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July 16, 2012 — Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing micro electro mechanical systems (MEMS), high-brightness light-emitting diodes (HB-LED), semiconductors, and other applications.

Deposition rate for high-quality SiO2 and SiNx improved with changes to the plasma-enhanced chemical vapor deposition (PECVD) hardware, which also reduces cleaning overhead. The latest generation of Cobra ICP source improves etch rate and feature control capability.

The tool’s robotic handler optimizes processes. Combined with the system’s control and software interface, this improves diagnostics, reliability and serviceability, the company reports.

The PlasmaPro 100 is configurable with process chambers as stand-alone modules or clusters. Users can access over 6,000 process recipes through Oxford Instruments.

Oxford Instruments specializes in the design, manufacture and support of high-tech tools and systems for industry research. Learn more at www.oxford-instruments.com.

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July 11, 2012 – Business Wire — The MiQro Innovation Collaborative Centre (C2MI) is improving its state-of-the-art micro electro mechanical system (MEMS) facility with Eyelit Manufacturing software to support R&D and the commercial activities of sponsor companies. C2MI is also installing a suite of new wafer processing tools from SPTS Technologies.

The C2MI is an international center for the development of advanced microsystems, focusing on 200mm MEMS and 3D wafer-level semiconductor packaging (WLP).

Eyelit’s software will be used to help produce prototypes and advance the commercialization of devices in fields such as information and communication technologies, automotive, aerospace, environment, and healthcare. C2MI will take advantage of Eyelit’s data partitioning capability to protect the intellectual property of C2MI members in the collaborative environment. Eyelit’s modular system offers MES, SPC, and Asset Management with fast and cost-effective deployment. Its user interface supports the concurrent display of multiple languages. The Web-based software does not require third-party software to access production data.

Eyelit’s products have recently been deployed at other research centers such as SEMATECH and CEA-Leti.

C2MI also added multiple SPTS Versalis fxP (etch, chemical vapor deposition [CVD]) and AVP thermal processing systems for through silicon via (TSV), MEMS and bulk acoustic wave (BAW) manufacturing.

The Versalis fxP, a cluster system that provides an integrated solution with multiple process steps, is fitted with Pegasus Rapier, APS, ICP and Isopod plasma etch modules together with an APM unit for plasma-enhanced CVD (PECVD). The system is used in multiple process steps including deep silicon etching, patterning of aluminum-based metals for interconnect, and the formation of aluminum nitride (AlN) bulk acoustic wave resonators in advanced packaging and MEMS applications.

The AVP vertical furnaces provide a wide variety of processes specifically developed for productive, low COO MEMS applications. At C2MI, the systems will be used to deposit thick doped polysilicon, stress-controlled Silicon Nitride and TEOS-based oxide films as well as thermal oxidation processes. In addition, SPTS will collaborate with partners at C2MI on the development of next-generation thermal technology for applications in MEMS and advanced packaging.

SPTS Technologies (a Bridgepoint portfolio company) designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com.

Eyelit Inc. makes manufacturing execution and quality management systems (MES and QMS) for the aerospace & defense, electronics, semiconductor, and solar industries. Learn more at www.eyelit.com.

The MiQro Innovation Collaborative Center (C2MI) is an international reference in the fields of advanced packaging and microsystems. The C2MI is a centre of excellence for commercialization and research (CECR) whose role is to help produce market-driven prototypes in the fields of applications of the information and communication technologies, automobile, aerospace as well as environment and health to accelerate their commercialization. The establishment of C2MI was made possible by contributions from Industry Canada, the ministère du Développement économique, de l’Innovation et de l’Exportation du Québec, Université de Sherbrooke, industrial partners and the Town of Bromont. Visit www.c2mi.ca.

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July 10, 2012 – BUSINESS WIRE — Semiconductor manufacturing equipment supplier SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms.

The ACS200 Gen3 offers the capability to combine four wet process modules with up to 19 plates for high-volume production. State of the art offerings include open bowl spin coating and proprietary GYRSET closed cover coating technology.

The configuration flexibility of modules and technologies suits production of advanced semiconductor packages, micro electro mechanical systems (MEMS) and light-emitting diodes (LEDs). The tool can also be used to bridge the gap between research & development (R&D) and high-volume manufacturing (HVM).

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.

