06/20/2016  When most people in packaging hear the term “Fan Out,” they usually think of the eWLB type of “chips first” fan out process/structure. This was the first of the embedded chips first structures to be taken into volume production by Infineon and ASE in Q1 2009. But this was not the end of the story.

06/16/2016  Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015.

06/14/2016  Today, SEMI announced that the latest packaging solutions will be the topic of an in-depth session at the SEMICON West 2016 Advanced Packaging Forum - and on display on the exhibition floor.

06/13/2016  The ConFab 2016 kicked off this morning with speakers from GlobalFoundries, Silicon Catalyst, imec, TechInsights, CEA Leti, and New York Empire State Development.

06/10/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $25.8 billion for the month of April 2016.

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

06/08/2016  Dr. Dongkai Shangguan is currently the Chief Marketing Officer of STATS ChipPAC. Previously, Dongkai served as the founding CEO of the National Center for Advanced Packaging Co., Ltd. (“NCAP China”), worked for 10 years at Ford Motor Company in various technical and management functions, and for 11 years at Flextronics as Corporate Vice President of Global Advanced Technology.

06/06/2016  Soitec's Power SOI substrates use to manufacture smart power IC's for automotive applications represent a significant and strategic market for Soitec's business, which is growing at a steady rate.

05/26/2016  As the opening day of SEMICON West (July 12-14) approaches, the electronics manufacturing industry is experiencing disruptive changes, making “business as usual” a thing of the past. To help technical and business professionals navigate this fast-changing landscape, SEMICON West programming has been upgraded extensively.

05/24/2016  North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.

05/18/2016  For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

05/12/2016  Qualcomm, Micron, and SK Hynix registered ?25% drops, with total top-20 sales off by 6%.

05/11/2016  EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.

05/11/2016  Reflects strong demand for eWLB in mobile market with accelerating adoption in Internet of Things, wearables, MEMS and automotive applications.

05/06/2016  Advanced Semiconductor Engineering, Inc. and Deca Technologies, a subsidiary of Cypress Semiconductor Corp., announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca's M-Series Fan-out Wafer-Level Packaging (FOWLP) technologies and processes.

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

05/02/2016  According to the latest research study released by Technavio, the global semiconductor stepper system market is expected to reach over USD 6 billion by 2020.

04/29/2016  The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

04/14/2016  To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.

04/06/2016  Worldwide semiconductor wafer-level manufacturing equipment revenue totaled $33.6 billion in 2015, a 1 percent decline from 2014, according to final results by Gartner, Inc.