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(October 13, 2010) — Coventor Inc., software supplier for developing micro-electromechanical systems (MEMS), released the latest version of its MEMS+ design suite. The new release, MEMS + 2.0, includes tight integration and simulation within the widely used Simulink environment from MathWorks.

This support builds on the company’s existing integration with the Virtuoso IC design system from Cadence Design Systems (also enhanced in this release) to provide designers with an efficient, integrated environment for incorporating MEMS into traditional IC and system-on-chip (SoC) design methodologies.

In addition to the more unified and complete MEMS+IC design flow enabled by MEMS+, the latest release improves simulation performance within the Cadence environment and expands the library of 3D MEMS building blocks available to enable a wider variety of MEMS-based applications. Additional features in the tool’s user interface improve the ease of design creation and re-use within the product as well.

With the newest version of MEMS+, designers can use the same parameterized behavioral model created in the MEMS+ environment for simulations in both the Simulink and Cadence Virtuoso environments. MEMS engineers can now simulate their MEMS design in the familiar Simulink environment, optimize parameters, and hand off automatically generated behavioral models to their counterparts in the system architecture and IC design domains.

System architects can then easily incorporate MEMS in algorithmic-level simulations that span software, firmware, digital logic and analog circuits, while IC designers can incorporate MEMS in implementation-level simulations as well as physical design. Through the integration, all groups work from a single MEMS design representation in MEMS+. As with the Virtuoso integration there is no programming, just the creation of the MEMS design in the intuitive 3D user interface provided by MEMS+.

MEMS+ 2.0 includes an expanded version of Coventor’s extensive library of MEMS building blocks for accelerometers, gyroscopes, display mirrors, resonators, pressure sensors and RF switches. The 2.0 library version offers enhancements particularly for designing and simulating the flexible structures that occur in inertial sensors, microphones, and energy harvesting devices.

Traditionally, to support algorithmic design in Simulink as well as implementation-level design in Cadence Virtuoso, a MEMS designer would manually create and hand off separate behavioral models for MATLAB and Virtuoso. The process of keeping different models in sync with the evolving MEMS design is complex; it must be done manually and, to avoid errors, requires time-consuming re-validation of the models. The Coventor MEMS+ parametric design format provides a new standard that facilitates communication between the various tools in a complete IC flow. Using MEMS+ for design entry, MEMS designers can develop and maintain a single design source and automatically generate schematic symbols and simulation models for the Simulink and Cadence Virtuoso environments. In addition, MEMS+ can export 3D solid models for verification of the detailed MEMS behavior with finite element analysis. The single design source assures that all models are in sync.

“This an elegant way to connect and manage the very specific 3D design information required for MEMS design within Simulink, which can address behavioral modeling and functional correctness. Both MEMS designers and IC designers can benefit from this integration, with IC designers being shielded from the complexity of the physics of MEMS but still able to simulate them in the context of the system,” said Jim Tung , MathWorks Fellow. “Our goal with MEMS+ has always been to develop a structured methodology that is familiar to traditional IC designers and allow them to easily incorporate MEMS devices into their flows. This support for Simulink makes MEMS+ even more accessible to MEMS designers and adds an important system-level capability that extends the value of MEMS+ to the functional definition stage,” said Mike Jamiolkowski, CEO of Coventor.

The MEMS+ platform and the included library of parametric MEMS building blocks provides MEMS designers with the ability to perform custom parameterization of all design aspects, including variations due to the manufacturing process, ambient environment, or geometric dimensions of the design itself. Each parameter can be defined as a value, a variable, or an algebraic expression.

Designers can then import MEMS+ designs into Simulink or the Virtuoso Parts Library using a simple import interface. The MEMS system designer confirms the device performance by running simulations directly in the Simulink environment. All simulation results can be loaded back into the MEMS+ system and animated in the tool’s 3-D canvas.

MEMS+ Version 2.0 is available now on Windows 32- and 64-bit OS as well as Linux. It is available through the Coventor sales channel. Pricing begins at under $30,000.

The MEMS+ product suite anchors Coventor’s strategy for “bringing MEMS to the mainstream.” The strategy focuses on removing the traditional barriers to developing and integrating MEMS — time, cost, complexity — particularly for traditional IC designers not familiar with the nuances of MEMS. In addition to the MEMS+ platform itself, Coventor is working to enable a complete ecosystem for MEMS development through collaboration with foundries, complementary tool suppliers, IP and library developers, as well as fabless IC companies looking to leverage the MEMS opportunity. More information is available at http://www.coventor.com.

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(October 12, 2010) — Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, joined with the National Science Foundation (NSF) to fund $2 million in supplemental grants for nanoelectronics research.

Researchers at six major NSF Centers in leading U.S. universities will contribute to the goal of discovering a new digital switching mechanism using nanoelectronic innovations as a replacement for the transistor — the foundational building block of computing technology for decades.

