12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

12/16/2016  Reliance on existing wafer sizes increases as outlook for 450mm wafers fades.

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

12/14/2016  Amkor Technology, Inc. today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT).

12/14/2016  SEMI today announced the lineup for six forums at SEMICON China and FPD China held at the Shanghai New International Expo Centre on March 14-16, 2017.

12/13/2016  SEMI today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 8.7 percent to $39.7 billion in 2016.

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

12/01/2016  Synopsys, Inc. has completed its acquisitions of Cigital, a privately held provider of software security managed and professional services, and Codiscope, a 2015 spinoff of Cigital and provider of complementary security tools.

11/30/2016  David Anderson joins as SEMI Americas President.

11/14/2016  Siemens and Mentor Graphics today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for an enterprise value of $4.5 billion.

11/11/2016  According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

11/09/2016  IC Market Drivers 2017 analyzes end-use applications and impact on IC market growth.

11/08/2016  Silicon photonic technologies have reached the tipping point that precedes massive growth.

11/04/2016  Semiconductor Manufacturing International Corporation announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC's Shenzhen facility. It will be the very first 12-inch fab in South China.

11/02/2016  In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole in its report Status and Prospects for the Advanced Packaging Industry.

11/01/2016  Investments in its facilities will enhance current System LSI production to meet the growing demands in the industry for advanced system-on-chip (SoC) products especially for mobile and other electronic devices.

10/30/2016  Toshiba was the first to commercially implement CMOS image sensors with backside TSV last technologies in 2007. Many of us stated in 2007 that further advances could be obtained by removing the CMOS circuitry to a separate layer and forming a true 3D chip stack, but the technology imple- mentation had to wait while the industry first converted to back side imaging technology.