July 10, 2012 — InvenSense, Inc. (NYSE:INVN), MEMS-based sensor maker, introduced its second-generation MPU-6500 6-axis MotionTracking device for smartphones, tablets, wearable sensors, and other consumer markets.

The MPU-6500’s 3 x 3 x 0.9mm QFN package is the world’s smallest for a 6-axis MotionTracking device, according to InvenSense. The single-chip design combines a micro electro mechanical system (MEMS) 3-axis gyroscope and 3-axis accelerometer with an onboard Digital Motion Processor (DMP). The MPU-6500 MotionTracking device offers nearly 60% lower power (1.8V operation) and a 45% smaller package than conventional designs. It consumes 6.1mW of power in full operating mode. Gyroscope performance is ±5dps zero-rate-output and 0.01dps/√Hz of noise; accelerometer specifications include a typical offset of ±60mg, 250µg/√Hz of noise, and 18µA of current in low-power mode.

The combo sensor enables pedestrian navigation, context-aware advertising, and other location-based services, along with supporting the specifications for emerging wearable sensor applications such as remote health monitoring, sports and fitness tracking, and other consumer applications. The MPU-6500 software drivers are fully compliant with Google’s latest Android 4.1 Jelly Bean release, and support new low-power DMP capabilities that offload the host processor to reduce power consumption and simplify application development.

Turnkey combo sensors can accelerate time to market and simplify design/software programming of devices, as well as inherent size and power reductions, simplified product qualification and inventory management, and precise sensor alignment and calibration. Learn more about sensor fusion in You make MEMS. Should you make sensor fusion software?

The MPU-6500 is sampling now to selected customers with mass production slated for Q4 2012.

InvenSense Inc. (NYSE:INVN) provides MEMS-based motion sensors for consumer electronic devices. More information can be found at www.invensense.com.

Check out Solid State Technology’s coverage of SEMICON West 2012!

July 6, 2012 — “MEMS will continue to see steady, sustainable, double-digit growth for the next 6 years, with 20% compound average annual growth (CAGR) in units and 13% growth in revenues, to become a $21 billion market by 2017,” said Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies at Yole Développement, which published its “Status of the MEMS Industry” report.

Figure. MEMS forecast through 2017. SOURCE: Yole.

Almost all micro electro mechanical systems (MEMS) players had a growth in sales in 2011 compared to 2010. Companies involved in inertial sensors and microphones are growing the most. New MEMS devices will emerge in the forecast period, with some experiencing >90% CAGR.

Yole expects continued strong growth in motion sensing and microfluidics, segments of the MEMS market that will grow to 25% (motion sensing accelerometers, gyroscopes, magnetometers and combos) and 23% (microfluidics) of the total MEMS arena in 2017.

Yole broke out combo sensors as a separate category in its market data and forecasts this year. The market for discrete inertial sensors is beginning to decline, but the growth for inertial combo solutions will be huge. Combo sensors will grow from <$100 million today to a $1.7 billion opportunity by 2017.

The MEMS market is still very fragmented, with limited high-volume MEMS applications. New MEMS devices and emerging-MEMS devices are hitting markets or nearing completion. Some of them have the possibility to ramp up to large volumes quickly: especially those that can be applied to mobile devices (RF MEMS switches, oscillators, auto-focus MEMS, etc). New sensors — humidity, touchscreen — and actuators — switches, energy harvesting — are driving future growth. Existing sensors are also expanding into new market spaces, sometimes using new types of integration (e.g. pressure sensors).

The report includes case studies on the STMicroeletronics (ST) and Bosch business models, as STMicroeletronics is becoming the dominant player in MEMS. ST has been able to diversify its MEMS offer with a wide range of MEMS devices and 90% of its IDM business done with 2 devices only (accelerometers, gyroscopes). It anticipated the growth with early investment in high-volume manufacturing infrastructure with an 8” wafer production line and diverse partnerships to speed time to market and enlarge its product offering. Bosch benefits from its captive fab infrastructure primarily dedicated to automotive applications, which helps Bosch to decrease prices.

In 2011, both the number and values of MEMS mergers and acquisitions (M&A) boomed. A total of $1.7B MEMS acquisition value was realized in 2011. Early-stage MEMS companies are acquired at high prices — SensorDynamics, Pixtronics — because there are a limited number of private candidates with solid technology. Large companies are looking to enter the attractive MEMS market, placing high value on these targets.