NSF Center Websites:

Columbia Nanoscale Science and Engineering Center, at Columbia University http://www.cise.columbia.edu/nsec/research/

Princeton Center for Complex Materials, at Princeton University http://www.princeton.edu/~pccm/

Q-Spins: Quantum and Spin Phenomena in Nanomagnetic Structures, at University of Nebraska-Lincoln http://www.mrsec.unl.edu/

Center for Nanoscale Science, at Pennsylvania State University http://www.mrsec.psu.edu/research/irg3.asp

Center for Probing the Nanoscale, at Stanford University http://www.stanford.edu/group/cpn/

Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, at University of Illinois-Urbana-Champaign http://www.nano-cemms.uiuc.edu/

The joint NSF-NRI supplemental grants were awarded to teams at six NSF Centers in nanoelectronics research:

  • Columbia Nanoscale Science and Engineering Center (NSEC), directed by James Yardley at Columbia University, working with T. Heinz, P. Kim, K. Shephard and J. Hone.
  • Princeton Center for Complex Materials, directed by Nai-Phuan Ong, a Materials Research Science and Engineering Center (MRSEC) at Princeton University, working with E. Tutuc and N.P. Ong.
  • Q-Spins: Quantum and Spin Phenomena in Nanomagnetic Structures, directed by Evgeny Tsymbal, a MRSEC at University of Nebraska-Lincoln, working with K. Belashchenko, C. Binek and P. Dowben.
  • Center for Nanoscale Science, directed by Thomas Mallouk, a MRSEC at Pennsylvania State University, working with T. Mayer and S. Datta.
  • Center for Probing the Nanoscale, directed by Kathryn Moler, a NSEC at Stanford University, working with H.-S. Philip Wong.
  • Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, directed by John Rogers, a NSEC at University of Illinois-Urbana-Champaign, working with E. Pop and J. Rogers.

“The semiconductor industry continues to actively work on developing a new device that will fuel the industry’s leadership in the nanoelectronics era, and the NSF-NRI projects bring together our country’s top researchers to help drive critical research that not only affects our U.S. national competitiveness, but also economies worldwide,” said Jeff Welser, director of the Nanoelectronics Research Initiative (NRI) for SRC.

Until recently, manufacturers were able to double the number of transistors on a chip at half the power for each transistor by shrinking them smaller and smaller in each new generation of semiconductor technology (Moore’s Law). However, it is becoming increasingly difficult to continue decreasing the power needed to switch transistors off and on, making it difficult to continue the pace of product innovation from scaling alone. New breakthroughs ranging from basic materials science to advanced devices and circuit architecture will be required, making the partnership between NSF and industry a natural fit for this work.

"These investments in nanoelectronics align closely with NSF’s support for engineering and scientific research that furthers discovery," said Lawrence Goldberg, senior engineering advisor at NSF. "We believe these supplemental grants, which support graduate students and postdoctoral associates, will create innovative technologies and help find a solution to this significant issue facing the semiconductor industry today."

These six NSF-NRI supplemental grants expand and strengthen the commitment to this public-private partnership program, which is in its fifth year with a total of 30 such awards. See the 2007 grants for logic research here. 2008 grants here. 2009 grants here.

Companies participating in NRI are AMD, GLOBALFOUNDRIES, IBM, Intel Corporation, Micron Technology and Texas Instruments. These companies will assign researchers to collaborate with the university teams. Strong interactions with the NSF-supported centers will be instrumental in NRI reaching its goal of demonstrating the feasibility of novel computing devices in simple computer circuits during the next five to 10 years.

The Nanoelectronics Research Initiative (SRC-NRI) is one of three research program entities of SRC. SRC defines industry needs, invests in and manages the research that gives its members a competitive advantage in the dynamic global marketplace. SRC expands the industry knowledge base and attracts premier students to help innovate and transfer semiconductor technology to the commercial industry. For more information, visit http://nri.src.org.

The National Science Foundation (NSF) is an independent federal agency that supports fundamental research and education across all fields of science and engineering. In fiscal year (FY) 2010, its budget is about $6.9 billion. NSF funds reach all 50 states through grants to nearly 2,000 universities and institutions. Each year, NSF receives over 45,000 competitive requests for funding, and makes over 11,500 new funding awards. NSF also awards over $400 million in professional and service contracts yearly. For more information, visit http://www.nsf.gov.

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A MEMS optical switch made with multimode, 50 µm core fiber is now available in a single fiber-optic switch device. Its compact, 25 × 16 × 8.5 mm housing consumes less than 170 mW of electrical power. Port count can be specified from 1 × 2 to 1 × 8, and can be controlled via either TTL or I2C. Other configurations and special fiber types are also available.
DiCon Fiberoptics
Richmond, CA
www.diconfiberoptics.com

 

—–

PRESS RELEASE

DiCon Fiberoptics Announces 1×8 50um Multi-mode Optical Switch in a Single Device

DiCon Fiberoptics is pleased to announce that a MEMS optical switch made with multimode 50um core fiber is now available with a port count of up to 1×8 in a single fiber optic switch device. This allows multi-mode optical switch systems requiring higher port counts, primarily used in military and defense applications, to be reduced in overall weight, size, and power requirements.

