08/15/2016  Semiconductor processes have long been a mystery for many circuit designers. They didn’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.

08/15/2016  Mentor Graphics Corporation today announced the first phase of the new Xpedition printed circuit design (PCB) flow to address the increasing complexity of today's advanced systems designs.

08/11/2016  SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.

08/02/2016  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.

08/02/2016  Ultratech, Inc. today announced that it has received an 'Outstanding Supplier Award' from SJ Semiconductor Corp.

07/28/2016  SJ Semiconductor Corp. and Qualcomm Technologies, Inc. jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.

07/27/2016  Over the past 20 years, China has become increasingly frustrated over the gap between its IC imports and indigenous IC production

07/25/2016  Applied Materials, Inc. today announced the appointment of Judy Bruner to serve on its Board of Directors. Ms. Bruner has also been appointed to serve as a member of the Audit Committee of the Board.

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

07/22/2016  Billings activity for equipment companies based in North America are at their highest level since February 2011.

07/21/2016  Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.

07/15/2016  At the ECTC conference in May, in the “Advances in Fan Out Packaging” session, Matt Lueck of RTI International discussed the results of their joint program with X-Celeprint.

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

07/11/2016  Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.

07/11/2016  AppliedMicro's innovative silicon products enabled by TSMC's advanced technology.

07/08/2016  Weak global economy and poor DRAM market to drag down growth this year.

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

06/21/2016  Earlier this year, a Taipei Times headline read “New packaging may spur TSMC growth” adding that despite its weak revenue growth guidance for this quarter, TSMC, might see stronger growth from next quarter thanks to its InFO (integrated fan out) packaging technology.