Companies cited in the report:

AAC, AGILTRON, AICHI MI, AKM, ALPS, ALTIS, AMKOR, ANALOG DEVICES, APPLE, ASE, ASIA PACIFIC MICROSYSTEMS, ASMC, AUDIOPIXELS, AVAGO TECHNOLOGIES, BAE, BLUECHIIP, BOEHRINGER INGELHEIM MICROPARTS, BSE, BTENDO, CANON, CAVENDISH KINETICS, CEA LETI, COLIBRYS, DEBIOTECH, DELFMEMS, DENSO, DISCERA, DNP, DRS, ENDVCO, EPCOS, EXCELITAS, FAUN INFRARED, FLIR SYSTEMS, FORMFACTOR, FOXCONN, FREESCALE SEMICONDUCTOR, FUJITSU, GE SENSING, GETTOP, GLADIATOR TECHNOLOGIES, GLOBAL FOUNDRIES, GOERTEK, GOODRICH-AIS, HEWLETT PACKARD, HITACHI, HONEYWELL, HOSIDEN, IDT, IMEC, IMT, INFINEON TECHNOLOGIES…

The 2012 edition of “Status of the MEMS Industry” includes MEMS device markets, key players strategies, key industry changes and trends and MEMS financial analysis. It also includes major MEMS manufacturing evolutions as well as an update on the “emerging” MEMS devices markets.

The Status of the MEMS industry report is written by Eric Mounier, PhD, co-founder and market analyst for MEMS, equipment and material, at Yole Développement and Laurent Robin, head of MEMS & Sensors market research at Yole Développement.

Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. Learn more at www.yole.fr.

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July 2, 2012 – Marketwire — Semiconductor maker STMicroelectronics (NYSE:STM) partnered with China’s Harbin Institute of Technology (HIT) to open a joint laboratory researching electronics.

This is HIT’s first joint laboratory built on a project-based learning mode, to boost innovation by students, said Professor XU Dianguo, Assistant Principal of HIT. The laboratory is located at the Electric and Electronic Experimental Teaching Center of HIT, with an aim to support efforts in the study, research and development of innovative and emerging applications of electronics, such as in medical, power management, and multimedia convergence. At the initial stage, the joint lab will focus on smart-sensor applications. STMicroelectronics will donate its advanced iNEMO development tools supported with an iNEMO software platform.

STMicroelectronics will provide its various products, IC samples, and technical documentation, as well as regular training to facilitate students in the design and development of innovative electronics projects. HIT will provide general-purpose facilities and management of the joint laboratory.

Starting with the micro electro mechanical systems (MEMS) smart sensors applications development, the lab will evolve to serve fields such as bio-medicine, energy saving and environment protecting, and user interfaces,” said Solomon NG, STMicroelectronics Regional Director, Strategic Business Development & Design Center, Greater China and South Asia Region.

“MEMS is a high-growth industry and high-quality engineers are very much in demand," said Patrick Boulaud, STMicroelectronics Regional Vice President, Analog, MEMS and Sensors, Greater China and South Asia Region, adding that the lab will help nurture the next generation of engineers and create new reference designs for the industry.

ST’s iNEMO is an evaluation and development tool that offers up to 10 degrees of freedom (DoF), combining 3-axis linear acceleration, 3-axis angular rate and 3-axis motion sensing through a magnetic field, together with barometric/altitude readings, managed by an STM32 32-bit microcontroller.

Also read: Solutions for MEMS sensor fusion

Harbin Institute of Technology (HIT) is designated a national key university of China by the Ministry of Higher Education.

ST provides semiconductors serving customers across the spectrum of sense and power technologies and multimedia convergence applications. Further information on ST can be found at www.st.com.

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!

June 28, 2012 — An annual guide for navigating the micro electro mechanical systems (MEMS) events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.

To get a sense of the scope of MEMS developments and trends, read Paula Doe’s preview articles, MEMS manufacturing changes with HV consumer apps and Maturing MEMS sector looks at ways to work together

TUESDAY, July 10, 10:30am-3:30pm

Taking MEMS to the Next Level: Transitioning to a Profitable High-Volume Business

Presented in cooperation with MEMS Industry Group (MIG)

We’ve expanded the MEMS program to all day this year, and invited speakers from around the world to address practical potential solutions to the major manufacturing issues for growing the sector to the next level. Yole Développement’s J.C. Eloy will give his views on the future of the industry and what it will take to get there. Harmeet Bhugra will talk about IC maker IDT’s entry into the MEMS timing business. Doug Sparks from the new Chinese MEMS IDM Hanking Electronics talks about the opportunities in the China market. Foundry executives Donald Robert from Teledyne Dalsa and Peter Hrudey from Micralyne examine possible collaborative solutions to speed time-to-market. Hillcrest Labs CTO Charles Gritton talks about issues of software integration and sensor fusion.