“As weight, space, and power consumption are critical features in military systems, the higher port count of our multi-mode MEMS 1×8 fiber optic switch will give some of our military and defense customers a lighter, more compact solution,” said Robert Schleicher, the Vice President of Product Development. “We can offer these as OEM components, build them into compact switch modules that incorporate a small number of switches, or integrate them into complete military grade solutions. Typical applications include secure switching or video distribution.”

DiCon’s MEMS technology, as featured in the 1×8 multi-mode optical switch, is fully proven, with hundreds of thousands of MEMS devices shipped. Based on a platform that has been qualified to Telcordia GR-1221 (equivalent to certain methods from MIL-STD-883), these fiber optic switches have passed billions of toggling cycles and survive high levels of shock & vibration, temperature cycling, damp heat, dry heat, and other adverse conditions, making them ideal for military and avionic customers.

Packaged in a compact housing, the 1×8 optical switch is only 25mm x 16mm x 8.5mm in size and consumes less than 170mW of electrical power. The port count can be specified anywhere from 1×2 up to 1×8, and can be controlled via either TTL or I2C. In addition to the standard switch configurations, other configurations and special fiber types are also available.

For more information about the multi-mode MEMS 1×8 fiber optic switch, please visit www.diconfiberoptics.com/products/scd0122/0122e.pdf.

Posted by Lee Mather, republished for Small Times with permission from Laser Focus World

(October 11, 2010 – Marketwire) — Integrated Sensing Systems Inc. (ISSYS) has completed its 2010 manufacturing expansion project, adding 5,400 square feet to its existing facility in Ypsilanti, MI. The expansion is dedicated to high-quality manufacturing of system-level products based on ISSYS MEMS chips that are fabricated in its current cleanroom facility. The expansion began in late 2009.

The ISSYS expansion includes assembly lines, production laboratories, clean assembly/packaging rooms and calibration areas for both medical and industrial products. The new floor space also includes a combination cleanroom and Faraday cage for final assembly and calibration area with capacity for over 10,000 units/year of ISSYS’ wireless, batteryless medical implants.

"ISSYS’ MEMS cleanroom facility has the capacity to produce several thousand MEMS chips. The expansion area allows ISSYS to manufacture system-level products based on these enabling MEMS chips. These products include wireless, batteryless, sensing implants (applications include congestive heart failure and traumatic brain injuries), and industrial fluidic devices such as the FC10 methanol concentration sensor, FuelSense, MassSense, and UL-approved density and flow meters," said Dr. Nader Najafi, ISSYS president and CEO.

This new manufacturing site will allow ISSYS to ramp up the production of its MEMS-based microdensity sensors and eventually the MicroCoriolis mass flow meters. The latest product, the FuelSense density meter, is gaining traction in the monitoring of fuel and petrochemical quality, fuel custody transfer, fuel type and fuel blending markets, taking over share from density meters based on steel resonating tubes. Phase I expansion accommodates production of over 10,000 industrial units per year.

ISSYS provides advanced MEMS technologies for industrial, medical devices, microfluidic and scientific analytical sensing applications. For more information, visit: http://www.mems-issys.com/

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(October 11, 2010) — The 6th edition of the Global Plastic Electronics Conference & Exhibition takes place October 19-21 at Messe Dresden in Dresden, Germany and for the first time it will be held together with the SEMICON Europa 2010. This year’s Physics Noble Laureate, Dr. Kostya Novoselov, will speak about graphene at the show.

Dr. Kostya Novoselov will present, "Graphene: Materials in the Flatland." His talk will be given within the Plastic Electronics Conference on Thursday, October 21 in the plenary hall of Messe Dresden. Novoselov and co-researcher Andre Geim won the Nobel Prize in Physics just days ago for their work on graphene nano material.

This week in Dresden will become an international focus point for new developments in the electronic industries. About 8000 professionals from science and industry are expected to attend the combined event.

The Plastic Electronics Conference program will include speakers from Philips Lighting, Osram, Merck, Samsung, Cambridge University, Stanford University, and more. There will be more than 100 lectures from prominent experts recognized for their outstanding achievements in this field.

The six topics of the conference are: Organic Electronics, Displays, Organic Photovoltaics, Lighting, Smart Integrated Systems, and Novel System Approaches. The adjacent exhibition offers the opportunity to see demonstrators, services and products as well as network.

The Plastic Electronic Conference & Exhibition 2010 and the SEMICON Europa 2010 are combined at the "Converging Electronics Week." Within this dual-hosted and dually organized event, there will be enterprise-tours to local businesses and expert workshops on organic electronics and semiconductor technology.

Dresden is the largest European locations for organic electronics and one of the top locations in the world. More than 850 specialists are working in one of Saxony’s fastest growing high-tech industries today. Saxony’s close network of universities, research-facilities and businesses, encourages excellent knowledge transfer lab-to-fab. The Free State of Saxony will have an opening reception on October 19 for all regular registered attendees of the conference.

