is sponsored by DARPA, the content of the information does not necessarily reflect the position or the policy of the government, and no official endorsement should be inferred.

QD Vision makes quantum dots, semiconductor crystals that control light, in highly differentiated display and lighting solutions. Learn more at www.qdvision.com

August 17, 2011 — MicroGen Systems Inc. and Infinite Power Solutions Inc. demonstrated a complete Wireless Sensor Network (WSN) powered by their products at this year’s Sensors Expo and Tradeshow. MicroGen’s BOLT 060 micro electro mechanical system (MEMS) -based piezoelectric vibrational energy harvester (PZEH) micro-power generator was combined with the THINERGY IPS-EVAL-EH-01 Energy Harvesting Evaluation Kit from IPS to power-up a complete wireless sensor board. The product is the result of more than a year of development using the nanofabrication tools at the Cornell NanoScale Science and Technology Facility (CNF).

MicroGen is incubating in the Cornell Business and Technology Park, and is the subject of a profile in the Cornell Chronicle this month.

MicroGen’s BOLT product line is intended to enable low-power electronic devices, such as wireless sensor nodes for wireless sensor network (WSN) applications. The BOLT devices are 1cm2 silicon-based chips or less that produce power levels up to 200 microWatts. These are the first commercial MEMS-based PZEH to be demonstrated at low relevant frequency and acceleration levels. "This is the first time in the world that a commercial company has produced a self-powered wireless sensor node using a MEMS-based energy harvester," MicroGen’s founder, president and CTO, Robert Andosca tells the Cornell Chronicle. Piezoelectric material generates electricity when flexed by a mechanical action (vibration), charging the device’s battery.

The IPS-EVAL-EH-01 is a universal energy harvesting evaluation kit that accepts energy from various energy harvesting transducers (both AC and DC charge sources), and efficiently stores the energy in a THINERGY MEC101 solid-state thin-film micro-energy cell (MEC)

The emerging energy harvesting market will help eliminate the constrant replacement of dead batteries in wireless sensor networks and nodes, Andosca says. An immediate use, according to Andosca, would be in wireless tire pressure monitoring systems required in new automobiles since 2007.

BOLT050, BOLT100, BOLT060 and BOLT120 resonate at vibrational frequencies of 50, 100, 60, and 120 Hz, respectively. A custom BOLT product can be fabricated for any target frequency between 30 and 1,500 Hz.

By 2016, MicroGen will be running an assembly plant employing 40 people, Andosca told the Cornell Chronicle. The start-up originally came to NY because of funding offered by Senator Charles Schumer via the Infotonics Technology Center (Canandaigua, NY). The MEMS technology has been honed at the CNF, particularly in collaboration with R. Bruce van Dover, professor of materials science and engineering.

MicroGen benefits from support provided by The University of Vermont, Cornell University’s Energy Materials Center and New York State Foundation for Science, Technology and Innovation, the Cleantech Center, High Tech Rochester, NY State Energy Research and Development Authority, and the National Aeronautics and Space Administration (NASA).

Learn more at http://www.microgensystems.com

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August 17, 2011 – Marketwire — FLIR Systems Inc. (NASDAQ:FLIR) priced a public offering of $250 million aggregate principal amount of 3.75% notes due September 1, 2016. With about $248 million net proceeds, FLIR plans to fund general corporate needs, such as working capital, investments in or extensions of credit to FLIR subsidiaries, capital expenditures, stock repurchases, and acquisitions. The offering will close on August 19, 2011.

FLIR Systems Inc. designs, manufactures, and markets sensor systems.

Joint book-running managers for the offering include Merrill Lynch, Pierce, Fenner & Smith Incorporated and Barclays Capital Inc.

The public offering is being made pursuant to an effective shelf registration statement on form S-3 on file with the U.S. Securities and Exchange Commission.

Notes offerings may be made only by means of a prospectus and prospectus supplement. Copies relating to the securities can be obtained from Merrill Lynch, Pierce, Fenner & Smith Incorporated at 100 West 33rd Street, 3rd Floor, New York, NY 10001, attention: Syndicate Operations, telephone: 1-800-294-1322, email: [email protected]; and from Barclays Capital Inc., c/o Broadridge Financial Solutions, 1155 Long Island Ave., Edgewood, NY 11717, telephone: 1-888-603-5847, email: [email protected].

This press release shall not constitute an offer to sell or the solicitation of an offer to buy FLIR’s notes or any other securities, nor shall there be any sale of securities mentioned in this press release in any state in which such offer, solicitation, or sale would be unlawful prior to registration or qualification under the securities laws of any such state.

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