On the manufacturing technology side, Coventor’s Matt Kamon tells us what’s coming next in MEMS design automation software, Applied Materials’ Mike Rosa talks about next-generation DRIE and other new processes being developed specifically for MEMS production, ‘and Nikon’s Jumpei Fukui discusses the advantages of mini-steppers. In addition, Finnish startup ScanNano’s CEO Andrei Pavlov presents his work making low-cost cavities without etching and NIST’s Janet Cassard introduces standard reference materials and best practices for consistent characterization and troubleshooting of processes for calibrating instruments and communicating between customers and suppliers.

Location: Extreme Electronics TechXPOT at Moscone Center (South Hall). The stage is in the same place as last year, in the far back right-hand corner of the Moscone South exhibit hall.

 

WEDNESDAY July 11, 5:00-7:00pm

MIG Happy Hour

Save the date and time. MIG will host its annual Happy Hour at SEMICON West. Invitations will be sent soon.

THURSDAY, July 12, 10:30am-12:30pm

MEMS and Sensor Packaging

The SEMI Packaging Committee presents a program focusing on MEMS packaging technology issues, featuring Analog Devices’ Asif Chowdhury on issues of packaging MEMS for industrial applications, and Yole Développement’s Jerome Baron on the roadmap for MEMS packaging going forward. Florian Solzbacher from the University of Utah’s Utah Nanofabrication Laboratory presents on biomedical packaging issues, while Marc Bachman from the University of California talks about the future of MEMS manufacturing.

Location: TechXPOT North, Moscone Center (North Hall)

THURSDAY, July 12, 11:45-1:00pm

Flexible Batteries and Flexible Mounting of Thinned Silicon Die on Textiles, Skin Patches and Implants

MEMS folks interested in integrating sensors into innovative wearable, flexible, implantable applications may want to check out presentations in the Plastic Electronics program on patterning flexible batteries on unconventional substrates and embedding thinned conventional silicon die into flexible polymer packaging, from companies who don’t typically show up at MEMS events. Imprint Energy talks about its low-cost, high-energy density Zn polymer battery technology suitable for wireless and wearable sensors, Applied Materials presents its lower cost technology for making thin film batteries, and MC10 describes its conformal electronics packaging targeted at wearable and implantable sensors.

Location: Extreme Electronics TechXPOT, Moscone Center (South Hall)

For more information on SEMICON West 2012, please visit www.semiconwest.org. To register, click Register now.

June 27, 2012 — MEMSCAP (NYSE Euronext:MEMS), provider of micro electro mechanical system (MEMS) based technology, sold its 11.6% stake in INTUISKIN/ICOSMECEUTICALS.

The INTUISKIN/ICOSMECEUTICALS stake sold for net disposal proceeds of EUR 2.9 million in cash. The consolidated financial gain from this sale amounts to EUR 1.3 million.

Also read: MEMSCAP ships 1M MEMS-based thermally actuated VOA

This asset was not related to MEMSCAP’s core businesses. The MEMSCAP Group retains the ownership of the IOMA brand and certain related trademarks, which will yield royalty payments via an exclusive license agreement with INTUISKIN/ICOSMECEUTICALS. This license agreement includes a buy-out option on those assets, which can be executed by INTUISKIN/ICOSMECEUTICALS at any time, by the payment to MEMSCAP of EUR 3.5 million in cash.

MEMSCAP provides innovative micro-electro-mechanical systems (MEMS)-based solutions. MEMSCAP standard and custom products and solutions include components, component designs (IP), manufacturing and related services. The company’s shares are traded on the Eurolist of NYSE Euronext Paris S.A (ISIN: FR0010298620-MEMS) and belong to the CAC small, CAC Mid & Small, CAC All-Tradable and CAC All-Share indexes. More information on the company’s products and services can be obtained at www.memscap.com.

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