OES — Organic Electronics Saxony e.V. represents the interests of the largest European cluster of organic semiconductor. The network combines local, midsize companies as well as some of the most important, global players working in the field of organic electronic research and development in Saxony. OES supports specifically the internal know-how-transfer in R&D and offers a platform to boost the existing global market position successfully and efficiently. www.oes-net.de

The Plastic Electronics Foundation is a not-for-profit organization whose main objective is to promote the technology of printable, organic based flexible electronics into marketable applications and products worldwide. For more information please contact [email protected]

SEMICON Europa is a leading European exposition for microelectronics manufacturing with an expanding focus on growing markets including MEMS, printed/flexible electronics, solid state lighting, and related technologies. www.semiconeuropa.org

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(October 8, 2010) — Yale University researchers have covalently re-engineered the cell wall of Staphylococcus aureus, the most common cause of a staph infection. James W. Nelson†, Alexander G. Chamessian†, Patrick J. McEnaney†, Ryan P. Murelli†, Barbara I. Kazmiercak‡, and David A. Spiegel†* † Department of Chemistry, Yale University and ‡ Department of Medicine (Infectious Diseases), Section of Microbial Pathogenesis, Yale University School of Medicine, published the research findings in American Chemical Society’s Journal of Chemical Biology, "A Biosynthetic Strategy for Re-engineering the Staphylococcus aureus Cell Wall with Non-native Small Molecules."

From the article abstract:
Staphylococcus aureus (S. aureus) is a Gram-positive bacterial pathogen that has emerged as a major public health threat. The Yale University authors report that the cell wall of S. aureus can be covalently re-engineered to contain non-native small molecules. This process makes use of endogenous levels of the bacterial enzyme sortase A (SrtA), which ordinarily functions to incorporate proteins into the bacterial cell wall.

Incubation of wild-type bacteria with rationally designed SrtA substrates results in covalent incorporation of functional molecular handles (fluorescein, biotin, and azide) into cell wall peptidoglycan. These conclusions are supported by data obtained through a variety of experimental techniques (epifluorescence and electron microscopy, biochemical extraction, and mass spectrometry), and cell-wall-incorporated azide was exploited as a chemical handle to perform an azide–alkyne cycloaddition reaction on the bacterial cell surface.

This report represents the first example of cell wall engineering of S. aureus or any other pathogenic Gram-positive bacteria and has the potential for widespread utility.

Staph infections are a major health risk globally, which has motivated other nanotech scientists to develop ZnO nanoparticle-based multilayer nanocomposite films that exhibit antimicrobial activity against Staphylococcus aureus bacteria.

Read more articles on micro and nanotechnology research here.

Click here for more medical and life sciences articles.

A Biosynthetic Strategy for Re-engineering the Staphylococcus aureus Cell Wall with Non-native Small Molecules, DOI: 10.1021/cb100195d, Publication Date (Web): October 5, 2010, Copyright 2010 American Chemical Society, can be accessed here: http://pubs.acs.org/doi/abs/10.1021/cb100195d

* Corresponding author, [email protected].

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(October 6, 2010) — This complete review of the inertial sensor market 2009-2015, provided by Yole Developpement, includes the market for high-performance sensing products, technologies currently available, IMU prices and penetration, key companies, and more information.

High-performance motion sensing is gaining interest in many industries. In the military & aerospace areas, the use of inertial measurement units (IMUs) and other systems based on high-performance gyroscopes has been widespread for navigation, flight control or stabilization functions for decades. Today, we see many industrial and healthcare applications emerging, driven by the possibility to integrate new functionality at low cost, mostly thanks to the recent developments in MEMS accelerometer and gyroscope technology.

The market for IMUs is estimated to be $1.55B in 2009, dominated by defense and aerospace applications. Yole sees this market growing at a 9% annual growth rate, to reach $2.60B in 2015. Industrial, commercial naval, and offshore applications will be the most dynamic with 16.5% yearly growth, when the aerospace and defense markets will be limited to a 5.5% and 6.8% annual growth.

Several technologies are currently on the market, RLG and FOG-based systems being the most widespread and still benefiting from progresses in photonics. However, the recent and rapid development of tactical-grade MEMS gyroscope technologies has the largest impact on the market landscape and on the competition. It is crucial for the companies involved in those markets to invest in the right technologies and partners, depending on the end-markets which are targeted. Different strategies are observed: some companies carefully invest in selected technologies like the market leader Honeywell, while others love all inertial technologies, like Northrop Grumman.

MEMS industrial and tactical-grade type of sensors is the most dynamic technology. Yole sees the market growing from $361.8M in 2009 to $604.6M in 2015 for single MEMS accelerometers and gyroscopes or assembly of MEMS accelerometers/gyroscopes. However many technical and commercial challenges are predicted for the players involved in MEMS: how to guarantee a high level of vacuum for keeping high performance over the years, how to bring down the costs when most of the applications are in the 100 or 1000 unit range per year, why is it so important to avoid export restrictions like ITAR, what are the best business partners to enter new markets which are sometimes captive.

The recent availability of tactical-grade MEMS IMUs is clearly attractive for a wide range of applications. Indeed many applications will find interest in low-cost devices while it also opens new market opportunities such as precision guided munitions or small size UAVs. This explains why nearly each major IMU manufacturer has a MEMS technology today, although the status of developments is not the same for all players.

This report is more than a simple update of the “IMU market 2007-2012” report. The involvement of Yole Developpement on the high-end inertial market has continued to grow in the last couple of years, with discussions with key companies involved in the field all over the world and participation in many conferences. Although this market remains very complex to monitor, with a wide range of technologies, applications and players, Yole has been able to make a few modifications since the last version to be closer to the reality when it comes to IMU prices, penetration, number of systems in each vehicle, and market shares. Moreover a complete analysis of the impact of MEMS technology and on the geographic description of the market (including the dynamic Asian and Israeli markets) has been included. Yole also had the chance to have Mike Perlmutter, who has more than 30 years of experience in the inertial navigation industry, provide an important contribution to this report.

Report outline:

  • Gyroscope technologies: DTG, RLG, FOG, HRG, Quartz, MEMS
  • Accelerometer technologies: Electromechanical pendulous type, Piezo, MEMS
  • Level of performance: Industrial, tactical, inertial navigation and strategic grade
  • Worldwide market metrics: 2009 – 2015 market ($M, M units, ASP)
  • 2009 market shares
  • 150+ companies cited in the report
  • Report is a 300+ slides PowerPoint presentation
  • Excel datasheet included
  • 20+ key applications for IMUs are described: Civil aircrafts, General aviation, Civil helicopters, Space satellites, Spacecrafts & skyrockets, Civil & paramilitary UAVs, Military fighters, Military transport aircrafts, Defense UAVs, Military & special mission helicopters, Missiles, Guided munitions, Combatant ships, Armored vehicles, Soldier equipment, Commercial ships, Underwater vehicles: AUVs, ROVs & submarines, Oil drilling, Trains, Healthcare & sport, Antenna stabilization & pointing, Mapping instruments…
  • 15+ applications described for MEMS accelerometers: Pacemakers, Blood pressure monitoring, Physical activity monitoring, Seismic sensors – Geophones, Inclinometers, Antenna stabilization, Vibration monitoring, Directional drilling & borehole survey, Mapping instruments, Model helicopters & high end toys, UAVs flight control, Aircraft backup instruments, Cockpit instrumentation/AHRS, Missile Guidance, Precision Guided Munitions, Bombs & Rockets, Armored vehicles, Military training systems…
  • 15+ applications described for MEMS gyroscopes: Human motion capture, Physical activity monitoring, Antenna Stabilization, Directional drilling & borehole survey, Camera stabilization, Model helicopters and high-end toys, UAVs flight control, Backup instruments, Cockpit instrumentation, Missile Guidance, Precision Guided Munitions, Bombs & Rockets, Platform stabilization, Military training systems, Agriculture…

The objectives of this report are:

  • To provide market data on high performance Inertial Measurement Units and MEMS accelerometers/gyroscopes: key market metrics & dynamics
  • Unit shipments, revenues and average selling price
  • Market shares for each category of application
  • Industrial, tactical, inertial navigation and strategic grade sensors are taken into account
  • To provide application focus on key existing markets and most promising emerging ones
  • Architecture of the systems, functions that are used, new features and specification requirements
  • Insight about future technology trends & challenges
  • Pricing analysis and expected evolution
  • To provide a deep understanding of inertial sensor value chain, level of integration & players
  • Quasi-exhaustive list of sensor manufacturers worldwide with technology offer
  • List of key integrators worldwide
  • Analysis on the new players and potential new entrants with MEMS technology

High-performance accelerometers and gyroscope suppliers can use this report to understand the system level technology trends and requirements for each application, evaluate market potential for components depending on performance and technology, understand the differentiated value of your products and technologies, identify new business opportunities and partners, and monitor and benchmark your competitor’s advancements. IMU module and AHRS or INS suppliers can evaluate the market potential of their product portfolio, define diversification strategies on new applications, find the best technologies to integrate and the best suppliers depending on target markets, identify new business opportunities and partners, and have an exhaustive analysis of the competition on a broad range of IMU field. MEMS material, equipment, or foundry/packaging service suppliers can identify new business opportunities and prospects, understand the level of activity of your customers, and understand what are the applications that will drive the volumes in 2015. Integrators of inertial solutions (INS, AHRS, sensors…) can find the best technologies to integrate and the best suppliers depending on your target markets, understand what will be the future applications to develop by taking benefit on the recent advances in inertial technologies, note financial & strategic investors, understand the structure and value chain of the high-end inertial industry, estimate the potential of new devices such as tactical-grade MEMS gyroscopes, and get the list of main key players and emerging start-ups of this industry worldwide.

Companies in this report include Agiltron, AIMS – Zetiq Development, Airbus & ATR, Al Cielo, American GNC, Analog Devices, Applanix, Ascension, ASM (Automation Sensorik Messtechnik), Astrium, Atlantic Inertial Systems, Autoflug, Azimuth, BAE, Bejing Aerospace, Boeing, Cape Peninsula University of Technology, CASC: China Aerospace, Clymer Tech, Cobham, Colibrys, Comac, Corrsys-Datron , Crossbow, CSRI Elektropribor, Daihen, Dassault Aviation, Denel, Diehl BGT Defence, Doosan DST, EADS Astrium, Elbit Elop, Elbit Systems, Endevco, Eurocopter, Expertisa, Fanuc, Finmecannica, Fitzoptika, Freescale, Fugro, Fuji, GE Energy, GEM elettronica, General Dynamics, Genesys, Georgia Tech, Gladiator technology, G-nius, Goodrich, Hindustan Aeronautics Limited (HAL) – Edgewood Technologies, Hitachi, Honeywell, Horiba, HP, Hyundai Rotem, IAI Tamam, IGI mbH, i-mar, IMEGO, Imperial College London, India Space Research Organization (ISRO), Inertial Science, Innalabs, InterSense, ION, ISNAV, Israel Aerospace Industries, Israel Military Industries, IXSEA, JAE – Japan Aviation Electronics Industry, John Deere, Kawasaki heavy industries, Kearfott, Kinemetrics Inc, Kionix, Kongsberg, KVH, L3 Communication, LITEF, Lockheed Martin, Loral, Lumedyne Technologies, Matra, MBDA, Melexis, Memsense, Michigan Aerospace Corp., Micro Infinity, Microbotics , MicroInfinity, MicroPilot , Microstrain, Movea, Nera Networks, Nexter, NG Italia – Lital, Northrop Grummann, NovAtel, Omni Instr., O-Navi, Onera, Optolink, Orbit Technology Group, PCB Piezo, Physical Logic, Poogsan FNS, Pruftechnik, Qinetiq, Rada, Rafael, Ramsys, Raytheon, Raytheon Anschütz, Rheinmetall, Rockwell Collins, Roketsan, RUAG, Saab, Sagem, Sandia National Laboratories, SBG Systems, Schlumberger, SDI: Seven Dimension Information Corp, Selex, Sensonor, SensorDynamics, Sensorex, SensR, Sercel, Sherbone Sensors , Silicon Audio, Silicon Design, Silicon Sensing Systems SSS, Southern Methodist University, Stockholm Precision Tools, Summit Instruments, Symphony Acoustics, Syowa Sokki, Systron Donner Industrial, Taïwan National Space Organization (NSPO), Teknol, Tethers Unlimited, Thales, Tokimec, Tronics, Vigor Technology, VTI, Watson Industries, Xi’an Chinastar, XSens, Yaskawa Electric, Yishay Sensors, and more.

The report can be found at http://www.i-micronews.com/reports/IMU-High-Performance-Inertial-MEMS-2011/160/

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(October 6, 2010) — The Royal Swedish Academy of Sciences has decided to award the Nobel Prize in Physics for 2010 to Andre Geim and Konstantin Novoselov, both of the University of Manchester, UK, for groundbreaking experiments regarding the two-dimensional material graphene.

A one-atom-thick flake of carbon, the nano material graphene was demonstrated by Geim and Novoselov to have exceptional properties that originate from the remarkable world of quantum physics. You can read the scientific background on graphene compiled for the Royal Swedish Academy here.

Related articles on graphene

 

Graphene: A playground for physics

Graphene quantized-electron bubble discovery at UC Berkeley

Bulk graphene oxide without the toxic gases

Listening to graphene’s quartet harmonies

Direct graphene CVD on a dielectric substrate

As a conductor of electricity, graphene performs as well as copper. As a conductor of heat, it outperforms all other known materials. It is almost completely transparent, yet so dense that not even helium, the smallest gas atom, can pass through it.

Geim and Novoselov extracted the graphene from a piece of graphite such as is found in ordinary pencils. Using regular adhesive tape they managed to obtain a flake of carbon with a thickness of just one atom. This at a time when many believed it was impossible for such thin crystalline materials to be stable.

However, with graphene, physicists can now study a new class of two-dimensional materials with unique properties. Graphene makes experiments possible that give new twists to the phenomena in quantum physics. Also a vast variety of practical applications now appear possible including the creation of new materials and the manufacture of innovative electronics. Graphene transistors are predicted to be substantially faster than today’s silicon transistors and result in more efficient computers.

 

Atomic force microscopy (AFM) image of a monolayer of graphene. Black area is substrate; dark orange is a monolayer of graphene about 0.5nm thick. The bright orange part contains a few layers, at about 2nm thick. Source: Scientific background material for the 2010 Nobel Prize in Physics.

Since it is practically transparent and a good conductor, graphene is suitable for producing transparent touch screens, light panels, and maybe even solar cells. Recent news has hinted at future mass production methods for graphene.

When mixed into plastics, graphene can turn them into conductors of electricity while making them more heat resistant and mechanically robust. This resilience can be used in new super strong materials, which are also thin, elastic and lightweight. In the future, satellites, airplanes, and cars could be manufactured out of the new composite materials.

This year’s Laureates have been working together for a long time. Konstantin Novoselov, 36, first worked with Andre Geim, 51, as a PhD student in the Netherlands. He subsequently followed Geim to the UK. Both of them originally studied and began their careers as physicists in Russia. Now they are both professors at the University of Manchester. In awarding the Nobel Prize, the Royal Swedish Academy noted that "playfulness is one of their hallmarks." The SEK 10 million prize money is to be shared equally between the Nobel Laureates.

Biographies of the Nobel Laureates

Andre Geim, Dutch citizen. Born 1958 in Sochi, Russia. Ph.D. 1987 from Institute of Solid State Physics, Russian Academy of Sciences, Chernogolovka, Russia. Director of Manchester Centre for Meso-science & Nanotechnology, Langworthy Professor of Physics and Royal Society 2010 Anniversary Research Professor, University of Manchester, UK.
www.condmat.physics.manchester.ac.uk/people/academic/geim

Konstantin Novoselov, Brittish and Russian citizen. Born 1974 in Nizhny Tagil, Russia. Ph.D. 2004 from Radboud University Nijmegen, The Netherlands. Professor and Royal Society Research Fellow, University of Manchester, UK.
www.condmat.physics.manchester.ac.uk/people/academic/novoselov

The Royal Swedish Academy of Sciences, founded in 1739, is an independent organization whose overall objective is to promote the sciences and strengthen their influence in society. The Academy takes special responsibility for the natural sciences and mathematics, but endeavours to promote the exchange of ideas between various disciplines.

For information about the Nobel Prize in Physics, including ways to post questions to the prize recipients and more information about their work, visit http://nobelprize.org/nobel_prizes/physics/laureates/2010/

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(October 4, 2010) — Forsyth Technical Community College in Winston-Salem, NC, is doing its part in keeping the Tar Heel State as one of the strongest nanotech clusters in the nation. Forsyth Tech provides a two-year nanotechnology degree program in the Southeast US. This program has strong partnerships with innovative employers, academic researchers, and industrial organizations across North Carolina, including both the Piedmont Triad (Winston-Salem, High Point, and Greensboro) and the Research Triangle (Raleigh, Durham, and Chapel Hill).

North Carolina is ranked 8th in nanotechnology while the Triangle metro area is ranked fourth by the Project on Emerging Nanotechnologies.

Nanotech second-year student Greg Walker changes the tip of a NanoSurf EasyScan 2 atomic force microscope.

Strong initial support

The two-year Associate Degree in Applied Science in Nanotechnology was first offered at Forsyth Tech in 2005 with the financial support of a $500,000 grant from the Wachovia Foundation. These financial resources give students access to a wide array of tools on campus at Forsyth Tech, including atomic-force microscopy (AFM) in both air and liquid, fluorescence microscopy, spin-coaters, polymer-synthesizing microwave ovens, heaters for nanotube fabrication, and high-rpm centrifugal mixers for the mixing of nanoparticles into macroscopic matrices.

From its inception, significant technical assistance from Dr. David Carroll, director of the Wake Forest University Center for Nanotechnology and Molecular Materials, has provided access to highly qualified adjunct faculty and equipment, including MOCVD equipment, electron microscopes, and a class 10,000 clean room.

The Nanotech Toolbox

This degree is built around eight core courses: a pair each in theory, safety, characterization, and fabrication.

The two theory courses introduce students to the qualitative and quantitative aspects of nanotechnology, respectively. NAN 112 Fundamentals of Nanoscience includes four weeks each of biology, chemistry, physics, and nanostructures. The two safety courses encompass elements of laboratory and occupational safety, waste management and removal, as well as IP and litigation. NAN 132 Controlled Materials addresses corporate and regulatory issues, and provides a good forum for telephone interviews with representatives from FDA, EPA, and compliance consultant firms such as NanoTox of Houston.

The two fabrication courses introduce students to chemical, physical, and thermal methods of creating nanoparticles and nanocomposites. NAN 241 Fabrication of Soft Matter focuses on the fabrication of nanoparticles and polymers, and the mixing of the two to form nanocomposites. Forsyth Tech students take NAN 242 Thin Films at the Wake Forest University Center for Nanotechnology and Molecular Materials.

The two characterization courses present the real strength of the program. NAN 243 covers all aspects of atomic-force microscopy, including AFM in liquid. Forsyth Tech students take NAN 244 Electron Microscopy with Wake Forest students but pay in-state community college tuition. In 2008, with the aid of a $136,000 grant from the North Carolina BioNetwork, an elective course, NAN 251 Biological Atomic-Force Microscopy, was added.

Nanotech program graduate Rei Kawamura processes fluorescence images of biological samples captured with an Olympus IX-71.

Human resources

Steven Crawford, a Nanotech diploma student with a B.A. in Biology from the University of North Carolina at Chapel Hill, was attracted to Forsyth Tech’s program because Nanotechnology is “at the forefront of everything I was interested in, both academics and my passion for technology.” Eric Norman, a first-year nanotech student adds “I’ve thought since high school chemistry, we know things are made of molecules, why can’t we move them around and build with them?” Wes Mays, a graduate of the program now working with PlexiLight, has benefitted from having “an internship to be able to work with an employer before I got a job. I now have an R&D position testing, optimizing, and making demonstration units.” Matt Craps of NanoTech Labs, producer of carbon nanotubes (CNT) and nanocomposite materials, sees it from the management side. He notes "Forsyth Tech graduates’ basis of knowledge, in the ever evolving field of nanotechnology, is valuable for our nanomaterials production. They demonstrate a keen interest to learn additional skills and become further involved in our manufacturing process."

Evolving curriculum

The curriculum received a significant overhaul in 2010 to provide students with easier access to the program. For those who enter with a two-year technical or four-year scientific degree, a new Diploma in Nanotechnology is offered. It consists of the eight core courses alone, and can be completed in just two semesters — or nine months. For incumbent workers, a new Certificate in Nanotechnology is now available. It includes one course each in theory, safety, characterization, and fabrication. The two-year Associate Degree for first-time college students remains the most popular option, but now students are able to supplement the eight core courses with electives, including more options in mathematics, chemistry, biology, physics, engineering, even biotechnology courses. This added flexibility allows students to prepare for careers in nanomaterials, quality control, metrology, nanobiology, regenerative medicine, and drug delivery. To support these classes in nanotechnology, students take one semester each of biology, chemistry, and physics. Integral to the program are also knowledge and skills from engineering, economics, and ethics.

Future nanotech advances for Forsyth Tech

A new facility for the program, a 3,000 sq.ft. laboratory – including a class-1000 clean room – on the ground floor of Forsyth Tech’s Center for Emerging Technologies in the Piedmont Triad Research Park situated in downtown Winston-Salem, is projected to open in 2014. The new campus will bring together Forsyth Tech’s Nanotech, Biotech, Design, and Corporate training programs for collaboration with other tenants in the park, including Nanoholdings’ PureLux and FiberCell, Triad Forensics Laboratory, Keranetics, Salzburg Therapeutics for Cancer, the North Carolina BioNetwork Pharmaceutical Center, and the Wake Forest Institute for Regenerative Medicine.

The Nanotechnology program, in close cooperation with Forsyth Tech’s Biotechnology program and partners across the state — NC A&T University, the Joint School of Nanoscience and Nanotechnology, Tengion, Cook Medical, Nanomedica, Pioneer Surgical, Xanofi, and the Center of Innovation in Nanobiotechnology — is expanding into nanomedicine: regenerative medicine, tissue engineering, drug delivery, and cancer therapies. North Carolina is ranked third in biotechnology by the Battelle Technology Partnership Practice.

The Forsyth Tech program focuses on producing a workforce trained in the mutltidisciplinary skills that nanotech and nanomedicine employers across North Carolina are demanding. Through internships and new jobs, Forsyth Tech Nanotechnology graduates have brought their nanotech skill set to R&D firms, nanomanufacturing companies, and physics and engineering laboratories. These same graduates will do their part to keep NC in the forefront of the nation’s emerging nanotechnology sector.

Dr. Kevin J. Conley, the Program Coordinator of Nanotechnology Education at Forsyth Tech can be reached by email at [email protected] or phone at 336-734-7389.

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(October 1, 2010) — Adama Materials, Inc., a developer ofnanotechnology-based advanced materials, completed a $4.75 million Series A equity financing led by Artiman Ventures, along with Startup Capital Ventures, the company’s founders and a group of Hawaii-based angel investors including Cellular Bioengineering Inc.

The HI-based company also announced the appointment of Tim Dick from Startup Capital Ventures as CEO and a member of the board of directors. Also appointed to the board are Amit Shah of Artiman Ventures and John Dean of Startup Capital Ventures. They join founder and chief technology advisor, Dr. Mehrdad Ghasemi Nejhad, graduate chair of the Department of Mechanical Engineering of the University of Hawaii (UH), Manoa. The company’s co-founder, Donavan Kealoha, will serve as director of administration.

Adama Materials was founded when Kealoha, a graduate of UH’s Shidler School of Business and the William S. Richardson School of Law, and Dr. Nejhad won first place and the technology prize at the 2008 UH business plan competition. Funded originally through grants from the United States Office of Naval Research, the company now has active projects with tier-one aerospace and composites companies and several patents.

"The investment will allow commercialization of the technology Adama has developed over many years at UH, our long-term partner," stated Dr. Nejhad.

"We are delighted to achieve this financial milestone with Hawaii technology that leads the world in this field," said Dick. "It reflects the excitement in the market for the striking performance increases made possible by Adama’s technology."

"Adama represents the ideal model of cross-disciplinary development of technology, business and law at UH, and demonstrates how UH discoveries can be successfully transferred to industry," said Jonathan Roberts of the UH Office of Technology Transfer and Economic Development.

Terms of the Series A equity financing were not disclosed.

Adama Materials Inc. develops proprietary nanotechnology-based advanced materials for use in composite materials and other applications. For more information on Adama, go to www.adamamaterials.com

Artiman Ventures helps talented entrepreneurs commercialize leading-edge technologies to create world-class companies.

Startup Capital Ventures focuses on early-stage companies that require relatively small amounts of capital to achieve success.

The University of Hawaii provides unique educational opportunities for its 58,000 students to learn and develop from undergraduate through post-doctoral work at its 10 UH campuses and dozens of educational, training and research centers on six Hawaiian Islands.

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